JPH0436337A - Near-infrared-absorbing resin composition and its production - Google Patents
Near-infrared-absorbing resin composition and its productionInfo
- Publication number
- JPH0436337A JPH0436337A JP14393590A JP14393590A JPH0436337A JP H0436337 A JPH0436337 A JP H0436337A JP 14393590 A JP14393590 A JP 14393590A JP 14393590 A JP14393590 A JP 14393590A JP H0436337 A JPH0436337 A JP H0436337A
- Authority
- JP
- Japan
- Prior art keywords
- meth
- parts
- weight
- ester
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000203 mixture Substances 0.000 claims abstract description 40
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 claims abstract description 32
- 239000000178 monomer Substances 0.000 claims abstract description 30
- -1 acrylic ester Chemical class 0.000 claims abstract description 25
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 9
- 150000002148 esters Chemical class 0.000 claims abstract description 6
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 38
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 19
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 16
- 229920000728 polyester Polymers 0.000 abstract description 7
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract description 2
- ZJXZSIYSNXKHEA-UHFFFAOYSA-L ethyl phosphate(2-) Chemical compound CCOP([O-])([O-])=O ZJXZSIYSNXKHEA-UHFFFAOYSA-L 0.000 abstract description 2
- 229910003091 WCl6 Inorganic materials 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 25
- 238000006116 polymerization reaction Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 12
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 229910019142 PO4 Inorganic materials 0.000 description 8
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 8
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 8
- 239000010452 phosphate Substances 0.000 description 8
- 150000008301 phosphite esters Chemical class 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000011358 absorbing material Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000411 transmission spectrum Methods 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 5
- 150000001348 alkyl chlorides Chemical class 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000113 methacrylic resin Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YOUIDGQAIILFBW-UHFFFAOYSA-J tetrachlorotungsten Chemical compound Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 description 3
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- NNWNNQTUZYVQRK-UHFFFAOYSA-N 5-bromo-1h-pyrrolo[2,3-c]pyridine-2-carboxylic acid Chemical compound BrC1=NC=C2NC(C(=O)O)=CC2=C1 NNWNNQTUZYVQRK-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002574 CR-39 Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000007810 chemical reaction solvent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 150000005691 triesters Chemical class 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- GPOGLVDBOFRHDV-UHFFFAOYSA-N (2-nonylphenyl) dihydrogen phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(O)O GPOGLVDBOFRHDV-UHFFFAOYSA-N 0.000 description 1
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- BGJQNPIOBWKQAW-UHFFFAOYSA-N 1-tert-butylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)(C)C BGJQNPIOBWKQAW-UHFFFAOYSA-N 0.000 description 1
- COXCGWKSEPPDAA-UHFFFAOYSA-N 2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)C#N COXCGWKSEPPDAA-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- TVAJJUOMNRUGQA-UHFFFAOYSA-N 2-butoxyethyl dihydrogen phosphate Chemical compound CCCCOCCOP(O)(O)=O TVAJJUOMNRUGQA-UHFFFAOYSA-N 0.000 description 1
- ANHAEBWRQNIPEV-UHFFFAOYSA-N 2-chloroethyl dihydrogen phosphate Chemical compound OP(O)(=O)OCCCl ANHAEBWRQNIPEV-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 description 1
- YIKVZDICBNEEOZ-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphite Chemical compound CCCCC(CC)COP(O)O YIKVZDICBNEEOZ-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- IOVBFSRXGQUXIU-UHFFFAOYSA-N 5-hydroxy-2-methylpent-2-enoic acid phosphoric acid Chemical compound OP(O)(O)=O.OC(=O)C(C)=CCCO.OC(=O)C(C)=CCCO IOVBFSRXGQUXIU-UHFFFAOYSA-N 0.000 description 1
- ZRIMDWRLVGDUBW-UHFFFAOYSA-N 5-hydroxy-2-methylpent-2-enoic acid phosphoric acid Chemical compound P(=O)(O)(O)O.OCCC=C(C(=O)O)C ZRIMDWRLVGDUBW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- PMGHIGLOERPWGC-UHFFFAOYSA-N Bis-(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(O)OCCCl PMGHIGLOERPWGC-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N DEAEMA Natural products CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- 229940090898 Desensitizer Drugs 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- LPWLFJWLOOPDRT-UHFFFAOYSA-N bis(2,3-dichloropropyl) hydrogen phosphite Chemical compound ClCC(Cl)COP(O)OCC(Cl)CCl LPWLFJWLOOPDRT-UHFFFAOYSA-N 0.000 description 1
- ZLMKQJQJURXYLC-UHFFFAOYSA-N bis(2-ethylhexoxy)-oxophosphanium Chemical compound CCCCC(CC)CO[P+](=O)OCC(CC)CCCC ZLMKQJQJURXYLC-UHFFFAOYSA-N 0.000 description 1
- ZKTGWOXVQUNCLN-UHFFFAOYSA-N bis(2-nonylphenyl) hydrogen phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(O)OC1=CC=CC=C1CCCCCCCCC ZKTGWOXVQUNCLN-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- CERDIVAFXRCORQ-UHFFFAOYSA-O butoxy-hydroxy-oxophosphanium Chemical compound CCCCO[P+](O)=O CERDIVAFXRCORQ-UHFFFAOYSA-O 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- PYFRLDVYGBCYLI-UHFFFAOYSA-N decyl dihydrogen phosphite Chemical compound CCCCCCCCCCOP(O)O PYFRLDVYGBCYLI-UHFFFAOYSA-N 0.000 description 1
- SEGLCEQVOFDUPX-UHFFFAOYSA-N di-(2-ethylhexyl)phosphoric acid Chemical compound CCCCC(CC)COP(O)(=O)OCC(CC)CCCC SEGLCEQVOFDUPX-UHFFFAOYSA-N 0.000 description 1
- BVXOPEOQUQWRHQ-UHFFFAOYSA-N dibutyl phosphite Chemical compound CCCCOP([O-])OCCCC BVXOPEOQUQWRHQ-UHFFFAOYSA-N 0.000 description 1
- POWRQOUEUWZUNQ-UHFFFAOYSA-N didecyl phosphite Chemical compound CCCCCCCCCCOP([O-])OCCCCCCCCCC POWRQOUEUWZUNQ-UHFFFAOYSA-N 0.000 description 1
- LXCYSACZTOKNNS-UHFFFAOYSA-N diethoxy(oxo)phosphanium Chemical compound CCO[P+](=O)OCC LXCYSACZTOKNNS-UHFFFAOYSA-N 0.000 description 1
- UCQFCFPECQILOL-UHFFFAOYSA-N diethyl hydrogen phosphate Chemical compound CCOP(O)(=O)OCC UCQFCFPECQILOL-UHFFFAOYSA-N 0.000 description 1
- OKXAFOJPRGDZPB-UHFFFAOYSA-N dioctadecoxy(oxo)phosphanium Chemical compound CCCCCCCCCCCCCCCCCCO[P+](=O)OCCCCCCCCCCCCCCCCCC OKXAFOJPRGDZPB-UHFFFAOYSA-N 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZUNGGJHBMLMRFJ-UHFFFAOYSA-O ethoxy-hydroxy-oxophosphanium Chemical compound CCO[P+](O)=O ZUNGGJHBMLMRFJ-UHFFFAOYSA-O 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- CSWFWSPPZMEYAY-UHFFFAOYSA-N octadecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(O)O CSWFWSPPZMEYAY-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- VCAFTIGPOYBOIC-UHFFFAOYSA-N phenyl dihydrogen phosphite Chemical compound OP(O)OC1=CC=CC=C1 VCAFTIGPOYBOIC-UHFFFAOYSA-N 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- FCFIEBVTVHJMQR-UHFFFAOYSA-N tris(2,3-dichloropropyl) phosphite Chemical compound ClCC(Cl)COP(OCC(Cl)CCl)OCC(Cl)CCl FCFIEBVTVHJMQR-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- ILLOBGFGKYTZRO-UHFFFAOYSA-N tris(2-ethylhexyl) phosphite Chemical compound CCCCC(CC)COP(OCC(CC)CCCC)OCC(CC)CCCC ILLOBGFGKYTZRO-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Optical Filters (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
本発明は可視光線を比較的よく透過し近赤外線吸収能に
優れた新規な近赤外線吸収性樹脂組成物およびその製造
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a novel near-infrared absorbing resin composition that transmits visible light relatively well and has excellent near-infrared absorbing ability, and a method for producing the same.
従来、近赤外線吸収材料としては、六塩化タングステン
(WCffi &)と塩化スズ(SnCl z・28z
O)をメタクリル酸メチルシラツブに溶解して重合する
ことにより得られることが米国特許第3,692,68
8号明細書に記載されている。Conventionally, near-infrared absorbing materials include tungsten hexachloride (WCffi &) and tin chloride (SnCl z・28z
U.S. Pat. No. 3,692,68 discloses that O) can be obtained by dissolving O) in methyl methacrylate and polymerizing it.
It is described in Specification No. 8.
我々が上記米国特許を追試した結果によれば、WCjl
!a と5nCj!z・2H20をメタクリル酸メチル
シラツブに溶解した組成物は濃青色に発色し近赤外線を
よく吸収する性質をもっているが、これを鋳型に注入し
て重合して得られた鋳型板すなわち近赤外線吸収材料は
褪色していると共に近赤外線を吸収する能力が大幅に減
少しており、これを紫外線あるいは太陽光に曝露しては
じめて再び濃青色を呈し近赤外線吸収能を発揮し、一方
暗所で長期間放置の間に褪色するいわゆるフォトクロミ
ズムを呈するという問題を有していた。このような従来
のWCj26と5nC12・2H20を含有してなる近
赤外線吸収材料における重合過程での分光特性の大幅な
変化や極めて緩かに進行するフォトクロミズムなどは、
一定の品質を備えた光学的フィルターや熱線吸収性グレ
ージングなどの工業製品を提供する上で好ましくない現
象である。According to the results of our reexamination of the above US patent, WCjl
! a and 5nCj! A composition prepared by dissolving z・2H20 in methyl methacrylate syrup develops a deep blue color and has the property of absorbing near-infrared rays well, but the mold plate obtained by injecting this into a mold and polymerizing it, that is, a near-infrared absorbing material, The color has faded and the ability to absorb near-infrared rays has decreased significantly, and it is only when exposed to ultraviolet rays or sunlight that it becomes deep blue again and exhibits near-infrared absorption ability, while it is left in a dark place for a long time. The problem was that it exhibited so-called photochromism, which caused the color to fade over time. In the conventional near-infrared absorbing material containing WCj26 and 5nC12.2H20, the large change in spectral characteristics during the polymerization process and the extremely slow progress of photochromism are caused by
This is an undesirable phenomenon in providing industrial products such as optical filters and heat-absorbing glazing with a certain level of quality.
また、メタクリル酸メチルシラツブを反応溶媒として、
これにt+cI!、6とSnCl 2 ・2HzOを
溶解する方法のため、フィルターの基体となる樹脂はポ
リメタクリル酸メチルに限られてしまい、製造の方法も
限定され形状・加工性・表面特性など工業製品として多
様なニーズに応えることができないという問題点もあっ
た。In addition, using methyl methacrylate as a reaction solvent,
T+cI for this! , 6 and SnCl 2 .2HzO, the resin that serves as the base of the filter is limited to polymethyl methacrylate, and the manufacturing method is also limited, making it difficult to use a variety of industrial products in terms of shape, processability, and surface properties. There was also the problem of not being able to meet needs.
さら4電Cf6は不安定であり、分解して塩化水素ガス
を発生するので重合性原料中に未反応のwci、6が残
存していると刺激臭が強く重合性原料の取扱いが困難で
あり、金属に対する腐食性もあるので調合する容器や重
合設備の材質が限定されてしまう。また−C16とリン
酸エステルおよび/または亜リン酸エステルとの反応に
よって副生ずる塩化水素と塩化アルキルが重合性原料中
に含まれていると、上記刺激性、腐食性の問題の他に重
合して得られた近赤外線吸収性の樹脂板には重合歪が発
生してしまうという問題があった。Furthermore, Cf6 is unstable and decomposes to generate hydrogen chloride gas, so if unreacted wci, 6 remains in the polymerizable raw material, it has a strong irritating odor and is difficult to handle. However, since it is corrosive to metals, the materials for the preparation container and polymerization equipment are limited. Furthermore, if the polymerizable raw material contains hydrogen chloride and alkyl chloride, which are by-produced by the reaction between -C16 and a phosphoric acid ester and/or a phosphorous acid ester, in addition to the above-mentioned irritation and corrosion problems, polymerization may also occur. There was a problem in that the near-infrared absorbing resin plate obtained by this method suffered from polymerization strain.
したがって、本発明は、上述の問題点を解決すべく、メ
タクリル酸メチルシラツブを反応溶媒として限定して用
いる必要がなく、かつ近赤外線吸収能及びその安定性の
優れた近赤外線吸収性樹脂組成物およびその製造方法を
提供することを目的とする。Therefore, in order to solve the above-mentioned problems, the present invention provides a near-infrared absorbing resin composition that does not require limited use of methyl methacrylate as a reaction solvent and has excellent near-infrared absorption ability and stability. The purpose is to provide a manufacturing method thereof.
本発明者等は、重合過程での不安定性を改良し、フォト
クロミズムを抑制することを目的とする近赤外線吸収性
樹脂組成物とその製造方法について鋭意検討を重ねた結
果、六塩化タングステンとリン酸エステルおよび/また
は亜リン酸エステルを組み合せて用いることによってな
されることを見出し本発明を完成した。The present inventors have conducted intensive studies on near-infrared absorbing resin compositions and methods for producing the same, which aim to improve instability during the polymerization process and suppress photochromism. The present invention was completed by discovering that the present invention can be achieved by using a combination of esters and/or phosphite esters.
すなわち本発明の要旨とするところは、(1)透明樹脂
100重量部に対して、六塩化タングステン0.01〜
10重量部と、六塩化タングステンの少なくとも2倍モ
ル以上のリン酸エステルおよび/または亜リン酸エステ
ルとを反応させて得られた実質的に塩素を含まない混合
物を含有せしめてなる近赤外線吸収性樹脂組成物、およ
び(2) (a) (メタ)アクリル酸モノエステル
単量体を主体とし、その重合体を含有していてもよい不
飽和単量体および/または(メタ)アクリル酸多価エス
テル単量体100重量部に対して、(b)六塩化タング
ステン0.01〜10重量部と、該六塩化タングステン
に対して少なくとも2倍モルのリン酸エステルおよび/
または亜リン酸エステルとを反応させて得られた実質的
に塩素を含まない混合物を添加混合せしめた後、ラジカ
ル重合開始剤の存在下で重合させることを特徴とする近
赤外線吸収性樹脂組成物の製造方法である。That is, the gist of the present invention is as follows: (1) 0.01 to 0.01 to tungsten hexachloride to 100 parts by weight of transparent resin;
A near-infrared absorbing material containing a substantially chlorine-free mixture obtained by reacting 10 parts by weight with a phosphoric acid ester and/or a phosphorous acid ester in an amount at least twice as much in mole as that of tungsten hexachloride. a resin composition, and (2) (a) an unsaturated monomer and/or (meth)acrylic acid polyhydric acid which is mainly composed of a (meth)acrylic acid monoester monomer and may contain a polymer thereof; For 100 parts by weight of the ester monomer, (b) 0.01 to 10 parts by weight of tungsten hexachloride, and at least twice the molar amount of phosphoric acid ester and/or tungsten hexachloride.
or a near-infrared absorbing resin composition characterized by adding and mixing a substantially chlorine-free mixture obtained by reacting with a phosphite ester, and then polymerizing the mixture in the presence of a radical polymerization initiator. This is a manufacturing method.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明における透明樹脂とは、実質的に透明であって吸
収・散乱が大きくない樹脂であればよく特に制限はない
が、その具体的なものとしては、アクリル樹脂、アリル
ジグリコールカーボネート樹脂、スチレン系樹脂、塩化
ビニル樹脂、ポリカーボネート樹脂、オレフィン系樹脂
、エポキシ樹脂、ポリアミド樹脂等をあげることができ
、実質的に透明であれば、上記1種類の樹脂にも限らず
、2種以上の樹脂をブレンドしたものも用いることがで
きる。これらの透明樹脂のうちアクリル樹脂である熱可
塑性の又は架橋された(メタ)アクリル酸エステル樹脂
が近赤外線吸収性能を有する反応混合物の分散性の点で
好ましく、また耐候性の点と加味すればメタクリル酸メ
チル単独又はメタクリル酸メチル単位を50%以上含有
するメタクリル樹脂が望ましい。The transparent resin in the present invention is not particularly limited as long as it is substantially transparent and does not have large absorption/scattering properties, but specific examples thereof include acrylic resin, allyl diglycol carbonate resin, and styrene resin. resins, vinyl chloride resins, polycarbonate resins, olefin resins, epoxy resins, polyamide resins, etc., and as long as they are substantially transparent, it is not limited to one type of resin, but two or more types of resins can be used. Blends can also be used. Among these transparent resins, thermoplastic or crosslinked (meth)acrylic acid ester resins such as acrylic resins are preferable from the viewpoint of dispersibility of the reaction mixture having near-infrared absorbing performance, and also from the viewpoint of weather resistance. A methacrylic resin containing methyl methacrylate alone or 50% or more of methyl methacrylate units is desirable.
本発明において(メタ)アクリル酸モノエステル単量体
を主体とし、その重合体を含有していてもよい不飽和単
量体とは、(メタ)アクリル酸モノエステル単量体単独
、該単量体混合物、または(メタ)アクリル酸モノエス
テルを主成分とし、これと共重合し得る他の不飽和単量
体との混合物あるいは当該単量体もしくは単量体混合物
中にこれらの重合体を溶解含有するシラツブである。他
の不飽和単量体との混合物中(メタ)アクリル酸モノエ
ステルの割合は50重量%以上、好ましくは60重量%
以上、更に好ましくは80重量%以上である。(メタ)
アクリル酸モノエステルの具体的な例としては、(メタ
)アクリル酸メチル(アクリル酸メチルあるいはメタク
リル酸メチルの意。以下同じ)、(メタ)アクリル酸エ
チル、(メタ)アクリル酸ブチル、(メタ)アクリル酸
シクロヘキシル、(メタ)アクリル酸2−エチルヘキシ
ル、(メタ)アクリル酸メトキシエチル、(メタ)アク
リル酸エトキシエチル、(メタ)アクリル酸N、N−ジ
エチルアミノエチル、(メタ)アクリル酸グリシジル、
(メタ)アクリル酸テトラヒドロキシフルフリール、(
メタ)アクリル酸ベンジル、(メタ)アクリル酸ヒドロ
キシエチル等を上げることができ、これらの1種類また
は2種類以上が用いられるが、耐候性を考慮した場合メ
タクリル酸メチルが好ましい。共重合可能な他の不飽和
単量体の例は、(メタ)アクリル酸、(メタ)アクリル
ニトリル、(メタ)アクリルアミド、スチレン、α−ス
チレン、ビニルトルエン、無水マレイン酸等を挙げるこ
とができる。(メタ)アクリル酸エステルの部分重合物
を得る方法としては、通常行われているように塊状予備
重合により部分重合物を得る方法、あるいは重合物を単
量体に溶解する方法があげられ、注入を考慮して35重
量%以下の重合体含有率に調整することが好ましい。In the present invention, the unsaturated monomer which is mainly composed of a (meth)acrylic acid monoester monomer and may contain a polymer thereof refers to the (meth)acrylic acid monoester monomer alone, or a mixture containing (meth)acrylic acid monoester as the main component and other unsaturated monomers that can be copolymerized with it, or dissolving these polymers in the monomer or monomer mixture. It is a shirub that contains. The proportion of (meth)acrylic acid monoester in the mixture with other unsaturated monomers is 50% by weight or more, preferably 60% by weight.
The content is more preferably 80% by weight or more. (meta)
Specific examples of acrylic acid monoesters include methyl (meth)acrylate (meaning methyl acrylate or methyl methacrylate; the same applies hereinafter), ethyl (meth)acrylate, butyl (meth)acrylate, and (meth)ethyl acrylate. Cyclohexyl acrylate, 2-ethylhexyl (meth)acrylate, methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate,
Tetrahydroxyfurfuryl (meth)acrylate, (
Examples include benzyl meth)acrylate and hydroxyethyl (meth)acrylate, and one or more of these may be used, but methyl methacrylate is preferred in consideration of weather resistance. Examples of other copolymerizable unsaturated monomers include (meth)acrylic acid, (meth)acrylonitrile, (meth)acrylamide, styrene, α-styrene, vinyltoluene, maleic anhydride, etc. . Methods for obtaining partial polymers of (meth)acrylic acid esters include the commonly used method of obtaining partial polymers by bulk prepolymerization, or the method of dissolving polymers in monomers. In consideration of this, it is preferable to adjust the polymer content to 35% by weight or less.
本発明において用いられる(メタ)アクリル酸多価エス
テルの例としてはポリオールポリ(メタ)アクリレート
、ポリエステル(メタ)アクリレート、エポキシ(メタ
)アクリレート、ポリウレタン(メタ)アクリレート等
が挙げることができる。Examples of the (meth)acrylic acid polyester used in the present invention include polyol poly(meth)acrylate, polyester (meth)acrylate, epoxy (meth)acrylate, polyurethane (meth)acrylate, and the like.
さらにポリオールポリ(メタ)アクリレートの具体的な
例としては、エチレングリコールジ(メタ)アクリレー
ト、トリエチレングリコールジ(メタ)アクリレート、
トリプロピレングリコールジ(メタ)アクリレート、ト
リメチロールエタンジ(メタ)アクリレート、ネオベン
チルグリコールジ(メタ)アクリレート、トリメチロー
ルプロパントリ (メタ)アクリレート、ペンタエリス
リトールテトラ(メタ)アクリレートであり、ポリエス
テル(メタ)アクリレートの具体的な例は多価アルコー
ルとしてエチレングリコール、1.4−ブタンジオール
、ジエチレングリコール、トリメチロールプロパンポリ
エチレングリコール、ペンタエリスリトール等と、多塩
基酸としてフタル酸、アジピン酸、マレイン酸、イタコ
ン酸、テレフタル酸等を反応させて合成したポリエステ
ルの(メタ)アクリレートであり、エポキシ(メタ)゛
アクリレートの具体的な例としてビスフェノールA−エ
ピクロルヒドリン型、フェノールノボラック−エピクロ
ルヒドリン型、脂環型エポキシ樹脂等のエポキシ樹脂の
(メタ)アクリレートであり、ポリウレタン(メタ)ア
クリレートの具体的な例としてはトリレンジイソシアネ
ート、ジフェニルメタンジイソシアネートなどのイソシ
アネート類の(メタ)アクリレートを挙げることができ
、これらの1種または2種以上の単量体が用いられる。Furthermore, specific examples of polyol poly(meth)acrylate include ethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate,
Tripropylene glycol di(meth)acrylate, trimethylolethane di(meth)acrylate, neobentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, and polyester(meth)acrylate. ) Specific examples of acrylates include polyhydric alcohols such as ethylene glycol, 1,4-butanediol, diethylene glycol, trimethylolpropane polyethylene glycol, and pentaerythritol, and polybasic acids such as phthalic acid, adipic acid, maleic acid, and itaconic acid. It is a (meth)acrylate of polyester synthesized by reacting , terephthalic acid, etc. Specific examples of epoxy (meth)acrylate include bisphenol A-epichlorohydrin type, phenol novolac-epichlorohydrin type, alicyclic epoxy resin, etc. It is a (meth)acrylate of an epoxy resin, and specific examples of polyurethane (meth)acrylate include (meth)acrylates of isocyanates such as tolylene diisocyanate and diphenylmethane diisocyanate, and one or two of these The above monomers are used.
本発明に用いられる(a)(メタ)アクリル酸モノエス
テル単量体を主体とし、その重合体を含有していてもよ
い不飽和単量体および/または(メタ)アクリル酸多価
エステル単量体(以下(メタ)アクリル酸エステル単量
体などと称す)とは、前記(メタ)アクリル酸モノエス
テル単量体を主体としその重合体を含有していてもよい
不飽和単量体、前記(メタ)アクリル酸多価エステル単
量体およびこれらの混合物の場合をそれぞれ意味し、そ
の組成については広範囲にとることができる。(a) Unsaturated monomers and/or (meth)acrylic acid polyester monomers that are mainly composed of (meth)acrylic acid monoester monomers and may contain polymers thereof used in the present invention (hereinafter referred to as (meth)acrylic acid ester monomer etc.) refers to an unsaturated monomer mainly composed of the above-mentioned (meth)acrylic acid monoester monomer and which may contain a polymer thereof; The term refers to a (meth)acrylic acid polyester monomer and a mixture thereof, and the composition thereof can be varied over a wide range.
本発明において用いられるリン酸エステルは次式(1)
で示されるフォスフエート
(但し式中nは1.2あるいは3であり、Rは炭素数1
〜18のアルキル基、アリル基、アリール基、アラルキ
ル基、(メタ)アクリロキシアルキル基あるいはそれの
誘導体を示す。)であり、具体的な例としては、モノエ
チルフォスフェート、ジエチルフォスフェート、トリエ
チルフォスフェート、モノブチルフォスフェート、ジブ
チルフォスフェート、トリブチルフォスフェート、モノ
ブトキシエチルフォスフェート、モノ(2−エチルヘキ
シル)フォスフェート、ビス(2−エチルヘキシル)フ
ォスフェート、トリス(2−エチルヘキシル)フォスフ
ェート、モノフェニルフォスフェート、ジフェニルフォ
スフェート、トリフェニルフォスフェート、モノ(2−
クロロエチル)フォスフェート、ビス(2−クロロエチ
ル)フォスフェート、トリス(2−クロロエチル)フォ
スフェート、モノ(2−ヒドロキシエチルメタクリレー
ト)フォスフェート、ビス(2−ヒドロキシエチルメタ
クリレート)フォスフェート、トリス(2ヒドロキシエ
チルメタクリレート)フォスフェート等であり、これら
のうちでジエステル、トリエステル、またはこれらの混
合物を好ましい例としてあげることができる。The phosphoric acid ester used in the present invention is represented by the following formula (1)
Phosphate represented by (where n is 1.2 or 3, R is 1 carbon number)
~18 alkyl groups, allyl groups, aryl groups, aralkyl groups, (meth)acryloxyalkyl groups, or derivatives thereof. ), and specific examples include monoethyl phosphate, diethyl phosphate, triethyl phosphate, monobutyl phosphate, dibutyl phosphate, tributyl phosphate, monobutoxyethyl phosphate, and mono(2-ethylhexyl) phosphate. Phate, bis(2-ethylhexyl) phosphate, tris(2-ethylhexyl) phosphate, monophenyl phosphate, diphenyl phosphate, triphenyl phosphate, mono(2-
chloroethyl) phosphate, bis(2-chloroethyl) phosphate, tris(2-chloroethyl) phosphate, mono(2-hydroxyethyl methacrylate) phosphate, bis(2-hydroxyethyl methacrylate) phosphate, tris(2-hydroxyethyl) phosphate methacrylate) phosphate, etc., and among these, diesters, triesters, and mixtures thereof are preferred examples.
本発明において用いられる亜リン酸エステルは次式(2
)で示されるフォスファイト
(但し式中nは1,2あるいは3であり、Rは炭素数1
〜18のアルキル基、アリル基、アリール基、アラルキ
ル基、(メタ)アクリロキシアルキル基あるいはそれの
誘導体を示す。)であり、具体的な例としては、モノエ
チルフォスファイト、ジエチルフォスファイト、トリエ
チルフォスファイト、モノブチルフォスファイト、ジブ
チルフォスファイト、トリブチルフォスファイト、モノ
(2−エチルヘキシル)フォスファイト、ビス(2−エ
チルヘキシル)フォスファイト、トリス(2−エチルヘ
キシル)フォスファイト、モノデシルフォスファイト、
ジデシルフォスファイト、トリデシルフォスファイト、
モノステアリルフォスファイト、ジステアリルフォスフ
ァイト、トリステアリルフォスファイト、モノフェニル
フォスファイト、ジフェニルフォスファイト、トリフェ
ニルフォスファイト、モノ(ノニルフェニル)フォスフ
ァイト、ビス(ノニルフェニル)フォスファイト、トリ
ス(ノニルフェニル)フォスファイト、モノ(2,3−
ジクロロプロピル)フォスファイト、ビス(2,3−ジ
クロロプロピル)フォスファイト、トリス(2,3−ジ
クロロプロピル)フォスファイト等であり、これらのう
ちでジエステル、トリエステルを好ましい例としてあげ
ることができる。The phosphite used in the present invention is expressed by the following formula (2
) (where n is 1, 2 or 3, R is 1 carbon number)
~18 alkyl groups, allyl groups, aryl groups, aralkyl groups, (meth)acryloxyalkyl groups, or derivatives thereof. ), and specific examples include monoethylphosphite, diethylphosphite, triethylphosphite, monobutylphosphite, dibutylphosphite, tributylphosphite, mono(2-ethylhexyl)phosphite, bis(2- ethylhexyl) phosphite, tris(2-ethylhexyl) phosphite, monodecyl phosphite,
didecyl phosphite, tridecyl phosphite,
Monostearylphosphite, distearylphosphite, tristearylphosphite, monophenylphosphite, diphenylphosphite, triphenylphosphite, mono(nonylphenyl)phosphite, bis(nonylphenyl)phosphite, tris(nonylphenyl) Phosphite, mono(2,3-
These include dichloropropyl) phosphite, bis(2,3-dichloropropyl) phosphite, tris(2,3-dichloropropyl) phosphite, and among these, diesters and triesters are preferred examples.
本発明において用いられる六塩化タングステン、リン酸
エステルおよび亜リン酸エステルは、目的とする樹脂組
成物の可視および近赤外域の透過率の設定および樹脂組
成物の板厚によってその量を変えることができるが、六
塩化タングステンの量は透明樹脂100重量部に対して
、0.01〜10重量部、好ましくは0.05〜5重量
部である。六塩化タングステンか0.01重量部未満の
場合には近赤外線吸収能の向上が十分でな(,10重量
部を超える場合には近赤外線吸収能の向上が見られず重
合原料中に不溶解部分が残る虞れがある。The amount of tungsten hexachloride, phosphate ester, and phosphite used in the present invention can be changed depending on the visible and near-infrared transmittance setting of the target resin composition and the thickness of the resin composition. However, the amount of tungsten hexachloride is 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight, based on 100 parts by weight of the transparent resin. If the amount of tungsten hexachloride is less than 0.01 part by weight, the near-infrared absorption ability will not be improved sufficiently (if it exceeds 10 parts by weight, the near-infrared absorption ability will not improve and it will not be dissolved in the polymerization raw material. There is a risk that some parts may remain.
リン酸エステルおよび/または亜リン酸エステルの量は
、六塩化タングステン量に対して少なくとも2倍モル、
好ましくは2〜300倍モル、さらに好ましくは2〜1
00倍モルである。六塩化タングステンとリン酸エステ
ルおよび/または亜リン酸エステルとを反応させると塩
化水素および/または塩化アルキルが副生ずるが、リン
酸エステルおよび/または亜リン酸エステルの量が六塩
化タングステンの2倍モル未満の場合には得られた反応
混合物中に塩素が残る戊れがある。このため調合や重合
時において刺激臭がしたり、器具、装置等の材質が限定
されるなどの不都合が生じ、またこの反応混合物を含む
近赤外線吸収性の樹脂板には重合歪が発生するなどの問
題があり、これらの事を考慮すると2倍モル以上が望ま
しい。一方、リン酸エステルおよび/または亜リン酸エ
ステルの量が多すぎると、すなわち大塩化タングステン
の500倍モルを超える場合には、樹脂の機械的強度等
の物性低下が大きくなり好ましくない。The amount of phosphoric acid ester and/or phosphite ester is at least twice the amount of tungsten hexachloride,
Preferably 2 to 300 times the mole, more preferably 2 to 1
00 times the mole. When tungsten hexachloride is reacted with phosphate ester and/or phosphite, hydrogen chloride and/or alkyl chloride are produced as by-products, but the amount of phosphate and/or phosphite is twice that of tungsten hexachloride. If the amount is less than mol, chlorine may remain in the resulting reaction mixture. This causes inconveniences such as an irritating odor during compounding and polymerization, and limitations on the materials used for instruments and devices, and polymerization distortion occurs in near-infrared absorbing resin plates containing this reaction mixture. Considering these problems, it is desirable to use at least twice the molar amount. On the other hand, if the amount of the phosphoric acid ester and/or the phosphite ester is too large, that is, if the amount exceeds 500 times the mole of large tungsten chloride, the physical properties such as mechanical strength of the resin will decrease significantly, which is not preferable.
本発明において透明樹脂に対して配合される混合物は、
六塩化タングステンとリン酸エステル、六塩化タングス
テンと亜リン酸エステル、あるいは六塩化タングステン
とリン酸エステルおよび亜リン酸エステルをそれぞれ出
発原料として得られ、これらの原料を充分に混合される
ように攪拌しながら反応することが、六塩化タングステ
ン(WCl &)の溶解性・反応性の点から好ましい。The mixture blended into the transparent resin in the present invention is
Tungsten hexachloride and phosphate ester, tungsten hexachloride and phosphite ester, or tungsten hexachloride and phosphate ester and phosphite ester are obtained as starting materials, respectively, and these raw materials are stirred so that they are thoroughly mixed. It is preferable to react while the tungsten hexachloride (WCl &) is reacted from the viewpoint of solubility and reactivity.
このときリン酸エステルおよび/または亜リン酸エステ
ルが液体の場合には、この液体中に一〇!6を添加して
反応を行ってもよく、あるいは溶媒中に一〇!6とリン
酸エステルおよび/または亜リン酸エステルを添加し反
応を行ってもよい。また室温で固体のリン酸エステルお
よび/または亜リン酸エステルの場合には、これらを融
点以上に加熱し溶融状態で一〇16を添加してもよく、
あるいは溶媒に溶解させてから反応を行ってもよい。溶
媒としては、反応させて得られた混合物が溶解し、溶媒
沸点が反応温度より著しく低くないものであれば特に限
定はなく、また溶媒の量としては少なくとも出発原料を
熔解する程度の量があればよい。該混合物を得るための
反応条件としては、室温あるいは室温より若干高い温度
から出発原料の1つであるリン酸エステルあるいは亜リ
ン酸エステルが激しく分解を起こさない程度の温度以下
で反応を行うことが望ましく、具体的には20〜200
°C1好ましくは30〜180°C1さらに好ましくは
50〜150°Cの温度で、30時間以下、好ましくは
0.5〜20時間、さらに好ましくは1〜10時間反応
を行なう。At this time, if the phosphate ester and/or phosphite ester is a liquid, 10! The reaction may be carried out by adding 6! or 10! in the solvent. 6 and a phosphoric acid ester and/or a phosphorous acid ester may be added to carry out the reaction. In the case of phosphoric acid esters and/or phosphorous esters that are solid at room temperature, 1016 may be added in the molten state by heating them above their melting point.
Alternatively, the reaction may be carried out after dissolving it in a solvent. The solvent is not particularly limited as long as it dissolves the mixture obtained by the reaction and the boiling point of the solvent is not significantly lower than the reaction temperature, and the amount of the solvent must be at least enough to dissolve the starting materials. Bye. The reaction conditions for obtaining this mixture include carrying out the reaction at room temperature or a temperature slightly higher than room temperature, but at a temperature below which the phosphoric acid ester or phosphite ester, which is one of the starting materials, does not cause severe decomposition. Desirably, specifically 20 to 200
The reaction is carried out at a temperature of preferably 30 to 180°C, more preferably 50 to 150°C, for 30 hours or less, preferably 0.5 to 20 hours, and more preferably 1 to 10 hours.
このようにして得られた混合物中には、副生じた塩化水
素、塩化アルキル等の化合物の形で残存する塩素は存在
しないことが製品品質上又は取扱い上好ましいが、実質
的に塩素を含まない状態、例えば塩化水素、塩化アルキ
ル等の化合物換算で六塩化タングステン0.1倍モル以
下、好ましくは0.05倍モル以下であってもよい。こ
れら塩化水素、塩化アルキル等の化合物の形で該混合物
中に残存する塩素は混合物合成中又は合成後窒素ガスな
どの不活性ガスを吹き込むことによって容易に除去する
ことができる。In terms of product quality and handling, it is preferable that the mixture thus obtained does not contain residual chlorine in the form of by-product hydrogen chloride, alkyl chloride, or other compounds; however, it does not contain substantially chlorine. For example, the amount of tungsten hexachloride in terms of compounds such as hydrogen chloride and alkyl chloride may be 0.1 times the mole or less, preferably 0.05 times the mole or less. Chlorine remaining in the mixture in the form of compounds such as hydrogen chloride and alkyl chloride can be easily removed by blowing inert gas such as nitrogen gas during or after synthesis of the mixture.
このようにして本発明の実質的に塩素を含まない混合物
は、六塩化タングステン0.01〜10重量部と六塩化
タングステンの少なくとも2倍モル以上の前記リン酸エ
ステルおよび/または亜リン酸エステルとを反応せしめ
ることによって得られるが、更に近赤外線吸収性能を向
上し、経時的な安定性を向上する目的で、上記反応系中
に水を添加することができる。水の添加時期は、六塩化
タングステンとリン酸エステルおよび/または亜リン酸
エステルとを反応する前、反応中、あるいは反応した後
に添加してもよい。また水の添加量は、透明樹脂′10
0重量部に対して0.01〜1重量部、好ましくは0.
1〜0.5重量部である。In this way, the substantially chlorine-free mixture of the present invention comprises 0.01 to 10 parts by weight of tungsten hexachloride and at least twice the molar amount of the phosphoric acid ester and/or phosphorous ester of the tungsten hexachloride. Water can be added to the reaction system for the purpose of further improving near-infrared absorption performance and stability over time. Water may be added before, during, or after the reaction of tungsten hexachloride with the phosphoric acid ester and/or the phosphorous acid ester. Also, the amount of water added is transparent resin'10
0.01 to 1 part by weight, preferably 0.01 to 1 part by weight.
It is 1 to 0.5 parts by weight.
本発明の樹脂組成物は、前記透明樹脂100重量部に対
して、前記特定量の六塩化タングステンとリン酸エステ
ルおよび/または亜リン酸エステルとを反応させて得ら
れる混合物を含有せしめるものであり、優れた近赤外線
吸収能及びその安定性を有する。The resin composition of the present invention contains a mixture obtained by reacting the specific amount of tungsten hexachloride with a phosphoric acid ester and/or a phosphorous acid ester, with respect to 100 parts by weight of the transparent resin. , has excellent near-infrared absorption ability and stability.
本発明の近赤外線吸収性樹脂組成物の製造方法としては
、例えば前記透明樹脂中に近赤外線吸収能を有する前記
混合物を混合含有する方法、前記透明樹脂の構成単量体
、好ましくは前記(メタ)アクリル酸エステルなどの重
合性原料に前記混合物を添加、し重合する方法、あるい
は重合性原料に大塩化タングステンとリン酸エステルお
よび/または亜リン酸エステルとを添加混合し重合する
方法などが挙げられる。The method for producing the near-infrared absorbing resin composition of the present invention includes, for example, a method in which the mixture having near-infrared absorbing ability is mixed and contained in the transparent resin, a constituent monomer of the transparent resin, preferably the (meth) ) A method in which the above mixture is added to a polymerizable raw material such as an acrylic ester and then polymerized, or a method in which large tungsten chloride and a phosphoric ester and/or a phosphorous ester are added and mixed to a polymerizable raw material and polymerized. It will be done.
透明樹脂中に前記混合物を混合含有する方法には、たと
えば押出成形、射出成形、押圧成形、キャスト製膜等が
あげられる。押出成形あるいは射出成形により得る方法
としては、大塩化タングステンとリン酸エステルおよび
/または亜リン酸エステルとを反応させて得られた混合
物を熱可塑性透明樹脂のペレットと均一にまぜ、これを
溶融成形機に搬送するか、またはこの混合ペレットを溶
融し反応物が含有された樹脂のベレットを形成した後溶
融成形機に搬送して成形を行う。押圧成形ではプレス機
において成形することにより得られる。Examples of methods for mixing and containing the above-mentioned mixture in the transparent resin include extrusion molding, injection molding, press molding, and cast film forming. To obtain the product by extrusion molding or injection molding, a mixture obtained by reacting large tungsten chloride with a phosphoric acid ester and/or a phosphorous acid ester is uniformly mixed with pellets of a transparent thermoplastic resin, and this is melt-molded. Alternatively, the mixed pellets are melted to form pellets of resin containing the reactant and then transported to a melt molding machine for molding. In press molding, it is obtained by molding in a press machine.
本発明で使用される溶融成形機あるいはプレス機は通常
の成形品、シート、異形品の製造に用いる成形機が用い
られる。またキャスト製膜は溶剤に透明樹脂と近赤外線
吸収性の混合物を溶解してポリマー溶液を得て、これを
回転ドラム、ガラス板あるいは金属板等の上に流延して
溶剤を藤発除去して得られる。The melt molding machine or press machine used in the present invention is a molding machine used for manufacturing ordinary molded products, sheets, and irregularly shaped products. Cast film formation involves dissolving a mixture of transparent resin and near-infrared absorbing material in a solvent to obtain a polymer solution, which is then cast onto a rotating drum, glass plate, metal plate, etc. to remove the solvent. can be obtained.
また、透明樹脂の構成単量体、好ましくは(メタ)アク
リル酸エステルなどの重合性原料中に前記混合物を添加
し重合する方法の場合には、ラジカル重合開始剤の存在
下で行ない、たとえばこのラジカル重合開始剤を重合性
原料100重量部に対して0.0001〜2.0重量部
、望ましくは0.01〜1.0重量部添加し加熱重合す
ることが望ましい。In addition, in the case of a method in which the mixture is added to a polymerizable raw material such as a constituent monomer of a transparent resin, preferably a (meth)acrylic acid ester, and polymerized, it is carried out in the presence of a radical polymerization initiator. It is desirable to add a radical polymerization initiator in an amount of 0.0001 to 2.0 parts by weight, preferably 0.01 to 1.0 parts by weight, per 100 parts by weight of the polymerizable raw material, and conduct polymerization by heating.
また、アリルジグリコールカーボネートの重合性原料中
には前記混合物を添加しキャスト重合する方法の場合に
は、ラジカル重合開始剤の存在下で行ない、たとえばこ
のラジカル重合開始剤を重合性原料100重量部に対し
て0.1〜10重量部、望ましくは1.0〜5.0重量
部添加し加熱重合することが望ましい。In addition, in the case of a method of adding the above-mentioned mixture to the polymerizable raw material of allyl diglycol carbonate and performing cast polymerization, the process is carried out in the presence of a radical polymerization initiator. It is desirable to add 0.1 to 10 parts by weight, preferably 1.0 to 5.0 parts by weight, and heat polymerize.
このようなラジカル重合開始剤として用いられるアゾ系
重合開始剤の具体例として、2,2′−アゾビスイソブ
チロニトリル、■、1′−アゾビスー1−シクロヘキサ
ンカルボニトリル、2.2′−アゾビス−2,4−ジメ
チルバレロニトリル、22′アゾビス〜4−メトキシ−
2,4−ジメチルバレロニトリル等をあげることができ
、また過酸化物系重合開始剤の具体例としてt−ブチル
パーオキシイソブチレート、l、1′−ビス−t−ブチ
ルパーオキシ−3,3,5〜トリメチルシクロヘキサン
、ラウロイルパーオキサイド、ベンゾイルパーオキサイ
ド、ジイソプロピルパーオキシカーボネート等をあげる
ことができる。Specific examples of azo polymerization initiators used as such radical polymerization initiators include 2,2'-azobisisobutyronitrile, 1,1'-azobis-1-cyclohexanecarbonitrile, and 2,2'-azobisisobutyronitrile. -2,4-dimethylvaleronitrile, 22'azobis-4-methoxy-
Specific examples of peroxide polymerization initiators include 2,4-dimethylvaleronitrile, t-butylperoxyisobutyrate, l,1'-bis-t-butylperoxy-3, Examples include 3,5-trimethylcyclohexane, lauroyl peroxide, benzoyl peroxide, diisopropyl peroxycarbonate, and the like.
重合は塊状重合、好ましくは鋳込重合で行なわれる。鋳
型重合する方法としては上記組成物を常法に従い、周辺
をガスケットでシールして対向させた2枚のガラスの間
に注入して加熱する方法が挙げられる。重合温度は使用
するラジカル重合開始剤の種類によって異なるが、一般
に40〜140°Cであり、通常前段階の重合を40〜
90″C1後段階の重合を100〜140°Cで重合す
ることが望ましい。The polymerization is carried out in bulk, preferably in cast polymerization. A method for mold polymerization includes a method in which the above-mentioned composition is injected between two sheets of glass facing each other with the periphery sealed with a gasket and heated according to a conventional method. The polymerization temperature varies depending on the type of radical polymerization initiator used, but is generally 40 to 140°C, and the polymerization temperature in the previous stage is usually 40 to 140°C.
It is desirable that the post-90'' C1 polymerization be carried out at 100-140°C.
また、本発明の近赤外線吸収性樹脂組成物を光重合開始
剤の存在下で重合する場合、この光重合開始剤を重合性
原料100重量部に対して0.05〜20重量部、好ま
しくは0.1〜10重量部、さらに好ましくは0.2〜
5重量部添加することが望ましい。Further, when the near-infrared absorbing resin composition of the present invention is polymerized in the presence of a photopolymerization initiator, the photopolymerization initiator is added to 0.05 to 20 parts by weight, preferably 0.05 to 20 parts by weight, based on 100 parts by weight of the polymerizable raw material. 0.1 to 10 parts by weight, more preferably 0.2 to 10 parts by weight
It is desirable to add 5 parts by weight.
光重合開始剤として用いられる具体的な例としてはアセ
トフェノン、2,2−ジェトキシアセトフェノン、2−
ヒドロキシ−2−メチルプロピオフェノン、ベンゾフェ
ノン、4.4 ’ −ビスジメチルアミノベンゾフェノ
ン、1−ヒドロキシシクロへキシルフェニルケトン、t
−ブチルアントラキノン、ベンゾイン、ベンゾインエチ
ルエーテル等があげられ、この1種類または2種類以上
が用いられる。重合は前記重合性原料と光重合開始剤を
主成分とする混合物を例えば基板上に塗布するかあるい
はセル中に封入した後、光により硬化して得られる。こ
こで使用される基板は例えば硝子、プラスチック、金属
等がある。またセルを使用する場合にはセルの少なくと
も一方の面は光重合を開始するのに必要な光を透過しな
ければならず、透明な硝子、プラスチック等が好適であ
る。露光用光源としてし低圧水銀灯、高圧水銀灯、超高
圧水銀灯、キセノンランプ、メタルハライドランプ、紫
外線蛍光灯等を使用することができる。Specific examples of photopolymerization initiators include acetophenone, 2,2-jetoxyacetophenone, and 2-
Hydroxy-2-methylpropiophenone, benzophenone, 4.4'-bisdimethylaminobenzophenone, 1-hydroxycyclohexylphenylketone, t
-Butylanthraquinone, benzoin, benzoin ethyl ether, etc., and one or more of these may be used. Polymerization is achieved by applying a mixture containing the polymerizable raw material and a photopolymerization initiator as main components, for example, onto a substrate or encapsulating it in a cell, and then curing it with light. The substrates used here include, for example, glass, plastic, and metal. Furthermore, when a cell is used, at least one surface of the cell must transmit the light necessary to initiate photopolymerization, and transparent glass, plastic, etc. are suitable. As a light source for exposure, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, an ultraviolet fluorescent lamp, etc. can be used.
また、本発明において重合系中に水を添加することによ
り、樹脂組成物の近赤外線吸収性能を更に向上させ、近
赤外線吸収能の経時安定性を更に向上させることができ
る。添加する水の量は、前記重合性原料100重量部に
対して0.01〜1.0重量部、好ましくは0.1〜0
.5重量部が望ましい。Further, in the present invention, by adding water to the polymerization system, the near-infrared absorbing ability of the resin composition can be further improved, and the stability of the near-infrared absorbing ability over time can be further improved. The amount of water added is 0.01 to 1.0 parts by weight, preferably 0.1 to 0 parts by weight, based on 100 parts by weight of the polymerizable raw material.
.. 5 parts by weight is desirable.
本発明の実施にあたっては種々の添加剤、例えば着色に
用いられる染顔料、酸化防止剤、紫外線吸収等の安定剤
、難燃剤、可望剤、重合調節側、剥離剤などを添加する
ことができ、また、基板上に塗布するなどコーティング
組成物として用いる場合には、前記重合性原料に有機溶
剤を添加することができ、これらの添加剤の種類および
量は本発明の目的を達する範囲内で任意に選択すること
ができる。In carrying out the present invention, various additives may be added, such as dyes and pigments used for coloring, antioxidants, stabilizers for ultraviolet absorption, flame retardants, desensitizers, polymerization control agents, release agents, etc. Furthermore, when used as a coating composition, such as by applying it on a substrate, an organic solvent can be added to the polymerizable raw material, and the type and amount of these additives can be determined within the range that achieves the purpose of the present invention. Can be selected arbitrarily.
このようにして製造された近赤外線吸収性樹脂組成物は
、樹脂板、フィルム、塗膜等の形態をとることにより近
赤外線吸収能を簡便に付与した光学的フィルターや熱線
吸収性グレージングとして用いることができ、例えば熱
線吸収材料、肉眼保護フィルター、半導体受光素子用赤
外吸収フィルター、赤外感光性の感光材料用セーフライ
トフィルターに好適である。The near-infrared absorbing resin composition produced in this way can be used as an optical filter or heat ray-absorbing glazing that easily imparts near-infrared absorbing ability by taking the form of a resin plate, film, coating film, etc. For example, it is suitable for heat ray absorbing materials, eye protection filters, infrared absorption filters for semiconductor light-receiving elements, and safelight filters for infrared-sensitive photosensitive materials.
以下、本発明を具体的実施例をもって説明するが、これ
らの実施例に限定されるものではない。Hereinafter, the present invention will be explained using specific examples, but it is not limited to these examples.
なお、実施例中において部は重量部を表わし、また得ら
れた樹脂組成物の透過スペクトルは分光光度計(■日立
製作所:U−3410型)で測定した。In the examples, parts represent parts by weight, and the transmission spectra of the resin compositions obtained were measured with a spectrophotometer (U-3410 model, manufactured by Hitachi, Ltd.).
実施例1
300 d三つロフラスコに六塩化タングステン(讐C
l h)60.0部とJ P−504124,2部を入
れテフロン製の撹拌棒・羽根で攪拌しながら、三つロフ
ラスコをオイルハス中で除々に加熱して、120°C6
時間反応を行った。この時副生した塩化水素を水酸化ナ
トリウム水溶液に吸収させ、この温度変化から発生量を
測定した。また三つロフラスコに窒素ガスを吹込み副生
じた塩化ブチルを三つロフラスコから追い出した。発生
量は塩化水素が六塩化タングステンの4.10倍モル、
塩化ブチルは1.85倍モルであった。Example 1 Tungsten hexachloride (C
l h) Add 60.0 parts and 2 parts of JP-504124 and gradually heat the three-necked flask in an oil bath while stirring with a Teflon stirring rod/impeller to 120°C6.
A time reaction was performed. Hydrogen chloride produced as a by-product at this time was absorbed into an aqueous sodium hydroxide solution, and the amount generated was measured from the temperature change. In addition, nitrogen gas was blown into the three-necked flask to expel the by-produced butyl chloride from the three-necked flask. The amount of hydrogen chloride generated is 4.10 times the mole of tungsten hexachloride,
Butyl chloride was 1.85 times the molar amount.
得られた近赤外線吸収能を有する混合物の19.0部を
とり、予め0.3部の水を溶解させておいたメタクリル
酸メチル12,000部に添加し溶解させ、比較例1と
同様に剥離剤、紫外線吸収剤および重合触媒を添加し重
合を行い、板厚3Wlの樹脂板を得た。19.0 parts of the obtained mixture having near-infrared absorption ability was added to 12,000 parts of methyl methacrylate in which 0.3 parts of water had been dissolved in advance, and dissolved in the same manner as in Comparative Example 1. A release agent, an ultraviolet absorber, and a polymerization catalyst were added and polymerization was carried out to obtain a resin plate having a thickness of 3Wl.
得られた樹脂板の透過スペクトルを測定し、その結果を
第1図中のAで示すが、同図に示す板厚3mmの通常の
メタクリル樹脂板(■クラレ製:パラグラス)の透過ス
ペクトルBとの比較がられがるように、この樹脂板は可
視域の先は比較的よく透過するが通常のメタクリル樹脂
板には見られない近赤外域の吸収能にすぐれていた。ま
たこの樹脂板には重合歪は見られず外観が非常に良好で
あった。The transmission spectrum of the obtained resin plate was measured, and the results are shown in A in Figure 1. The transmission spectrum B of a normal methacrylic resin plate (Kuraray: Paraglass) with a thickness of 3 mm is shown in the same figure. As can be seen from the comparison, this resin plate has relatively good transmission beyond the visible range, but it has excellent absorption ability in the near-infrared range, which is not found in ordinary methacrylic resin plates. Moreover, no polymerization distortion was observed in this resin plate, and the appearance was very good.
比較例1
300 d三つロフラスコに六塩化タングステン(Kp
&)60.0部とモノブチルフォスフェートとジブチ
ルフォスフェートの混合物(城北化学KK製:商品名J
P −504) 124.2部を入れテフロン製の撹
拌棒・羽根で攪拌しながら、三つロフラスコをオイルバ
ス中で除々に加熱して、120”C2時間反応を行った
。この時副生ずる塩化水素は水酸化ナトリウム水溶液に
吸収させ、この濃度変化から発生量を測定したところ、
六塩化タングステンの4.2倍モルであった。Comparative Example 1 Tungsten hexachloride (Kp
&) 60.0 parts, a mixture of monobutyl phosphate and dibutyl phosphate (manufactured by Johoku Kagaku KK: product name J
P-504) 124.2 parts was added, and while stirring with a Teflon stirring rod/impeller, the three-necked flask was gradually heated in an oil bath to conduct a reaction at 120"C for 2 hours. At this time, the chloride produced as a by-product Hydrogen was absorbed into an aqueous sodium hydroxide solution, and the amount generated was measured from the change in concentration.
The mole amount was 4.2 times that of tungsten hexachloride.
得られた近赤外線吸収能を有し、塩素を含有する混合物
の19.0部をとり予め0.3部の水を溶解させておい
たメタクリル酸メチル12,000部に添加し溶解させ
、剥離剤としてZelec U N (デュポン社製)
12.0部、紫外線吸収剤としてTinuvin 3
27(チハガイギー社製) 24.0部および重合触媒
として2.2′−アゾビス−2,4−ジメチルバレロニ
トリル12.0部を添加混合した。これを常法に従って
、ガスケットを2枚のガラスにはさんでつくった鋳型間
に注入し、60°C5時間加熱し、ついで120°Cで
2時間加熱を行って重合を完了させ、冷却ガラスより剥
離させて板厚3−の樹脂板を得た。19.0 parts of the obtained mixture having near-infrared absorbing ability and containing chlorine was added to 12,000 parts of methyl methacrylate in which 0.3 part of water had been dissolved in advance, and then peeled off. Zelec UN (manufactured by DuPont) as an agent
12.0 parts, Tinuvin 3 as UV absorber
27 (manufactured by Chiha Geigy) and 12.0 parts of 2.2'-azobis-2,4-dimethylvaleronitrile as a polymerization catalyst were added and mixed. This was injected into a mold made by sandwiching a gasket between two pieces of glass according to a conventional method, heated at 60°C for 5 hours, then heated at 120°C for 2 hours to complete polymerization, and then released from the cooled glass. A resin plate having a thickness of 3 mm was obtained by peeling.
得られた樹脂板の第2図に示す様な範囲で重合歪が発生
しており、熱線吸収板や光学フィルターにとって重要な
外観性が損われたものになった。Polymerization strain occurred in the area shown in FIG. 2 of the obtained resin plate, and the appearance, which is important for heat ray absorption plates and optical filters, was impaired.
本発明は以上述べたように、透明樹脂に、六塩化タング
ステンと、リン酸エステルおよび/または亜リン酸エス
テルとを反応させて得られた実質的に塩素を含まない混
合物を含有せしめてなる近赤外線吸収性樹脂組成物とそ
の製造方法であるから、得られた樹脂組成物は重合過程
での褪色など不安定性はなく、すぐれた近赤外線吸収能
を示し、六塩化タングステンの刺激臭や腐食性を考慮す
る必要がなく、良好的な外観を有するので、光学的フィ
ルター、熱線吸収グレージング材等として工業的に有用
である。As described above, the present invention provides a transparent resin containing a substantially chlorine-free mixture obtained by reacting tungsten hexachloride with a phosphoric acid ester and/or a phosphorous acid ester. Because it is an infrared absorbing resin composition and its manufacturing method, the resulting resin composition does not have any instability such as fading during the polymerization process, has excellent near-infrared absorbing ability, and has no irritating odor or corrosiveness of tungsten hexachloride. There is no need to take this into consideration, and it has a good appearance, so it is industrially useful as an optical filter, a heat ray absorbing glazing material, etc.
第1図は透過スペクトルを表わした図面、第2図は比較
例1で得られた樹脂板の歪状態を示した外観概略図であ
る。
A;実施例1で得られた樹脂板の透過スペクトル、B;
通常のメタクリル樹脂層の透過スペクトルFIG. 1 is a drawing showing a transmission spectrum, and FIG. 2 is a schematic external view showing the strained state of the resin plate obtained in Comparative Example 1. A; Transmission spectrum of the resin plate obtained in Example 1; B;
Transmission spectrum of normal methacrylic resin layer
Claims (3)
テン0.01〜10重量部と、六塩化タングステンの少
なくとも2倍モルのリン酸エステルおよび/または亜リ
ン酸エステルとを反応させて得られた実質的に塩素を含
まない混合物を含有せしめてなる近赤外線吸収性樹脂組
成物。(1) Obtained by reacting 0.01 to 10 parts by weight of tungsten hexachloride with phosphoric acid ester and/or phosphorous acid ester in an amount at least twice the mole of tungsten hexachloride with respect to 100 parts by weight of a transparent resin. A near-infrared absorbing resin composition comprising a substantially chlorine-free mixture.
る請求項1記載の近赤外線吸収性樹脂組成物。(2) The near-infrared absorbing resin composition according to claim 1, wherein the transparent resin is a (meth)acrylic acid ester resin.
主体とし、その重合体を含有していてもよい不飽和単量
体および/または(メタ)アクリル酸多価エステル単量
体100重量部に対して、(b)六塩化タングステン0
.01〜10重量部と、該六塩化タングステンに対して
少なくとも2倍モルのリン酸エステルおよび/または亜
リン酸エステルとを反応させて得られた実質的に塩素を
含まない混合物を添加混合せしめた後、ラジカル重合開
始剤の存在下で重合させることを特徴とする近赤外線吸
収性樹脂組成物の製造方法。(3) (a) Unsaturated monomers and/or (meth)acrylic acid polyvalent ester monomers mainly composed of (meth)acrylic acid monoester monomers and which may contain polymers thereof 100 Based on parts by weight, (b) 0 tungsten hexachloride
.. A substantially chlorine-free mixture obtained by reacting 1 to 10 parts by weight of 01 to 10 parts by weight with a phosphoric acid ester and/or a phosphorous acid ester in an amount at least twice the mole of the tungsten hexachloride was added and mixed. A method for producing a near-infrared absorbing resin composition, which comprises subsequently polymerizing in the presence of a radical polymerization initiator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14393590A JPH0436337A (en) | 1990-05-31 | 1990-05-31 | Near-infrared-absorbing resin composition and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14393590A JPH0436337A (en) | 1990-05-31 | 1990-05-31 | Near-infrared-absorbing resin composition and its production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0436337A true JPH0436337A (en) | 1992-02-06 |
Family
ID=15350496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14393590A Pending JPH0436337A (en) | 1990-05-31 | 1990-05-31 | Near-infrared-absorbing resin composition and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0436337A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06191137A (en) * | 1992-12-28 | 1994-07-12 | Toppan Printing Co Ltd | Medium for data carrying sheet and mechanically readable data carrying sheet |
CN101852503A (en) * | 2010-05-31 | 2010-10-06 | 西安交通大学 | Multi-temperature refrigerator |
WO2016133022A1 (en) * | 2015-02-20 | 2016-08-25 | コニカミノルタ株式会社 | Heat shielding film |
-
1990
- 1990-05-31 JP JP14393590A patent/JPH0436337A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06191137A (en) * | 1992-12-28 | 1994-07-12 | Toppan Printing Co Ltd | Medium for data carrying sheet and mechanically readable data carrying sheet |
CN101852503A (en) * | 2010-05-31 | 2010-10-06 | 西安交通大学 | Multi-temperature refrigerator |
WO2016133022A1 (en) * | 2015-02-20 | 2016-08-25 | コニカミノルタ株式会社 | Heat shielding film |
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