JPH04364095A - Heat radiator of image pickup equipment - Google Patents

Abstract

PURPOSE:To prevent adverse effect on the performance, which occurs by the temperature rise of heating electric parts, in an image pickup equipment. CONSTITUTION:There is a printed board 3 where heating electric parts 1 are attached. A plate spring piece 5 is mounted on a casing 4 in advance. It is so constituted that the plate spring piece 5 face-contacts with the heating parts 1 when the casing 4 is attached. By this constitution, the heat generated from the heating electric parts 1 is conducted and is radiated to the casing 4 low in temperature. The heat can be radiated effectively with small space and without marring the external appearance.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device that effectively transfers heat generated by electrical components inside an imaging device to a housing and dissipates the heat.

0002

2. Description of the Related Art In recent years, imaging devices have become widespread, and user demands have become more sophisticated year by year. In particular, people have become extremely sensitive to not only the operability of equipment but also its performance and image quality.

[0003] Conventionally, heat from imaging equipment has generally been radiated using ventilation holes or heat sinks. The configuration will be described below with reference to FIG. 2.

As shown in the figure, it has been common practice to bring a heat-radiating piece 2 attached to a housing 4 into contact with a heat-generating electric component 1 attached to a printed circuit board 3 to transfer and radiate heat.

[0005]

[Problems to be Solved by the Invention] With such conventional heat dissipation devices, if the heat dissipation plate is a ventilation hole, dust may enter and have an adverse effect on the inside of the device, and if the heat dissipation plate is a flat plate, there is no contact. A complete and effective heat dissipation effect cannot be obtained.

[0006] The present invention solves the above-mentioned problems.
It is an object of the present invention to provide a heat radiating device that can effectively radiate heat by imparting spring properties to a heat radiating plate.

[0007]

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides a method for closing a housing with a heat dissipating piece having a spring property installed in a housing for heat-generating electrical components on a printed circuit board. Therefore, it is configured to press with a constant pressure.

[0008]

[Operation] In the present invention, in the above structure, since the heat dissipation device is composed of a leaf spring, it is securely pressed against the electric component, and therefore, there is no problem due to poor contact, and heat can be dissipated effectively.

[0009]

Embodiment An embodiment of the present invention will be described below with reference to FIG.

As shown in the figure, a housing 4 is attached to a printed circuit board 3 on which a heat generating electric component 1 is attached. This housing 4 is equipped with a U-shaped plate spring heat dissipating piece 5 made of a material with high thermal conductivity, such as phosphor bronze. By attaching the housing 4, the leaf spring heat dissipating piece 5
is configured so that it comes into contact with the heat generating electric component 1.

[0011] To explain the operation in the above structure, since the leaf spring heat dissipating piece 5 is attached to the casing 4 side, the casing 4
When closed, the leaf spring heat dissipating piece 5 contacts the heat generating electrical component 1 with a constant pressure, making it possible to effectively dissipate heat from the heat generating electrical component 1 to the outside of the casing 4.

As described above, according to the heat dissipation device of the present invention,
An effective heat dissipation effect can be obtained without the heat dissipation effect being deteriorated due to poor contact between the heat dissipation members. Furthermore, the heat dissipation member can also serve as an electrical and electromagnetic shield.

[0013]

[Effects of the Invention] As is clear from the above embodiments, the heat dissipation device for an imaging device of the present invention can effectively dissipate heat using a heat dissipation member that utilizes spring properties, and the imaging device can also perform stable imaging. This is something that can be provided.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a heat dissipation device for an imaging device according to an embodiment of the present invention.

[Figure 2] Cross-sectional view of a heat dissipation device of a conventional imaging device

[Explanation of symbols]

1 Heat generating electrical parts 4 Housing 5. Leaf spring heat dissipation piece

Claims (2)

[Claims] [Claim 1] A leaf spring heat dissipation piece is attached to the inside of the casing,
A heat dissipation device for an imaging device, in which the leaf spring heat dissipation piece is pressed into contact with a heat-generating electrical component. 2. The heat dissipation device for an imaging device according to claim 1, wherein the plate spring heat dissipation piece is an electrical and electromagnetic shielding member.