JPH0436251U - - Google Patents
Info
- Publication number
- JPH0436251U JPH0436251U JP7841390U JP7841390U JPH0436251U JP H0436251 U JPH0436251 U JP H0436251U JP 7841390 U JP7841390 U JP 7841390U JP 7841390 U JP7841390 U JP 7841390U JP H0436251 U JPH0436251 U JP H0436251U
- Authority
- JP
- Japan
- Prior art keywords
- discrete component
- semiconductor element
- terminal
- lead frame
- mounting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7841390U JPH0436251U (bg) | 1990-07-23 | 1990-07-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7841390U JPH0436251U (bg) | 1990-07-23 | 1990-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0436251U true JPH0436251U (bg) | 1992-03-26 |
Family
ID=31621665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7841390U Pending JPH0436251U (bg) | 1990-07-23 | 1990-07-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0436251U (bg) |
-
1990
- 1990-07-23 JP JP7841390U patent/JPH0436251U/ja active Pending