JPH04324992A - Mounting structure of power element - Google Patents
Mounting structure of power elementInfo
- Publication number
- JPH04324992A JPH04324992A JP9547291A JP9547291A JPH04324992A JP H04324992 A JPH04324992 A JP H04324992A JP 9547291 A JP9547291 A JP 9547291A JP 9547291 A JP9547291 A JP 9547291A JP H04324992 A JPH04324992 A JP H04324992A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- power element
- connection hole
- insertion hole
- lead connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims abstract description 17
- 230000037431 insertion Effects 0.000 claims abstract description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001481833 Coryphaena hippurus Species 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、発熱性のパワー素子
を実装する構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a heat generating power element.
【０００２】0002
【従来の技術】図４および図５は例えば実開平２−５２
３９３号公報に示された従来のパワー素子の実装構造で
、１は筐体で、凹部１ａを有する。２はプリント基板、
３はパワー素子、４はこのパワー素子に設けられたリー
ド、５は上記パワー素子３に一体化された放熱フィン、
６は上記プリント基板２の表面に実装された通常の電子
部品、７は上記プリント基板２に設けられたリード接続
孔である。[Prior Art] FIGS. 4 and 5 are, for example, Utility Model Application Publication No. 2-52
In the conventional power device mounting structure shown in Japanese Patent No. 393, reference numeral 1 denotes a housing having a recess 1a. 2 is a printed circuit board,
3 is a power element, 4 is a lead provided on this power element, 5 is a heat dissipation fin integrated with the power element 3,
Reference numeral 6 indicates a normal electronic component mounted on the surface of the printed circuit board 2, and 7 indicates a lead connection hole provided in the printed circuit board 2.
【０００３】従来のパワー素子の実装構造は上記のよう
に構成され、その組立ては、筐体１の凹部１ａに放熱フ
ィン５をネジ止めし、次にリード４を上に向けた状態で
プリント基板２を実装し、最後にリード４を基板２に半
田付けする。The conventional power device mounting structure is constructed as described above, and its assembly involves screwing the radiation fins 5 into the recesses 1a of the casing 1, and then mounting the printed circuit board with the leads 4 facing upward. 2 is mounted, and finally the leads 4 are soldered to the board 2.
【０００４】0004
【発明が解決しようとする課題】上記のような従来のパ
ワー素子の実装構造では、筐体１に取り付けられたパワ
ー素子３のリード４を上に向けた状態でプリント基板２
を装着するため、パワー素子３のリードフォーミング、
パワー素子３の取り付け角度、取り付け位置のばらつき
等により、非常に作業性が悪いという課題があった。[Problems to be Solved by the Invention] In the conventional power device mounting structure as described above, the printed circuit board 2 is mounted with the leads 4 of the power device 3 attached to the housing 1 facing upward.
In order to install the power element 3, lead forming,
There was a problem in that workability was extremely poor due to variations in the mounting angle and mounting position of the power element 3.
【０００５】この発明は、係る課題を解決するためにな
されたもので、パワー素子に対するプリント基板２の装
着作業が簡単にできるパワー素子の実装構造を得ること
を目的とするものである。[0005] The present invention was made in order to solve the above problem, and an object thereof is to obtain a mounting structure for a power element that allows easy attachment of a printed circuit board 2 to the power element.
【０００６】[0006]
【課題を解決するための手段】この発明に係るパワー素
子の実装構造では、電子部品を搭載し、リード接続孔を
設けた基板と、この基板にリード線を介して接続される
パワー素子を設けた筐体とを備え、上記基板に上記リー
ド接続孔より大径からなるリード挿入孔をリード接続孔
に連設したものである。[Means for Solving the Problems] A power device mounting structure according to the present invention includes a board on which electronic components are mounted and a lead connection hole, and a power device connected to this board via lead wires. The lead insertion hole has a diameter larger than that of the lead connection hole and is connected to the lead connection hole in the substrate.
【０００７】[0007]
【作用】この発明においては、電子部品を搭載し、リー
ド接続孔を設けた基板と、この基板にリード線を介して
接続されるパワー素子を設けた筐体とを備え、上記基板
に上記リード接続孔より大径からなるリード挿入孔をリ
ード接続孔に連設したことより、パワー素子のリード線
は基板のリード挿入孔に挿通され、ここから、リード接
続孔へと導かれる。[Operation] The present invention includes a board on which electronic components are mounted and a lead connection hole provided therein, and a casing provided with a power element connected to the board via lead wires, and the board is provided with the leads. Since the lead insertion hole having a diameter larger than the connection hole is provided in series with the lead connection hole, the lead wire of the power element is inserted into the lead insertion hole of the substrate and is guided from there to the lead connection hole.
【０００８】[0008]
実施例１．図１および図２はこの発明の一実施例を示す
図であり、１０は筐体、１１はこの筐体に放熱板１２と
一体に設けられたパワー素子、１３はこのパワー素子の
リード線、１４は上記筐体１０に取付足１５を介して装
着されるプリント基板、１６はこのプリント基板の表面
に実装された通常の電子部品、１７は上記プリント基板
１４に設けられたリード接続孔、１８はこのリード接続
孔に連設されたリード挿入孔で、リード接続孔１７より
大径からなり図２に示すようなリード接続孔１７と合わ
せ達磨形を形成する。１９は放熱フィンである。Example 1. 1 and 2 are diagrams showing an embodiment of the present invention, in which 10 is a housing, 11 is a power element provided integrally with the heat sink 12 in this housing, 13 is a lead wire of this power element, 14 is a printed circuit board mounted on the housing 10 via the mounting feet 15; 16 is a normal electronic component mounted on the surface of the printed circuit board; 17 is a lead connection hole provided in the printed circuit board 14; 18 is a lead insertion hole connected to this lead connection hole, which has a larger diameter than the lead connection hole 17, and forms a dolphin shape with the lead connection hole 17 as shown in FIG. 19 is a heat radiation fin.
【０００９】上記のように構成されたパワー素子の実装
構造においては、筐体１０に取り付けられた放熱板１２
にパワー素子１１を固定し、パワー素子１１のリード線
１３を上に向け、リード挿入孔１８に挿通させるように
してプリント基板１４を実装する。次に、リード線１３
をリード接続孔１７へ導き半田付けする。In the power device mounting structure configured as described above, the heat sink 12 attached to the housing 10
The power element 11 is fixed to the holder, and the printed circuit board 14 is mounted so that the lead wire 13 of the power element 11 faces upward and is inserted into the lead insertion hole 18. Next, lead wire 13
is guided into the lead connection hole 17 and soldered.
【００１０】実施例２．なお、上記実施例ではリード挿
入孔１８を円形状について述べたが、図３に示すような
長穴形状あるいは方形状のものでもよく、上記実施例と
同様の効果を奏する。Example 2. In the above embodiment, the lead insertion hole 18 was described as having a circular shape, but it may have an elongated hole shape or a square shape as shown in FIG. 3, and the same effects as in the above embodiment can be obtained.
【００１１】実施例３．また、上記実施例の他にリード
挿入孔は、リード接続孔に対して、どの方向に設けても
よく、上記実施例と同様の効果が得られる。Example 3. Further, in addition to the above embodiment, the lead insertion hole may be provided in any direction with respect to the lead connection hole, and the same effects as in the above embodiment can be obtained.
【００１２】0012
【発明の効果】この発明は、以上説明したとおり電子部
品を搭載し、リード接続孔を設けた基板と、この基板に
リード線を介して接続されるパワー素子を設けた筐体と
を備え、上記基板に上記リード接続孔より大径からなる
リード挿入孔をリード接続孔に連設したことより、パワ
ー素子のリード線がリード挿入孔に容易に挿通された後
、リード接続孔へスムーズに配線されるので、パワー素
子に対し、プリント基板の装着作業がより簡単且つ、効
率よくできる。[Effects of the Invention] As described above, the present invention includes a board on which electronic components are mounted and a lead connection hole provided, and a casing provided with a power element connected to the board via lead wires. By providing a lead insertion hole with a larger diameter than the lead connection hole on the above board, the lead wire of the power device can be easily inserted into the lead insertion hole and then wired smoothly to the lead connection hole. Therefore, it is possible to more easily and efficiently attach the printed circuit board to the power device.
【図１】この発明の実施例１を示す構造図である。FIG. 1 is a structural diagram showing a first embodiment of the present invention.
【図２】この発明の実施例１を示すリード挿入孔とリー
ド接続孔の部分拡大図である。FIG. 2 is a partially enlarged view of a lead insertion hole and a lead connection hole showing Embodiment 1 of the present invention.
【図３】この発明の実施例２を示すリード挿入孔とリー
ド接続孔の部分拡大図である。FIG. 3 is a partially enlarged view of a lead insertion hole and a lead connection hole showing a second embodiment of the present invention.
【図４】従来のパワー素子の実装構造を示す断面図であ
る。FIG. 4 is a cross-sectional view showing a conventional power device mounting structure.
【図５】従来のパワー素子の実装構造を示す斜視図であ
る。FIG. 5 is a perspective view showing a conventional power device mounting structure.
１０ 筐体 １１ パワー素子 １３ リード線 １４ プリント基板 １６ 電子部品 １７ リード接続孔 １８ リード挿入孔 10 Housing 11 Power element 13 Lead wire 14 Printed circuit board 16 Electronic parts 17 Lead connection hole 18 Lead insertion hole
Claims (1)
けた基板と、この基板にリード線を介して接続されるパ
ワー素子を設けた筐体とを備え、上記基板に上記リード
接続孔より大径からなるリード挿入孔をリード接続孔に
連設したことを特徴とするパワー素子の実装構造。Claim 1: A board on which electronic components are mounted and a lead connection hole provided therein; and a casing provided with a power element connected to the board via a lead wire; A power device mounting structure characterized by a lead insertion hole having a large diameter connected to a lead connection hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9547291A JPH04324992A (en) | 1991-04-25 | 1991-04-25 | Mounting structure of power element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9547291A JPH04324992A (en) | 1991-04-25 | 1991-04-25 | Mounting structure of power element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04324992A true JPH04324992A (en) | 1992-11-13 |
Family
ID=14138584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9547291A Pending JPH04324992A (en) | 1991-04-25 | 1991-04-25 | Mounting structure of power element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04324992A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6882539B2 (en) | 2002-02-06 | 2005-04-19 | Keihin Corporation | Electronic circuit board case and method of producing electronic circuit unit |
-
1991
- 1991-04-25 JP JP9547291A patent/JPH04324992A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6882539B2 (en) | 2002-02-06 | 2005-04-19 | Keihin Corporation | Electronic circuit board case and method of producing electronic circuit unit |
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