JPH04362921A - Manufacture of liquid crystal display element - Google Patents
Manufacture of liquid crystal display elementInfo
- Publication number
- JPH04362921A JPH04362921A JP19772391A JP19772391A JPH04362921A JP H04362921 A JPH04362921 A JP H04362921A JP 19772391 A JP19772391 A JP 19772391A JP 19772391 A JP19772391 A JP 19772391A JP H04362921 A JPH04362921 A JP H04362921A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- lower substrates
- sealing material
- crystal display
- display element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000003566 sealing material Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は液晶表示素子の製造方法
の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method of manufacturing a liquid crystal display element.
【0002】本発明は上下電極基板と周辺シール材との
間にできるすき間をうめる有機接着剤塗布に関するもの
であり、前記すき間をうめることにより、非常に信頼性
の高い、特に耐湿性に優れた液晶表示素子を提供するも
のである。The present invention relates to applying an organic adhesive to fill the gap between the upper and lower electrode substrates and the peripheral sealing material. The present invention provides a liquid crystal display element.
【0003】0003
【従来の技術】一般に液晶表示素子の構造は、図2に示
すように上下電極1a,2aがそれぞれ形成された上下
基板1、2の周辺をシール材3で接着して外囲器を形成
した後、内部に液晶物質を注入している。2. Description of the Related Art In general, the structure of a liquid crystal display element is such that an envelope is formed by bonding the periphery of upper and lower substrates 1 and 2, on which upper and lower electrodes 1a and 2a are respectively formed, with a sealing material 3, as shown in FIG. Afterwards, a liquid crystal substance is injected inside.
【0004】さて、かかる液晶表示素子を1個取り、す
なわち1対の上下基板1、2を組み立てて製作する場合
は、図2に示すごとく周辺シール材3と上下基板1、2
の間にはすき間は全く無くすることができ、信頼性が高
いものが得られる。Now, when manufacturing one such liquid crystal display element by assembling a pair of upper and lower substrates 1 and 2, as shown in FIG.
There can be no gap at all between them, resulting in a highly reliable product.
【0005】しかし、この1個取り方法は工程が複雑で
あり、合理的でないために、最近多数個取り方法で素子
を製作している。この多数個取り方法は、図3に示すよ
うに1枚の大きな基板11、12に上下の電極を多数作
り、同一の基板11、12を2枚重ねてシール材13で
シールし、切断ライン14で切断して素子を1度に多数
個同時に製作する。この方法では上下基板11、12が
シール材13で接着された後に切断されるために、図4
に示すごとく、上下基板11、12と周辺シール材13
との間にすき間15を作らなければならない。これはシ
ール材13がたとえば、エポキシ樹脂、フリットガラス
であっても、接着部分の上は切断できないためである。
なお、11a、12aはそれぞれ上下電極を示す。[0005]However, this single-chip manufacturing process involves complicated steps and is not rational, so recently, devices have been manufactured using a multi-chip manufacturing method. As shown in FIG. 3, this multi-piece manufacturing method involves making a large number of upper and lower electrodes on one large substrate 11, 12, stacking two identical substrates 11, 12 and sealing them with a sealing material 13, and cutting lines 14. A large number of devices can be manufactured at once by cutting the device. In this method, the upper and lower substrates 11 and 12 are bonded together with the sealing material 13 and then cut.
As shown, upper and lower substrates 11 and 12 and peripheral sealing material 13
A gap 15 must be created between the two. This is because even if the sealing material 13 is, for example, epoxy resin or frit glass, it is impossible to cut above the bonded portion. Note that 11a and 12a indicate upper and lower electrodes, respectively.
【0006】[0006]
【発明が解決しようとする課題】このようにすき間15
があると、高湿雰囲気下に前記素子が放置された場合、
前述したすき間15に水滴がたまる。そこで、水滴が溜
った状態で通電されると、端子と端子の間に電流が流れ
るか、またはコモン側電極と端子間に電流が流れ、長時
間経過すると端子側あるいはコモン側の透明導電膜特に
In2O3を主成分としたものが溶解する結果となる。
特にフリットガラスを用いた素子では、通電しない場合
であっても長時間高湿雰囲気下に放置すると、透明導電
膜の溶解が有機シール素子の場合にくらべより顕著に発
生する。多数個取りプロセスを用いて液晶素子を製作し
た場合には、以上説明したすき間15をなくすことは不
可能であり、すき間15があれば、ほとんどの素子で高
湿下におかれた場合、あるいは水滴が溜った際にかなら
ず透明導電膜の溶解現象が発生する。[Problem to be solved by the invention] In this way, the gap 15
If the element is left in a high humidity atmosphere,
Water droplets accumulate in the gap 15 mentioned above. Therefore, when electricity is applied with water droplets accumulated, current flows between the terminals or between the common side electrode and the terminal, and after a long period of time, the transparent conductive film on the terminal side or the common side This results in the dissolution of In2O3 as the main component. In particular, in an element using frit glass, if the element is left in a high humidity atmosphere for a long period of time even when no current is applied, the transparent conductive film dissolves more noticeably than in the case of an organic seal element. When manufacturing a liquid crystal element using a multi-crystal process, it is impossible to eliminate the gap 15 described above. When water droplets accumulate, the phenomenon of dissolution of the transparent conductive film always occurs.
【0007】本発明は上記透明電極溶解現象をおさえる
ためのものであり、シール部分が有機接着剤あるいはフ
リットガラスいずれの場合にも適用可能な液晶表示素子
の製造方法を提供することを目的とする。The present invention is intended to suppress the above-mentioned transparent electrode dissolution phenomenon, and an object of the present invention is to provide a method for manufacturing a liquid crystal display element that can be applied whether the sealing part is made of organic adhesive or frit glass. .
【0008】[0008]
【課題を解決するための手段】このような目的を達成す
るために本発明による液晶表示素子の製造方法は、電極
の形成された上,下基板を、前記電極が所定間隔をもっ
て対向するようにして、該上,下基板の周囲端面より内
側にシール材を介して固着後、前記上,下基板間に液晶
を封入し気密封止した後、前記固着された上,下基板の
周辺部内面と前記シール材の外側面とにより形成される
凹所の、前記電極の延在する部分に有機樹脂を塗布硬化
することを特徴とするものである。[Means for Solving the Problems] In order to achieve the above object, the method for manufacturing a liquid crystal display element according to the present invention includes forming upper and lower substrates on which electrodes are formed such that the electrodes face each other with a predetermined interval. After fixing the upper and lower substrates inward from their peripheral end surfaces via a sealing material, sealing liquid crystal between the upper and lower substrates and airtightly sealing them, the inner surfaces of the peripheral parts of the fixed upper and lower substrates are sealed. The present invention is characterized in that an organic resin is applied and hardened to a portion of the recess formed by the electrode and the outer surface of the sealing material, where the electrode extends.
【0009】[0009]
【作用】強度が要求される上,下基板固着は、上下基板
の周囲端より内側に配置されたシール材を介して行なう
ので、固着強度が確保できるのは勿論、量産性の高い多
数個取り方法が採用できる。基板周辺の凹部の電極の耐
湿性向上のために塗布する有機樹脂と上,下基板固着用
シール材とは独立に塗布硬化されるので、それらの目的
,塗布方法,時期に合ったものを選ぶ選択幅が拡大され
る。[Operation] The fixation of the upper and lower substrates, which requires strength, is done through the sealing material placed inside the peripheral edges of the upper and lower substrates, which not only ensures the fixation strength, but also enables mass production of multiple pieces. method can be adopted. The organic resin applied to improve the moisture resistance of the electrodes in the recesses around the substrate and the sealant for fixing the upper and lower substrates are applied and cured independently, so choose the one that suits your purpose, application method, and timing. The selection range is expanded.
【0010】0010
【実施例】以下、本発明を図示の実施例により説明する
。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained below with reference to illustrated embodiments.
【0011】図1は本発明になる液晶表示素子の製造方
法の一実施例を説明するための液晶表示素子の断面図で
ある。なお、図4と同じまたは相当部材には同一符号を
付し、その説明を省略する。前記のように多数個取り加
工プロセスで製作した素子を破断し1ケとし、液晶を封
入した後封入孔を気密封止する。そして、上下基板11
,12と周辺シール材13とのすき間に液状エポキシ樹
脂16、たとえばエピコート828に直鎖形アミン、た
とえばTTA(トリエチルテトラアミン)を硬化剤とし
て加え塗布する。塗布方法としては、素子端部に滴下し
、自重で樹脂16を流れさせる方法が良い。塗布後、素
子を80℃に60分放置し、樹脂16を硬化させる。
または樹脂16として、エポキシ樹脂エピコート828
にポリアミド樹脂を加え、さらにγ−アミノトリエトキ
シシランを2〜5Phr加える。さらにSiO2粉末を
(粒径5μm以下)を加え、エチルセロソルブを加えて
混合し、うめ込み用接着剤を作る。そして、前記のよう
にして塗布し、塗布後常温で溶剤を取りのぞき、その後
100℃で60分硬化させる。FIG. 1 is a sectional view of a liquid crystal display element for explaining an embodiment of the method for manufacturing a liquid crystal display element according to the present invention. Note that the same or equivalent members as in FIG. 4 are denoted by the same reference numerals, and the explanation thereof will be omitted. The device manufactured by the multi-piece manufacturing process as described above is broken into one piece, and after filling the liquid crystal, the filling hole is hermetically sealed. Then, the upper and lower substrates 11
, 12 and the peripheral sealing material 13, a liquid epoxy resin 16 such as Epikote 828 is coated with a linear amine such as TTA (triethyltetraamine) added as a curing agent. A good application method is to drop the resin 16 onto the end of the element and allow the resin 16 to flow under its own weight. After coating, the element is left at 80° C. for 60 minutes to harden the resin 16. Or as resin 16, epoxy resin Epicoat 828
A polyamide resin is added to the mixture, and 2 to 5 Phr of γ-aminotriethoxysilane is added. Furthermore, SiO2 powder (particle size of 5 μm or less) is added and ethyl cellosolve is added and mixed to prepare an adhesive for embedding. Then, it is applied as described above, and after application, the solvent is removed at room temperature, and then it is cured at 100° C. for 60 minutes.
【0012】本発明においては、信頼性の点から強度が
要求される上,下基板の固着は、この上,下基板の周囲
端より内側に配置されたシール材を介して行なうので、
量産性の高い多数個取り方法が採用出来る。この際形成
される基板周辺部の凹所の、電極の延在している部分に
は、この凹所に入り込む水分によりこの電極が溶解する
のを防止するために有機樹脂を塗布するが、この塗布膜
には余り強度が要求されないので硬化温度の低い有機樹
脂を塗布硬化することで十分である。上下基板固着用有
機樹脂シール材の硬化温度は通常150℃以上なのに対
し、この様に硬化温度の低い有機樹脂が使えるので、こ
の塗布硬化作業は、液晶セルへ液晶を注入した後でも行
なうことが出来る。In the present invention, the fixing of the upper and lower substrates, which require strength from the viewpoint of reliability, is performed through the sealing material disposed inside the peripheral edges of the upper and lower substrates.
A multi-piece method with high mass production efficiency can be adopted. At this time, an organic resin is applied to the part of the recess formed around the substrate where the electrode extends in order to prevent the electrode from dissolving due to moisture entering the recess. Since the coating film is not required to have much strength, it is sufficient to apply and cure an organic resin with a low curing temperature. The curing temperature of organic resin sealants for fixing the upper and lower substrates is usually 150°C or higher, but since organic resins with low curing temperatures can be used, this coating and curing work can be performed even after the liquid crystal is injected into the liquid crystal cell. I can do it.
【0013】シール材により固着された2枚の基板の間
隔は通常10μm以下であるから、前記凹所に有機樹脂
を塗布しても、完全にこの凹所を埋めることは作業上困
難で微小孔が生じることがある。液晶セルへ液晶を注入
する前に、この様な微小孔が生じていると、液晶注入時
この部分に液晶等が侵入すると、洗浄しても容易に除去
することが出来ない。すなわち凹所には水分等の侵入を
防止する為に樹脂の塗布を行なうのであるが、この塗布
膜にピンホール等が生じて、このピンホールに液晶材料
が一旦侵入してしまうと、この除去が困難となり却って
悪影響を及ぼす。従ってこの凹所への有機樹脂の塗布は
なるべく製造プロセスの後の方で行なえることは大きな
メリットとなる。Since the distance between the two substrates fixed by the sealant is usually 10 μm or less, even if the organic resin is applied to the recess, it is difficult to completely fill the recess, and the micropores are difficult to fill. may occur. If such micropores are formed before the liquid crystal is injected into the liquid crystal cell, if liquid crystal or the like enters into these areas when the liquid crystal is injected, it cannot be easily removed even by cleaning. In other words, resin is applied to the recesses to prevent moisture from entering, but once pinholes are formed in this coating and the liquid crystal material has entered the pinholes, it is difficult to remove the resin. This makes it difficult and even has a negative impact. Therefore, it is a great advantage to be able to apply the organic resin to this recess as late as possible in the manufacturing process.
【0014】[0014]
【発明の効果】以上の説明から明らかな如く、本発明に
なる液晶表示素子の製造方法は上下基板間に液晶を封入
気密封止した後に、上下基板の周辺部内面とシール材の
外側面とにかこまれた凹所部分に有機接着剤を充填して
なるので、この凹所部分の水滴による透明電極の溶解現
象は防止される。Effects of the Invention As is clear from the above description, the method for manufacturing a liquid crystal display element according to the present invention involves sealing the liquid crystal between the upper and lower substrates and then sealing them between the inner surfaces of the peripheral parts of the upper and lower substrates and the outer surface of the sealing material. Since the organic adhesive is filled in the recesses surrounded by the recesses, the transparent electrode is prevented from dissolving due to water droplets in the recesses.
【図1】本発明になる液晶表示素子の製造方法の一実施
例を説明するための液晶表示素子の要部断面図である。FIG. 1 is a sectional view of a main part of a liquid crystal display element for explaining an embodiment of a method for manufacturing a liquid crystal display element according to the present invention.
【図2】従来の1個取りの液晶表示素子の製造方法によ
る液晶表示素子の要部断面図である。FIG. 2 is a sectional view of a main part of a liquid crystal display element produced by a conventional method of manufacturing a single-piece liquid crystal display element.
【図3】多数個取り方法を説明するための正面図である
。FIG. 3 is a front view for explaining a multi-piece production method.
【図4】図3の方法によって得られた液晶表示素子の要
部断面図である。FIG. 4 is a sectional view of a main part of a liquid crystal display element obtained by the method of FIG. 3;
11・・・上基板 12・・・下基板 13・・・シール材 16・・・樹脂 11...Top board 12...lower board 13...Sealing material 16...Resin
Claims (1)
が所定間隔をもって対向するようにして、該上,下基板
の周囲端面より内側にシール材を介して固着後、前記上
,下基板間に液晶を封入し気密封止した後、前記固着さ
れた上,下基板の周辺部内面と前記シール材の外側面と
により形成される凹所の、前記電極の延在する部分に有
機樹脂を塗布硬化したことを特徴とする液晶表示素子の
製造方法。1. After fixing upper and lower substrates on which electrodes are formed, with the electrodes facing each other with a predetermined interval, inside the peripheral end surfaces of the upper and lower substrates via a sealing material, After the liquid crystal is sealed between the lower substrates and hermetically sealed, a portion of the recess formed by the inner surfaces of the peripheral portions of the fixed upper and lower substrates and the outer surface of the sealing material, in which the electrodes extend, is placed. A method for manufacturing a liquid crystal display element, characterized by coating and curing an organic resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19772391A JPH04362921A (en) | 1991-08-07 | 1991-08-07 | Manufacture of liquid crystal display element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19772391A JPH04362921A (en) | 1991-08-07 | 1991-08-07 | Manufacture of liquid crystal display element |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10714180A Division JPS5732419A (en) | 1980-08-06 | 1980-08-06 | Liquid crystal display element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04362921A true JPH04362921A (en) | 1992-12-15 |
Family
ID=16379281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19772391A Pending JPH04362921A (en) | 1991-08-07 | 1991-08-07 | Manufacture of liquid crystal display element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04362921A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7023518B1 (en) | 1995-12-19 | 2006-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a non-conductive material or a weakly conductive material applied to a side edge of a substrate and a method of fabricating the same |
US7538849B2 (en) | 1995-02-15 | 2009-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display and forming method thereof |
JP2010026307A (en) * | 2008-07-22 | 2010-02-04 | Citizen Finetech Miyota Co Ltd | Liquid crystal display element and method of manufacturing the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49104656A (en) * | 1973-02-05 | 1974-10-03 | ||
JPS5638326B2 (en) * | 1978-08-12 | 1981-09-05 |
-
1991
- 1991-08-07 JP JP19772391A patent/JPH04362921A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49104656A (en) * | 1973-02-05 | 1974-10-03 | ||
JPS5638326B2 (en) * | 1978-08-12 | 1981-09-05 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7538849B2 (en) | 1995-02-15 | 2009-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display and forming method thereof |
US7924392B2 (en) | 1995-02-15 | 2011-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display and forming method thereof |
US7023518B1 (en) | 1995-12-19 | 2006-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a non-conductive material or a weakly conductive material applied to a side edge of a substrate and a method of fabricating the same |
JP2010026307A (en) * | 2008-07-22 | 2010-02-04 | Citizen Finetech Miyota Co Ltd | Liquid crystal display element and method of manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0121482B2 (en) | ||
US4083099A (en) | Manufacture of a twisted nematic field effect mode liquid crystal display cell | |
JPS62218937A (en) | Liquid crystal display pannel | |
JPH04362921A (en) | Manufacture of liquid crystal display element | |
CN106353928A (en) | 2D/3D switchable display device and manufacturing method thereof | |
JP2001185769A (en) | Peltier module and its manufacturing method | |
JP2564986B2 (en) | Active matrix liquid crystal display panel | |
JPS6327695B2 (en) | ||
JPH0436366B2 (en) | ||
JPH03287232A (en) | Production of liquid crystal display panel | |
JPH0413116A (en) | Method for packaging ic for driving liquid crystal display panel | |
JPH02156221A (en) | Manufacture of liquid crystal display element | |
JP2701749B2 (en) | Manufacturing method of liquid crystal display device | |
JPS60175033A (en) | Production for liquid crystal display element | |
JP2780215B2 (en) | Liquid crystal display | |
JPS62153830A (en) | Preparation of liquid crystal display element | |
JPH07287238A (en) | Liquid crystal display device and its manufacture | |
JPH01177018A (en) | Liquid crystal display element and production thereof | |
JPH08201837A (en) | Liquid crystal display and its manufacture | |
JPH04104127A (en) | Liquid crystal display device | |
JPS60121420A (en) | Display device | |
JPH0511258A (en) | Production of liquid crystal display element | |
JPS6055834B2 (en) | Manufacturing method of liquid crystal cell | |
JPS60154283A (en) | Sealing of display panel | |
JPS5814821A (en) | Liquid crystal display panel and its manufacture |