JPH0434933Y2 - - Google Patents

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Publication number
JPH0434933Y2
JPH0434933Y2 JP1983188968U JP18896883U JPH0434933Y2 JP H0434933 Y2 JPH0434933 Y2 JP H0434933Y2 JP 1983188968 U JP1983188968 U JP 1983188968U JP 18896883 U JP18896883 U JP 18896883U JP H0434933 Y2 JPH0434933 Y2 JP H0434933Y2
Authority
JP
Japan
Prior art keywords
cap body
melting point
low melting
point glass
receiving member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983188968U
Other languages
Japanese (ja)
Other versions
JPS6095975U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18896883U priority Critical patent/JPS6095975U/en
Publication of JPS6095975U publication Critical patent/JPS6095975U/en
Application granted granted Critical
Publication of JPH0434933Y2 publication Critical patent/JPH0434933Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 (産業上の利用分野) 本考案はキヤツプ本体内面に低融点ガラスを塗
布する低融点ガラス塗布装置に係り、特に、光半
導体装置における光半導体素子収容用のキヤツプ
におけるキヤツプ本体に光透過用窓体を加熱封止
するための低融点ガラスを予めキヤツプ本体のフ
ランジ底面内面に塗布する際に使用して有効な低
融点ガラス塗布装置に関するものである。
[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to a low melting point glass coating device for coating a low melting point glass on the inner surface of a cap body, and is particularly applicable to a cap for accommodating an optical semiconductor element in an optical semiconductor device. The present invention relates to a low melting point glass coating device which is effective for use in advance coating the inner surface of the bottom surface of the flange of a cap body with low melting point glass for heat sealing a light transmitting window to the main body.

(技術の背景) この種の塗布装置としては、均質でかつ均一厚
さの低融点ガラスを塗布できるように構成する必
要がある。
(Technical Background) This type of coating device needs to be configured to be able to coat low-melting glass that is homogeneous and has a uniform thickness.

(従来技術と問題点) この種塗布装置の従来としては、エアーを用い
たデイスペンサーに粉末の低融点ガラスとバイン
ダーとを混合した液状低融点ガラスを充填し、ま
たキヤツプ本体を固定し、デイスペンサーの細い
射出ノズルよりキヤツプ本体のフランジ底面内面
コーナー周円部に作業者が手で該ノズルを回転さ
せながら塗布する事が考えられるが、このような
人的作業では均一な塗布厚を得ることが困難であ
り、又ガラス粉末が沈殿する為、たえずデイスペ
ンサーを手で振り揺動させなければ均質に塗布で
きないという欠点がある。
(Prior art and problems) Conventionally, this type of coating device fills a dispenser using air with liquid low-melting glass, which is a mixture of powdered low-melting glass and a binder, and fixes the cap body. It is conceivable that the worker would use Spencer's narrow injection nozzle to apply the coating to the inner corner of the bottom surface of the flange of the cap body while rotating the nozzle by hand, but it is difficult to obtain a uniform coating thickness with such manual work. Moreover, since the glass powder precipitates, it is difficult to uniformly coat the dispenser unless the dispenser is constantly shaken by hand.

(考案の目的) 本考案は上述の欠点を除去するために提案され
たもので、液状低融点ガラスをキヤツプ本体のフ
ランジ底面内面のコーナー円周上に、均質にかつ
均一な厚さで塗布することを目的とするものであ
る。
(Purpose of the invention) This invention was proposed to eliminate the above-mentioned drawbacks, and involves applying liquid low melting point glass homogeneously and with a uniform thickness on the inner corner circumference of the bottom surface of the flange of the cap body. The purpose is to

(課題を解決する手段) この考案の目的は、一端側が開口し、他端側に
内側に折曲つたフランジ底面を有する筒状のキヤ
ツプ本体のフランジ底面内面に光透過用窓体を加
熱封止するための低融点ガラスを塗布するキヤツ
プ本体内面への低融点ガラス塗布装置において、 キヤツプ本体への低融点ガラスの塗布位置と該
塗布位置とは離れた位置のキヤツプ本体の脱着位
置との間に亙つて往復移動可能に設けられた移動
体上に回転自在に支承され、前記キヤツプ本体を
その一端開口側が上方を向くように取出し自在に
着座する受部材と、 前記移動体を前記塗布位置と脱着位置との間で
移動させる移動機構と、 前記受部材を前記キヤツプ本体の軸線を中心と
して回転させる回転駆動手段と、 液状低融点ガラスが充填されたデイスペンサー
を支持すると共に、デイスペンサーのノズル先端
が前記キヤツプ本体のフランジ底面内面と微小ギ
ヤツプを介して対向する位置とキヤツプ本体開口
部外に位置する位置との間に亙つて回動可能に設
けられたデイスペンサー支持体と、 該デイスペンサー支持体を回動させる回動機構
とを具備することを特徴とするキヤツプ本体内面
への低融点ガラス塗布装置により達成される。
(Means for solving the problem) The purpose of this invention is to heat-seal a light transmitting window on the inner surface of the flange bottom of a cylindrical cap body that is open at one end and has an inwardly bent flange bottom at the other end. In a low melting point glass application device for applying low melting point glass to the inner surface of a cap body, there is a space between the position where the low melting point glass is applied to the cap body and the attachment/detachment position of the cap body which is located away from the application position. a receiving member which is rotatably supported on a movable body which is provided to be reciprocally movable, and is seated so that the cap main body can be taken out with one end of the cap body facing upward; and the movable body is attached to and detached from the application position. a moving mechanism for moving the receiving member between positions; a rotation driving means for rotating the receiving member about the axis of the cap body; a dispenser support rotatably provided between a position facing the inner surface of the bottom surface of the flange of the cap body via a small gap and a position located outside the opening of the cap body; This is achieved by an apparatus for applying low melting point glass to the inner surface of the cap body, which is characterized by being equipped with a rotation mechanism for rotating the body.

(作用) 受部材上にキヤツプ本体を一端開口側を上にし
てのせ、移動体により受け部材が塗布位置に位置
するよう移動すると共に、受部材をキヤツプ本体
の軸線を中心として回転させる。
(Operation) The cap body is placed on the receiving member with one end of the opening facing upward, and the moving body moves the receiving member to the application position, and the receiving member is rotated about the axis of the cap body.

デイスペンサー支持機構によりデイスペンサー
をそのノズル先端がキヤツプ本体のフランジ底面
内面と微小ギヤツプを介して対向する位置まで回
動移動したのち、ノズルから液体状低融点ガラス
を一定量吐出する。この吐出量を一定にすること
で、ノズル先端が塗布された低融点ガラスをかき
まわし、一定厚でかつ均質にさせると共に、キヤ
ツプ本体回転による遠心力で低融点ガラスが広が
り、一層塗布厚を均一にすることができる。
After the dispenser is rotated by the dispenser support mechanism to a position where the nozzle tip faces the inner surface of the bottom surface of the flange of the cap body through a small gap, a fixed amount of liquid low-melting glass is discharged from the nozzle. By keeping this discharge amount constant, the nozzle tip stirs the coated low melting point glass to make it uniform and uniform in thickness, and the centrifugal force from the rotation of the cap body spreads the low melting point glass, making the coated thickness even more uniform. can do.

次いでデイスペンサーをそのノズル先端がキヤ
ツプ本体開口部外に位置するよう回動させ、移動
体により受部材を取出し位置まで移動させて、塗
布の終了したキヤツプ本体を取り出す。
Next, the dispenser is rotated so that its nozzle tip is positioned outside the opening of the cap body, and the moving body moves the receiving member to the take-out position, and the cap body after application is taken out.

(実施例) 以下、本考案の実施例を図面に沿つて説明す
る。
(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

第1図A,Bは本塗布装置を適用する光半導体
装置の金属製円筒径キヤツプ本体を示す上面図と
側断面図である。
1A and 1B are a top view and a side sectional view showing a metal cylindrical diameter cap body of an optical semiconductor device to which the present coating apparatus is applied.

図示の如く、キヤツプ本体1は上方が開口2と
なつており、また下方が内側に折曲がつたフラン
ジ底面3を有するよう開口4となつている。
As shown in the figure, the cap body 1 has an opening 2 at the top and an opening 4 at the bottom with a flange bottom surface 3 bent inward.

そして、キヤツプ本体1の内面の底部コーナー
円周上には液体状低融点ガラス5が塗布され、こ
の状態で加熱して低融点ガラスのバインダーの除
去とグレーズ処理を行つた後、光透過用窓体を形
成するガラス6(点線図示)をキヤツプ本体内に
載置して加熱し、該低融点ガラス5を溶解するこ
とにより開口4が気密止される。
Then, liquid low melting point glass 5 is applied on the circumference of the bottom corner of the inner surface of the cap body 1, and after heating in this state to remove the binder of the low melting point glass and perform glazing treatment, a light transmitting window is formed. Glass 6 (shown by dotted lines) forming the cap body is placed inside the cap body and heated to melt the low melting point glass 5, thereby making the opening 4 airtight.

更にキヤツプ本体1内には図示せぬ光半導体素
子が封入され光半導体装置を構成する。
Furthermore, an optical semiconductor element (not shown) is enclosed within the cap body 1 to constitute an optical semiconductor device.

第2図と第3図は本考案に係る低融点ガラス塗
布装置を示す上図面とデイスペンサー側より見た
側面図である。また第4図は本考案装置の低融点
ガラス塗布動作を示す図である。
2 and 3 are a top view and a side view as seen from the dispenser side, showing the low melting point glass coating device according to the present invention. Further, FIG. 4 is a diagram showing the low melting point glass coating operation of the apparatus of the present invention.

図において、7は台板、8は仕切り板、9はカ
ム軸モータ、10はギヤー列、11はカム軸、1
2は手操作用ハンドル、13と14はカム軸11
の軸受、15と16は略楕円形状の軸11に固定
されたカム板、17は従来と同様液体状低融点ガ
ラスを充填したデイスペンサー、18は先端の射
出ノズル、19はデイスペンサー17を斜め状態
で固定する支持アーム、20は一端に支持アーム
19が固定された回転軸、21は仕切り板8に取
付けた回転軸20の軸受、22は一端が回転軸2
0の他端に固定され且つ他端がカム板16に当接
された回転軸20とカム板16を接続する軸、2
3はキヤツプ本体1を着座する受部材、24は受
部材23がこのモータ軸に固定され該受部材23
をキヤツプ本体1の中心軸を回転中心として回転
させるモータ、25は腕部材、26は腕部材25
の回転軸、27は軸26の軸受、28は腕部材2
5より導出されたカム板15の当接部材、29は
腕部材25の復帰ばねである。
In the figure, 7 is a base plate, 8 is a partition plate, 9 is a camshaft motor, 10 is a gear train, 11 is a camshaft, 1
2 is a manual handle, 13 and 14 are camshafts 11
15 and 16 are cam plates fixed to the substantially oval shaft 11, 17 is a dispenser filled with liquid low melting point glass as in the past, 18 is an injection nozzle at the tip, and 19 is an injection nozzle at the tip of the dispenser 17. 20 is a rotating shaft to which the supporting arm 19 is fixed at one end, 21 is a bearing of the rotating shaft 20 attached to the partition plate 8, and 22 is a rotating shaft 20 whose one end is fixed to the rotating shaft 2.
a shaft 2 that connects the rotating shaft 20 and the cam plate 16, which are fixed to the other end of the cam plate 16 and whose other end is in contact with the cam plate 16;
3 is a receiving member on which the cap body 1 is seated; 24 is a receiving member 23 fixed to the motor shaft;
25 is an arm member; 26 is an arm member 25;
27 is the bearing of the shaft 26, 28 is the arm member 2
The abutment member 29 of the cam plate 15 led out from 5 is a return spring of the arm member 25.

腕部材25が移動体に相当し、カム軸モータ
9、カム軸11、カム板15、当接部材28等に
より移動体の移動機構を構成する。また支持アー
ム19が支持体に相当し、カム軸モータ9、カム
軸11、カム板16、軸22、回転軸20等で支
持体の回転機構を構成する。
The arm member 25 corresponds to a moving body, and the camshaft motor 9, camshaft 11, cam plate 15, abutting member 28, etc. constitute a moving mechanism for the moving body. Further, the support arm 19 corresponds to a support body, and the camshaft motor 9, camshaft 11, cam plate 16, shaft 22, rotating shaft 20, etc. constitute a rotation mechanism of the support body.

フートスイツチ等によりモータ9が駆動される
とギヤー列10を介して軸11が回転し、この軸
回転によつてカム板15,16を介しデイスペン
サー支持機構とキヤツプ本体17を支持する支持
アーム19と腕部材25が駆動される。
When the motor 9 is driven by a foot switch or the like, the shaft 11 rotates through the gear train 10, and this shaft rotation causes the support arm 19, which supports the dispenser support mechanism and the cap body 17, to rotate through the cam plates 15 and 16. Arm member 25 is driven.

すなわち、軸11が1回転する間に支持アーム
19はまず第3図位置から射出ノズル18がギヤ
ツプ本体1の内面の底部コーナー位置に微小ギヤ
ツプを介し対向するよう矢印a方向に回転移動す
る。そして、この挿入状態で一定時間デイスペン
サー17へのエアー供給装置の電気入力が行わ
れ、ノズル18から液体状低融点ガラス5が一定
量吐出される。次にこの塗布後支持アーム19は
矢印b方向に回転移動し再び第3図位置に復帰
し、軸11の1回転による1サイクルのデイスペ
ンサー動作が行われ、これの多サイクルによりキ
ヤツプ本体1を順次取替えながら多数個のキヤツ
プ本体1への塗布が果される。
That is, during one revolution of the shaft 11, the support arm 19 rotates from the position shown in FIG. 3 in the direction of arrow a so that the injection nozzle 18 faces the bottom corner position of the inner surface of the gap main body 1 through a small gap. Then, in this inserted state, electrical input from the air supply device to the dispenser 17 is performed for a certain period of time, and a certain amount of liquid low melting point glass 5 is discharged from the nozzle 18. After this application, the support arm 19 rotates in the direction of arrow b and returns to the position shown in FIG. The coating is applied to a large number of cap bodies 1 while being replaced one after another.

尚、支持アーム19の矢印a,b方向の回転移
動は軸11よつてカム板16が1回転することに
より、該カム板16の外形形状で軸22が矢印
a,b方向に移動し、軸20が同様に回転移動し
て行われる。
The rotational movement of the support arm 19 in the directions of arrows a and b is achieved by one rotation of the cam plate 16 by the shaft 11, which causes the shaft 22 to move in the directions of arrows a and b due to the external shape of the cam plate 16. 20 is similarly rotated and moved.

一方、軸11が1回転する間に腕部材25はカ
ム板15の外形形状およびばね29のばね力によ
り当接部材28を介し軸26を中心として矢印
c,d方向に回転し、1サイクルのキヤツプ本体
移動が行われる。
On the other hand, during one rotation of the shaft 11, the arm member 25 rotates in the directions of arrows c and d about the shaft 26 via the abutment member 28 due to the external shape of the cam plate 15 and the spring force of the spring 29. The cap body is moved.

このキヤツプ本体移動とデイスペンサー移動の
関係は、支持アーム19が第3図位置にある時腕
部材25は第2図実線位置にある。そしてこの状
態から該腕部材25は支持アーム19が矢印a方
向に移動し塗布を行ないしかも矢印b方向に移動
してノズル18がキヤツプ本体1に引つかからな
い位置に達した時点で、点線位置に移動しキヤツ
プ本体1の取出しが可能となる。またこの後再び
腕部材25は実線位置に移動する。
The relationship between the movement of the cap body and the movement of the dispenser is such that when the support arm 19 is in the position shown in FIG. 3, the arm member 25 is in the position shown by the solid line in FIG. From this state, the arm member 25 moves to the dotted line position when the support arm 19 moves in the direction of the arrow a to perform coating, and further moves in the direction of the arrow b to reach a position where the nozzle 18 is not caught on the cap body 1. The cap body 1 can be moved and taken out. After this, the arm member 25 moves again to the solid line position.

このキヤツプ本体移動とデイスペンサー移動は
軸1の1回転毎に行なわれ、該軸11の回転は作
業者のフートスイツチによつて制御される。
This movement of the cap body and the movement of the dispenser is performed every rotation of the shaft 1, and the rotation of the shaft 11 is controlled by the operator's foot switch.

またキヤツプ本体1は作業中腕部材25が第2
図実線位置にある時、モータ24により受部材2
3を介して常に一定速度で回転されており、第2
図点線位置でモータ24は停止されキヤツプ本体
1の取出しが行なわれる。
Also, while the cap body 1 is being operated, the arm member 25 is in the second position.
When in the solid line position in the figure, the motor 24 causes the receiving member 2 to
The second
The motor 24 is stopped at the position indicated by the dotted line in the figure, and the cap body 1 is taken out.

このように本装置の低融点ガラス塗布では第4
図の如く、キヤツプ本体1が回転しながらデイス
ペンサー17のノズル18より吐出した液体状低
融点ガラス5の塗布が行なわれるため、吐出量さ
え一定にしていればノズル先端で塗布された低融
点ガラスをかきまわし一定厚で且つ均質にさせる
と共に、キヤツプ本体回転による遠心力で該低融
点ガラスは広がり更に塗布厚が均一となる。
In this way, in the low melting point glass coating of this device, the fourth
As shown in the figure, since the liquid low melting point glass 5 is applied while the cap body 1 is rotating and is discharged from the nozzle 18 of the dispenser 17, if the discharge amount is kept constant, the low melting point glass will be applied at the tip of the nozzle. The low melting point glass is stirred to have a constant thickness and uniformity, and the centrifugal force caused by the rotation of the cap body spreads the low melting point glass, further making the coating thickness uniform.

また、キヤツプ本体1の回転はスピードコント
ロールモータで回転数を変えることにより一層の
均一塗布が可能となる。
Furthermore, by changing the rotation speed of the cap body 1 using a speed control motor, more uniform application can be achieved.

更に、デイスペンサー17内の液体状低融点ガ
ラス5はデイスペンサー17の矢印a,b方向の
回転移動によつてかく拌されガラス粉末の沈殿も
防止できるので均質な塗布が可能となる。
Further, the liquid low melting point glass 5 in the dispenser 17 is agitated by the rotational movement of the dispenser 17 in the directions of arrows a and b, and precipitation of glass powder can be prevented, so that uniform application is possible.

(考案の効果) 本考案によれば、従来のデイスペンサー等を使
用した手作業と比較してノズル先端により低融点
ガラスがかきまわされること、またキヤツプ本体
が回転することにより遠心力が作用することによ
り、低融点ガラスを均一な塗布厚でかつ均質に塗
布することが可能となり、塗布動作の自動化によ
り容易に量産ができるという効果が得られる。
(Effects of the invention) According to the invention, compared to manual work using conventional dispensers, the low melting point glass is stirred by the nozzle tip, and centrifugal force is applied by rotating the cap body. This makes it possible to apply the low melting point glass homogeneously with a uniform coating thickness, and the automation of the application operation facilitates mass production.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図A,Bは本塗布装置を適用する光半導体
装置の金属製円筒形キヤツプ本体を示す上面図と
側断面図、第2図と第3図は本考案に係る低融点
ガラス塗布装置を示す上面図とデイスペンサー側
より見た側面図である。第4図は本考案装置の低
融点ガラス塗布動作を示す図である。 符号の説明、1……キヤツプ本体、17……デ
イスペンサー、18……ノズル、19……支持ア
ーム、23……受部材、24……モータ、25…
…腕部材。
1A and 1B are a top view and a side sectional view showing a metal cylindrical cap body of an optical semiconductor device to which this coating device is applied, and FIGS. 2 and 3 show a low melting point glass coating device according to the present invention. FIG. 2 is a top view and a side view seen from the dispenser side. FIG. 4 is a diagram showing the low melting point glass coating operation of the apparatus of the present invention. Explanation of symbols: 1... Cap body, 17... Dispenser, 18... Nozzle, 19... Support arm, 23... Receiving member, 24... Motor, 25...
...Arm parts.

Claims (1)

【実用新案登録請求の範囲】 一端側が開口し、他端側に内側に折曲つたフラ
ンジ底面を有する筒状のキヤツプ本体のフランジ
底面内面に光透過用窓体を加熱封止するための低
融点ガラスを塗布するキヤツプ本体内面への低融
点ガラス塗布装置において、 キヤツプ本体への低融点ガラスの塗布位置と該
塗布位置とは離れた位置のキヤツプ本体の脱着位
置との間に亙つて往復移動可能に設けられた移動
体上に回転自在に支承され、前記キヤツプ本体を
その一端開口側が上方を向くように取出し自在に
着座する受部材と、 前記移動体を前記塗布位置と脱着位置との間で
移動させる移動機構と、 前記受部材を前記キヤツプ本体の軸線を中心と
して回転させる回転駆動手段と、 液状低融点ガラスが充填されたデイスペンサー
を支持すると共に、デイスペンサーのノズル先端
が前記キヤツプ本体のフランジ底面内面と微小ギ
ヤツプを介して対向する位置とキヤツプ本体開口
部外に位置する位置との間に亙つて回動可能に設
けられたデイスペンサー支持体と、 該デイスペンサー支持体を回動させる回動機構
とを具備することを特徴とするキヤツプ本体内面
への低融点ガラス塗布装置。
[Claims for Utility Model Registration] Low melting point for heat-sealing a light transmitting window to the inner surface of the flange bottom of a cylindrical cap body that is open at one end and has an inwardly bent flange bottom at the other end. In a low melting point glass application device for applying glass to the inner surface of a cap body, it is possible to reciprocate between the position where low melting point glass is applied to the cap body and the attachment/detachment position of the cap body which is located away from the application position. a receiving member which is rotatably supported on a movable body provided on the cap body and is seated on the cap body so that the cap body can be taken out with one end of the cap body facing upward; a moving mechanism for moving the receiving member; a rotation driving means for rotating the receiving member about the axis of the cap main body; a dispenser support rotatably provided between a position facing the inner surface of the bottom surface of the flange via a small gap and a position located outside the opening of the cap body; and rotating the dispenser support. 1. A device for applying low melting point glass to the inner surface of a cap body, characterized by comprising a rotation mechanism.
JP18896883U 1983-12-07 1983-12-07 Adhesive application device to the inside of the cap Granted JPS6095975U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18896883U JPS6095975U (en) 1983-12-07 1983-12-07 Adhesive application device to the inside of the cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18896883U JPS6095975U (en) 1983-12-07 1983-12-07 Adhesive application device to the inside of the cap

Publications (2)

Publication Number Publication Date
JPS6095975U JPS6095975U (en) 1985-06-29
JPH0434933Y2 true JPH0434933Y2 (en) 1992-08-19

Family

ID=30407535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18896883U Granted JPS6095975U (en) 1983-12-07 1983-12-07 Adhesive application device to the inside of the cap

Country Status (1)

Country Link
JP (1) JPS6095975U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624402B2 (en) * 1973-07-20 1981-06-05

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624402U (en) * 1979-07-31 1981-03-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624402B2 (en) * 1973-07-20 1981-06-05

Also Published As

Publication number Publication date
JPS6095975U (en) 1985-06-29

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