JPH04354327A - Device for epitaxially growing compound semiconductor - Google Patents

Device for epitaxially growing compound semiconductor

Info

Publication number
JPH04354327A
JPH04354327A JP15775091A JP15775091A JPH04354327A JP H04354327 A JPH04354327 A JP H04354327A JP 15775091 A JP15775091 A JP 15775091A JP 15775091 A JP15775091 A JP 15775091A JP H04354327 A JPH04354327 A JP H04354327A
Authority
JP
Japan
Prior art keywords
resin
compound semiconductor
hcl
piping
supply line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15775091A
Other languages
Japanese (ja)
Inventor
Norio Otaki
大滝 紀夫
Akio Nakamura
秋夫 中村
Yuki Tamura
田村 雄輝
Munehisa Yanagisawa
柳澤 宗久
Susumu Higuchi
晋 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP15775091A priority Critical patent/JPH04354327A/en
Publication of JPH04354327A publication Critical patent/JPH04354327A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To extend the life of an HCl supply line and manufacture a compound semiconductor light emitting element whose Fe concentration is reduced by permitting a part from a filter to a gas supply port to be resin piping or piping whose interior is coated with ceramic or resin. CONSTITUTION:At least the part from a filter 28 to a gas supply port 6 among the HCl supply line 20 of the device, in other words, a connector 22 and a guide pipe 24, are permitted to be resin piping or piping whose interior is coated with ceramic or resin. Fluororesin is suitable for the resin for the piping and coating. The piping of the device does not corrode even the corrosive HCl gas is passed through. Contamination by Fe, etc., on the compound semiconductor substrate is suppressed and the life of the HCl supply line is extended.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、HCl供給ライン内面
の腐食を防止でき、化合物半導体ウェーハへのFe等の
汚染を抑制し、かつHCl供給ラインの寿命延長を可能
とした化合物半導体エピタキシャル成長装置に関する。
[Field of Industrial Application] The present invention relates to a compound semiconductor epitaxial growth apparatus that can prevent corrosion on the inner surface of an HCl supply line, suppress contamination of compound semiconductor wafers with Fe, etc., and extend the life of the HCl supply line. .

【0002】0002

【従来の技術】化合物半導体基板上にエピタキシャル層
を成長させる手段の一つとして、例えばGaAsPをV
PE(気相エピタキシャル成長)で成長させる装置には
、GaソースのキャリアガスとしてHClを供給し、こ
のHCl供給ラインとは別の配管によってAsH3 ,
PH3 を供給する方式の装置が知られている。この種
装置においては、HClガスはその中に含まれる微量の
水分や、配管の着脱時に必然的に侵入するH2 Oによ
って腐食性を呈することとなる。エピタキシャル成長装
置における反応室は石英製であり、かつこの反応室に設
けられるガス供給口も石英管であるため腐食することは
ない。しかし、HCl供給ラインの配管はステンレスス
チール等の腐食可能な材質で形成されているため、上記
した腐食性のHClガスの通過によって腐食される。こ
の腐食したFeの粒子等は反応室内まで侵入しエピタキ
シャル層中に混在し、このような化合物半導体を用いた
発光素子の発光性能は著しく低下してしまうという問題
が発生していた。このような不都合を回避するために、
エピタキシャル成長装置、特にHCl供給ラインの清掃
を繁雑に行うことが必要である。腐食が進行した場合に
はHCl供給ラインの全体を新品と交換することも必要
であった。
2. Description of the Related Art As one of the means for growing an epitaxial layer on a compound semiconductor substrate, for example, GaAsP is
HCl is supplied as a carrier gas for the Ga source to an apparatus for growing by PE (vapor phase epitaxial growth), and AsH3, AsH3,
Devices that supply PH3 are known. In this type of device, HCl gas exhibits corrosive properties due to trace amounts of moisture contained therein and H2O that inevitably enters when the piping is attached or detached. The reaction chamber in the epitaxial growth apparatus is made of quartz, and the gas supply port provided in this reaction chamber is also a quartz tube, so it will not corrode. However, since the piping of the HCl supply line is made of a corrodable material such as stainless steel, it is corroded by the passage of the above-mentioned corrosive HCl gas. These corroded Fe particles enter the reaction chamber and become mixed in the epitaxial layer, causing a problem in that the light emitting performance of a light emitting device using such a compound semiconductor is significantly reduced. To avoid such inconvenience,
It is necessary to clean the epitaxial growth equipment, especially the HCl supply line, in a complicated manner. If corrosion progressed, it was also necessary to replace the entire HCl supply line with a new one.

【0003】0003

【発明が解決しようとする課題】本発明は、上記した従
来技術の問題点に鑑みて発明されたもので、HCl供給
ライン内面の腐食を防止でき、化合物半導体ウェーハへ
のFe等の汚染を抑制し、かつHCl供給ラインの寿命
延長を可能とした化合物半導体エピタキシャル成長装置
及びこのような装置を用いることによってFeの濃度を
低減化した化合物半導体発光素子を提供することを目的
とする。
[Problems to be Solved by the Invention] The present invention was invented in view of the problems of the prior art described above, and can prevent corrosion of the inner surface of the HCl supply line and suppress contamination of compound semiconductor wafers with Fe, etc. It is an object of the present invention to provide a compound semiconductor epitaxial growth apparatus that can extend the life of an HCl supply line, and a compound semiconductor light emitting device that has a reduced Fe concentration by using such an apparatus.

【0004】0004

【課題を解決するための手段】上記課題を解決するため
に、本願第一発明の化合物半導体エピタキシャル成長装
置は、反応室に連通して設けられたガス供給口に一端が
接続されかつ他端部分に設けられたフィルターを介して
HClガスを反応室内に供給するHCl供給ラインを備
え、該HCl供給ラインのうち少なくともフィルターか
らガス供給口までの部分を樹脂配管又はセラミック若し
くは樹脂で内部がコーティングされた配管としたもので
ある。
[Means for Solving the Problems] In order to solve the above problems, the compound semiconductor epitaxial growth apparatus of the first invention of the present application has one end connected to a gas supply port provided in communication with a reaction chamber, and the other end portion connected to a gas supply port provided in communication with a reaction chamber. Equipped with an HCl supply line that supplies HCl gas into the reaction chamber through a filter provided, at least a portion of the HCl supply line from the filter to the gas supply port is resin piping or piping whose inside is coated with ceramic or resin. That is.

【0005】上記樹脂は耐熱性で高純度であることが必
要であるが、特にフッ素樹脂、例えば四フッ化エチレン
樹脂が好適である。
[0005] The above-mentioned resin needs to be heat resistant and highly pure, and fluororesins such as tetrafluoroethylene resin are particularly suitable.

【0006】上記セラミックコーティングに使用される
セラミック材料の材質には特別の限定はないが、TiO
2 が好適であり、Cr2 O3 、Al2 O3 等
の公知のセラミック材料を適用することができる。
[0006] There are no particular limitations on the quality of the ceramic material used for the ceramic coating, but TiO
2 is suitable, and known ceramic materials such as Cr2O3 and Al2O3 can be used.

【0007】本願第二発明の化合物半導体発光素子は、
pn接合界面及びその近傍のFeの濃度が1×1016
atoms/cc以下であるようにしたものである。
[0007] The compound semiconductor light emitting device of the second invention of the present application includes:
The concentration of Fe at the pn junction interface and its vicinity is 1×1016
It is designed to be less than atoms/cc.

【0008】[0008]

【実施例】以下に本発明装置の一実施例を添付図面に基
づいて説明する。図1において、2は本発明に係る化合
物半導体エピタキシャル成長装置である。該成長装置2
は石英製の反応室4を有している。該反応室4の供給側
には第一ガス供給口6及び第二ガス供給口8が反応室4
に連通してそれぞれ設けられている。これらのガス供給
口6及び8は石英管で形成されている。本実施例では、
第一ガス供給口6からはHClガスが供給され、第二ガ
ス供給口8からは、AsH3 ,PH3 及びH2 が
供給される例を示した。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the apparatus of the present invention will be described below with reference to the accompanying drawings. In FIG. 1, 2 is a compound semiconductor epitaxial growth apparatus according to the present invention. The growth device 2
has a reaction chamber 4 made of quartz. On the supply side of the reaction chamber 4, a first gas supply port 6 and a second gas supply port 8 are connected to the reaction chamber 4.
They are connected to each other. These gas supply ports 6 and 8 are formed of quartz tubes. In this example,
An example has been shown in which HCl gas is supplied from the first gas supply port 6, and AsH3, PH3, and H2 are supplied from the second gas supply port 8.

【0009】10は反応室4の排出側に設けられたガス
排出口である。12は該反応室4を加熱するヒータであ
る。
Reference numeral 10 denotes a gas exhaust port provided on the exhaust side of the reaction chamber 4. 12 is a heater that heats the reaction chamber 4;

【0010】14は該反応室4内に設けられた石英製ボ
ートで、例えばGaソース16が収容されている。18
は基板支持具で、基板Wがセットされる。
Reference numeral 14 denotes a quartz boat provided within the reaction chamber 4, in which, for example, a Ga source 16 is accommodated. 18
is a substrate support, on which the substrate W is set.

【0011】しかして、20はHCl供給ラインで、上
記第一ガス供給口6に接続するコネクタ22と、該コネ
クタ22に接続するガイド管24と、HClガスを導入
する導入管26と、該ガイド管24と該導入管26との
間に介在して設けられたフィルター28とから形成され
ている。
Reference numeral 20 denotes an HCl supply line, which includes a connector 22 connected to the first gas supply port 6, a guide tube 24 connected to the connector 22, an introduction tube 26 for introducing HCl gas, and the guide. It is formed from a pipe 24 and a filter 28 interposed between the introduction pipe 26.

【0012】本発明装置の特徴は、このHCl供給ライ
ン20のうち少なくともフィルター28からガス供給口
6までの部分、換言すれば、コネクタ22及びガイド管
24を樹脂配管又はセラミック若しくは樹脂で内部がコ
ーティングされた配管とすることである。導入管26を
樹脂配管又はセラミック若しくは樹脂で内部がコーティ
ングされた配管とすればよりよいことは勿論である。
A feature of the device of the present invention is that at least the portion of the HCl supply line 20 from the filter 28 to the gas supply port 6, in other words, the connector 22 and the guide tube 24 are coated inside with resin piping or ceramic or resin. The piping should be Of course, it is better if the introduction pipe 26 is a resin pipe or a pipe whose inside is coated with ceramic or resin.

【0013】上記した樹脂配管又は樹脂コーティングに
用いられる樹脂は耐熱性で高純度であることが必要であ
るが、特にフッ素樹脂、例えば四フッ化エチレン樹脂が
好適である。
[0013] The resin used for the resin piping or resin coating described above needs to be heat resistant and of high purity, and fluororesins such as tetrafluoroethylene resin are particularly suitable.

【0014】上記セラミックコーティングに使用される
セラミック材料の材質には特別の限定はないが、TiO
2 が好適であり、Cr2 O3 、Al2 O3 等
の公知のセラミック材料を適用することができる。
[0014] There are no particular limitations on the quality of the ceramic material used for the ceramic coating, but TiO
2 is suitable, and known ceramic materials such as Cr2O3 and Al2O3 can be used.

【0015】叙上の構成により、HCl供給ライン20
からHClガスを流すことによってGaソースからGa
がGaClとして供給され、一方第二ガス供給口8から
供給されるAsH3 ,PH3 及びH2 と混合して
基板W上にはGaAsPのエピタキシャル層が成長せし
められる。
With the above configuration, the HCl supply line 20
Ga from the Ga source by flowing HCl gas from
is supplied as GaCl, and mixed with AsH3, PH3 and H2 supplied from the second gas supply port 8, and an epitaxial layer of GaAsP is grown on the substrate W.

【0016】本発明装置においては、HCl供給ライン
20が樹脂配管又はセラミック若しくは樹脂で内部がコ
ーティングされた配管とされているので、腐食性のHC
lガスの通過によっても配管が腐食されることはない。 従って、従来のステンレススチール等の腐食可能な材質
を用いた配管の場合には避けることのできなかった腐食
したFeの粒子等の反応室内への侵入という問題は解消
され、化合物半導体基板へのFe等の汚染も抑制できる
。また、配管が腐食されることがなくなるのであるから
、必然的にHCl供給ラインの寿命も延びることとなる
In the apparatus of the present invention, since the HCl supply line 20 is a resin pipe or a pipe whose inside is coated with ceramic or resin, corrosive HC
The piping will not be corroded by the passage of l gas. Therefore, the problem of corroded Fe particles entering the reaction chamber, which was unavoidable in the case of conventional piping made of corrosive materials such as stainless steel, is solved, and Fe It is also possible to suppress pollution such as Furthermore, since the piping will not be corroded, the life of the HCl supply line will inevitably be extended.

【0017】上述した本発明装置を用いてFe粒子の混
入の少ない化合物半導体発光素子を作成し、従来のステ
ンレススチール製の配管によってHClガスを供給する
装置を用いてFe粒子の混入の多い化合物半導体発光素
子を作成してpn接合界面及びその近傍のFeの濃度と
輝度との関係について実験を行った結果を図2に示した
A compound semiconductor light-emitting device with a small amount of Fe particles mixed in is produced using the above-described apparatus of the present invention, and a compound semiconductor light-emitting device with a large amount of Fe particles mixed in is produced using a conventional device for supplying HCl gas through stainless steel piping. FIG. 2 shows the results of an experiment conducted on the relationship between the Fe concentration and brightness at the pn junction interface and its vicinity after fabricating a light emitting device.

【0018】なお、図2において、相対輝度(%)はS
IMS検出下限(1×1015atoms/cc)時の
出力を100とした場合の相対出力値で表示されている
Note that in FIG. 2, the relative brightness (%) is S
It is displayed as a relative output value when the output at the lower limit of IMS detection (1×10 15 atoms/cc) is set as 100.

【0019】図2から明らかなごとく、pn接合界面及
びその近傍のFeの濃度が1×1016atoms/c
c以下であれば、輝度の低下はないが、1×1016a
toms/ccを超えると輝度が著しく低下することが
判った。
As is clear from FIG. 2, the Fe concentration at the pn junction interface and its vicinity is 1×10 16 atoms/c.
If it is less than c, there will be no decrease in brightness, but 1×1016a
It was found that the brightness significantly decreases when the value exceeds toms/cc.

【0020】なお、図1に示した実施例では、VPE(
気相エピタキシャル成長)装置の例について説明したが
、LPE(液相エピタキシャル成長)装置においてもH
Clガスのエンチング作用を利用して洗浄を行う場合に
、HCl供給ラインを設けてHClガスを供給する方式
を採用するから、LPE装置のHCl供給ラインにおい
ても本発明装置の構成を採用すれば、配管の腐食による
不都合は同様に解消されるものである。
Note that in the embodiment shown in FIG.
Although we have explained an example of a vapor phase epitaxial growth) device, HPE can also be used in an LPE (liquid phase epitaxial growth) device.
When cleaning is performed using the enching action of Cl gas, a method is adopted in which an HCl supply line is provided to supply HCl gas, so if the configuration of the device of the present invention is also adopted in the HCl supply line of the LPE device, Inconveniences caused by corrosion of pipes are likewise eliminated.

【0021】[0021]

【発明の効果】以上述べたごとく、本発明の化合物半導
体エピタキシャル成長装置によれば、HCl供給ライン
内面の腐食を防止でき、化合物半導体基板へのFe等の
汚染を抑制し、かつHCl供給ラインの寿命を延長する
ことができ、Feの濃度を低減化した化合物半導体発光
素子を製造することが可能となる。
As described above, according to the compound semiconductor epitaxial growth apparatus of the present invention, corrosion of the inner surface of the HCl supply line can be prevented, contamination of compound semiconductor substrates with Fe, etc. can be suppressed, and the life of the HCl supply line can be reduced. This makes it possible to manufacture a compound semiconductor light emitting device with a reduced Fe concentration.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明装置の一実施例を示す概略説明図である
FIG. 1 is a schematic explanatory diagram showing an embodiment of the device of the present invention.

【図2】本発明装置と従来の装置によってそれぞれ作成
した化合物半導体発光素子におけるFe濃度と輝度との
関係を示すグラフである。
FIG. 2 is a graph showing the relationship between Fe concentration and brightness in compound semiconductor light emitting devices produced by the apparatus of the present invention and the conventional apparatus, respectively.

【符号の説明】[Explanation of symbols]

2  化合物半導体エピタキシャル成長装置4  反応
室 6  第一ガス供給口 8  第二ガス供給口 16  Gaソース 20  HCl供給ライン 22  コネクタ 24  ガイド管 26  導入管 28  フィルター W  基板
2 Compound semiconductor epitaxial growth apparatus 4 Reaction chamber 6 First gas supply port 8 Second gas supply port 16 Ga source 20 HCl supply line 22 Connector 24 Guide tube 26 Introduction tube 28 Filter W Substrate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】  反応室に連通して設けられたガス供給
口に一端が接続されかつ他端部分に設けられたフィルタ
ーを介してHClガスを反応室内に供給するHCl供給
ラインを備え、該HCl供給ラインのうち少なくともフ
ィルターからガス供給口までの部分が樹脂配管又はセラ
ミック若しくは樹脂で内部がコーティングされた配管で
あることを特徴とする化合物半導体エピタキシャル成長
装置。
1. An HCl supply line having one end connected to a gas supply port provided in communication with the reaction chamber and supplying HCl gas into the reaction chamber through a filter provided at the other end, A compound semiconductor epitaxial growth apparatus characterized in that at least a portion of the supply line from the filter to the gas supply port is a resin pipe or a pipe whose inside is coated with ceramic or resin.
【請求項2】  上記樹脂がフッ素樹脂であることを特
徴とする請求項1記載の化合物半導体エピタキシャル成
長装置。
2. The compound semiconductor epitaxial growth apparatus according to claim 1, wherein the resin is a fluororesin.
【請求項3】  pn接合界面及びその近傍のFeの濃
度が1×1016atoms/cc以下であることを特
徴とする化合物半導体発光素子。
3. A compound semiconductor light emitting device characterized in that the concentration of Fe at and near the pn junction interface is 1×10 16 atoms/cc or less.
JP15775091A 1991-05-31 1991-05-31 Device for epitaxially growing compound semiconductor Pending JPH04354327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15775091A JPH04354327A (en) 1991-05-31 1991-05-31 Device for epitaxially growing compound semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15775091A JPH04354327A (en) 1991-05-31 1991-05-31 Device for epitaxially growing compound semiconductor

Publications (1)

Publication Number Publication Date
JPH04354327A true JPH04354327A (en) 1992-12-08

Family

ID=15656532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15775091A Pending JPH04354327A (en) 1991-05-31 1991-05-31 Device for epitaxially growing compound semiconductor

Country Status (1)

Country Link
JP (1) JPH04354327A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003092064A1 (en) * 2002-04-25 2003-11-06 Tokyo Electron Limited Member for semiconductor manufacturing system and its manufacturing method
JP2014229821A (en) * 2013-05-24 2014-12-08 信越半導体株式会社 Life management method of gas filter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210633A (en) * 1982-03-01 1982-12-24 Nec Corp Surface treating device for 3-5 family compound semiconductor
JPS59171136A (en) * 1983-08-12 1984-09-27 Hitachi Ltd Hanger for wafer susceptor
JPS62281417A (en) * 1986-05-30 1987-12-07 Nippon Telegr & Teleph Corp <Ntt> Vapor phase growth device
JPH0285358A (en) * 1987-10-24 1990-03-26 Tadahiro Omi Pressure reducing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210633A (en) * 1982-03-01 1982-12-24 Nec Corp Surface treating device for 3-5 family compound semiconductor
JPS59171136A (en) * 1983-08-12 1984-09-27 Hitachi Ltd Hanger for wafer susceptor
JPS62281417A (en) * 1986-05-30 1987-12-07 Nippon Telegr & Teleph Corp <Ntt> Vapor phase growth device
JPH0285358A (en) * 1987-10-24 1990-03-26 Tadahiro Omi Pressure reducing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003092064A1 (en) * 2002-04-25 2003-11-06 Tokyo Electron Limited Member for semiconductor manufacturing system and its manufacturing method
JP2014229821A (en) * 2013-05-24 2014-12-08 信越半導体株式会社 Life management method of gas filter

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