JPH0433400A - Automatic supplier of electronic component - Google Patents
Automatic supplier of electronic componentInfo
- Publication number
- JPH0433400A JPH0433400A JP2138409A JP13840990A JPH0433400A JP H0433400 A JPH0433400 A JP H0433400A JP 2138409 A JP2138409 A JP 2138409A JP 13840990 A JP13840990 A JP 13840990A JP H0433400 A JPH0433400 A JP H0433400A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive tape
- electronic component
- ultraviolet rays
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 241000219321 Caryophyllaceae Species 0.000 description 1
- 235000002845 Dianthus plumarius Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば、半導体素子を機器基板に装着する際
に、粘着テープに半導体素子を１個ずつ等間隔に接着固
定しながらリールに巻き取ったリールテープから粘着テ
ープを送り出しなから接着した半導体素子を１個ずつ剥
離して供給する自動供給装置に関する。[Detailed Description of the Invention] [Industrial Application Field] For example, when mounting semiconductor elements on a device board, the present invention is capable of attaching and fixing semiconductor elements one by one to an adhesive tape at equal intervals while winding the semiconductor elements onto a reel. This invention relates to an automatic feeding device that feeds adhesive tape from a taken reel tape, peels off bonded semiconductor elements one by one, and then feeds them.
電子機器の組立てに、電子部品を自動装着する方法が広
く採られている。2. Description of the Related Art A method of automatically mounting electronic components is widely used in the assembly of electronic devices.
この場合、粘着テープに電子部品を１個ずつ等間隔に接
着固定しながらリールに巻き取ったり一ルテーブから粘
着テープを送り出しながら接着した電子部品を１個ずつ
剥離して供給する自動供給装置が用いられることが多い
。In this case, an automatic feeding device is used that adhesively fixes the electronic components one by one to the adhesive tape at equal intervals and winds it onto a reel, or feeds the adhesive tape from a tape and peels off the adhered electronic components one by one. This is often the case.
上記のような構成の自動供給装置では、粘着テープの粘
着力か弱過ぎると接着の際に剥離するものが生じ、粘着
力が強過ぎると剥離の際にピンクアップできないものが
生ずる。In the automatic supply device configured as described above, if the adhesive strength of the adhesive tape is too weak, some tapes may peel off during adhesion, and if the adhesive strength is too strong, some tapes may not pink up when peeled off.
そして、粘着テープの粘着力は環境や供給電子部品の材
質によって大きく変わるという条件のもとで、粘着テー
プの粘着力を、接着の際に剥離するものが生じなく、剥
離の際にピンクアップできないものが生じないように設
定することは難しい。Under the condition that the adhesive strength of the adhesive tape varies greatly depending on the environment and the material of the supplied electronic components, the adhesive strength of the adhesive tape can be adjusted so that there is no peeling during adhesion and no pink-up occurs when peeling. It is difficult to configure settings so that things do not occur.
従来、上記の問題の解決のため、機械的手段による対策
が施されたものがあるが、構造が複雑で、高価になると
いう問題があった。Conventionally, in order to solve the above-mentioned problems, some mechanical measures have been taken, but there have been problems in that the structure is complicated and expensive.
本発明は上記の事情に鑑みてなされたもので、接着の際
に剥離するものが生ずることなく、剥離の際にピンクア
ンプできないものが生ずることのない構造の簡単な自動
供給装置を提供することを目的とする。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an automatic feeding device with a simple structure that does not cause anything to peel off during adhesion and does not cause anything that cannot be pink-amplified during peeling. With the goal.
本発明の自動供給装置は、粘着テープの粘着剤に硬化す
るまでは充分な粘着力を有し紫外線を照射すると硬化し
て粘着力が弱まる粘着剤を使用し、粘着テープから電子
部品を剥離する際に該電子部品が接着している粘着剤に
紫外線を照射する手段を設けたものである。The automatic feeding device of the present invention uses an adhesive that has sufficient adhesive strength until it hardens, but which hardens and weakens when exposed to ultraviolet rays, and peels electronic components from the adhesive tape. In this case, a means is provided for irradiating the adhesive to which the electronic component is adhered with ultraviolet rays.
第１図は粘着テープに半導体素子を接着固定する方法を
示し、第２図は本発明の装置の粘着テープから半導体素
子を剥離する方法を示す。FIG. 1 shows a method of adhesively fixing a semiconductor element to an adhesive tape, and FIG. 2 shows a method of peeling a semiconductor element from the adhesive tape of the apparatus of the present invention.
図においてｌは層間紙、２はキャリアベース紙、３は粘
着テープ、４は位置決め、５は半導体素子、６はブツシ
ャ−７は真空チャック、８は紫外線照射装置である。In the figure, 1 is an interlayer paper, 2 is a carrier base paper, 3 is an adhesive tape, 4 is a positioner, 5 is a semiconductor element, 6 is a buttonhole, 7 is a vacuum chuck, and 8 is an ultraviolet irradiation device.
粘着テープ３に一定間隔ごとに半導体素子５を１個ずつ
位置決めした後プッシャー６で押えて接着固定しながら
リールに巻き取ってゆく。After positioning the semiconductor elements 5 one by one on the adhesive tape 3 at regular intervals, they are pressed by a pusher 6 and wound onto a reel while being adhesively fixed.
粘着テープは充分な粘着力を有しているので、剥離する
ものが発生することがなく、作業が効率よく進展する。Since the adhesive tape has sufficient adhesive strength, there will be no peeling, and the work will proceed efficiently.
自動供給装置における半導体素子５の剥離は、半導体素
子５が接着している粘着剤に紫外線照射装置８からの紫
外線を照射して硬化させ、粘着力を弱めてから、真空チ
ャック７で吸着してピンクアップするので、ピックアッ
プできないものがなく、トラブルが発生することがなく
なる。To peel off the semiconductor element 5 in the automatic supply device, the adhesive to which the semiconductor element 5 is adhered is irradiated with ultraviolet rays from the ultraviolet irradiation device 8 to harden it, weaken the adhesive force, and then adsorbed with the vacuum chuck 7. Since it pinks up, there is nothing that cannot be picked up, and trouble does not occur.
また、粘着テープ３の粘着剤は、紫外線が照射されるま
では硬化することなく充分な粘着力を保っているので、
自動供給装置での移送途中で剥れるようなことがなくな
る。In addition, the adhesive of the adhesive tape 3 maintains sufficient adhesive strength without curing until it is irradiated with ultraviolet rays.
This eliminates the possibility of peeling off during transfer using an automatic feeding device.
以上説明したように、本発明によれば、簡単な構造のま
まで、移送途中で剥れたり、剥離する際ピックアップす
ることができないものが発生しなくなり、実用上の効果
が大である。As described above, the present invention has a simple structure and prevents the occurrence of peeling during transportation or the occurrence of items that cannot be picked up when peeled off, which has great practical effects.
第１図は粘着テープに半導体素子を接着固定する方法を
示す説明図、第２図は本発明の装置の粘着テープから半
導体素子を剥離する方法を示す説明図である。
１・・・層間紙、２・・・キャリアベース紙、３・・・
粘着テープ、４・・・位置決め、５・・・半導体素子、
６・・・プッシャー、７・・・真空チャンク、８・・・
紫外線照射装置。
図中同一符号は同一のものを示す。
２ キャリアベース紙
３ 粘着テープ
４ 位置決め
特許出願人 新日本無線株式会社FIG. 1 is an explanatory diagram showing a method of adhesively fixing a semiconductor element to an adhesive tape, and FIG. 2 is an explanatory diagram showing a method of peeling a semiconductor element from an adhesive tape of the apparatus of the present invention. 1... interlayer paper, 2... carrier base paper, 3...
Adhesive tape, 4... Positioning, 5... Semiconductor element,
6...Pusher, 7...Vacuum chunk, 8...
Ultraviolet irradiation device. The same reference numerals in the figures indicate the same things. 2 Carrier base paper 3 Adhesive tape 4 Positioning patent applicant New Japan Radio Co., Ltd.
Claims (1)
がらリールに巻き取ったリールテープから粘着テープを
送り出しながら接着した電子部品を１個ずつ剥離して供
給する電子部品の自動供給装置において、 粘着テープの粘着剤に硬化するまでは充分な粘着力を有
し紫外線を照射すると硬化して粘着力が弱まる粘着剤を
使用し、粘着テープから電子部品を剥離する際に該電子
部品が接着している粘着剤に紫外線を照射する手段を設
けたことを特徴とする電子部品の自動供給装置。[Scope of Claims] An electronic component that is supplied by adhesively fixing electronic components one by one to an adhesive tape at regular intervals and peeling off the adhesive tape one by one while feeding the adhesive tape from a reel tape wound on a reel. In the automatic feeding device of the adhesive tape, an adhesive that has sufficient adhesive strength until it hardens and weakens when exposed to ultraviolet rays is used to remove electronic components from the adhesive tape. An automatic supply device for electronic components, characterized in that the electronic component is provided with means for irradiating an adhesive to which the electronic component is adhered with ultraviolet rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2138409A JPH0433400A (en) | 1990-05-30 | 1990-05-30 | Automatic supplier of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2138409A JPH0433400A (en) | 1990-05-30 | 1990-05-30 | Automatic supplier of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0433400A true JPH0433400A (en) | 1992-02-04 |
Family
ID=15221288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2138409A Pending JPH0433400A (en) | 1990-05-30 | 1990-05-30 | Automatic supplier of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0433400A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8661655B2 (en) * | 2002-05-24 | 2014-03-04 | Koninklijke Philips N.V. | Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this |
-
1990
- 1990-05-30 JP JP2138409A patent/JPH0433400A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8661655B2 (en) * | 2002-05-24 | 2014-03-04 | Koninklijke Philips N.V. | Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7268059B2 (en) | Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components | |
| JP3553551B2 (en) | Method of manufacturing semiconductor device using semiconductor wafer | |
| JP2008066336A (en) | Sheet for machining wafer | |
| JPH0433400A (en) | Automatic supplier of electronic component | |
| JP2000091281A (en) | Wafer surface protective tape peel-off apparatus | |
| JP2005085827A (en) | Adhesive tape | |
| JPH02210844A (en) | Manufacture of semiconductor device | |
| JP2004063678A (en) | Peeling method of surface masking tape from fragile member | |
| JPS61296734A (en) | Wafer tape mounting method and apparatus | |
| JPS60213087A (en) | Coverlay film for flexible printed circuit board and method of forming coverlay of flexible printed circuit board using same | |
| JPS5565442A (en) | Bonding method and apparatus therefor | |
| JPH05154438A (en) | Transfer method of self-adhesive and mounting method for electronic parts using the same | |
| JPH048784A (en) | Heat-resistant tacky agent useful for taping and temporary fixation of electric part | |
| JPH02257626A (en) | Coupling apparatus of jig of semiconductor substrate | |
| JP3402130B2 (en) | Adhesive sheet with carrier film | |
| JP2005154572A (en) | Sticky body and method for fixing printed wiring board | |
| JPH0710702B2 (en) | Carrier tape for storing electronic components | |
| JPH06327175A (en) | Mounting electronic component and its mounting method | |
| JPH04180980A (en) | Adhesive | |
| JPH07175206A (en) | Pellicle | |
| JP3418455B2 (en) | Thin film adhesive and electronic component mounting method using the same | |
| JPH04311413A (en) | Sticking method of semiconductor device to adhesive tape | |
| JPH0515496U (en) | Carrier tape | |
| JP3633748B2 (en) | Method for forming electronic circuit and adhesive container used therefor | |
| JPH05152787A (en) | Method for removing electronic parts from adhesive carrier tape |