JPH0436237U - - Google Patents
Info
- Publication number
- JPH0436237U JPH0436237U JP1990078363U JP7836390U JPH0436237U JP H0436237 U JPH0436237 U JP H0436237U JP 1990078363 U JP1990078363 U JP 1990078363U JP 7836390 U JP7836390 U JP 7836390U JP H0436237 U JPH0436237 U JP H0436237U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- opening
- passivation film
- entire surface
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000002161 passivation Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000003909 pattern recognition Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10125—Reinforcing structures
- H01L2224/10126—Bump collar
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990078363U JP2513016Y2 (ja) | 1990-07-23 | 1990-07-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990078363U JP2513016Y2 (ja) | 1990-07-23 | 1990-07-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0436237U true JPH0436237U (US07579456-20090825-P00002.png) | 1992-03-26 |
| JP2513016Y2 JP2513016Y2 (ja) | 1996-10-02 |
Family
ID=31621575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990078363U Expired - Fee Related JP2513016Y2 (ja) | 1990-07-23 | 1990-07-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2513016Y2 (US07579456-20090825-P00002.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125839A (ja) * | 1982-01-21 | 1983-07-27 | Nec Corp | 半導体装置 |
| JPH02307235A (ja) * | 1989-05-23 | 1990-12-20 | Mitsubishi Electric Corp | ワイヤボンデイング方法 |
-
1990
- 1990-07-23 JP JP1990078363U patent/JP2513016Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125839A (ja) * | 1982-01-21 | 1983-07-27 | Nec Corp | 半導体装置 |
| JPH02307235A (ja) * | 1989-05-23 | 1990-12-20 | Mitsubishi Electric Corp | ワイヤボンデイング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2513016Y2 (ja) | 1996-10-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |