JPH04331013A - Device for cutting fine wire into constant size - Google Patents

Device for cutting fine wire into constant size

Info

Publication number
JPH04331013A
JPH04331013A JP12661291A JP12661291A JPH04331013A JP H04331013 A JPH04331013 A JP H04331013A JP 12661291 A JP12661291 A JP 12661291A JP 12661291 A JP12661291 A JP 12661291A JP H04331013 A JPH04331013 A JP H04331013A
Authority
JP
Japan
Prior art keywords
stopper
upper blade
thin wire
cutting
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12661291A
Other languages
Japanese (ja)
Inventor
Michihiro Nakatani
中谷 道浩
Masami Oomuta
大牟田 正美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP12661291A priority Critical patent/JPH04331013A/en
Publication of JPH04331013A publication Critical patent/JPH04331013A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shearing Machines (AREA)
  • Accessories And Tools For Shearing Machines (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To increase the cutting accuracy of fine wire and reduce the cutting size of the wire smaller. CONSTITUTION:In a device for cutting fine wire into constant size 9 in which a lower blade 1, an upper blade 2, and a stopper 3 are positioned in order, the thickness of the upper blade 2 is made thicker and the stopper 3 is put under the upper blade 2 and a spring 7 is put under the stopper 3 or the stopper 3 is provided integrally under the upper blade 2. Then, as the upper blade 2 is lowered, the stopper 3 is lowered, and as the upper blade 2 is raised, the stopper 3 is raised.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、ICパッケージにリー
ドピンを接合するのに用いるろう材のような一定量の材
料を細線から得るための細線の定寸切断装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin wire cutting device for obtaining a fixed amount of material from a thin wire, such as a brazing filler metal used for bonding lead pins to an IC package.

【0002】0002

【従来の技術】従来の細線の定寸切断装置は、図3に示
すように下刃1、上刃2、ストッパー3の順に配列され
てなるもので、この定寸切断装置4により細線を切断し
て短尺品を得るには、図3に示すように細線5を下刃1
よりも前方に送り出して、先端をストッパー3に当てて
停止し、然る後上刃2を下降して細線5を切断している
。こうして細線5を切断して得られる短尺品6の長さ寸
法は、下刃1とストッパー3が固定されている為、下刃
1とストッパー3との間の寸法となる。
2. Description of the Related Art A conventional thin wire cutting device has a lower blade 1, an upper blade 2, and a stopper 3 arranged in this order as shown in FIG. In order to obtain short products, the thin wire 5 is cut into the lower blade 1 as shown in Fig. 3.
The wire is fed forward, the tip touches the stopper 3 and stopped, and then the upper blade 2 is lowered to cut the thin wire 5. Since the lower blade 1 and the stopper 3 are fixed, the length of the short product 6 obtained by cutting the thin wire 5 is between the lower blade 1 and the stopper 3.

【0003】ところで、近時リードピンの小型化により
ろう付け用のろう材量も少なくなり、ろう細線の切断寸
法も小さく(長さ 0.2mm以下)なっている。
By the way, as lead pins have become smaller in recent years, the amount of brazing material used for brazing has also decreased, and the cutting dimensions of thin brazing wires have also become smaller (length: 0.2 mm or less).

【0004】上記の定寸切断装置4では、上刃2の厚さ
を薄くし、下刃1とストッパー3を近付けることで、細
線5の切断寸法を小さくすることが可能であるが、上刃
2の機械的強度が低下し、また細線5の切断寸法精度が
出ない等の問題があって、細線5の切断寸法には限界が
あって、前記のろう細線の切断には十分対応できないで
いる。
[0004] In the above-mentioned sizing cutting device 4, it is possible to reduce the cutting size of the thin wire 5 by reducing the thickness of the upper blade 2 and bringing the lower blade 1 and the stopper 3 closer together. There are problems such as a decrease in the mechanical strength of the thin wire 2 and a lack of precision in the cutting dimensions of the thin wire 5, and there is a limit to the cutting size of the thin wire 5, so that it cannot adequately handle the cutting of the thin wax wire mentioned above. There is.

【0005】[0005]

【発明が解決しようとする課題】そこで本発明は、細線
の切断寸法が小さくても精度良く切断できる細線の定寸
切断装置を提供しようとするものである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a fixed-size cutting device for thin wires that can cut fine wires with high accuracy even if the cutting size of the thin wires is small.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
の本発明の細線の定寸切断装置の1つは、下刃、上刃、
ストッパーの順に配設された細線の定寸切断装置に於い
て、上刃の厚みを厚くし、上刃の下にストッパーを配し
、ストッパーの下にスプリングを配して、上刃の下降に
よりストッパーをスプリングに抗して下降させ、上刃の
上昇によりストッパーをスプリングにより所定位置まで
上昇させるようにしたことを特徴とするものである。
[Means for Solving the Problems] One of the thin wire sizing cutting devices of the present invention for solving the above problems has a lower blade, an upper blade,
In a thin wire sizing cutting device that is arranged in the order of a stopper, the thickness of the upper blade is made thicker, the stopper is placed under the upper blade, and a spring is placed under the stopper, so that the lowering of the upper blade The feature is that the stopper is lowered against a spring, and as the upper blade rises, the stopper is raised to a predetermined position by the spring.

【0007】本発明の細線の定寸切断装置の他の一つは
、下刃、上刃、ストッパーの順に配設された細線の定寸
切断装置に於いて、上刃の厚みを厚くすると共に上刃の
下にストッパーを一体に設けて、上刃の下降と一緒にス
トッパーを下降させ、上刃の上昇と一緒にストッパーを
上昇させるようにしたことを特徴とするものである。
Another aspect of the thin wire sizing cutting device of the present invention is a thin wire sizing cutting device in which a lower blade, an upper blade, and a stopper are arranged in this order, in which the thickness of the upper blade is increased and It is characterized in that a stopper is integrally provided under the upper blade, the stopper is lowered when the upper blade is lowered, and the stopper is raised when the upper blade is raised.

【0008】[0008]

【作用】上述のように本発明による細線の定寸切断装置
は、上刃の厚さを薄くすることなく逆に厚くしているの
で、機械的強度が向上し、細線の切断時上刃がぶれるこ
とがなく、切断精度を向上できる。またストッパーが上
刃と共に上下するので、上刃を薄くすることなくストッ
パーを下刃に近付けることができ、細線の切断寸法をよ
り一層小さくできる。
[Function] As mentioned above, the thin wire sizing cutting device according to the present invention does not make the thickness of the upper blade thinner, but rather thickens it, so the mechanical strength is improved, and the upper blade does not tighten when cutting fine wire. There is no wobbling and cutting accuracy can be improved. Furthermore, since the stopper moves up and down with the upper blade, the stopper can be moved closer to the lower blade without making the upper blade thinner, and the cutting size of thin wire can be further reduced.

【0009】[0009]

【実施例】本発明の細線の定寸切断装置の1つの一実施
例を図1によって説明すると、下刃1、上刃2、ストッ
パー3が順次配設され、上刃2の厚さが厚くなされ、ス
トッパー3が上刃2の下側に寄せて配され、ストッパー
3の下側にスプリング7が配され、ストッパー3とスプ
リング7がホルダー8内に保持されていて、上刃2の下
降によりストッパー3がスプリング7に抗して下降し、
上刃2の上昇によりストッパーがスプリング7により所
定位置まで上昇するようになっている。
[Embodiment] One embodiment of the thin wire sizing cutting device of the present invention will be explained with reference to FIG. The stopper 3 is arranged below the upper blade 2, the spring 7 is arranged below the stopper 3, the stopper 3 and the spring 7 are held in a holder 8, and the lowering of the upper blade 2 The stopper 3 descends against the spring 7,
As the upper blade 2 rises, the stopper is raised to a predetermined position by a spring 7.

【0010】次に本発明の細線の定寸切断装置の他の1
つの一実施例を図2によって説明すると、下刃1、上刃
2、ストッパー3が順次配設され、上刃2の厚さが厚く
なされ且つ上刃2の下にストッパー3が一体に設けられ
ていて、上刃2の下降と一緒にストッパー3が下降し、
上刃2の上昇と一緒にストッパー3が上昇するようにな
っている。
Next, another one of the thin wire sizing cutting devices of the present invention
To explain one embodiment with reference to FIG. 2, a lower blade 1, an upper blade 2, and a stopper 3 are arranged in this order, the upper blade 2 is made thicker, and the stopper 3 is integrally provided under the upper blade 2. When the upper blade 2 is lowered, the stopper 3 is lowered.
The stopper 3 is designed to rise together with the rise of the upper blade 2.

【0011】上記のように構成された各実施例の細線の
定寸切断装置9、10により線径0.15mmのAg−
Cu15wt%の細線5を 0.1mmの長さ(下刃1
からストッパー3までの寸法)に順次切断して、夫々1
000万個の短尺品(ろう材)6を得た。そしてこの短
尺品(ろう材)6の切断寸法精度を重量に置き換えて測
定した処、下記の表1の左欄及び中央欄に示す通りであ
った。また1000万個切断した上刃2 は摩耗が無く
、短尺品(ろう材)6の切断状態も良好であった。
The thin wire cutting devices 9 and 10 of each embodiment configured as described above cut Ag-
Thin wire 5 of 15wt% Cu with a length of 0.1 mm (lower blade 1
to stopper 3).
0 million short products (brazing filler metal) 6 were obtained. The cutting dimensional accuracy of this short piece (brazing material) 6 was measured by replacing it with weight, and the results were as shown in the left column and center column of Table 1 below. Moreover, the upper blade 2 which cut 10 million pieces showed no wear, and the cutting condition of the short products (brazing material) 6 was also good.

【0012】然るに従来の図3に示す細線の定寸切断装
置により実施例と同じ線径0.15mmのAg−Cu1
5wt%の細線5を 0.1mmの長さ(下刃1からス
トッパー3までの寸法)に順次切断した処10万個の短
尺品(ろう材)6を得る直前で上刃2がこわれた。そし
て10万個の短尺品(ろう材)6の切断寸法精度を重量
に置き換えて測定した処、下記の表1の右欄に示す通り
であった。
However, using the conventional thin wire sizing cutting device shown in FIG.
The upper blade 2 broke just before 100,000 short pieces (brazing material) 6 were obtained by sequentially cutting the 5 wt % thin wire 5 into lengths of 0.1 mm (dimension from the lower blade 1 to the stopper 3). The cutting dimensional accuracy of 100,000 short pieces (brazing material) 6 was measured by replacing it with weight, and the results were as shown in the right column of Table 1 below.

【0013】[0013]

【表1】[Table 1]

【0014】上記の表1で明らかなように従来例の短尺
品の重量はばらつきが大きく、切断寸法精度が低いのに
対し、実施例1、2の短尺品の重量はばらつきが小さく
、切断寸法精度が高いことが判る。
As is clear from Table 1 above, the weight of the short products of the conventional example has a large variation and the cutting dimension accuracy is low, whereas the weight of the short products of Examples 1 and 2 has a small variation and the cutting dimension It can be seen that the accuracy is high.

【0015】[0015]

【発明の効果】以上の通り本発明の細線の定寸切断装置
によれば、細線の切断精度を向上でき、しかも細線の切
断寸法をより一層小さくすることができる。
As described above, according to the thin wire sizing cutting device of the present invention, the cutting precision of the thin wire can be improved and the cutting size of the thin wire can be further reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の細線の定寸切断装置の1つの一実施例
を示す図である。
FIG. 1 is a diagram showing one embodiment of a thin wire sizing cutting device of the present invention.

【図2】本発明の細線の定寸切断装置の他の1つの一実
施例を示す図である。
FIG. 2 is a diagram showing another embodiment of the thin wire sizing cutting device of the present invention.

【図3】従来の細線の定寸切断装置を示す図である。FIG. 3 is a diagram showing a conventional thin wire sizing cutting device.

【符号の説明】[Explanation of symbols]

1  下刃 2  上刃 3  ストッパー 5  細線 7  スプリング 9  細線の定寸切断装置 10  細線の定寸切断装置 1 Lower blade 2 Upper blade 3 Stopper 5 Thin line 7 Spring 9 Thin wire sizing cutting device 10 Thin wire sizing cutting device

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】  下刃、上刃、ストッパーの順に配設さ
れた細線の定寸切断装置に於いて、上刃の厚みを厚くし
、上刃の下にストッパーを配し、ストッパーの下にスプ
リングを配して、上刃の下降によりストッパーをスプリ
ングに抗して下降させ、上刃の上昇によりストッパーを
スプリングにより所定位置まで上昇させるようにしたこ
とを特徴とする細線の定寸切断装置。
Claim 1: In a thin wire sizing cutting device in which a lower blade, an upper blade, and a stopper are arranged in this order, the thickness of the upper blade is made thicker, the stopper is arranged under the upper blade, and the stopper is placed under the stopper. A thin wire sizing cutting device characterized in that a spring is disposed so that the stopper is lowered against the spring when the upper blade is lowered, and the stopper is raised to a predetermined position by the spring when the upper blade is raised.
【請求項2】  下刃、上刃、ストッパーの順に配設列
された細線の定寸切断装置に於いて、上刃の厚みを厚く
すると共に上刃の下にストッパーを一体に設けて、上刃
の下降と一緒にストッパーを下降させ、上刃の上昇と一
緒にストッパーを上昇させるようにしたことを特徴とす
る細線の定寸切断装置。
Claim 2: In a thin wire sizing cutting device in which a lower blade, an upper blade, and a stopper are arranged in this order, the thickness of the upper blade is increased, and the stopper is integrally provided under the upper blade. A device for cutting thin wire to size, characterized in that a stopper is lowered when the blade is lowered, and the stopper is raised when the upper blade is raised.
JP12661291A 1991-04-30 1991-04-30 Device for cutting fine wire into constant size Pending JPH04331013A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12661291A JPH04331013A (en) 1991-04-30 1991-04-30 Device for cutting fine wire into constant size

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12661291A JPH04331013A (en) 1991-04-30 1991-04-30 Device for cutting fine wire into constant size

Publications (1)

Publication Number Publication Date
JPH04331013A true JPH04331013A (en) 1992-11-18

Family

ID=14939511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12661291A Pending JPH04331013A (en) 1991-04-30 1991-04-30 Device for cutting fine wire into constant size

Country Status (1)

Country Link
JP (1) JPH04331013A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005342559A (en) * 2004-05-31 2005-12-15 Hitachi Metals Ltd Method of manufacturing quantitatively cut chip and method of manufacturing metal sphere using the chip-manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005342559A (en) * 2004-05-31 2005-12-15 Hitachi Metals Ltd Method of manufacturing quantitatively cut chip and method of manufacturing metal sphere using the chip-manufacturing method

Similar Documents

Publication Publication Date Title
US3289452A (en) Method and device for bonding a contact wire to a semiconductor member
GB2175009B (en) Wire for bonding a semiconductor device and process for producing the same
CA2035857A1 (en) Leadframe
JPH04331013A (en) Device for cutting fine wire into constant size
US4938923A (en) Gold wire for the bonding of a semiconductor device
JP3090548B2 (en) Bonding wire for semiconductor device
JPS61157648A (en) Electrode material for wire cut electric discharge machining
CN220821552U (en) Chip bonding structure and chip
JPS6035549A (en) Cut-off shaping device
JPH05251452A (en) Solder bump forming material for semiconductor element
JPS5649534A (en) Bonding wire for semiconductor device
JP2872469B2 (en) Manufacturing method of sliding contact
KR930002806B1 (en) Gold wire for bonding semiconductor device
JPH03230555A (en) Resin-sealed semiconductor device
CN217599043U (en) Automatic change equipment for packing and have positioning function's knife rest extension spring
JP3142391B2 (en) Discharge electrode for automatic wire bonder
KR100376965B1 (en) Trim Punch
JPH06112261A (en) Automatic wire bonder
JPS60200553A (en) Manufacture of semiconductor device
JP2680415B2 (en) Gold wire for bonding semiconductor elements
JP2680414B2 (en) Gold wire for bonding semiconductor elements
JP3985743B2 (en) Manufacturing method of bonding wire for semiconductor element and bonding wire for semiconductor element
JP3026381B2 (en) Au ultrafine wires for semiconductor devices
JPH0464256A (en) Manufacture of semiconductor device
JPS6428852A (en) Semiconductor device