JPH04329011A - Support jig for lead frame - Google Patents
Support jig for lead frameInfo
- Publication number
- JPH04329011A JPH04329011A JP12659791A JP12659791A JPH04329011A JP H04329011 A JPH04329011 A JP H04329011A JP 12659791 A JP12659791 A JP 12659791A JP 12659791 A JP12659791 A JP 12659791A JP H04329011 A JPH04329011 A JP H04329011A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- holder
- permanent magnet
- holding groove
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 238000003780 insertion Methods 0.000 abstract description 6
- 230000037431 insertion Effects 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000003618 dip coating Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電子部品に外装樹脂をデ
ィップコーティングする場合などに使用されるリードフ
レームの保持具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame holder used when dip-coating electronic parts with exterior resin.
【０００２】0002
【従来の技術】平板状リード端子を備えた電子部品にお
いて、外装樹脂をディップコーティングする場合にセパ
レータと呼ばれる保持具が使用される。この保持具は、
電子部品素子を半田付け等によって取り付けたリードフ
レームを並列にかつ同一高さに保持するものであり、こ
のリードフレームを保持した保持具を逆さにして電子部
品素子をデイップ槽に浸漬し、電子部品素子の周囲に外
装樹脂層を形成している。その後、リードフレームを保
持具に保持したまま乾燥炉へ運び、ここで外装樹脂層を
乾燥，固化させた後、リードフレームを保持具から外し
、次の工程へ送るようになっている。2. Description of the Related Art A holder called a separator is used when dip coating an exterior resin on an electronic component having a flat lead terminal. This holder is
Lead frames to which electronic component elements are attached by soldering etc. are held in parallel and at the same height.The holder holding the lead frames is turned upside down and the electronic component elements are immersed in a dip bath. An exterior resin layer is formed around the element. Thereafter, the lead frame held in the holder is carried to a drying oven, where the outer resin layer is dried and solidified, and then the lead frame is removed from the holder and sent to the next process.
【０００３】従来使用されている保持具としては、図５
に示されるものがある。この保持具Ｂは、矩形状の枠体
５０の中に２本の支柱５１を平行に固定し、この支柱５
１に多数枚の支持板５２を摺動自在に挿通するとともに
、湾曲した板ばね５３の両端部も挿通する。そして、各
支持板５２の間にリードフレーム５４の帯部を挿入した
後、末端の支持板５２ａと枠体５０の内面との間に板ば
ね５３を押し撓めた状態で介装することにより、各支持
板５２の間でリードフレーム５４を圧着保持している。
なお、図５では１枚のリードフレーム５４のみを記載し
てあるが、実際には各支持板５２の間にリードフレーム
５４が圧着される。FIG. 5 shows a conventionally used holder.
There is something shown in This holder B has two pillars 51 fixed in parallel in a rectangular frame 50.
A large number of support plates 52 are slidably inserted through the support plate 1, and both ends of the curved leaf spring 53 are also inserted therethrough. After inserting the band portion of the lead frame 54 between each support plate 52, the leaf spring 53 is inserted between the support plate 52a at the end and the inner surface of the frame 50 in a pressed state. , a lead frame 54 is crimped and held between each support plate 52. Although only one lead frame 54 is shown in FIG. 5, the lead frame 54 is actually crimped between each support plate 52.
【０００４】0004
【発明が解決しようとする課題】ところが、上記の保持
具Ｂにリードフレーム５４を保持する場合には、まず板
ばね５３の支持板５２への押圧力を解除しておき、支持
板５２を支柱５１に対して摺動させて各支持板５２の間
に隙間を設ける。そして、各支持板５２の間に上方から
リードフレーム５４を順次挿入した後、板ばね５３を回
転させて末端の支持板５２ａと枠体５０との間に板ばね
５３を圧着させるという操作が必要である。また、保持
具Ｂからリードフレーム５４を取り出す際も、板ばね５
３を支柱５１に対して回転させて支持板５２への押圧力
を解除した後、支持板５２を支柱５１に対して摺動させ
て各支持板５２の間からリードフレーム５４を１枚ずつ
順次取り出すという操作が必要である。つまり、上記の
操作は全て手作業で行わなければならないため、作業性
が非常に悪く、自動化も困難であるという問題があった
。However, when holding the lead frame 54 on the above-mentioned holder B, the pressing force of the leaf spring 53 on the support plate 52 is first released, and then the support plate 52 is attached to the support plate 52. 51 to provide a gap between each support plate 52. Then, after sequentially inserting the lead frame 54 from above between each support plate 52, it is necessary to rotate the leaf spring 53 and press the leaf spring 53 between the support plate 52a at the end and the frame 50. It is. Also, when taking out the lead frame 54 from the holder B, the leaf spring 5
3 relative to the support plates 51 to release the pressing force on the support plates 52, the support plates 52 are slid relative to the support plates 51, and the lead frames 54 are sequentially inserted one by one from between each support plate 52. It is necessary to take it out. In other words, all the above-mentioned operations have to be performed manually, resulting in problems such as very poor workability and difficulty in automation.
【０００５】また、リードフレーム５４を各支持板５２
の間に挿入した際、リードフレーム５４の帯部の下端が
支柱５１に当たって停止するが、この時、リードフレー
ム５４に長手方向の撓みが生じたり、あるいはリードフ
レーム５４の帯部下端が確実に支柱５１に当たらない状
態で圧着保持される場合があり、電子部品素子５５の高
さが一定に揃わない恐れがある。その結果、外装樹脂層
の塗布位置にバラツキが生じる欠点があった。この問題
は、特に低背型電子部品の場合に重大である。[0005] Also, the lead frame 54 is attached to each support plate 52.
When the lead frame 54 is inserted between the two, the lower end of the band of the lead frame 54 hits the support column 51 and stops. In some cases, the electronic component elements 55 may be held under pressure without contacting the electronic component elements 51, and the heights of the electronic component elements 55 may not be uniform. As a result, there was a drawback that the coating position of the exterior resin layer varied. This problem is particularly serious in the case of low profile electronic components.
【０００６】そこで、本発明の目的は、リードフレーム
の挿入，取り出しが容易で、リードフレームの撓みを矯
正して電子部品素子の高さばらつきを小さくできるリー
ドフレームの保持具を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a lead frame holder that allows easy insertion and removal of the lead frame, corrects deflection of the lead frame, and reduces height variations of electronic component elements. .
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
、本発明の保持具は、非磁性の硬質基板の上面に、少な
くとも一側方が開口しかつ上記リードフレームの帯部を
摺動自在に嵌挿し得る一定深さの保持溝を複数本平行に
形成し、これら保持溝の底部近傍にリードフレームを磁
力により吸着する永久磁石を固定したものである。[Means for Solving the Problems] In order to achieve the above object, the holder of the present invention has an opening on at least one side on the upper surface of a non-magnetic hard substrate and is capable of freely sliding a band portion of the lead frame. A plurality of holding grooves of a constant depth that can be inserted into the lead frame are formed in parallel, and permanent magnets that magnetically attract the lead frame are fixed near the bottoms of these holding grooves.
【０００８】電子部品素子を固定したフープ状のリード
フレームは硬質基板の保持溝に対して側方から挿入され
る。リードフレームの抜けや倒れを防止するため、保持
溝の深さはリードフレームの帯部の幅とほぼ同等または
これよりやや深くするのが望ましい。また、保持溝の溝
幅は、リードフレームの傾きを防止しかつリードフレー
ムの摺動性を阻害しない範囲に設定するのが望ましい。
保持溝の底部近傍には永久磁石が固定されているので、
その磁力によりリードフレームの帯部が吸着保持される
。この吸着力は、保持具をディップコーティングのため
に逆さにした場合でも、リードフレームが保持溝から落
下しない程度以上に設定されている。また、永久磁石の
吸着力によりリードフレームが保持溝の底部に密着する
ので、リードフレームの撓みが矯正され、電子部品素子
の高さばらつきを小さくできる。保持具からリードフレ
ームを取り出す場合には、保持溝が側方へ開口している
ので、保持具の側方へ簡単に引き抜くことができる。
このように保持具に対してリードフレームを側方から挿
入，取り出しができるため、従来のような手作業による
挿入，取り出しとは異なり作業性が格段に向上するとと
もに、自動化が可能となる。なお、リードフレームを保
持具の保持溝に挿入する際、保持溝の縁部に当たってリ
ードフレームが損傷するのを防止するため、保持溝の少
なくとも一方の縁部にテーパ状の開口を設けてもよい。A hoop-shaped lead frame to which an electronic component element is fixed is laterally inserted into a holding groove of a hard substrate. In order to prevent the lead frame from coming off or falling down, it is desirable that the depth of the holding groove be approximately equal to or slightly deeper than the width of the band of the lead frame. Further, it is desirable that the groove width of the holding groove is set within a range that prevents the lead frame from tilting and does not inhibit the slidability of the lead frame. A permanent magnet is fixed near the bottom of the retaining groove, so
The magnetic force attracts and holds the band portion of the lead frame. This suction force is set to a level greater than enough to prevent the lead frame from falling from the holding groove even when the holding tool is turned upside down for dip coating. Further, since the lead frame is brought into close contact with the bottom of the holding groove due to the attraction force of the permanent magnet, the deflection of the lead frame is corrected, and variations in the height of the electronic component elements can be reduced. When taking out the lead frame from the holder, since the holding groove opens laterally, the lead frame can be easily pulled out to the side of the holder. Since the lead frame can be inserted into and removed from the holder from the side in this way, unlike the conventional manual insertion and removal, work efficiency is greatly improved and automation is possible. Note that when inserting the lead frame into the holding groove of the holder, in order to prevent the lead frame from being damaged by hitting the edge of the holding groove, at least one edge of the holding groove may be provided with a tapered opening. .
【０００９】[0009]
【実施例】図１は本発明にかかる保持具Ａを示し、４本
の硬質基板１と一対の断面略Ｔ字形のガイド板１０とで
構成されている。硬質基板１はアルミニウム等の非磁性
金属よりなり、その上面には両側方に開口する平行な多
数の保持溝２が幅方向に形成されている。この保持溝２
の深さはリードフレーム２０の帯部２１の幅寸法とほぼ
等しく設定されている。保持溝２の一方の開口部３はテ
ーパ状に開いており、開口部３側の溝底部には、開口部
３側にかけて漸次下方へ傾斜した傾斜面４が形成されて
いる。これら開口部３および傾斜面４は側方からリード
フレーム２０を挿入する際に、その端部を円滑に案内す
る機能を有する。硬質基板１の下面には略Ｔ字形の溝５
が長手方向に連続して形成されており、この溝５には長
方形断面を有する棒状の永久磁石６が埋め込み固定され
ている。そのため、永久磁石６の磁力が保持溝２の挿入
されたリードフレーム２０の帯部２１に作用し、帯部２
１を保持溝２方向に吸着保持する。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a holder A according to the present invention, which is composed of four rigid substrates 1 and a pair of guide plates 10 having a substantially T-shaped cross section. The hard substrate 1 is made of a non-magnetic metal such as aluminum, and a large number of parallel holding grooves 2 opening on both sides are formed in the width direction on its upper surface. This retaining groove 2
The depth of the lead frame 20 is set to be approximately equal to the width dimension of the band portion 21 of the lead frame 20. One opening 3 of the holding groove 2 is tapered open, and an inclined surface 4 that gradually slopes downward toward the opening 3 is formed at the bottom of the groove on the opening 3 side. The opening 3 and the inclined surface 4 have the function of smoothly guiding the end of the lead frame 20 when the lead frame 20 is inserted from the side. A substantially T-shaped groove 5 is formed on the bottom surface of the hard substrate 1.
are formed continuously in the longitudinal direction, and a rod-shaped permanent magnet 6 having a rectangular cross section is embedded and fixed in this groove 5. Therefore, the magnetic force of the permanent magnet 6 acts on the band portion 21 of the lead frame 20 into which the holding groove 2 is inserted, and the band portion 2
1 is sucked and held in two directions of the holding groove.
【００１０】上記硬質基板１の両端部は断面略Ｔ字形の
ガイド板１０の段差面１１に載置した状態でネジ１２に
より固定され、このガイド板１０によって４本の硬質基
板１は互いに平行に連結固定されている。そのため、各
硬質基板１の保持溝２はそれぞれ一直線状に整列される
。ガイド板１０の水平部１３は図示しない駆動機構によ
り保持され、リードフレーム２０の挿入，取出時、ディ
ップコーティング時、乾燥炉への搬送時などにこの水平
部１３によって保持具Ａが支持される。Both ends of the hard substrate 1 are fixed with screws 12 while being placed on the step surface 11 of a guide plate 10 having a substantially T-shaped cross section. Connection is fixed. Therefore, the holding grooves 2 of each hard substrate 1 are aligned in a straight line. The horizontal portion 13 of the guide plate 10 is held by a drive mechanism (not shown), and the holder A is supported by this horizontal portion 13 when the lead frame 20 is inserted or removed, during dip coating, when transported to a drying oven, etc.
【００１０】リードフレーム２０はＦｅ等の磁性金属板
からプレス加工されたものであり、連続した帯部２１と
、帯部２１から上方に平行に突設された３本一組のリー
ド端子２２とを備えており、帯部２１には一定間隔おき
にパイロット穴２３が形成されている。上記リード端子
２２の各組には電子部品素子２４が半田付け等によって
接続固定されている。The lead frame 20 is pressed from a magnetic metal plate made of Fe or the like, and includes a continuous band portion 21 and a set of three lead terminals 22 projecting upward in parallel from the band portion 21. Pilot holes 23 are formed in the band portion 21 at regular intervals. An electronic component element 24 is connected and fixed to each set of the lead terminals 22 by soldering or the like.
【００１２】ここで、上記保持具Ａの使用方法を説明す
る。まず保持具Ａの保持溝２を上側に向けた状態にセッ
トする。つぎに、取入・取出機構の爪３０（図２参照）
を前工程におけるリードフレーム２０の各リード端子２
２の間に挿入し、リードフレーム２０を一枚ずつ保持具
Ａの保持溝２に対し側方から挿入する。このとき、帯部
２１の先端は開口部３および傾斜面４によって保持溝２
へ導かれるので、左右あるいは上下方向に多少のずれが
あってもリードフレーム２０は円滑に案内され、帯部２
１が変形することがない。１枚のリードフレーム２０が
挿入し終わると、保持具Ａを保持溝２の直交方向に１ピ
ッチだけ動かし、次のリードフレーム２０を挿入すると
いう具合にリードフレーム２０を全ての保持溝２に挿入
し終わるまで上記の挿入動作を繰り返す。硬質基板１の
保持溝２に挿入されたリードフレーム２０は、保持溝２
の底部近傍に埋め込まれた永久磁石６によって吸着保持
され、帯部２１の下端が保持溝２の底部に密着する。そ
のため、リードフレーム２０の長手方向の撓みが矯正さ
れ、電子部品素子２４の硬質基板１からの高さＨのばら
つきを小さくできる（図２参照）。具体的には、従来の
保持具（図５参照）では高さＨのバラツキが１．２ｍｍ
程度あったが、本発明の場合には０．２ｍｍに低減でき
た。次に、保持具Ａをディップコーティングのために逆
さ状態に反転させる。このときも永久磁石６の吸着力に
よりリードフレーム２０が保持溝２から落下する恐れは
ない。リードフレーム２０を逆さにした後、図３，図４
のように電子部品素子２４部分を樹脂液４０中に浸漬す
る。この時、電子部品素子２４の高さＨのばらつきが小
さいので、外装樹脂４０の塗布ばらつきも小さくなり、
均質の電子部品を得ることが可能である。ディップコー
ティングを終了した後、保持具Ａはリードフレーム２０
が上側となるように反転され、乾燥炉（図示せず）に搬
送される。ここで、電子部品素子２４の周囲に塗布され
た外装樹脂４０が乾燥，固化される。外装樹脂４０が固
化した後、取入・取出機構の爪３０（図２参照）が再び
各リード端子２２の間に挿入され、リードフレーム２０
は側方へ水平に引き抜かれ、次工程へ搬送される。[0012] Here, a method of using the above-mentioned holder A will be explained. First, set the holder A so that the holding groove 2 faces upward. Next, the claw 30 of the intake/extraction mechanism (see Figure 2)
Each lead terminal 2 of the lead frame 20 in the previous process
2, and insert the lead frame 20 one by one into the holding groove 2 of the holder A from the side. At this time, the tip of the band 21 is connected to the holding groove 2 by the opening 3 and the inclined surface 4.
Therefore, even if there is some deviation in the horizontal or vertical direction, the lead frame 20 is guided smoothly, and the band portion 2
1 will not be deformed. When one lead frame 20 has been inserted, the holder A is moved by one pitch in the direction perpendicular to the holding grooves 2, and the next lead frame 20 is inserted, and the lead frames 20 are inserted into all the holding grooves 2. Repeat the above insertion operation until the insertion is complete. The lead frame 20 inserted into the holding groove 2 of the hard substrate 1 is inserted into the holding groove 2.
It is attracted and held by a permanent magnet 6 embedded near the bottom of the band 21 , and the lower end of the band 21 is brought into close contact with the bottom of the holding groove 2 . Therefore, the deflection in the longitudinal direction of the lead frame 20 is corrected, and variations in the height H of the electronic component element 24 from the hard substrate 1 can be reduced (see FIG. 2). Specifically, in the conventional holder (see Figure 5), the variation in height H is 1.2 mm.
However, in the case of the present invention, it was possible to reduce it to 0.2 mm. Next, holder A is turned upside down for dip coating. At this time, there is no fear that the lead frame 20 will fall from the holding groove 2 due to the attraction force of the permanent magnet 6. After turning the lead frame 20 upside down, FIGS. 3 and 4
The electronic component element 24 portion is immersed in the resin liquid 40 as shown in FIG. At this time, since the variation in the height H of the electronic component element 24 is small, the variation in the application of the exterior resin 40 is also small.
It is possible to obtain homogeneous electronic components. After finishing the dip coating, the holder A is attached to the lead frame 20.
It is turned over so that it faces upward, and then transported to a drying oven (not shown). Here, the exterior resin 40 applied around the electronic component element 24 is dried and solidified. After the exterior resin 40 is solidified, the claws 30 of the intake/extraction mechanism (see FIG. 2) are inserted between each lead terminal 22 again, and the lead frame 20
is pulled horizontally to the side and transported to the next process.
【００１３】なお、本発明は上記実施例に限るものでは
ない。例えば４本の硬質基板１を一対のガイド板１０に
よって平行に固定したが、これは保持溝２の加工時にお
ける硬質基板１の変形を最少限に抑制し、かつ保持具Ａ
を軽量化するためであって、１枚の大形な硬質基板の上
面に連続した保持溝を形成してもよい。この場合、硬質
基板の両端部に段差面を形成することにより、ガイド板
を省略することも可能である。また、永久磁石は少なく
とも保持溝の底部近傍に設ければよく、実施例のように
棒状の永久磁石を硬質基板の全長にわたって固定する必
要はない。また、硬質基板は非磁性材料で形成してあれ
ばよく、アルミニウムのような金属材料に限らず樹脂材
料を用いてもよい。さらに、保持溝は両側方に開口した
ものに限らず、一側方のみに開口したものでもよい。た
だ、両側方に開口している場合には、リードフレームの
挿入，取出を２方向から行うことができるので便利であ
る。Note that the present invention is not limited to the above embodiments. For example, four hard substrates 1 are fixed in parallel by a pair of guide plates 10, which minimizes the deformation of the hard substrates 1 during machining of the holding grooves 2, and also
A continuous holding groove may be formed on the upper surface of a single large rigid substrate in order to reduce the weight of the substrate. In this case, it is also possible to omit the guide plate by forming stepped surfaces at both ends of the hard substrate. In addition, the permanent magnet may be provided at least near the bottom of the holding groove, and it is not necessary to fix the bar-shaped permanent magnet over the entire length of the hard substrate as in the embodiment. Further, the hard substrate may be made of a non-magnetic material, and may be made of a resin material instead of a metal material such as aluminum. Furthermore, the holding groove is not limited to one that is open on both sides, but may be one that is open only on one side. However, if it is open on both sides, it is convenient because the lead frame can be inserted and removed from two directions.
【００１４】[0014]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、保持溝に対しリードフレームを側方へスライド
させるだけで出し入れでき、保持溝に挿入したリードフ
レームは永久磁石に磁力によって保持されるので、従来
に比べて挿入，取出時の作業性が格段に向上するととも
に、自動化も容易である。また、リードフレームは永久
磁石によって保持溝の底部に吸着されるため、リードフ
レームの長手方向の撓みが矯正され、電子部品素子の高
さバラツキを小さくできる。そのため、外装樹脂層の塗
布位置のバラツキも小さくでき、従来では困難であった
低背型電子部品への展開が容易となった。さらに、本発
明の保持具の場合には従来に比べて板ばねの収容部が不
要になるため、リードフレームの収納個数を増やすこと
ができる。したがって、ディップコーティング処理能率
の向上を図ることができる。As is clear from the above explanation, according to the present invention, the lead frame can be taken in and out of the holding groove by simply sliding it sideways, and the lead frame inserted into the holding groove is moved by the magnetic force of the permanent magnet. Since it is retained, the workability during insertion and removal is much improved compared to the conventional method, and automation is also easy. Further, since the lead frame is attracted to the bottom of the holding groove by the permanent magnet, the deflection in the longitudinal direction of the lead frame is corrected, and variations in the height of the electronic component elements can be reduced. Therefore, variations in the coating position of the exterior resin layer can be reduced, making it easier to apply this method to low-profile electronic components, which was difficult to do in the past. Furthermore, in the case of the holder of the present invention, the number of lead frames to be stored can be increased since a leaf spring accommodating part is not required compared to the conventional one. Therefore, it is possible to improve the dip coating processing efficiency.
【図１】本発明にかかる保持具にリードフレームを挿入
する状態を示す斜視図である。FIG. 1 is a perspective view showing a state in which a lead frame is inserted into a holder according to the present invention.
【図２】図１のＩＩ−ＩＩ線拡大断面図である。FIG. 2 is an enlarged sectional view taken along line II-II in FIG. 1;
【図３】ディップコーティング時における図１のＩＩＩ
−ＩＩＩ 線断面図である。[Figure 3] III of Figure 1 during dip coating
-III line sectional view.
【図４】図３のＩＶ−ＩＶ線断面図である。FIG. 4 is a sectional view taken along the line IV-IV in FIG. 3;
【図５】従来例の斜視図である。FIG. 5 is a perspective view of a conventional example.
Ａ 保持具１
硬質基板２
保持溝６ 永久磁石２
０ リードフレーム２１
帯部A Holder 1
Hard substrate 2
Holding groove 6 Permanent magnet 2
0 Lead frame 21
obi part
Claims (1)
ードフレームを複数枚並列に保持するための保持具にお
いて、非磁性の硬質基板の上面に、少なくとも一側方が
開口しかつ上記リードフレームの帯部を摺動自在に嵌挿
し得る一定深さの保持溝を複数本平行に形成し、これら
保持溝の底部近傍にリードフレームを磁力により吸着す
る永久磁石を固定したことを特徴とするリードフレーム
の保持具。Claims: 1. A holder for holding a plurality of hoop-shaped lead frames to which electronic component elements are fixed in parallel, wherein at least one side of the upper surface of a non-magnetic hard substrate is open and the lead frames are A lead frame characterized in that a plurality of holding grooves of a constant depth are formed in parallel into which a band part can be slidably inserted, and a permanent magnet is fixed near the bottom of these holding grooves to magnetically attract the lead frame. holder.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3126597A JP2581342B2 (en) | 1991-04-30 | 1991-04-30 | Lead frame holder |
| DE19924213934 DE4213934C2 (en) | 1991-04-30 | 1992-04-28 | Lead frame holder |
| GB9209307A GB2255295B (en) | 1991-04-30 | 1992-04-30 | Lead frame holder |
| US08/265,688 US5549754A (en) | 1991-04-30 | 1994-06-24 | Lead frame holder |
| SG13895A SG13895G (en) | 1991-04-30 | 1995-01-26 | Lead frame holder |
| US08/411,866 US5578126A (en) | 1991-04-30 | 1995-03-28 | Lead frame holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3126597A JP2581342B2 (en) | 1991-04-30 | 1991-04-30 | Lead frame holder |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5223870A Division JPH06260867A (en) | 1993-08-16 | 1993-08-16 | Holding tool for lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04329011A true JPH04329011A (en) | 1992-11-17 |
| JP2581342B2 JP2581342B2 (en) | 1997-02-12 |
Family
ID=14939130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3126597A Expired - Lifetime JP2581342B2 (en) | 1991-04-30 | 1991-04-30 | Lead frame holder |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2581342B2 (en) |
| DE (1) | DE4213934C2 (en) |
| GB (1) | GB2255295B (en) |
| SG (1) | SG13895G (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5338189A (en) * | 1992-02-10 | 1994-08-16 | Murata Manufacturing Co., Ltd. | Heat treat furnace |
| JP2004223637A (en) * | 2003-01-21 | 2004-08-12 | Fuji Xerox Co Ltd | Method for manufacturing laminated structure and laminated structure |
| JP2010171207A (en) * | 2009-01-22 | 2010-08-05 | Rubycon Corp | Capacitor element fixture and method of manufacturing the capacitor element |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538017U (en) * | 1976-07-05 | 1978-01-24 | ||
| JPS55164842U (en) * | 1979-05-11 | 1980-11-27 | ||
| JPS57131934A (en) * | 1981-02-06 | 1982-08-16 | Sharp Corp | Electronic range |
| JPS5938055U (en) * | 1982-09-02 | 1984-03-10 | 三洋電機株式会社 | Thermal head protection circuit |
| JPH028149U (en) * | 1988-06-28 | 1990-01-19 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195703U (en) * | 1987-06-04 | 1988-12-16 | ||
| DE3815713C1 (en) * | 1988-05-07 | 1989-08-10 | Standard Elektrik Lorenz Ag, 7000 Stuttgart, De | Workpiece support for hybrid devices (circuits), integrated film circuits and the like |
-
1991
- 1991-04-30 JP JP3126597A patent/JP2581342B2/en not_active Expired - Lifetime
-
1992
- 1992-04-28 DE DE19924213934 patent/DE4213934C2/en not_active Expired - Lifetime
- 1992-04-30 GB GB9209307A patent/GB2255295B/en not_active Expired - Lifetime
-
1995
- 1995-01-26 SG SG13895A patent/SG13895G/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538017U (en) * | 1976-07-05 | 1978-01-24 | ||
| JPS55164842U (en) * | 1979-05-11 | 1980-11-27 | ||
| JPS57131934A (en) * | 1981-02-06 | 1982-08-16 | Sharp Corp | Electronic range |
| JPS5938055U (en) * | 1982-09-02 | 1984-03-10 | 三洋電機株式会社 | Thermal head protection circuit |
| JPH028149U (en) * | 1988-06-28 | 1990-01-19 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5338189A (en) * | 1992-02-10 | 1994-08-16 | Murata Manufacturing Co., Ltd. | Heat treat furnace |
| JP2004223637A (en) * | 2003-01-21 | 2004-08-12 | Fuji Xerox Co Ltd | Method for manufacturing laminated structure and laminated structure |
| JP4528488B2 (en) * | 2003-01-21 | 2010-08-18 | 富士ゼロックス株式会社 | Manufacturing method of laminated structure and laminated structure |
| JP2010171207A (en) * | 2009-01-22 | 2010-08-05 | Rubycon Corp | Capacitor element fixture and method of manufacturing the capacitor element |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4213934C2 (en) | 1994-11-24 |
| GB2255295B (en) | 1994-11-23 |
| DE4213934A1 (en) | 1992-11-05 |
| GB9209307D0 (en) | 1992-06-17 |
| SG13895G (en) | 1995-06-16 |
| GB2255295A (en) | 1992-11-04 |
| JP2581342B2 (en) | 1997-02-12 |
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