JPH04356991A - Thermoplastic electric insulating board - Google Patents

Abstract

PURPOSE:To provide a new thermoplastic electric insulating board which is excellent in heat resistance, fire retardancy, dimensional stability, etc., being indispensable when responding to the theme of mounting parts in high on a printed wiring board. CONSTITUTION:This is a thermoplastic electric insulating board for a printed wiring board, which is constituted by molding a composition which contains 51-500 pts.wt. of mica or the two kinds of mica and talc to 100 pts.wt. of polyethylene terephthalate resin.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel thermoplastic electrically insulating substrate that is used as a printed wiring board and has excellent heat resistance, flame resistance, dimensional stability, etc.

0002

[Prior Art] Conventionally, insulating substrates for printed wiring boards have been widely used, which are formed by combining thermosetting resins such as epoxy resins and phenol resins with reinforcing materials such as paper and glass fibers. It is being A metal layer is provided on the insulating base material to form a laminate, and holes are drilled as required to form a printed wiring board, such as a non-through-hole plated printed wiring board, a through-hole plated printed wiring board, and a multilayer printed wiring board. It is considered to be a board, etc. however,
The manufacturing process of printed wiring boards incorporates the drilling process as described above, and is accompanied by machining work, making the manufacturing process complicated. In addition, the recent trend in the electrical equipment, telecommunications equipment, and electronic equipment industries is to make these equipment lighter, thinner, shorter, and lower in cost.Therefore, printed wiring boards are also required to be mounted in higher density, and are highly heat resistant. Further improvements in physical properties such as flame resistance and dimensional stability are required. However, the above-mentioned substrates are no longer able to fully meet such demands.

0003

[Problem to be solved by the invention] The purpose is to develop a new thermoplastic material that has excellent heat resistance, flame retardance, and dimensional stability, which are essential for meeting the challenge of high-density mounting of printed wiring boards. The purpose of the present invention is to provide an electrically insulating substrate.

0004

[Means for Solving the Problems] The present invention provides that, for 100 parts by weight of polyethylene terephthalate resin (PET),
A thermoplastic electrical insulating base material for printed wiring boards formed by molding a composition containing 51 to 500 parts by weight of mica, or 2 parts of mica and talc per 100 parts by weight of PET.
This is a thermoplastic electrically insulating substrate for a printed wiring board formed by molding a composition containing a total of 51 to 500 parts by weight of seeds.

In the present invention, PET has the general formula (-OC
Those containing 70 mol% or more of the structural unit represented by -C6H5-COO(CH)2O-)n are preferable, and the amount thereof is 70 mol% or more.
If it is less than 0 mol%, it is difficult to obtain a composition with excellent properties. Suitable polymerization methods for this polymer include a method of condensation polymerization of ethylene glycol and terephthalic acid, and a transesterification method using ethylene glycol and dimethyl terephthalate. At this time, a dicarboxylic acid other than terephthalic acid or a diol other than ethylene glycol may be added to form a copolymer. Examples of polymerization catalysts include antimony and titanium germanium.

[0006] As long as the copolymerization component is less than 30 mol%, it is acceptable as long as it does not significantly affect the crystallinity of the polymer, but preferably the copolymerization component is 10 mol% or less. Moreover, those with modified terminal groups can also be used if necessary. Regarding the melt viscosity, a low viscosity one is preferable since it is highly filled with mica or mica and talc.

On the other hand, as the mica, muscovite-based mica (muscovite) and phlogopite-based mica (phlogopite) are preferably used, and those with an aspect ratio of 30 or more, which is a factor that specifies the shape, have good mechanical strength and warpage. It is preferably used to maintain good dimensional stability. Here, the aspect ratio is expressed as average diameter/average thickness. Furthermore, talc has an average particle diameter of 0.5 to 20μ.
talc is preferable to maintain good mechanical strength, and such talc is a natural talc (hydrated magnesium silicate).
It is a fine powder obtained by pulverizing and classifying talc from China, which has a total content of iron and aluminum as impurities of 0.9% by weight or less, and is particularly good. . Further, mica and talc may be used without any surface treatment, but they may also be surface treated with various surface treatment agents. Surface treatment agents include waxes such as low molecular weight polyethylene and low molecular weight polypropylene, saturated higher fatty acids such as stearic acid and palmitic acid, saturated higher fatty acid metal salts such as magnesium stearate, unsaturated higher fatty acids such as oleic acid, and oleic acid. unsaturated higher fatty acid metal salts such as magnesium,
Titanate coupling agents such as isopropyl triisostearic titanate, silane coupling agents, various surfactants such as polyoxyethylene alkyl ether, etc. can be used.

The blending ratio of mica or mica and talc is preferably 51 to 500 parts by weight, more preferably 100 to 300 parts by weight, based on PET. Here, if the amount exceeds 500 parts by weight, molding becomes difficult and is therefore not appropriate. On the other hand, if the amount is less than 50 parts by weight, the insulating base material formed from such a composition will have low dimensional accuracy and large warpage, making it impossible to achieve the intended purpose.

The composition of the present invention is prepared in advance as a molding material in any form, such as pellets, so that it can be made suitable for molding an insulating substrate. That is, as a kneading method, a usual known method is applied, but generally the mixture is melt-kneaded using an extrusion kneader and then pelletized. In addition,
Appropriate amounts of other components such as pigments, heat stabilizers, antioxidants, weathering agents, crystallization promoters, lubricants, etc. may be added to the composition of the present invention.

[0010] The pellet-shaped molded material thus obtained is processed by a commonly used thermoplastic resin molding machine,
For example, it is molded into a desired shape as an insulating base material using an injection molding machine, a compression molding machine, an injection compression molding machine, an extrusion molding machine, or the like. The molding conditions in the molding method are not particularly limited, and the molding is carried out under normal molding conditions. In this way, a desired thermoplastic electrically insulating substrate for printed circuit boards can be obtained.

Various methods have been proposed for forming a conductive circuit on the thus obtained thermoplastic electrically insulating substrate of the present invention, examples of which include an additive method and a semi-additive method. There are also methods of forming a circuit using conductive paste using a screen printer, and methods of printing a circuit pattern on a film using conductive paste and then transfer-printing the circuit pattern.

Next, the present invention will be explained in more detail with reference to Examples, but it is needless to say that the present invention is not limited to these Examples.

[0013]

【Example】

<Example 1> PET (homopolymer manufactured by Kanebo) 100
300 parts by weight of mica (Suzolite Mica, product number 200HK, manufactured by Kuraray) was melt-kneaded, and the composition was molded into an injection molding machine at a cylinder temperature of 300°C, an injection pressure of 1000 kg/cm2, and a mold temperature of 90°C. 1.6 mm thick and 30 cm as shown in Figure 1.
A plate-shaped molded product measuring 30 cm was obtained. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product,
A metal clad plate-like molded product was obtained by heating and pressing at 145°C for 30 minutes at a molding pressure of 20 kg/cm2, and holes (a, b, c) of 1 mm diameter were made in the metal clad plate-like molded product as shown in Fig. 1. Between b: 2
Openings were made in three locations, 5 cm apart and 25 cm between b and c. Further etching was performed to form a circuit on the surface to obtain a printed wiring board.

(Example 2) 100 parts by weight of PET (copolymer manufactured by Kanebo Co., Ltd.) and 300 parts by weight of mica (Susolite Mica manufactured by Kuraray, product number 200HK) were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 300°C. A plate-shaped molded product similar to that of Example 1 was obtained by molding at an injection pressure of 1000 kg/cm 2 and a mold temperature of 90° C. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 kg/cm2, 14
The product was heated and pressed at 5° C. for 30 minutes to obtain a metal clad plate-like molded product, and further etched to form a circuit on the surface to obtain a printed wiring board.

Example 3 100 parts by weight of PET (homopolymer manufactured by Kanebo) and 100 parts by weight of mica (Suzolite Mica, product number 200HK manufactured by Kuraray) were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 3.
00℃, injection pressure 800kg/cm2, mold temperature 90℃
A plate-shaped molded product similar to that of Example 1 was obtained by molding at ℃. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 kg/cm2, 1
A metal clad plate molded product was obtained by heating and pressing at 45°C for 30 minutes.
Further etching was performed to form a circuit on the surface to obtain a printed wiring board.

<<Example 4>> 100 parts by weight of PET (homopolymer manufactured by Kanebo) and aminosilane surface-treated mica (Suzolite mica manufactured by Kuraray, product number 200KI)
300 parts by weight were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 300°C and an injection pressure of 1000 kg/c.
m2 and a mold temperature of 90° C. to obtain a plate-shaped molded product similar to that in Example 1. Thickness 35 on both sides of the plate-shaped molded product
After disposing one μm adhesive copper foil on each sheet, heat and press at 145°C for 30 minutes at a molding pressure of 20 kg/cm2 to obtain a metal-clad plate-like molded product, which was further etched to form a circuit on the surface. A printed wiring board was obtained.

<<Example 5>> 300 parts by weight of mica (Suzolite Mica, product number 200HK, manufactured by Kuraray) was melt-kneaded with 100 parts by weight of PET (homopolymer manufactured by Kanebo), and the composition was molded using an injection molding machine at a cylinder temperature of 3.
00℃, injection pressure 1000kg/cm2, mold temperature 9
A plate-shaped molded product similar to that of Example 1 was obtained by molding at 0°C. The plate-shaped molded product was further heat-treated at 145° C. for 120 minutes, and then required circuits were formed on both sides of the plate-shaped molded product with conductive paste using a screen printer to obtain a printed wiring board.

Comparative Example 1 100 parts by weight of PET (homopolymer manufactured by Kanebo) and 50 parts by weight of mica (Suzolite mica product number 200HK manufactured by Kuraray) were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 30°C.
0℃, injection pressure 800kg/cm2, mold temperature 90℃
A plate-shaped molded product similar to that of Example 1 was obtained by molding under the following conditions. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 kg/cm2, 14
The product was heated and pressed at 5° C. for 30 minutes to obtain a metal clad plate-like molded product, and further etched to form a circuit on the surface to obtain a printed wiring board.

Comparative Example 2 Paper-based phenolic resin copper-clad laminate (JIS-C6484, PP5F) with a thickness of 1.6 mm
A 30 cm x 30 cm plate-shaped molded product was obtained from a compatible product), holes were made as shown in FIG. 1, and a circuit was formed on the surface by etching to obtain a printed wiring board.

<<Example 6>> 100 parts by weight of mica (Suzolite mica, product number 200HK, manufactured by Kuraray) per 100 parts by weight of PET (homopolymer manufactured by Kanebo),
200 parts by weight of talc (manufactured by Nippon Talc) was melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 300°C, an injection pressure of 1000/cm2, and a mold temperature of 90°C, as shown in Figure 1. Thickness 1.6mm, 30cm x
A 30 cm plate-shaped molded product was obtained. After disposing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, heat and press at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes to obtain a metal-clad plate-shaped molded product. Holes were made in the same manner as in Example 1, and a circuit was formed on the surface by etching to obtain a printed wiring board.

<<Example 7>> 100 parts by weight of PET (homopolymer manufactured by Kanebo), 200 parts by weight of mica (Suzolite mica product number 200HK manufactured by Kuraray) and 100 parts by weight of talc (manufactured by Nippon Talc) were melt-kneaded, and The composition was molded using an injection molding machine at a cylinder temperature of 300°C, an injection pressure of 1000 kg/cm2, and a mold temperature of 90°C to obtain a plate-shaped molded product similar to that in Example 6. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, it was heated at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes.
The product was heated and pressed for a minute to obtain a metal clad plate-like molded product, and further etched to form a circuit on the surface to obtain a printed wiring board.

Example 8: 100 parts by weight of PET (homopolymer manufactured by Kanebo), 50 parts by weight of mica (Suzolite mica product number 200HK manufactured by Kuraray) and 50 parts by weight of talc (manufactured by Nippon Talc) were melt-kneaded, The composition was molded using an injection molding machine at a cylinder temperature of 300°C, an injection pressure of 800 kg/cm2, and a mold temperature of 90°C to obtain a plate-shaped molded product similar to Example 6. One piece of adhesive copper foil with a thickness of 35 μm was placed on each side of the plate-shaped molded product, and then heated and pressed at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes to obtain a metal-clad plate-shaped molded product. A printed wiring board was obtained by etching and forming a circuit on the surface.

<<Example 9>> 100 parts by weight of PET (homopolymer manufactured by Kanebo) and aminosilane surface-treated mica (Suzolite mica manufactured by Kuraray, product number 200KI)
) and 200 parts by weight of aminosilane surface-treated talc (manufactured by Tsuchiya Kaolin Industries) were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 300°C and an injection pressure of 1.
000 kg/cm2 and a mold temperature of 90° C. to obtain a plate-shaped molded product similar to that of Example 6. One piece of adhesive copper foil with a thickness of 35 μm was placed on each side of the plate-shaped molded product, and then heated and pressed at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes to obtain a metal-clad plate-shaped molded product. A printed wiring board was obtained by etching and forming a circuit on the surface.

<<Example 10>> PET (homopolymer)
100 parts by weight of mica (Suzorite Mica, product number 200HK, manufactured by Kuraray) and 200 parts by weight of talc (manufactured by Nippon Talc) were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 300°C. A plate-shaped molded product similar to that of Example 6 was obtained by molding at an injection pressure of 1000 kg/cm 2 and a mold temperature of 90°C. The plate-shaped molded product was further heat-treated at 145° C. for 120 minutes, and then required circuits were formed on both sides of the plate-shaped molded product with conductive paste using a screen printer to obtain a printed wiring board.

Comparative Example 3 100 parts by weight of PET (homopolymer manufactured by Kanebo), 20 parts by weight of mica (Suzolite mica product number 200HK manufactured by Kuraray) and 30 parts by weight of talc (manufactured by Nippon Talc) were melted and kneaded. The composition was molded using an injection molding machine at a cylinder temperature of 300°C and an injection pressure of 8.
A plate-shaped molded product similar to that of Example 6 was obtained by molding at a pressure of 00 kg/cm2 and a mold temperature of 90°C. One piece of adhesive copper foil with a thickness of 35 μm was placed on each side of the plate-shaped molded product, and then heated and pressed at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes to obtain a metal-clad plate-shaped molded product. A printed wiring board was obtained by etching and forming a circuit on the surface.

Comparative Example 4 Paper-based phenolic resin copper-clad laminate (JIS C6484, PP5) with a thickness of 1.6 mm
Obtain a plate-shaped molded product of 30 cm x 30 cm from F-compliant product).
A printed wiring board was obtained by making holes as shown in FIG. 1 and etching to form a circuit on the surface.

In each of the above Examples and Comparative Examples, a flame retardant formulation was applied. Table 1 compares and contrasts the physical properties of the printed wiring boards obtained in each example with those of conventional copper-clad printed wiring boards.
and shown in Table 2. The test method is shown in Table 3.

[0028]

[0029]

[0030]

[0031]

Effects of the Invention As shown in the table, the electrically insulating substrate of the present invention has the synergistic properties of PET and mica contained in its resin structure, or mica and talc, and is superior to the conventional paper base phenolic resin copper. Compared to stretched laminates, it can better respond to the trend toward lighter, thinner, shorter, and lower cost electronic and electrical equipment.

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating a plate-shaped molded product in an embodiment of the present invention.

Claims (2)

[Claims] [Claim 1] Polyethylene terephthalate resin 10
1. A thermoplastic electrically insulating substrate formed by molding a composition containing 51 to 500 parts by weight of mica to 0 parts by weight. [Claim 2] Polyethylene terephthalate resin 10
For 0 parts by weight, the total amount of mica and talc is 51~
A thermoplastic electrically insulating substrate formed by molding a composition containing 500 parts by weight.