JPH04357818A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPH04357818A JPH04357818A JP13156191A JP13156191A JPH04357818A JP H04357818 A JPH04357818 A JP H04357818A JP 13156191 A JP13156191 A JP 13156191A JP 13156191 A JP13156191 A JP 13156191A JP H04357818 A JPH04357818 A JP H04357818A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- coating liquid
- framework
- frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 238000005192 partition Methods 0.000 claims abstract description 5
- 230000002093 peripheral effect Effects 0.000 claims abstract 2
- 239000011521 glass Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 238000009825 accumulation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 2
- 238000011176 pooling Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は，半導体装置，特に半導
体チップの形状に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor devices, and particularly to the shape of semiconductor chips.
【０００２】0002
【従来の技術】図４（ａ）に示すように，円形のシリコ
ンウエーハの表面にできるだけ多数のチップを形成する
ために，半導体チップは，一番効果的な形状である矩形
（正方形，長方形）に形成している。[Prior Art] As shown in FIG. 4(a), in order to form as many chips as possible on the surface of a circular silicon wafer, semiconductor chips are formed in a rectangular (square, rectangular) shape, which is the most effective shape. is formed.
【０００３】半導体チップの周辺には，図４（ｂ）に示
すように，耐湿性を改善するためにＡｌリングが形成さ
れる。その後，半導体ウエーハに，フォトレジストやＳ
ＯＧ（Ｓｐｉｎ Ｏｎ Ｇｌａｓｓ），後処理液などを
塗布すると，図４（ｃ）に示すように，半導体チップの
コーナー部においてＡｌリングの段差により塗布液の溜
まりの厚い領域が発生していた。As shown in FIG. 4(b), an Al ring is formed around the semiconductor chip to improve moisture resistance. After that, photoresist and S
When OG (Spin On Glass), post-processing liquid, etc. were applied, a thick area of pooling of the coating liquid was generated at the corner of the semiconductor chip due to the step of the Al ring, as shown in FIG. 4(c).
【０００４】0004
【発明が解決しようとする課題】矩形の半導体チップは
，コーナー部が直角であるため，チップ内に各種の機能
を搭載するマイクロプロセッサやＡＳＩＣなどチップサ
イズが大きくなってくると，チップのコーナー部にレジ
ストやＳＯＧなどの塗布液の溜まり量が多くなったり，
引っ掛かり頻度が高くなり，様々な障害が発生するよう
になってきた。[Problem to be Solved by the Invention] Since rectangular semiconductor chips have right-angled corners, as the size of chips such as microprocessors and ASICs that incorporate various functions within the chip increases, the corner portions of the chip become larger. When the amount of coating liquid such as resist or SOG increases,
The frequency of getting stuck has increased, and various failures have started to occur.
【０００５】とりわけＳＯＧは，チップのコーナー部で
厚く形成されるために，配線層などの上層膜が形成され
たりしてストレスがかかると容易に割れてクラックが発
生し，配線の断線などにつながり半導体デバイスが機能
しなくなる，という問題が生じていた。[0005] In particular, since SOG is formed thickly at the corners of the chip, it easily breaks and cracks occur when upper layers such as wiring layers are formed and stress is applied, leading to disconnections in the wiring. A problem has arisen in which semiconductor devices no longer function.
【０００６】本発明は，この問題点を解決して，半導体
チップのコーナー部における塗布液が溜まらないように
して，塗布液の滞留に起因するクラックの発生を防止し
，半導体デバイスの信頼性を高めた半導体装置を提供す
ることを目的とする。The present invention solves this problem by preventing the coating liquid from accumulating at the corners of the semiconductor chip, preventing the occurrence of cracks due to the accumulation of the coating liquid, and improving the reliability of semiconductor devices. The purpose is to provide an improved semiconductor device.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
めに，本発明に係る半導体装置は，次のように構成する
。
（１）表面の周縁部に，その表面を包囲するように枠体
が設けられている半導体チップであって，上方から見て
矩形の枠体のコーナー部の半導体チップ上に，該枠体に
対し斜め方向に仕切り物体が設けられているように構成
する。Means for Solving the Problems In order to achieve the above object, a semiconductor device according to the present invention is constructed as follows. (1) A semiconductor chip in which a frame is provided at the periphery of the surface so as to surround the surface, and the frame is placed on the semiconductor chip at the corner of the rectangular frame when viewed from above. On the other hand, the partitioning object is provided in a diagonal direction.
【０００８】（２）表面の周縁部に，その表面を包囲す
るように枠体が設けられている半導体チップであって，
上方から見て矩形の枠体のコーナー部が面取りされた形
状を有しているように構成する。
（３）表面の周縁部に，その表面を包囲するように枠体
が設けられている半導体チップであって，上方から見て
矩形の枠体のコーナー部に，半導体チップの表面から溝
あるいは穴が設けられているように構成する。(2) A semiconductor chip in which a frame is provided at the periphery of the surface so as to surround the surface,
The frame is configured such that the corner portions of the rectangular frame are chamfered when viewed from above. (3) A semiconductor chip in which a frame is provided at the periphery of the surface so as to surround the surface, and grooves or holes are formed from the surface of the semiconductor chip in the corners of the rectangular frame when viewed from above. be configured so that it is provided.
【０００９】本発明に係る半導体装置の製造方法は，上
記（１）〜（３）の構成を有する半導体チップが複数個
形成されたウエーハの表面に，液状の樹脂またはガラス
を滴下した後，ウエーハを回転させ，ウエーハ表面に前
記樹脂またはガラスを一様に塗布するように構成する。In the method for manufacturing a semiconductor device according to the present invention, liquid resin or glass is dropped onto the surface of a wafer on which a plurality of semiconductor chips having the configurations (1) to (3) above are formed, and then the wafer is is rotated to uniformly apply the resin or glass to the wafer surface.
【００１０】0010
【作用】本発明では，半導体チップのコーナー部を塗布
液が滞留しないように構成している。
（１）上方から見て矩形の枠体のコーナー部の半導体チ
ップ上に，枠体に対し斜め方向に仕切り物体を設けると
，塗布液の回転塗布時に塗布液は仕切り物体に沿って流
れ，その流速が高まり，余分の塗布液は枠体の外へ流れ
出すので，枠体のコーナー部に滞留するのを抑制するこ
とができる。[Operation] In the present invention, the corners of the semiconductor chip are constructed so that the coating liquid does not stagnate therein. (1) If a partition object is provided diagonally to the frame on the semiconductor chip at the corner of a rectangular frame viewed from above, the coating liquid will flow along the partition object when the coating liquid is applied by rotation. Since the flow velocity increases and the excess coating liquid flows out of the frame, it is possible to prevent it from staying in the corners of the frame.
【００１１】（２）上方から見て矩形の枠体のコーナー
部を面取りされた形状にすると，塗布液の回転塗布時に
余分の塗布液は面取りされた部分の枠体を乗り越えて外
へ流れ出すので，枠体のコーナー部に滞留するのを抑制
することができる。
（３）上方から見て矩形の枠体のコーナー部に，半導体
チップの表面から溝あるいは穴が設けらると，塗布液の
回転塗布時に余分の塗布液は溝に溜まるか，穴から下に
流れ落ちるので，枠体のコーナー部に滞留するのを抑制
することができる。(2) If the corners of the rectangular frame are chamfered when viewed from above, excess coating liquid will flow out over the chamfered portions of the frame when the coating liquid is applied by rotation. , it is possible to prevent the particles from accumulating in the corners of the frame. (3) If grooves or holes are provided in the corners of the rectangular frame when viewed from above, from the surface of the semiconductor chip, excess coating liquid will accumulate in the grooves or flow down through the holes during spin coating. Since it flows down, it is possible to prevent it from accumulating in the corners of the frame.
【００１２】以上のように，本発明に係る半導体チップ
では，枠体のコーナー部に塗布液が溜まることが無くな
る。したがって，従来問題となっていた，塗布液の溜ま
りに起因するクラックの発生などが起こらないので，半
導体デバイスの信頼性を向上させることができる。As described above, in the semiconductor chip according to the present invention, the coating liquid does not accumulate at the corners of the frame. Therefore, the reliability of the semiconductor device can be improved since cracks caused by pooling of the coating solution, which have been a problem in the past, do not occur.
【００１３】[0013]
（実施例１）図１は，実施例１を示す図であり，半導体
チップの左下隅を示している。本実施例では，半導体チ
ップのコーナー部のＡｌリングを変形させて斜め線を挿
入させている。この斜め線は，塗布液の飛行線に沿って
いるので，塗布液の回転塗布時に斜め線の間を流れる塗
布液の流速を高め，余分の塗布液は枠体の外へ流れ出す
から，塗布液が半導体チップのコーナー部に溜まるのを
抑制する。(Embodiment 1) FIG. 1 is a diagram showing Embodiment 1, and shows the lower left corner of a semiconductor chip. In this embodiment, the Al ring at the corner of the semiconductor chip is deformed to insert a diagonal line. Since these diagonal lines are along the flight line of the coating liquid, the flow rate of the coating liquid that flows between the diagonal lines during spin coating is increased, and the excess coating liquid flows out of the frame. This prevents the particles from accumulating at the corners of the semiconductor chip.
【００１４】（実施例２）図２は，実施例２を示す図で
あり，半導体チップの左下隅を示している。本実施例は
，半導体チップのコーナー部を多角形化し，従来直角で
あったものを２つ以上のコーナー部に分割することによ
り，半導体チップ内方向への塗布液の溜まりを減少させ
るものである。(Embodiment 2) FIG. 2 is a diagram showing Embodiment 2, and shows the lower left corner of a semiconductor chip. In this embodiment, the corner portions of the semiconductor chip are made polygonal, and what used to be right angles is divided into two or more corner portions, thereby reducing the accumulation of the coating liquid toward the inside of the semiconductor chip. .
【００１５】（実施例３）図３は，実施例３を示す図で
あり，半導体チップの左下隅を示している。本実施例は
，半導体チップのコーナー部に電子ビームなどによって
，穴または溝を形成したものである。塗布液は，穴から
下に流れ落ちるか，溝に溜まるかするので，半導体チッ
プのコーナー部における余分な液溜まりを解消すること
ができる。(Embodiment 3) FIG. 3 is a diagram showing Embodiment 3, and shows the lower left corner of the semiconductor chip. In this embodiment, holes or grooves are formed in the corners of a semiconductor chip using an electron beam or the like. Since the coating liquid flows down through the holes or collects in the grooves, it is possible to eliminate excess liquid from accumulating at the corners of the semiconductor chip.
【００１６】[0016]
【発明の効果】本発明によれば，半導体チップのコーナ
ー部に塗布液が溜まることがないから，液溜まりに起因
するクラックが発生することが無くなるので，半導体デ
バイスの信頼性を高めることができる。[Effects of the Invention] According to the present invention, since the coating liquid does not accumulate in the corners of the semiconductor chip, the occurrence of cracks due to liquid accumulation is eliminated, so the reliability of the semiconductor device can be improved. .
【図１】実施例１を示す図である。FIG. 1 is a diagram showing Example 1.
【図２】実施例２を示す図である。FIG. 2 is a diagram showing Example 2.
【図３】実施例３を示す図である。FIG. 3 is a diagram showing Example 3.
【図４】従来例を示す図である。FIG. 4 is a diagram showing a conventional example.
Claims (4)
ように枠体が設けられている半導体チップであって，上
方から見て矩形の枠体のコーナー部の半導体チップ上に
，該枠体に対し斜め方向に仕切り物体が設けられている
ことを特徴とする半導体装置。Claim 1: A semiconductor chip in which a frame is provided at the peripheral edge of the surface so as to surround the surface, and the frame is placed on the semiconductor chip at the corner of the rectangular frame when viewed from above. A semiconductor device characterized in that a partition object is provided diagonally to the body.
ように枠体が設けられている半導体チップであって，上
方から見て矩形の枠体のコーナー部が面取りされた形状
を有していることを特徴とする半導体装置。[Claim 2] A semiconductor chip in which a frame is provided at the periphery of the surface so as to surround the surface, and the corner of the rectangular frame is chamfered when viewed from above. A semiconductor device characterized by:
ように枠体が設けられている半導体チップであって，上
方から見て矩形の枠体のコーナー部に，半導体チップの
表面から溝あるいは穴が設けられていることを特徴とす
る半導体装置。3. A semiconductor chip in which a frame is provided at the periphery of the surface so as to surround the surface, and a corner of the frame, which is rectangular when viewed from above, is provided with grooves extending from the surface of the semiconductor chip. Or a semiconductor device characterized by being provided with a hole.
プが複数個形成されたウエーハの表面に，液状の樹脂ま
たはガラスを滴下した後，ウエーハを回転させ，ウエー
ハ表面に前記樹脂またはガラスを一様に塗布することを
特徴とする半導体装置の製造方法。4. After dropping liquid resin or glass onto the surface of a wafer on which a plurality of semiconductor chips according to claims 1 to 3 are formed, the wafer is rotated, and the resin or glass is uniformly applied to the wafer surface. 1. A method for manufacturing a semiconductor device, characterized by coating the semiconductor device in a similar manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156191A JPH04357818A (en) | 1991-06-04 | 1991-06-04 | Semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156191A JPH04357818A (en) | 1991-06-04 | 1991-06-04 | Semiconductor device and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04357818A true JPH04357818A (en) | 1992-12-10 |
Family
ID=15060947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13156191A Withdrawn JPH04357818A (en) | 1991-06-04 | 1991-06-04 | Semiconductor device and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04357818A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015198908A1 (en) * | 2014-06-27 | 2015-12-30 | ソニー株式会社 | Solid-state image pickup element and electronic device |
-
1991
- 1991-06-04 JP JP13156191A patent/JPH04357818A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015198908A1 (en) * | 2014-06-27 | 2015-12-30 | ソニー株式会社 | Solid-state image pickup element and electronic device |
| US20170117313A1 (en) * | 2014-06-27 | 2017-04-27 | Sony Corporation | Solid-state imaging element, and electronic device |
| US11018172B2 (en) | 2014-06-27 | 2021-05-25 | Sony Semiconductor Solutions Corporation | Solid-state imaging element, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |