JPH04331386A - Inspection device - Google Patents

Abstract

PURPOSE:To perform the observation without the influence of the vibration of a cooling fan by absorbing the vibration with contact shoes. CONSTITUTION:Contact shoes 2 to prevent vibration are provided to the first module 1 connected directly to a semiconductor integrated circuit product 9. While the vibration from the second module 3 is prevented, a luminous instrument 4 to transduce an electric signal into light is provided to the module 3, and a light-catching instrument 5 to transduce the light into the electric signal is provided to the module 1. By this, the vibration of a fan to cool an inspection device can be prevented.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for inspecting semiconductor integrated circuit products.

0002

2. Description of the Related Art In recent years, semiconductor integrated circuit products have tended to have more complex structures and more pins. As shown in FIGS. 3(a) and 3(b), conventional electrical testing equipment
A first module 1 is fixed to a metal stand 6 on which a product 9 is installed, and a probe 7 is attached to the module 1.
is in contact with the product 9, and the second module 3, which transmits electrical signals, is connected by a conductive metal 8 with a spring, and no consideration is given to vibrations from the second module 3. was the norm.

0003

[Problem to be solved by the invention] Recent semiconductor integrated circuit products have finer structures and more complex functions, and no matter how much verification is done in advance during development, it is inevitable that defects will occur. is the reality. Therefore, after the product is assembled into a package, defects in the product are analyzed, and corrections are made again before the product is completed.

Furthermore, even if the circuit is correct, it may not function properly due to diffusion dust, scratches during assembly, etc. In this case, it is extremely difficult to identify the defective location (
especially when caused by diffusion). It is possible to analyze the failure by analyzing the signal from the terminal, imagining the defective circuit on paper, and confirming it by means such as simulation, but this is extremely difficult, especially when speed, such as timing, is an influence. Have difficulty.

[0005] Therefore, in order to observe the signal of the defective location itself in the actual product, a probe with a sharp tip (~several microns in diameter) is brought into contact with the conductive pattern (signal line made of aluminum or the like) of the product. However, the conductive pattern is very thin, about 1 micron to several microns, and it is very difficult to bring the probe into contact with it, and it is particularly necessary to avoid vibration.

[0006] That is, while measuring with an inspection device, a probe was placed on the product for observation. However, if left as is, the inspection device will be subject to vibrations from the fan used to cool it, making it impossible to perform observations while avoiding vibrations.

[0007] An object of the present invention is to provide an inspection device for solving the above problems.

[0008]

[Means for Solving the Problems] In order to achieve the above-mentioned object, an inspection apparatus according to the present invention includes a set of first and second modules and a contact, and electrically conducts semiconductor integrated circuit products. An inspection device for inspecting a semiconductor integrated circuit product, wherein the first and second module sets transmit and receive signals to and from a semiconductor integrated circuit product, and are supported separately and independently;
The contactor is installed on at least one of the support parts that separately support each module of the set, and prevents vibrations from being applied to each module.

[0009] Furthermore, the modules making up the set are electrically connected by an optical system that converts electrical signals into light and transmits and receives them, or by cables of sufficient length.

0010

[Operation] The contactor 2 prevents the influence of vibration of the first module 1 or the second module 3 to which the semiconductor integrated circuit product 9 is directly connected.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

(Embodiment 1) FIG. 1(a) is a front view showing Embodiment 1 of the present invention, and FIG. 1(b) is a side view. In the figure,
A contactor 2 for preventing vibration is provided on the first module 1 that is directly connected to the semiconductor integrated circuit product 9 to prevent vibration from the second module 3 and to transmit an electrical signal to the second module 3. A light emitter 4 for converting light into an electric signal is provided, and a light receiver 5 for converting light into an electrical signal is provided in the first module 1. This can prevent vibration of the fan for cooling the inspection device.

(Embodiment 2) FIG. 2(a) is a front view showing Embodiment 2 of the present invention, and FIG. 2(b) is a side view. In the figure,
A contactor 2 for preventing vibration is provided on the second module 3 to prevent vibration from being applied to the first module 1 that is directly connected to the semiconductor integrated circuit product 9, and an electrical signal is transmitted to the second module 3. The first module 1 is provided with a light emitter 4 that converts light into an electrical signal, and a light receiver 5 that converts light into an electrical signal.This prevents vibration of the fan used to cool the inspection equipment. can.

In each embodiment, the first module 1 and the second module 3 may be connected by a cable having a sufficient length.

[0015]

[Effects of the Invention] As explained above, the present invention provides a method for preventing vibration of the first module and the second module directly connected to the product in an inspection device for electrically testing semiconductor integrated circuit products. This has the effect that observation can be carried out without being affected by the vibrations of the fan used to cool the inspection equipment.

[Brief explanation of drawings]

FIG. 1 (a) is a front view showing Example 1 of the present invention, (b)
) is a side view.

FIG. 2 (a) is a front view showing Example 2 of the present invention, (b)
) is a side view.

FIG. 3(a) is a front view showing a conventional example, and FIG. 3(b) is a side view.

[Explanation of symbols]

1 First module 2 Contact 3 Second module 4 Light emitter 5 Photo receiver

Claims (2)

[Claims] 1. An inspection device for electrically testing a semiconductor integrated circuit product, comprising a set of first and second modules and a contactor, the set of first and second modules comprising:
A device that sends and receives signals to and from semiconductor integrated circuit products.
An inspection characterized in that the contactor is installed on at least one of the support parts that separately support each module of the set, and prevents vibration to each module. Device. [Claim 2] The modules forming the set are electrically connected by an optical system that converts an electrical signal into light and transmits and receives it, or by a cable having a sufficient length. The inspection device according to claim 1.