JPH04349197A - Apparatus for forming thin film - Google Patents

Apparatus for forming thin film

Info

Publication number
JPH04349197A
JPH04349197A JP3120535A JP12053591A JPH04349197A JP H04349197 A JPH04349197 A JP H04349197A JP 3120535 A JP3120535 A JP 3120535A JP 12053591 A JP12053591 A JP 12053591A JP H04349197 A JPH04349197 A JP H04349197A
Authority
JP
Japan
Prior art keywords
carbon
chamber
film
film forming
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3120535A
Other languages
Japanese (ja)
Other versions
JP2936790B2 (en
Inventor
Kenji Sato
賢治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP3120535A priority Critical patent/JP2936790B2/en
Publication of JPH04349197A publication Critical patent/JPH04349197A/en
Application granted granted Critical
Publication of JP2936790B2 publication Critical patent/JP2936790B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Plasma Technology (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To prevent the peeling of a film laminated on the wall face of a film forming chamber and to form a thin film good in properties and uniformity with good reproducibility. CONSTITUTION:At the inside of the inner wall parts of a film forming chamber 3 and a plasma generating chamber 2, protective sheets 18... 18 for the wall faces made of high purity graphite coated with glassy carbon are set, and a holder 11 and a shutter 16 are formed by high purity graphite coated with glassy carbon. The high purity graphite coated with glassy carbon has high adhesion for a hard diamond like carbon film, so that the peeling of a carbon film can be eliminated.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、表面保護材料、硬質材
料、音響材料、熱伝導材料等に利用される硬質ダイヤモ
ンド状炭素膜等を形成する薄膜形成装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film forming apparatus for forming hard diamond-like carbon films used for surface protection materials, hard materials, acoustic materials, heat conductive materials, etc.

【0002】0002

【従来の技術】硬質ダイヤモンド状炭素膜等を形成する
ための装置には、スパッタ装置、マイクロ波プラズマC
VD装置、ECRプラズマCVD装置等がある。
[Prior Art] Apparatus for forming hard diamond-like carbon films include sputtering equipment, microwave plasma carbon film, etc.
There are VD equipment, ECR plasma CVD equipment, etc.

【0003】0003

【発明が解決しようとする課題】硬質ダイヤモンド状炭
素膜は内部応力が高く、化学的に安定した物質であるた
め、他の物質との付着性が悪く、特に従来の製造装置の
成膜室主要構成材料であるステンレス材には付着性が良
くなかったため、成膜室壁面に堆積したダイヤモンド状
炭素膜が真空排気中、ガス導入中または成膜中に剥離し
、成膜室中を浮遊するために、得られた膜の特性、均一
性、再現性に問題が生じていた。本発明は、上記の問題
点を解消するために創案されたものであり、特性、均一
性の良い硬質ダイヤモンド状炭素膜等の薄膜を再現性良
く形成することができる薄膜形成装置を提供することを
目的とする。
[Problems to be Solved by the Invention] Hard diamond-like carbon films have high internal stress and are chemically stable substances, so they have poor adhesion to other substances, especially in the main film forming chamber of conventional manufacturing equipment. Because the stainless steel material used as the constituent material did not have good adhesion, the diamond-like carbon film deposited on the walls of the deposition chamber peeled off during vacuum evacuation, gas introduction, or deposition, and floated in the deposition chamber. Moreover, problems have arisen in the properties, uniformity, and reproducibility of the obtained films. The present invention was devised to solve the above problems, and provides a thin film forming apparatus capable of forming a thin film such as a hard diamond-like carbon film with good characteristics and uniformity with good reproducibility. With the goal.

【0004】0004

【課題を解決するための手段】上記目的を達成するため
に本発明の薄膜形成装置は、成膜室の内壁部分と基板取
付けホルダー部分とを、ガラス状炭素で被覆した高純度
グラファイトを用いて形成することを特徴とする。
[Means for Solving the Problems] In order to achieve the above object, the thin film forming apparatus of the present invention uses high purity graphite coated with glassy carbon for the inner wall portion of the film forming chamber and the substrate mounting holder portion. It is characterized by forming.

【0005】[0005]

【作用】ガラス状炭素で被覆した高純度グラファイトは
、耐プラズマ性、耐熱性、耐酸化性、低ダスト発生率等
の優れた特徴を有しており、特に同一元素である硬質ダ
イヤモンド状炭素膜に対しては、高い付着性を持ってい
る。ゆえに、薄膜形成装置のプラズマにさらされる部分
をこの材料を用いて形成すれば、壁面からの炭素膜の剥
離がなくなり、良質な硬質状ダイヤモンド状炭素膜等を
形成することができる。
[Action] High-purity graphite coated with glassy carbon has excellent characteristics such as plasma resistance, heat resistance, oxidation resistance, and low dust generation rate. It has high adhesion to. Therefore, if the part of the thin film forming apparatus exposed to plasma is formed using this material, the carbon film will not peel off from the wall surface, and a high quality hard diamond-like carbon film etc. can be formed.

【0006】[0006]

【実施例】図1は本発明を、ECRプラズマCVD型硬
質ダイヤモンド状炭素膜形成装置に適用した実施例であ
る。この硬質ダイヤモンド状炭素膜形成装置1は、プラ
ズマ室2と成膜室3とを備え、プラズマ室2は導入され
るマイクロ波に対して空洞共振器となるように構成され
ている。プラズマ室2の上部には、石英等で構成された
マイクロ波導入窓4を介して、マイクロ波導入用の導波
管5が接続されている。また、プラズマ室2の周囲には
、プラズマ発生用の磁気回路として電磁コイル6a,6
bが配設されている。電磁コイル6a,6bによる磁界
の強度は、マイクロ波による電子サイクロトロン共鳴の
条件がプラズマ室2の内部で成立するように決定されて
いる。また、この電磁コイル6a,6bによって下方に
向けて発散する発散磁界が形成され得る。
Embodiment FIG. 1 shows an embodiment in which the present invention is applied to an ECR plasma CVD type hard diamond-like carbon film forming apparatus. This hard diamond-like carbon film forming apparatus 1 includes a plasma chamber 2 and a film forming chamber 3, and the plasma chamber 2 is configured to act as a cavity resonator for microwaves introduced therein. A waveguide 5 for introducing microwaves is connected to the upper part of the plasma chamber 2 via a microwave introduction window 4 made of quartz or the like. Further, around the plasma chamber 2, electromagnetic coils 6a and 6 are provided as a magnetic circuit for plasma generation.
b is provided. The strength of the magnetic field generated by the electromagnetic coils 6a and 6b is determined so that the conditions for electron cyclotron resonance due to microwaves are established inside the plasma chamber 2. Furthermore, a diverging magnetic field that diverges downward can be formed by the electromagnetic coils 6a and 6b.

【0007】さらに、プラズマ室2の上部にはガス導入
管7の一端が連結され、ガス導入管7はコントロールバ
ルブ8を有しており、他端は成膜用ガスが充填されたガ
スボンベ9に接続されている。なお、成膜用ガスとして
は、例えばエチレンガスやベンゼンガス等の単一ガスや
メタンガスと水素ガスとの混合ガス、メタンガスと水素
ガスと炭酸ガスとの混合ガス等が用いられる。
Furthermore, one end of a gas introduction pipe 7 is connected to the upper part of the plasma chamber 2, and the gas introduction pipe 7 has a control valve 8, and the other end is connected to a gas cylinder 9 filled with a film-forming gas. It is connected. Note that, as the film-forming gas, for example, a single gas such as ethylene gas or benzene gas, a mixed gas of methane gas and hydrogen gas, a mixed gas of methane gas, hydrogen gas, and carbon dioxide gas, etc. are used.

【0008】成膜室3はプラズマ室2の下方に配置され
ており、この成膜室3の上部にはプラズマ室2に連絡す
る連絡口10が設けられている。連絡口10の下方には
ホルダ11が配置され、このホルダ11上には基板12
を保持し得るようになっている。ホルダ11は支軸13
に取り付けられ、支軸13と整合装置15とを介して高
周波電源14が接続されている。なお、ホルダ11には
冷却水が循環するジャケット(図示せず)が装着されて
いる。
The film forming chamber 3 is located below the plasma chamber 2, and a communication port 10 communicating with the plasma chamber 2 is provided in the upper part of the film forming chamber 3. A holder 11 is arranged below the communication port 10, and a substrate 12 is placed on this holder 11.
It is designed to be able to hold. The holder 11 is a support shaft 13
A high frequency power source 14 is connected via the support shaft 13 and the alignment device 15. Note that the holder 11 is equipped with a jacket (not shown) through which cooling water circulates.

【0009】成膜室3内において、連絡口10とホルダ
11との間には開閉自在なシャッタ16が設けられ、こ
のシャッタ16は開度を調整することができる。また、
成膜室3の下部には排気口17が設けられており、この
排気口17は図示しない排気系に接続されている。そし
て、成膜室3の内壁部分とプラズマ生成室2の内壁部分
の内側には、ガラス状炭素で被覆した高純度グラファイ
ト製の壁面保護板18……18が設置されている。また
、ホルダ11及びシャッター16はガラス状炭素で被覆
した高純度グラファイトそのもので形成している。
In the film forming chamber 3, a shutter 16 that can be opened and closed is provided between the communication port 10 and the holder 11, and the degree of opening of the shutter 16 can be adjusted. Also,
An exhaust port 17 is provided at the bottom of the film forming chamber 3, and this exhaust port 17 is connected to an exhaust system (not shown). Wall protection plates 18 made of high-purity graphite coated with glassy carbon are installed inside the inner wall portions of the film forming chamber 3 and the plasma generation chamber 2. Further, the holder 11 and the shutter 16 are made of high-purity graphite itself coated with glassy carbon.

【0010】次に、この薄膜形成装置を用いた硬質ダイ
ヤモンド状炭素膜の形成方法について説明する。まず、
図示しない排気系によりプラズマ室2及び成膜室3内を
真空状態に設定する。次に、コントロールバルブ8を開
き、ガスボンベ9から導入管7を介してプラズマ室2内
に成膜用ガスを導入する。ここでは、コントロールバル
ブ8を調整して成膜用ガスの流量制御をしながらガスの
導入を行う。
Next, a method for forming a hard diamond-like carbon film using this thin film forming apparatus will be explained. first,
The inside of the plasma chamber 2 and the film forming chamber 3 are set to a vacuum state by an exhaust system (not shown). Next, the control valve 8 is opened, and a film-forming gas is introduced into the plasma chamber 2 from the gas cylinder 9 through the introduction pipe 7. Here, the gas is introduced while controlling the flow rate of the film-forming gas by adjusting the control valve 8.

【0011】一方、プラズマ室2の周囲に設けられた電
磁コイル6a、6bに通電してプラズマ室2内の磁束密
度を例えば875ガウスに設定する。そして、導波管5
を介して周波数2.45GHzのマイクロ波をプラズマ
室2内に導入する。
On the other hand, the electromagnetic coils 6a and 6b provided around the plasma chamber 2 are energized to set the magnetic flux density within the plasma chamber 2 to, for example, 875 Gauss. And the waveguide 5
Microwaves with a frequency of 2.45 GHz are introduced into the plasma chamber 2 through the plasma chamber 2.

【0012】このような操作により、プラズマ室2内に
おいては、875ガウスの磁場により回転する電子の周
波数と、マイクロ波の周波数2.45GHzとが一致し
、電子サイクロトロン共鳴が起こる。この結果、プラズ
マ室2内では、電子がマイクロ波から効率良くエネルギ
ーを吸収し、低ガス圧にて高密度のプラズマが発生する
。このプラズマは成膜用ガスのプラズマである。プラズ
マ室2内に発生したプラズマは、電磁コイル6a、6b
によって形成される発散磁界の磁力線に沿って流れるプ
ラズマ流Mとなり、連絡口10を通って成膜室3内に引
き出される。
[0012] Through this operation, in the plasma chamber 2, the frequency of the electrons rotated by the magnetic field of 875 Gauss matches the frequency of the microwave of 2.45 GHz, and electron cyclotron resonance occurs. As a result, in the plasma chamber 2, electrons efficiently absorb energy from microwaves, and high-density plasma is generated at low gas pressure. This plasma is a plasma of film-forming gas. The plasma generated in the plasma chamber 2 is transferred to the electromagnetic coils 6a and 6b.
The plasma flow M flows along the lines of magnetic force of the divergent magnetic field formed by the plasma flow, and is drawn out into the film forming chamber 3 through the communication port 10.

【0013】成膜室3内のシャッタ16を開くと、プラ
ズマ室2からのプラズマ流Mはシャッタ16により流量
調整されながら基板12上に照射される。ここで、基板
12には整合装置15、支軸13及びホルダ11を介し
て高周波電源14から高周波電圧が印加されているので
、周期的に正、負の電位がかかる。この結果、基板12
に負の自己バイアスが発生する。この負の自己バイアス
によって成膜用ガスのプラズマ中の正イオンが基板12
側に引き込まれ、基板12上に硬質ダイヤモンド状炭素
膜が形成される。
When the shutter 16 in the film forming chamber 3 is opened, the plasma flow M from the plasma chamber 2 is irradiated onto the substrate 12 while the flow rate is adjusted by the shutter 16. Here, since a high frequency voltage is applied to the substrate 12 from the high frequency power source 14 via the alignment device 15, the support shaft 13, and the holder 11, positive and negative potentials are applied periodically. As a result, the substrate 12
negative self-bias occurs. Due to this negative self-bias, positive ions in the plasma of the film-forming gas are transferred to the substrate 12.
A hard diamond-like carbon film is formed on the substrate 12.

【0014】このとき、上記したように、成膜室3の内
壁部分とプラズマ生成室2の内壁部分の内側には、ガラ
ス状炭素で被覆した高純度グラファイト製の壁面保護板
18……18が設置され、ホルダ11及びシャッター1
6はガラス状炭素で被覆した高純度グラファイトそのも
ので形成されており、このガラス状炭素で被覆した高純
度グラファイトは、硬質ダイヤモンド状炭素膜に対して
は、高い付着性を持っているので、成膜室3、プラズマ
生成室2の内壁部分、ホルダ11及びシャッター16か
らの炭素膜の剥離がなくなり、良質な硬質状ダイヤモン
ド状炭素膜を形成することができる。
At this time, as described above, on the inside of the inner wall of the film forming chamber 3 and the inner wall of the plasma generation chamber 2, there are wall protection plates 18 made of high purity graphite coated with vitreous carbon. installed, holder 11 and shutter 1
6 is made of high-purity graphite itself coated with glassy carbon, and this high-purity graphite coated with glassy carbon has high adhesion to hard diamond-like carbon films, so it is difficult to form There is no peeling of the carbon film from the inner wall portions of the film chamber 3, the plasma generation chamber 2, the holder 11, and the shutter 16, and a high-quality hard diamond-like carbon film can be formed.

【0015】なお、上記実施例では、ガラス状炭素で被
覆した高純度グラファイトからなる壁面保護板18を別
個に取り付けた場合を説明したが、別個に取り付けずに
一体型として成膜室3、プラズマ生成室2の内壁部分を
形成することもできる。また、上記実施例以外の硬質ダ
イヤモンド状炭素膜形成装置も、プラズマにさらされる
部分をすべてガラス状炭素で被覆した高純度グラファイ
トで覆うことにより、ECRプラズマCVD型以外のシ
ャッター等を有さない薄膜形成装置にも本発明を適用す
ることができる。さらに、ガラス状炭素で被覆した高純
度グラファイトに付着性の良い膜であれば、硬質ダイヤ
モンド状炭素膜以外の薄膜形成装置にも本発明を適用す
ることができ、例えばW、SiNx、SiOx等の薄膜
形成装置にも本発明を適用することができる。
In the above embodiment, the case where the wall protection plate 18 made of high-purity graphite coated with glassy carbon was separately installed was explained. It is also possible to form the inner wall portion of the generation chamber 2. In addition, the hard diamond-like carbon film forming apparatus other than the above-mentioned embodiments can also be used to form thin films without shutters other than the ECR plasma CVD type by covering all the parts exposed to plasma with high-purity graphite coated with glassy carbon. The present invention can also be applied to a forming device. Furthermore, the present invention can be applied to thin film forming apparatuses other than hard diamond-like carbon films, as long as the film has good adhesion to high-purity graphite coated with glassy carbon, for example, W, SiNx, SiOx, etc. The present invention can also be applied to a thin film forming apparatus.

【0016】[0016]

【発明の効果】以上のように、本発明による薄膜形成装
置は、成膜室の内壁部分と基板取付けホルダー部分とを
、ガラス状炭素で被覆した高純度グラファイトを用いて
形成しているので、内壁部分及びホルダからの炭素膜の
剥離がなくなり、特性、均一性の良い硬質ダイヤモンド
状炭素膜等の薄膜を再現性良く形成することができる。
[Effects of the Invention] As described above, in the thin film forming apparatus according to the present invention, the inner wall portion of the film forming chamber and the substrate mounting holder portion are formed using high purity graphite coated with vitreous carbon. There is no peeling of the carbon film from the inner wall portion and the holder, and a thin film such as a hard diamond-like carbon film with good characteristics and uniformity can be formed with good reproducibility.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明をECRプラズマCVD型硬質ダイヤモ
ンド状炭素膜形成装置に適用した一実施例を示す図であ
る。
FIG. 1 is a diagram showing an embodiment in which the present invention is applied to an ECR plasma CVD type hard diamond-like carbon film forming apparatus.

【符号の説明】[Explanation of symbols]

2……プラズマ室、3……成膜室、4……マイクロ波導
入窓、6a,6b……電磁コイル、11……ホルダ、1
2……基板、13……支軸、14……高周波電源、16
……シャッタ、18……壁面保護板
2... Plasma chamber, 3... Film forming chamber, 4... Microwave introduction window, 6a, 6b... Electromagnetic coil, 11... Holder, 1
2... Board, 13... Support shaft, 14... High frequency power supply, 16
...Shutter, 18...Wall surface protection plate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  成膜室の内壁部分と基板取付けホルダ
ー部分とを、ガラス状炭素で被覆した高純度グラファイ
トを用いて形成したことを特徴とする薄膜形成装置。
1. A thin film forming apparatus characterized in that an inner wall portion of a film forming chamber and a substrate mounting holder portion are formed using high purity graphite coated with vitreous carbon.
JP3120535A 1991-05-27 1991-05-27 Thin film forming equipment Expired - Fee Related JP2936790B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3120535A JP2936790B2 (en) 1991-05-27 1991-05-27 Thin film forming equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3120535A JP2936790B2 (en) 1991-05-27 1991-05-27 Thin film forming equipment

Publications (2)

Publication Number Publication Date
JPH04349197A true JPH04349197A (en) 1992-12-03
JP2936790B2 JP2936790B2 (en) 1999-08-23

Family

ID=14788692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3120535A Expired - Fee Related JP2936790B2 (en) 1991-05-27 1991-05-27 Thin film forming equipment

Country Status (1)

Country Link
JP (1) JP2936790B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0803896A2 (en) * 1996-04-22 1997-10-29 Nisshinbo Industries Inc. Plasma processing system and protective member used for the same
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
WO1999056309A1 (en) * 1998-04-28 1999-11-04 Tokai Carbon Co., Ltd. Protective member for inner surface of chamber and plasma processing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0803896A2 (en) * 1996-04-22 1997-10-29 Nisshinbo Industries Inc. Plasma processing system and protective member used for the same
KR970070243A (en) * 1996-04-22 1997-11-07 모치즈키 아키히로 Plasma processing apparatus and protective member for plasma processing apparatus
EP0803896A3 (en) * 1996-04-22 1998-07-15 Nisshinbo Industries Inc. Plasma processing system and protective member used for the same
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
WO1999056309A1 (en) * 1998-04-28 1999-11-04 Tokai Carbon Co., Ltd. Protective member for inner surface of chamber and plasma processing apparatus

Also Published As

Publication number Publication date
JP2936790B2 (en) 1999-08-23

Similar Documents

Publication Publication Date Title
US5178739A (en) Apparatus for depositing material into high aspect ratio holes
JPH05507963A (en) Equipment for depositing material into high aspect ratio holes
MY118033A (en) Plasma processing method and apparatus.
JPH0641733A (en) Reactive sputtering device
US6010755A (en) Method and apparatus for forming thin films using dual ECR plasma generators
JPH04349197A (en) Apparatus for forming thin film
JPS6372875A (en) Sputtering device
JP2808922B2 (en) Method for forming diamond-like carbon film
JPH04193953A (en) Method and device for forming hard carbon film
JPH066786B2 (en) Thin film forming equipment
JPH01205533A (en) Plasma deposition apparatus
JPH01309973A (en) Thin film-forming equipment
JP2995705B2 (en) Hard carbon film forming method
JP3106528B2 (en) Method and apparatus for forming hard carbon film
US6060131A (en) Method of forming a thin film by plasma chemical vapor deposition
JP3134386B2 (en) Thin film formation method
JPH02294476A (en) Cathode for magnetron sputtering
JP2725203B2 (en) Microwave plasma processing equipment
JPH04304376A (en) Formation of hard carbon film
JP2787134B2 (en) Equipment for thin film formation
JPH04304374A (en) Formation of hard carbon film
GB2360530A (en) High target utilisation sputtering system with remote plasma source
JPS6483668A (en) Film deposition device by microwave plasma
JPS63278221A (en) Thin film forming equipment
JPH02197567A (en) Plasma sputtering device

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080611

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090611

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100611

Year of fee payment: 11

LAPS Cancellation because of no payment of annual fees