JPH0436250U - - Google Patents

Info

Publication number
JPH0436250U
JPH0436250U JP7838090U JP7838090U JPH0436250U JP H0436250 U JPH0436250 U JP H0436250U JP 7838090 U JP7838090 U JP 7838090U JP 7838090 U JP7838090 U JP 7838090U JP H0436250 U JPH0436250 U JP H0436250U
Authority
JP
Japan
Prior art keywords
package
weight
external lead
lead terminals
insulating container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7838090U
Other languages
English (en)
Japanese (ja)
Other versions
JP2517203Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7838090U priority Critical patent/JP2517203Y2/ja
Publication of JPH0436250U publication Critical patent/JPH0436250U/ja
Application granted granted Critical
Publication of JP2517203Y2 publication Critical patent/JP2517203Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7838090U 1990-07-24 1990-07-24 半導体素子収納用パッケージ Expired - Lifetime JP2517203Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7838090U JP2517203Y2 (ja) 1990-07-24 1990-07-24 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7838090U JP2517203Y2 (ja) 1990-07-24 1990-07-24 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0436250U true JPH0436250U (US07943777-20110517-C00090.png) 1992-03-26
JP2517203Y2 JP2517203Y2 (ja) 1996-11-20

Family

ID=31621609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7838090U Expired - Lifetime JP2517203Y2 (ja) 1990-07-24 1990-07-24 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2517203Y2 (US07943777-20110517-C00090.png)

Also Published As

Publication number Publication date
JP2517203Y2 (ja) 1996-11-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term