JPH04360302A - Strip line - Google Patents
Strip lineInfo
- Publication number
- JPH04360302A JPH04360302A JP3134714A JP13471491A JPH04360302A JP H04360302 A JPH04360302 A JP H04360302A JP 3134714 A JP3134714 A JP 3134714A JP 13471491 A JP13471491 A JP 13471491A JP H04360302 A JPH04360302 A JP H04360302A
- Authority
- JP
- Japan
- Prior art keywords
- capacitance
- dielectric substrate
- line
- dielectric board
- strip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、高周波電力伝送に用い
られるストリップ線路に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a strip line used for high frequency power transmission.
【0002】0002
【従来の技術】図3は従来のストリップ線路の外観斜視
図である。この図において、1は誘電体基板、2はこの
誘電体基板1の裏面導体、3は前記誘電体基板1の一主
面上に形成されたマイクロストリップ線路である。図4
は、図3のBーB線による断面図である。2. Description of the Related Art FIG. 3 is an external perspective view of a conventional strip line. In this figure, 1 is a dielectric substrate, 2 is a back conductor of this dielectric substrate 1, and 3 is a microstrip line formed on one main surface of the dielectric substrate 1. Figure 4
3 is a sectional view taken along line BB in FIG. 3. FIG.
【0003】次に、動作について説明する。きめられた
誘電率εをもった誘電体基板1の裏面全体に、裏面導体
2が形成されている。誘電体基板1の表面側は、マイク
ロストリップ線路3が必要な長さ及び誘電体基板1の誘
電率εと誘電体基板1の厚さとマイクロストリップ線路
3の幅から決定されるインピーダンスをもって配置され
ている。決められた誘電体基板1の面積内に必要な長さ
を納める必要があるため、マイクロストリップ線路3を
図4に示すように、線路幅Wと線路間隔Dを等分につづ
ら折りに配置している。Next, the operation will be explained. A back conductor 2 is formed on the entire back surface of a dielectric substrate 1 having a determined dielectric constant ε. On the surface side of the dielectric substrate 1, the microstrip line 3 is arranged with an impedance determined from the required length, the dielectric constant ε of the dielectric substrate 1, the thickness of the dielectric substrate 1, and the width of the microstrip line 3. There is. Since it is necessary to fit the required length within the predetermined area of the dielectric substrate 1, the microstrip lines 3 are arranged in a meandering manner with the line width W and line spacing D equally divided, as shown in FIG. There is.
【0004】0004
【発明が解決しようとする課題】上記のようなストリッ
プ線路では、相対する線路間の線路間隔Dが狭いことか
ら、[Problem to be Solved by the Invention] In the above-mentioned strip line, since the line spacing D between opposing lines is narrow,
【0005】[0005]
【数1】
式(1)に示す線間容量、すなわち対向する線路間の空
気中を介して発生する容量(式(1)のa項)と、誘電
体基板1内を介して発生する容量(式(1)のb項)の
総和が大きくなるなどの問題点があった。[Equation 1] The line capacitance shown in equation (1), that is, the capacitance generated through the air between opposing lines (term a of equation (1)) and the capacitance generated through the inside of the dielectric substrate 1 There were problems such as the sum of (term b in equation (1)) becoming large.
【0006】本発明は、かかる問題点を解決するために
なされたもので、小型化をはかったストリップ線路を得
ることを目的とする。The present invention has been made to solve these problems, and an object of the present invention is to obtain a strip line that is miniaturized.
【0007】[0007]
【課題を解決するための手段】本発明に係るストリップ
線路は、マイクロストリップ線路間の誘電体基板部分を
凹状の溝としたものである。[Means for Solving the Problems] A strip line according to the present invention has a dielectric substrate portion between microstrip lines formed into a concave groove.
【0008】[0008]
【作用】本発明におけるストリップ線路の線間容量は、
誘電体基板内を介する容量において、線間距離が長くな
るため小さくなる。[Operation] The line capacitance of the strip line in the present invention is
The capacitance through the dielectric substrate becomes smaller because the distance between the lines becomes longer.
【0009】[0009]
【実施例】以下、本発明について説明する。図1は本発
明の一実施例を示すストリップ線路の外観斜視図であり
、図2は、図1のAーA線による断面図である。これら
の図において、図3,図4と同一符号は同一構成部分を
示し、4は前記マイクロストリップ線路3の対向する線
路間のそれぞれの誘電体基板1部分を凹状に形成した溝
である。[Example] The present invention will be explained below. FIG. 1 is an external perspective view of a strip line showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along line AA in FIG. 1. In these figures, the same reference numerals as in FIGS. 3 and 4 indicate the same components, and 4 is a groove formed in a concave shape in each portion of the dielectric substrate 1 between the opposing lines of the microstrip line 3.
【0010】次に、動作について説明する。誘電体基板
1上に構成されたマイクロストリップ線路3の対向する
線路間のそれぞれの誘電体基板1に溝4が深さD′にて
凹状に掘られている。Next, the operation will be explained. A groove 4 is formed in a concave shape at a depth D' in each dielectric substrate 1 between opposing lines of microstrip lines 3 formed on the dielectric substrate 1.
【0011】[0011]
【数2】
式(2)より、誘電体基板1を介して発生する容量値は
、従来の1/3となることが分かる。また、空気中を介
する容量(式(2)のa項)と誘電体基板1内を介する
容量(式2のb項)とでは、通常、誘電体基板1の誘電
率εが空気より大きいことから、式2のb項のしめる割
合が線間容量に対して大きい。よって非常に大きな容量
の低減が行われる。##EQU00002## From equation (2), it can be seen that the capacitance value generated through the dielectric substrate 1 is 1/3 of the conventional value. In addition, between the capacitance through the air (term a in equation (2)) and the capacitance through the inside of the dielectric substrate 1 (term b in equation 2), the dielectric constant ε of the dielectric substrate 1 is usually larger than that of air. Therefore, the ratio of the term b in Equation 2 to the line capacitance is large. A very large capacity reduction is thus achieved.
【0012】0012
【発明の効果】以上説明したように、本発明によれば、
マイクロストリップ線路の対向する線路間のそれぞれの
誘電体基板を所要深さの凹状の溝としたので、線路間容
量が減少し、特性が向上する。また、ストリップ線路を
それぞれ近づけることが可能となり、回路の小型化が可
能となる。[Effects of the Invention] As explained above, according to the present invention,
Since each dielectric substrate between the opposing lines of the microstrip line is formed into a concave groove of a required depth, the inter-line capacitance is reduced and the characteristics are improved. Moreover, it becomes possible to bring the strip lines close to each other, and it becomes possible to miniaturize the circuit.
【図1】本発明の一実施例を示すストリップ線路の外観
斜視図である。FIG. 1 is an external perspective view of a strip line showing an embodiment of the present invention.
【図2】図1のAーA線による断面図である。FIG. 2 is a sectional view taken along line AA in FIG. 1;
【図3】従来のストリップ線路を示す外観斜視図である
。FIG. 3 is an external perspective view showing a conventional strip line.
【図4】図3のBーB線による断面図である。FIG. 4 is a sectional view taken along line BB in FIG. 3;
1 誘電体基板 2 裏面導体 3 マイクロストリップ線路 4 凹状の溝 1 Dielectric substrate 2 Back conductor 3 Microstrip line 4 Concave groove
Claims (1)
路において、誘電体基板上に形成されたマイクロストリ
ップ線路の対向する線路間のそれぞれの前記誘電体基板
部分を凹状の溝としたことを特徴とするストリップ線路
。1. A strip line used for high frequency power transmission, characterized in that each dielectric substrate portion between opposing lines of microstrip lines formed on a dielectric substrate is formed into a concave groove. strip line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3134714A JPH04360302A (en) | 1991-06-06 | 1991-06-06 | Strip line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3134714A JPH04360302A (en) | 1991-06-06 | 1991-06-06 | Strip line |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04360302A true JPH04360302A (en) | 1992-12-14 |
Family
ID=15134882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3134714A Pending JPH04360302A (en) | 1991-06-06 | 1991-06-06 | Strip line |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04360302A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996026555A1 (en) * | 1995-02-23 | 1996-08-29 | Superconductor Technologies, Inc. | Method and apparatus for increasing power handling capabilities of high temperature superconducting devices |
WO1998012751A1 (en) * | 1996-09-20 | 1998-03-26 | Hitachi, Ltd. | High-frequency integrated circuit device and its manufacture |
-
1991
- 1991-06-06 JP JP3134714A patent/JPH04360302A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996026555A1 (en) * | 1995-02-23 | 1996-08-29 | Superconductor Technologies, Inc. | Method and apparatus for increasing power handling capabilities of high temperature superconducting devices |
WO1998012751A1 (en) * | 1996-09-20 | 1998-03-26 | Hitachi, Ltd. | High-frequency integrated circuit device and its manufacture |
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