JPS58170160U - Mold temperature sensor mounting structure - Google Patents
Mold temperature sensor mounting structureInfo
- Publication number
- JPS58170160U JPS58170160U JP6771082U JP6771082U JPS58170160U JP S58170160 U JPS58170160 U JP S58170160U JP 6771082 U JP6771082 U JP 6771082U JP 6771082 U JP6771082 U JP 6771082U JP S58170160 U JPS58170160 U JP S58170160U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- mounting structure
- sensor mounting
- mold temperature
- sensing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Continuous Casting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図１よ本考案に用いる測温体の実施例の一部切欠側
面図、第２図は本考案の測温体取付構造の実施例の鋳型
の部分断面図である。、
１・・・熱電対、２・・・保護パイプ、３・・・充填物
、・４・・・ストッパ、５・・・ばね、６・・・取り付
はキャップ、７−・・・キャップストッパ、８・・・保
護スプリング、９・・・補償導線、１０・・・鋳型銅板
、１１．１１３・・・バックプレート、１２・・・０リ
ング、１３・・・ガイドパイプ、１４．１５・・・銅板
背面の盲孔、１６・・・取り１ 付は固定キャップ、２
０・・・鋳拗組立用ボルト、２１・・・間隔片、２２・
・・間隔片固定ボルト。FIG. 1 is a partially cutaway side view of an embodiment of the temperature sensor used in the present invention, and FIG. 2 is a partial sectional view of a mold of the embodiment of the temperature sensor mounting structure of the present invention. , 1... Thermocouple, 2... Protective pipe, 3... Filler, 4... Stopper, 5... Spring, 6... Mounting cap, 7-... Cap Stopper, 8...Protection spring, 9...Compensation lead wire, 10...Mold copper plate, 11.113...Back plate, 12...0 ring, 13...Guide pipe, 14.15.・・Blind hole on the back of the copper plate, 16・・With 1 fixing cap, 2
0... Bolt for cast assembly, 21... Spacing piece, 22.
・Space piece fixing bolt.
Claims (1)
し、該銅板背面に冷却水通路をはさんで当接するバック
プレートと後方やバックプレートとに測温体挿入用貫通
孔を設けると共に該貫通孔間をガイ下パイプで接続し、
該ガイドパイプ内に測温体を挿入して装脱自在に固定し
、該測温体には前記銅板の盲孔底に測温体先端を圧着す
る手段を備えたことを特徴とする鋳型の測温体取付構造
。A blind hole for inserting a temperature sensor is drilled in the back of the steel plate that makes up the inner wall of the mold, and a through hole for inserting a temperature sensor is provided in the back plate that contacts the back of the copper plate across the cooling water passage, and in the rear and back plate. and connect the through holes with a pipe under the guide,
A mold, characterized in that a temperature sensing element is inserted into and removably fixed in the guide pipe, and the temperature sensing element is provided with a means for crimping the tip of the temperature sensing element to the bottom of the blind hole of the copper plate. Temperature sensor mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6771082U JPS58170160U (en) | 1982-05-10 | 1982-05-10 | Mold temperature sensor mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6771082U JPS58170160U (en) | 1982-05-10 | 1982-05-10 | Mold temperature sensor mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58170160U true JPS58170160U (en) | 1983-11-14 |
Family
ID=30077524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6771082U Pending JPS58170160U (en) | 1982-05-10 | 1982-05-10 | Mold temperature sensor mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170160U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016125887A (en) * | 2014-12-26 | 2016-07-11 | 大林道路株式会社 | Mixed material temperature measuring device |
-
1982
- 1982-05-10 JP JP6771082U patent/JPS58170160U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016125887A (en) * | 2014-12-26 | 2016-07-11 | 大林道路株式会社 | Mixed material temperature measuring device |
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