JPH04348095A - Thermoplastic electrical insulating board - Google Patents

Abstract

PURPOSE:To provide a novel thermoplastic electrical insulating board excellent in heat resistance, fire retardancy, dimensional stability, etc., being indispensable for responding to the problem of mounting parts on a printed wiring board in high density. CONSTITUTION:This is a thermoplastic electrical insulating base material for a printed wiring board which is made by molding a composition which contains 51-500wt. parts of mica alone or both mica and talc to 100wt. parts of polyphenylene sulfite resin.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel thermoplastic electrically insulating substrate that is used as a printed wiring board and has excellent heat resistance, flame resistance, dimensional stability, etc.

0002

[Prior Art] Conventionally, insulating substrates for printed wiring boards have been widely used, which are formed by combining thermosetting resins such as epoxy resins and phenolic resins with reinforcing materials such as paper and glass fibers. It is being A metal layer is provided on such an insulating base material to form a laminate, and as a printed wiring board, holes are bored as necessary to form a non-through-hole plated printed wiring board, a through-hole plated printed wiring board, and a multilayer printed wiring board. It is considered to be a board etc. however,
The manufacturing process of printed wiring boards incorporates the drilling process as described above, and is accompanied by machining work, making the manufacturing process complicated. In addition, the recent trend in the electrical equipment, telecommunications equipment, and electronic equipment industries is to make these equipment lighter, thinner, shorter, and lower in cost.As a result, printed wiring boards are also required to be mounted in higher density, and are highly heat resistant. Further improvements in physical properties such as flame resistance and dimensional stability are required. However, the above-mentioned substrates are no longer able to fully meet such demands.

0003

[Problem to be solved by the invention] The purpose is to develop a new thermoplastic material that has excellent heat resistance, flame retardance, and dimensional stability, which are essential for meeting the challenge of high-density mounting of printed wiring boards. The purpose of the present invention is to provide an electrically insulating substrate.

0004

[Means for Solving the Problems] The present invention provides that, for 100 parts by weight of polyphenylene sulfide resin (PPS),
A thermoplastic electrical insulating base material for printed wiring boards formed by molding a composition containing 51 to 500 parts by weight of mica, or 2 parts of mica and talc per 100 parts by weight of PPS.
This is a thermoplastic electrically insulating substrate for a printed wiring board formed by molding a composition containing a total of 51 to 500 parts by weight of seeds.

In the present invention, PPS has the general formula (-
Those containing 70 mol% or more of the structural unit represented by C6H5-S-)n are preferred; if the amount is less than 70 mol%, it is difficult to obtain a composition with excellent properties. A suitable method for polymerizing this polymer is a method in which sodium sulfide and p-dichlorobenzene are reacted in an amide solvent such as N-methylpyrrolidrine or dimethylacetamide, or a sulfone solvent such as sulfolane.

At this time, in order to adjust the degree of polymerization, an alkali metal salt of carboxylic acid or sulfonic acid, or an alkali hydroxide, an alkali metal carbonate, or an alkaline earth metal oxide is added. If it is less than 30 mol% as a copolymerization component, meta bonds, ortho bonds, ether bonds, sulfone bonds,
Biphenyl bond, substituted phenylene sulfide bond (here, substituents include alkyl group, nitro group, phenyl group,
Alkoxy groups, carboxylic acid groups, or metal bases of carboxylic acids), trifunctional bonds, etc. may be included as long as they do not significantly affect the crystallinity of the polymer, but preferably the copolymerization component is 10 mol% or less. good. Regarding the melt viscosity, a low viscosity one is preferable since it is highly filled with mica or mica and talc.

On the other hand, as the mica, muscovite-based mica (muscovite) and phlogopite-based mica (phlogopite) are preferably used, and those with an aspect ratio of 30 or more, which is a factor that specifies the shape, have good mechanical strength and warpage. It is preferably used to maintain good dimensional stability. Here, the aspect ratio is expressed as average diameter/average thickness. Furthermore, talc has an average particle diameter of 0.5 to 20μ.
talc is preferable to maintain good mechanical strength, and such talc is a natural talc (hydrated magnesium silicate).
It is a fine powder obtained by pulverizing and classifying talc from China, which has a total content of iron and aluminum as impurities of 0.9% by weight or less, and is particularly good. . Further, mica and talc may be used without any surface treatment, but they may also be surface treated with various surface treatment agents. Surface treatment agents include waxes such as low molecular weight polyethylene and low molecular weight polypropylene, saturated higher fatty acids such as stearic acid and palmitic acid, saturated higher fatty acid metal salts such as magnesium stearate, unsaturated higher fatty acids such as oleic acid, and oleic acid. unsaturated higher fatty acid metal salts such as magnesium,
Titanate coupling agents such as isopropyl triisostearic titanate, silane coupling agents, various surfactants such as polyoxyethylene alkyl ether, etc. can be used.

The blending ratio of mica or mica and talc is preferably 51 to 500 parts by weight, more preferably 100 to 300 parts by weight, based on PPS. Here, if the amount exceeds 500 parts by weight, molding becomes difficult and is therefore not appropriate. On the other hand, if the amount is less than 50 parts by weight, the insulating base material formed from such a composition will have low dimensional accuracy and large warpage, making it impossible to achieve the intended purpose.

The composition of the present invention is prepared in advance as a molding material in any form, such as pellets, so that it can be made suitable for molding an insulating substrate. That is, as a kneading method, a usual known method is applied, but generally the mixture is melt-kneaded using an extrusion kneader and then pelletized. In addition,
Appropriate amounts of other components such as pigments, heat stabilizers, antioxidants, weathering agents, crystallization promoters, lubricants, etc. may be added to the composition of the present invention.

[0010] The pellet-shaped molded material thus obtained is processed by a commonly used thermoplastic resin molding machine,
For example, it is molded into a desired shape as an insulating base material using an injection molding machine, a compression molding machine, an injection compression molding machine, an extrusion molding machine, or the like. The molding conditions in the molding method are not particularly limited, and the molding is carried out under normal molding conditions. In this way, a desired thermoplastic electrically insulating substrate for printed circuit boards can be obtained.

Various methods have been proposed for forming a conductive circuit on the thus obtained thermoplastic electrically insulating substrate of the present invention, examples of which include an additive method and a semi-additive method. There are also methods of forming a circuit using conductive paste using a screen printer, and methods of printing a circuit pattern on a film using conductive paste and then transfer-printing the circuit pattern.

Next, the present invention will be explained in more detail with reference to Examples, but it is needless to say that the present invention is not limited to these Examples.

[0013]

【Example】

<<Example 1>> Mica (manufactured by Kuraray, Suzolite Mica, part number 200HK) 3 to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., part number E2480)
00 parts by weight were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 1000 kg/cm.
2, molding was performed at a mold temperature of 150° C. to obtain a plate-shaped molded product having a thickness of 1.6 mm and a size of 30 cm×30 cm as shown in FIG. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 kg/c was applied.
m2, heated and pressurized at 145°C for 30 minutes to obtain a metal clad plate-like molded product, and holes (a, b, c) of 1 mmφ were drilled in the metal clad plate-like molded product as shown in Fig. 1 between a and b: 25 cm. , between b and c: 2
I made three 5cm holes. Further etching was performed to form a circuit on the surface to obtain a printed wiring board.

<<Example 2>> 100 parts by weight of high-viscosity PPS (Toray Phillips Petroleum Co., Ltd. product number E0780) was melted and kneaded with 300 parts by weight of mica (Suzolite Mica, product number 200HK, manufactured by Kuraray Co., Ltd.) to obtain the composition. The product is molded using an injection molding machine at a cylinder temperature of 350℃ and an injection pressure of 15℃.
A plate-shaped molded product similar to that of Example 1 was obtained by molding at a pressure of 00 kg/cm2 and a mold temperature of 150°C. One piece of adhesive copper foil with a thickness of 35 μm was placed on each side of the plate-shaped molded product, and then heated and pressed at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes to obtain a metal-clad plate-shaped molded product. A printed wiring board was obtained by etching and forming a circuit on the surface.

<<Example 3>> Mica (manufactured by Kuraray, Susolite Mica, product number 2) to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480)
00HK) was melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 800°C.
kg/cm2 and a mold temperature of 150° C. to obtain a plate-shaped molded product similar to that of Example 1. After disposing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, heat and press at a molding pressure of 20 kg/cm 2 at 145° C. for 30 minutes to obtain a metal-clad plate-shaped molded product, Further etching was performed to form a circuit on the surface to obtain a printed wiring board.

<<Example 4>> Aminosilane surface-treated mica (manufactured by Kuraray, product number 2) was added to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480).
00KI) was melt-kneaded and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 100°C.
A plate-shaped molded product similar to that of Example 1 was obtained by molding at a pressure of 0 kg/cm2 and a mold temperature of 150°C. One piece of adhesive copper foil with a thickness of 35 μm was placed on each side of the plate-shaped molded product, and then heated and pressed at a molding pressure of 20 kg/cm2 and 145°C for 30 minutes to obtain a metal-clad plate-shaped molded product. A printed wiring board was obtained by etching and forming a circuit on the surface.

<<Example 5>> Mica (manufactured by Kuraray, Suzolite Mica, product number 2) to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480)
00HK) was melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 100°C.
A plate-shaped molded product similar to that of Example 1 was obtained by molding at a pressure of 0 kg/cm2 and a mold temperature of 150°C. The plate-shaped molded product was further heat-treated at 145° C. for 120 minutes, and then required circuits were formed on both sides of the plate-shaped molded product with conductive paste using a screen printer to obtain a printed wiring board.

<Comparative Example 1> Mica (manufactured by Kuraray, Suzolite Mica, product number 2) per 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480)
00HK) was melt-kneaded and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 800k.
g/cm2 and a mold temperature of 150° C. to obtain a plate-shaped molded product similar to that in Example 1. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product,
A metal clad plate-like molded product was obtained by heating and pressing at a molding pressure of 20 kg/cm 2 and 145° C. for 30 minutes, and was further etched to form a circuit on the surface to obtain a printed wiring board.

Comparative Example 2 Glass cloth base epoxy resin copper clad laminate (JIS-C6484, GE
A plate-shaped molded product of 30 cm x 30 cm was obtained from the 2F compatible product), holes were made as shown in FIG. 1, and a circuit was formed on the surface by etching to obtain a printed wiring board.

<<Example 6>> Mica (manufactured by Kuraray, Susolite Mica, product number 2) to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480)
00HK) 100 parts by weight, talc (manufactured by Nippon Talc) 20
0 parts by weight were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 1000 kg/cm2.
The molded product was molded at a mold temperature of 150° C. to obtain a plate-shaped molded product having a thickness of 1.6 mm and a size of 30 cm×30 cm as shown in FIG. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 kg/cm2 was applied.
The molded product was heated and pressed at 145° C. for 30 minutes to obtain a metal-clad plate-like molded product, holes were made in the same manner as in Example 1, and circuits were formed on the surface by etching to obtain a printed wiring board.

<<Example 7>> Mica (manufactured by Kuraray, Suzolite Mica, product number 2) to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480)
00HK) 200 parts by weight, talc (manufactured by Nippon Talc) 10
0 parts by weight were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 1500 kg/cm2.
Then, molding was performed at a mold temperature of 150° C. to obtain a plate-shaped molded product similar to that in Example 6. Thickness 35μ on both sides of the plate-shaped molded product
After arranging one adhesive copper foil of m each, the molding pressure was 2.
The product was heated and pressed at 0 kg/cm2 and 145° C. for 30 minutes to obtain a metal-clad plate-like molded product, and further etched to form a circuit on the surface to obtain a printed wiring board.

<<Example 8>> Mica (manufactured by Kuraray, Suzolite Mica, product number 2) to 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480)
50 parts by weight of 00HK), 50 parts of talc (manufactured by Nippon Talc)
Parts by weight were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 800 kg/cm2.
A plate-shaped molded product similar to that of Example 6 was obtained by molding at a mold temperature of 150°C. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 k was applied.
g/cm2 at 145° C. for 30 minutes to obtain a metal clad plate-like molded product, which was further etched to form a circuit on the surface to obtain a printed wiring board.

<<Example 9>> 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480), 100 parts by weight of aminosilane surface-treated mica (manufactured by Kuraray, product number 200KI), aminosilane surface-treated talc (manufactured by Kuraray, product number 200KI), 200 parts by weight (manufactured by Tsuchiya Kaolin Kogyo) were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 1000 kg/cm2.
A plate-shaped molded product similar to that of Example 6 was obtained by molding at a mold temperature of 150°C. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, a molding pressure of 20 k was applied.
g/cm2 at 145° C. for 30 minutes to obtain a metal clad plate-like molded product, which was further etched to form a circuit on the surface to obtain a printed wiring board.

<<Example 10>> 100 parts by weight of PPS (product number E2480, manufactured by Toray Phillips Petroleum Co., Ltd.), 100 parts by weight of mica (product number 200HK, manufactured by Kuraray), talc (manufactured by Nippon Talc)
200 parts by weight were melt-kneaded, and the composition was molded using an injection molding machine at a cylinder temperature of 350°C and an injection pressure of 1000 kg/c.
m2 and a mold temperature of 150° C. to obtain a plate-shaped molded product similar to that in Example 6. The plate-shaped molded product is further heated to 145°C.
After heat treatment for 120 minutes, necessary circuits were formed on both sides of the plate-shaped molded product with conductive paste using a screen printer to obtain a printed wiring board.

<Comparative Example 3> 100 parts by weight of PPS (manufactured by Toray Phillips Petroleum Co., Ltd., product number E2480), 20 parts by weight of mica (product number 200HK, manufactured by Kuraray) and 30 parts by weight of talc (manufactured by Nippon Talc) were melt-kneaded. death,
The composition was molded using an injection molding machine at a cylinder temperature of 350°C.
A plate-shaped molded product similar to that of Example 6 was obtained by molding at an injection pressure of 800 kg/cm 2 and a mold temperature of 150°C. After placing one piece of adhesive copper foil with a thickness of 35 μm on each side of the plate-shaped molded product, molding pressure was 20 kg/cm2 and 145°C.
The product was heated and pressed for 30 minutes to obtain a metal clad plate-like molded product, which was further etched to form a circuit on the surface to obtain a printed wiring board.

Comparative Example 4 Glass cloth base epoxy resin copper clad laminate (JIS C6484, G
A plate-shaped molded product of 30 cm x 30 cm was obtained from the E2F compliant product, a hole was made as shown in FIG. 1, and a circuit was formed on the surface by etching to obtain a printed wiring board.

The physical properties of the printed wiring boards obtained in each of the above examples are shown in Tables 1 and 2 in comparison with those of conventional copper-clad printed wiring boards. The test method is shown in Table 3.

[0028]

[0029]

[0030]

[0031]

Effects of the Invention As shown in the table, the electrically insulating substrate of the present invention has the synergistic properties of the PPS resin and the mica or mica and talc contained in the resin structure, and is superior to the conventional glass cloth base epoxy. Compared to resin copper-clad laminates, it can better respond to the trend toward smaller, lighter, thinner, and lower costs in electronic and electrical equipment.

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating a plate-shaped molded product in an embodiment of the present invention.

Claims (2)

[Claims] [Claim 1] Polyphenylene sulfide resin 10
1. A thermoplastic electrically insulating substrate formed by molding a composition containing 51 to 500 parts by weight of mica to 0 parts by weight. [Claim 2] Polyphenylene sulfide resin 10
For 0 parts by weight, the total amount of mica and talc is 51~
A thermoplastic electrically insulating substrate formed by molding a composition containing 500 parts by weight.