JPH0433350A - Construction of tab tape - Google Patents

Abstract

PURPOSE:To reduce the thickness of an insulating film by a method wherein the opening edges of sprocket holes provided along the side ends of the insulating film are reinforced with metal foils. CONSTITUTION:A polyimide base tape 1 which has a thickness of 50mum and is coated with epoxy system thermosetting adhesive is punched by a die to form a semiconductor chip mounting hole 3, outer connection holes 4 and sprocket holes 1a. The base tape 1 is cladded with a rolled copper foil having a thickness of 35mum and respectively independent conductor wirings 5, sprocket hole reinforcing belts 6 and a horizontal bar 7 which prevents a distance between the left and right sprocket hole reinforcing belts 6 from variation are formed from the copper foil. The sprocket holes 1a are provided continuously along both side edges of the base tape 1 with a certain pitch. The reinforcing belts 6 made from copper foils are bonded to both side edges of the base tape 1 except the parts of the sprocket holes 1a to reinforce the opening edges of the sprocket holes 1a. The mounting hole 3 is provided at the center part of the base tape 1. The connection holes 4 are provided before and behind and on the left and right of the mounting hole 4. The wirings 5 are provided between the hole 3 and the holes 4. Further, the horizontal bar 7 is formed between the reinforcing belts 6 and 6 of both the side edges.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to the structure of a TAB tape, and in particular, the insulating film that is the base of the TAB tape is thin and the TAB tape is
The present invention relates to a TAB tape structure that allows efficient use of the area on the B tape.

[Conventional technology]

Conventional transport of TAB tape is carried out using feed holes provided on both sides of the base insulating film (hereinafter referred to as base tape). For example, the thickness of the film must be 75μ with polyimide base tape.
There was a need to make it between 12,511 m and 12,511 m.

[Problems to be Solved by the Invention] With this conventional TAB tape, the base tape thickness of the TAB tape cannot be reduced, and therefore, it is necessary to use a large amount of expensive polyimide.

In addition, with conventional TAB tapes, if the thickness of the feed holes exceeds the specified thickness, it will impede transport, so conductor wiring cannot be provided around the holes for transporting the TAB tape, making efficient use of the area on the TAB tape. was inhibiting.

An object of the present invention is to provide a TAB tape structure in which the thickness of the insulating film is reduced by reinforcing the opening edges of the feed holes provided on the side edges of the insulating film with metal foil. shall be.

[Means to solve the problem]

In order to achieve the above object, the TAB tape structure according to the present invention includes an insulating film and a metal foil, and the insulating film has some perforations on its side edges. The metal foil is continuously provided at a pitch, and the metal foil is continuously attached to the side edge of the insulating film except for the part of the perforation to reinforce the opening edge of the perforation.

[Function] According to the present invention, the feed hole 1a provided in the insulating film 1
Since the opening edge of the TAB is reinforced with the metal foil 6, there is no need to make the insulating film l thicker than necessary, and by using the metal foil 6 as a part of the conductive wiring, the TAB
This makes it possible to efficiently utilize the area on the tape.

〔Example] Next, the present invention will be explained with reference to the drawings.

(Example 1) Figure 1 (a) is a front view showing Example 1 of the present invention, (b)
is the same sectional view.

In the figure, the TA and B tapes according to the present invention have a thickness of 50 mm.
pm polyimide base tape (insulating film) 1
An epoxy thermosetting adhesive 2 is applied on top, and a mold is used to form a hole 3 for mounting a semiconductor element, a hole 4 for external connection, and a feed hole 1a.
A rolled copper foil with a thickness of 35 pm is pasted on the base tape 1, and this copper foil is used to form the individual conductive wiring 5, the belt 6 for reinforcing the conveying holes, and the reinforcement for the left and right conveying holes. It also forms a horizontal bar 7 for preventing changes in the interval of the belt 6.

The feed holes 1a are continuously provided on both sides of the base tape 1 at a partial pitch, and the reinforcing band 6 made of copper foil is
It is continuously attached to both side edges of the base tape l except for the portion of the feed hole 1a, and reinforces the opening edge of the feed hole 1a. The mounting hole 3 is provided in the center of the base tape l, and connection holes 4 are provided on the front, rear, left and right sides of the mounting hole 3, and the wiring 5 is provided between both holes 3.4.
is provided. In addition, the horizontal crosspiece 7 has side edge reinforcing bands 6,
It is formed over 6 hours.

Next, a method for manufacturing the TAB tape of Example 1 will be explained.

First, a polyimide base tape 1 having a thickness of 50 μm was cut to a width of 35 nm, and then an epoxy thermosetting adhesive 2 was applied to a width of 33 nm, leaving an uncoated portion of IM on one side. Subsequently, a semiconductor mounting hole 3 and an external connection hole 4 were punched out using the first mold. After that, tensile strength 35.15Kg/
A rolled copper foil having a thickness of 354 m and having a width of 354 mm was cut into a width of 33 mm, pasted through a rolling roller in accordance with the application position of the epoxy thermosetting adhesive 2, and laminated by heating at 150° C. for 1 hour.

Next, using the second mold, seven transport holes 1a are sequentially punched out for each semiconductor mounting area, and TAB is performed using the transport holes 1a.
Made it possible to transport the tape. Next, by applying a photosensitive agent on the rolled copper foil and performing exposure with reference to the conveying spout hole 1a, the conductive wiring 5, the conveying spout hole reinforcing band 6, and the conveying spout hole reinforcing band are formed. Horizontal bars 7 for preventing interval changes are formed.

Finally, the TAB tape was immersed in an electroless tinning bath to coat the rolled steel foil with 0.5 pm thick tin plating.

(Example 2) Figure 2 (a) is a front view showing Example 2 of the present invention, (b)
is the same sectional view.

This TAB tape is made by applying an epoxy thermosetting adhesive 2 onto a polyester base tape (insulating film) 8 with a thickness of 50 μm, and punching holes 3 for mounting semiconductor elements and holes 4 for external connections using a mold. A rolled copper foil with a thickness of 35 pm is attached to the top, and this copper foil is used to connect the independent conductive wiring 5, the belt 9 for reinforcing the conveying perforation and plating current, and the reinforcing and plating current for the left and right conveying perforations. A horizontal bar 10 is formed for preventing changes in the interval of the supply band 9 and for supplying plating current. Further, in this embodiment, a plating cutting hole 11 is also provided.

Next, a method for manufacturing the TAB tape of Example 2 will be explained.

First, epoxy thermosetting adhesive 2 was applied to the entire surface of a 50 pm thick polyester base tape 8, and then 35 m
It was cut into m width. Next, use the third mold to make semiconductor mounting hole 3.
A hole 4 for external connection was punched out. Thereafter, a 35 pm thick rolled copper foil with a tensile strength of 35.15 Kg/mm2 was cut into a 35 mm width, aligned with the base tape, pasted through a rolling roller, and laminated by heating at 120 °C for 4 hours. .

Next, using a fourth mold, seven transport holes 8a are punched out in the base tape 8 for each semiconductor mounting area, and the transport holes 8a
TAB tape can be transported using a. Next, a photosensitive agent is applied onto the rolled copper foil, and exposure is performed using the conveyance feed hole 8a as a reference, thereby forming the connected conductive wiring, the conveyance feed hole reinforcing and plating current supply band 9, and the conveyance feed hole. A horizontal bar 10 for preventing changes in reinforcing band spacing and for supplying plating current was formed.

After that, the TAB tape is immersed in an electrolytic nickel plating bath and a gold plating bath, and a current is passed from the end of the tape to the plating current supply band 9 and the plating current supply horizontal bar IO,
1.0 μm thick nickel plating and 0.0 μm thick nickel plating on rolled copper foil.
It was coated with 511°C thick gold plating.

Finally, using the fifth mold, the belt 9 for reinforcing the transporting sprocket and plating current supply, the horizontal bar 10 for preventing change in the belt interval for reinforcing the transporting sprocket and supplying plating current, and the conductive wiring are cut out, respectively. An independent conductive wiring 5 was formed.

[Advantageous Effects of the Invention 1] As explained above, the present invention has the effect that the thickness of the base tape can be reduced by reinforcing the periphery of the conveying feed hole of the TAB tape with copper foil.

Moreover, the total thickness of the TAB tape around the conveyance hole is
It has the characteristic that it is no different from the conventional one.

In addition, since the reinforcing steel foil can also be used as plating current supply wiring, there is no need to provide special plating wiring, and TAB
This has the effect that the conductor wiring area of the tape can be effectively utilized.

[Brief explanation of the drawing]

FIG. 1(a) is a front view showing Embodiment 1 of the present invention, FIG. 1(b)
is a sectional view taken along the line A-A' in Fig. 1(a), Fig. 2(a) is a front view showing Embodiment 2 of the present invention, and Fig. 2(b) is a sectional view taken along line A-A' in Fig. 2(a).
It is a BB' line sectional view of. 1... Polyimide base tape 2... Epoxy thermosetting adhesive 3... Hole for semiconductor mounting 4... Hole for external connection 5
...Conductivity wiring 6...Band for reinforcing the feed hole for conveyance 7...Horizontal bar for preventing change in band interval 8...Polyester base tape 9...Band for reinforcing feed hole for conveyance and plating current supply 10・
・Horizontal bar 11 for preventing change in band spacing and supplying plating current...
Hole for plating cutting

Claims (1)

[Claims] (1) A TAB tape structure comprising an insulating film and a metal foil, where the insulating film has perforations continuously provided at a constant pitch on its side edges, and the metal foil is A structure of a TAB tape characterized in that it is continuously attached to the side edge of an insulating film except for the part of the perforation hole, and reinforces the opening edge of the perforation hole.