JPH04351520A - Injection molding setter - Google Patents

Abstract

PURPOSE:To prevent the erroneous setting of the conditions of molding, and to improve operating efficiency by providing a means, in which a region, in which a defective phenomenon is generated, is formed at a position on an image plane corresponding to the conditions of molding selected by an operator. CONSTITUTION:A console panel 3 for inputting the conditions of molding and the kind of a defective phenomenon generated as the result of molding under the conditions of the molding, is mounted. An injection molding machine 1 is set by the conditions of molding input by the console panel 3, and the data of the conditions of molding input and the kinds of the defective phenomena are stored in a memory every time the data are changed into the conditions of molding. A program pattern diagram in the process of a molding cycle and an image figure in a region, in which the defective phenomenon is generated, are displayed onto the image plane of a display unit 4. The region, in which the defective phenomenon is generated, is formed at a position on an image plane corresponding to the conditions of molding selected by an operator.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection molding setting device.

0002

[Prior Art] Conventionally, resin that has been heated and fluidized in a heating cylinder is injected into a mold at high pressure, and then cooled in the mold.
In an injection molding machine that solidifies or hardens and then opens the mold to take out the molded product, it is necessary to improve the quality of the molded product, such as dimensional accuracy, appearance, strength, etc.
Therefore, molding conditions such as temperature, pressure, speed, time, position, etc. are set based on a comprehensive understanding of the resin, mold, and injection molding machine.

[0003] For example, regarding temperature, there are the heating cylinder temperature, mold temperature, etc., regarding pressure, there are injection force, injection pressure, mold clamping force, screw back pressure, etc., and regarding time, there are injection time, pressure holding time, cooling time, etc. However, injection molding is performed by setting the filling speed, mold clamping/opening speed, screw rotation speed, etc. with respect to speed, and the screw position with respect to position.

[0004] The work of setting these molding conditions in an injection molding machine is performed by a skilled operator through repeated trial and error, relying on experience and intuition.

[0005]

[Problems to be Solved by the Invention] However, in the conventional injection molding setting device described above, if the initial setting conditions such as the resin used, screw diameter, projected area of the mold, and injection weight differ, the molding conditions will be affected. Not only is it difficult to set the appropriate molding conditions, but also the time required to set the molding conditions is longer.

[0006]Furthermore, in the process of repeating trial and error before determining the molding conditions, if the same error is made, it will take that much more time to determine the molding conditions. The present invention solves the problems of the conventional injection molding setting device described above, and provides an injection molding setting device that can easily set molding conditions and shorten the time required to determine the molding conditions. The purpose is to

[0007]

[Means for Solving the Problems] To this end, the injection molding setting device of the present invention includes a microprocessor and an operation panel for inputting molding conditions and the types of defective phenomena that occur as a result of molding under the molding conditions. The injection molding machine is set according to the molding conditions input through the operation panel.

[0008] Furthermore, a memory is provided for storing input molding conditions and data on types of defective phenomena, and each time an operator changes the molding conditions and molding is performed under the changed molding conditions, these data are stored. is memorized. A display device is provided that has a screen for displaying a program pattern diagram in the process of the molding cycle and an image diagram of an area where a defective phenomenon occurs, and the area is displayed on the screen corresponding to the molding condition selected by the operator. It is formed at the position of

[0009]

[Function] As described above, the present invention includes a microprocessor and an operation panel for inputting molding conditions and the type of defective phenomenon that occurs as a result of molding under the molding conditions. When the operator inputs molding conditions, the injection molding machine is set according to the molding conditions and molding is performed.

[0010] Furthermore, a memory is provided for storing input molding conditions and data on types of defective phenomena, and each time the operator changes the molding conditions and molding is performed under the changed molding conditions, the microprocessor stores the above data in memory. A program pattern diagram is displayed on the screen of a display device for each step of the molding cycle, and an image diagram of an area where a defective phenomenon occurs can be displayed superimposed on the program pattern diagram.

[0011] The above area is formed at a position on the screen corresponding to the molding conditions selected by the operator.

0012

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing an example of changing molding conditions on the setting screen of the injection molding setting device of the present invention, and FIG.
1 is a block diagram of an injection molding setting device of the present invention. Figure 2
, 1 is an injection molding machine, 2 is a microprocessor that controls the injection molding machine 1 and processes data for determining molding conditions, and 3 is a microprocessor for inputting the molding conditions of the injection molding machine 1. 4 is a display device that displays the molding conditions input by the operator and the molding results; 5 is a memory that stores previously input molding conditions and data on the results of injection molding according to the molding conditions; 6 is a control panel; It's a printer.

In the injection molding setting device configured as described above, when starting a molding operation with different initial setting conditions such as the resin used, the screw diameter, the projected area of the mold, the injection weight, etc., the operator first uses the operation panel 3 to Instructions are given to perform injection molding according to preset molding conditions, and injection molding is performed. In this case, the above molding conditions include, for example, temperature such as heating cylinder temperature, mold temperature, etc., pressure such as injection force, injection pressure, mold clamping force, screw back pressure, etc., and time regarding injection time, maintenance, etc. Pressure time, cooling time, etc., speed include filling speed, mold clamping/opening speed, screw rotation speed, etc., and position includes screw position, and each value is set in advance based on past experience. It is stored in the memory 5.

In the first shot, the microprocessor 2 reads out the molding conditions and displays them on the display device 4. The operator looks at the display device 4 and changes the molding conditions according to conditions such as the resin used, the screw diameter, the projected area of the mold, and the injection weight, as necessary. In this case, the molding conditions are changed by the operator operating the operation panel 3.

When the microprocessor 2 receives a signal to change the molding conditions from the operation panel 3, it stores the signal in the memory 5 and controls the injection molding machine 1 according to the molding conditions.
Set and perform injection molding. The injection molding machine 1 molds a molded article by performing injection molding comprising the steps of injection, holding pressure, cooling, and metering according to the above-mentioned molding conditions. Then, the operator observes the molding state of the injection molding machine 1, the quality of the molded product, etc., and inputs it via the operation panel 3 if a defective phenomenon is observed corresponding to the above-mentioned molding conditions. Microprocessor 2 is
The data on the type of defective phenomenon is received and stored in the memory 5, and the changes in the molding conditions and the type of defective phenomenon are outputted to the printer 6 and displayed on the screen of the display device 4.

An example of the output of the printer 6 (an example of the display on the screen of the display device 4) will be explained based on FIG. In the figure, "shot number" indicates the injection molding shot number consisting of each step of injection, holding pressure, cooling, and metering. It is designed to be output for all shots after starting injection molding. "Condition change details" indicates the change in molding conditions input by the operator from the operation panel 3, and "defect phenomenon" indicates the type of defect phenomenon that occurred as a result of molding under the changed molding conditions.

In this case, in the first shot,
The value of the screw position S4 in the preset molding conditions is changed from 10 to 8 in accordance with the contents of the initial setting conditions. Then, as a result of the injection molding machine 1 performing molding under the changed molding conditions, burrs were generated. Similarly, in the fourth shot, the sink mark was eliminated by changing the value of the holding pressure P1 from 20 to 40 under the third molding conditions. In addition, in the 8th shot, the value of the holding pressure P2 was changed from 0 to 30.
In the 10th shot, jetting was resolved by changing the value of the filling speed V2 from 10 to 6, and in the 11th shot
In the 12th shot, the short circuit was resolved by changing the value of the filling speed V3 from 25 to 30, and the 12th shot
In the 1st shot, burning occurred by changing the value of the filling speed V4 from 10 to 25, and in the 13th shot, the value of the screw position S4 was changed from 45 to 5.
By changing it to 0, burrs are generated.

As described above, the data on the changes in the molding conditions and the types of defects that have occurred for each shot are stored in the memory 5 by the microprocessor 2, displayed on the display device 4, and displayed on the printer. 6 is output. The microprocessor 2 further performs calculations based on the data in accordance with the operator's instructions, and displays a program pattern diagram and areas where defective phenomena occur on the display device 4 for each molding process.

FIG. 3 is a diagram showing an example of the defective phenomenon area on the setting screen, and FIG. 4 is a diagram showing another example of the defective phenomenon area on the setting screen. In FIG. 3, the vertical axis of the screen represents the holding pressure, and the horizontal axis represents the holding pressure time. 11 shows a program pattern of molding conditions determined by the molding condition determination. In the pressure holding process, it is preferable that the program pattern 11 controls the holding pressure with respect to the pressure holding time. Reference numeral 12 indicates an area where burrs occur, 13 indicates an area where mold release defects occur, and 14 indicates an area where sink marks occur. These areas 12 to 14 are formed as images of dot configurations on the screen of the display device 4, and each time a defective phenomenon as shown in FIG. 1 occurs, dots are added to positions on the screen corresponding to the molding conditions. , the above areas 12-1
The image of 4 has been changed. Note that the names of the types of defective phenomena in each of the areas 12 to 14 are also displayed in an appropriate manner.

The operator can determine the program pattern 11 while avoiding the areas 12 to 14 of defective phenomena by looking at the screen thus displayed. Further, in FIG. 4, the vertical axis of the screen represents the filling speed, and the horizontal axis represents the screw position. Reference numeral 16 indicates a program pattern of molding conditions determined by determining the molding conditions. In the filling process, it is preferable that the filling speed with respect to the screw position be controlled by this program pattern 16. Reference numeral 17 indicates an area where jetting occurs, 18 indicates an area where burning occurs, 19 indicates an area where burrs occur, and 20 indicates an area where short circuit occurs.

In this case as well, the operator can determine the program pattern 16 by looking at the screen of the display device 4 while avoiding each of the areas 17 to 20 of defective phenomena. Note that the present invention is not limited to the above embodiments,
Various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0022]

Effects of the Invention As described above in detail, the present invention includes a microprocessor and an operation panel for inputting molding conditions and the type of defective phenomena that occur as a result of molding under the molding conditions. In addition, a memory is provided to store data on the input molding conditions and types of defective phenomena, and each time the operator changes the molding conditions and molding is performed under the changed molding conditions, the microprocessor stores the above data in memory.

[0023] A program pattern diagram is displayed on the screen of a display device for each step of the molding cycle, and an image diagram of an area where a defective phenomenon occurs can be displayed superimposed on the program pattern diagram. The above area is formed at a position on the screen corresponding to the molding conditions selected by the operator. Therefore, the operator can look at the screen of the display device, select molding conditions and form a program pattern while avoiding areas where defective phenomena occur, and reduce the time required to set molding conditions. Can be done.

Moreover, since it is possible to prevent erroneous setting of molding conditions, work efficiency is improved.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an example of changing molding conditions on a setting screen of an injection molding setting device of the present invention.

FIG. 2 is a block diagram of the injection molding setting device of the present invention.

FIG. 3 is a diagram showing an example of a defective phenomenon area on a setting screen.

FIG. 4 is a diagram showing another example of a defective phenomenon area on a setting screen.

[Explanation of symbols]

1 Injection molding machine 2 Microprocessor 3 Operation panel 4 Display device 5 Memory 6 Printer 11, 16 Program patterns 12 to 14, 1
7-20 area

Claims (1)

[Claims] Claim 1: (a) a microprocessor; (b)
(c) means for setting the injection molding machine according to the molding conditions inputted through the operation panel; (d) A memory that stores the input molding conditions and defect type data each time the molding conditions are changed, and (e) Displays a program pattern diagram in the molding cycle process and an image diagram of the area where the defective phenomenon occurs. An injection molding setting device comprising: a display device having a screen; and (f) means for forming an area where the defective phenomenon occurs at a position on the screen corresponding to molding conditions selected by an operator.