JPH04320814A - Conductive article and manufacture thereof - Google Patents
Conductive article and manufacture thereofInfo
- Publication number
- JPH04320814A JPH04320814A JP11383691A JP11383691A JPH04320814A JP H04320814 A JPH04320814 A JP H04320814A JP 11383691 A JP11383691 A JP 11383691A JP 11383691 A JP11383691 A JP 11383691A JP H04320814 A JPH04320814 A JP H04320814A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- thermoplastic material
- predetermined shape
- manufacture
- conductive article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000012815 thermoplastic material Substances 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229920003002 synthetic resin Polymers 0.000 abstract description 4
- 239000000057 synthetic resin Substances 0.000 abstract description 4
- 208000032365 Electromagnetic interference Diseases 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、導電性物品及びその製
造法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive article and a method for manufacturing the same.
【０００２】0002
【従来の技術】従来、導電性物品（例えば、ＥＭＩシー
ルド）の製造時には、金属器体の表面に導電性塗料を塗
布していたが、塗布の場合は剥離や塗布むらを起し易く
また塗布面に亀裂が入る等の欠点があった。[Prior Art] Conventionally, when manufacturing conductive articles (for example, EMI shields), a conductive paint was applied to the surface of a metal body, but the coating was prone to peeling and uneven coating. There were drawbacks such as cracks on the surface.
【０００３】0003
【発明が解決しようとする課題】本発明は、このような
欠点をすべて除去した画期的な製造法を提供するととも
にこれによってＥＭＩシールド（電磁波シールド）の完
全な物品を提供することを目的とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide an innovative manufacturing method that eliminates all of these drawbacks, and thereby to provide a complete EMI shield (electromagnetic shield). It is something to do.
【０００４】0004
【課題を解決するための手段】本発明は、所定形状に成
形した高機能性材料による器体を熱可塑性材料の射出成
形によって被覆して被套体を形成して成る導電性物品で
ある。SUMMARY OF THE INVENTION The present invention is an electrically conductive article in which a housing is formed by covering a vessel made of a highly functional material molded into a predetermined shape by injection molding of a thermoplastic material.
【０００５】また、予め所定形状に成形した高機能性材
料による器体を熱可塑性材料成形用金型にセットし、こ
の金型に熱可塑性材料を射出して前記器体の外面を被覆
し異質材料を一体に構成する導電性物品の製造法である
。[0005] Also, a container body made of a highly functional material, which has been molded in advance into a predetermined shape, is set in a mold for molding a thermoplastic material, and the thermoplastic material is injected into the mold to cover the outer surface of the container body, thereby forming a foreign material. This is a method for manufacturing conductive articles that are made of integral materials.
【０００６】[0006]
【実施例】本発明にかかる導電性物品の製造工程につい
て説明する。[Example] The manufacturing process of the conductive article according to the present invention will be explained.
【０００７】用意した導電材や高強度材等の金属から成
る高機能材板１を、所定の金型２によって所定形状に、
周辺部に適当長さのバリ３を突出してプレス成形し、所
定の成品４を得る。（図１・図２参照）A prepared high-performance material plate 1 made of a metal such as a conductive material or a high-strength material is molded into a predetermined shape using a predetermined mold 2.
A predetermined product 4 is obtained by press-forming with a burr 3 of an appropriate length protruding from the periphery. (See Figures 1 and 2)
【０００８】こ
の成品４の周辺バリ３を全部切断して、所定の器体５を
製作する。（図３参照）[0008] All the peripheral burrs 3 of this finished product 4 are cut off to produce a predetermined container body 5. (See Figure 3)
【０００９】この器体５の外面
に接着剤６を塗布する。
（図４参照） この接着剤の塗布は、熱可塑性材料と
高機能材料との接着性が劣悪の場合に行う。Adhesive 6 is applied to the outer surface of this vessel body 5. (See FIG. 4) This adhesive is applied when the adhesiveness between the thermoplastic material and the highly functional material is poor.
【００１０】この器体５を、この器体の形態に合わせて
構成した下金型７に載置するとともに上金型８を嵌合す
る。（図５・図６参照）The container 5 is placed on a lower mold 7 configured to match the shape of the container, and an upper mold 8 is fitted thereinto. (See Figures 5 and 6)
【００１１】この金型７，８に合成樹脂材等の熱可塑性
材料９を射出し、これを前記器体５の表面又は及び裏面
に付着する。これによって器体５の外面に熱可塑性材料
による被套体９’を一体に被覆成形する。（図７参照）
A thermoplastic material 9 such as a synthetic resin material is injected into the molds 7 and 8 and attached to the front or back surface of the vessel body 5. As a result, the outer surface of the container body 5 is integrally coated with a jacket 9' made of a thermoplastic material. (See Figure 7)
【００１２】しかる後、上金型８を開き、下金型７から
完成品１０を取り出す。（図８・図９参照）Thereafter, the upper mold 8 is opened and the finished product 10 is taken out from the lower mold 7. (See Figures 8 and 9)
【００１３
】0013
]
【発明の効果】導電材又は高強度材等の高機能性材料に
よって所定形状にプレス成形した金属製器体の外面に、
異質材であるが流動性のある合成樹脂材等の熱可塑性材
料を一体に被覆成形した物品を製造することが容易にで
きるようになる。[Effect of the invention] On the outer surface of a metal container body press-molded into a predetermined shape using a highly functional material such as a conductive material or a high-strength material,
It becomes possible to easily manufacture an article that is integrally coated and molded with a thermoplastic material such as a synthetic resin material, which is a different material but has fluidity.
【００１４】これによって、製品の外観は合成樹脂材等
の熱可塑性材料の外面を呈するが、内部は強度の高い堅
牢な金属材料を使用することができるようになり、製品
全体においてＥＭＩシールド（電磁波シールド）の完全
な導電性物品を比較的安価に製造して提供することがで
きるようになる。[0014] As a result, although the external appearance of the product is made of thermoplastic material such as synthetic resin, it is now possible to use a strong and robust metal material inside, and the entire product is EMI shielded (electromagnetic wave shielding). It becomes possible to manufacture and provide a completely conductive article (shield) at a relatively low cost.
【図１】高機能材板の正断面図[Figure 1] Front cross-sectional view of high-performance timber board
【図２】金型の作用状態を示した正断面図[Figure 2] Front sectional view showing the working state of the mold
【図３】成品
の正断面図[Figure 3] Front cross-sectional view of finished product
【図４】接着剤を塗布した器体の正断面図[Figure 4] Front cross-sectional view of the vessel body coated with adhesive
【図５】金型
の作用状態を示した正断面図[Figure 5] Front sectional view showing the working state of the mold
【図６】金型の作用状態を
示した正断面図[Figure 6] Front sectional view showing the working state of the mold
【図７】金型の作用状態を示した正断面
図[Figure 7] Front sectional view showing the working state of the mold
【図８】金型の作用状態を示した正断面図[Figure 8] Front sectional view showing the working state of the mold
【図９】金
型の作用状態を示した正断面図[Figure 9] Front sectional view showing the working state of the mold
５ 高機能性材料によって成形した器体９’
熱可塑性材料によって被覆した被套体１０ 完成
品5 Vessel 9' molded from highly functional material
Mantle 10 coated with thermoplastic material Finished product
Claims (2)
る器体を熱可塑性材料の射出成形によって被覆して被套
体を形成して成る導電性物品。1. An electrically conductive article comprising a container made of a highly functional material molded into a predetermined shape and covered by injection molding of a thermoplastic material to form a sheath.
による器体を熱可塑性材料成形用金型にセットし、この
金型に熱可塑性材料を射出して前記器体の外面を被覆し
異質材料を一体に構成する導電性品の製造法。2. A container body made of a highly functional material that has been pre-molded into a predetermined shape is set in a mold for molding thermoplastic material, and the thermoplastic material is injected into the mold to cover the outer surface of the container body, thereby forming a foreign material. A manufacturing method for conductive products that consist of integral materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11383691A JPH04320814A (en) | 1991-04-19 | 1991-04-19 | Conductive article and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11383691A JPH04320814A (en) | 1991-04-19 | 1991-04-19 | Conductive article and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04320814A true JPH04320814A (en) | 1992-11-11 |
Family
ID=14622268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11383691A Pending JPH04320814A (en) | 1991-04-19 | 1991-04-19 | Conductive article and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04320814A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS571713A (en) * | 1980-06-04 | 1982-01-06 | Daicel Chem Ind Ltd | Bonding method of nylon |
| JPS60131715A (en) * | 1983-12-20 | 1985-07-13 | 住友ベークライト株式会社 | Method of producing molded article for electromagnetic shield |
| JPS63240100A (en) * | 1987-03-27 | 1988-10-05 | 東海ゴム工業株式会社 | Resin box with metal layer and manufacture of the same |
| JPH01165415A (en) * | 1987-12-22 | 1989-06-29 | Mitsubishi Cable Ind Ltd | Preparation of ic card case |
-
1991
- 1991-04-19 JP JP11383691A patent/JPH04320814A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS571713A (en) * | 1980-06-04 | 1982-01-06 | Daicel Chem Ind Ltd | Bonding method of nylon |
| JPS60131715A (en) * | 1983-12-20 | 1985-07-13 | 住友ベークライト株式会社 | Method of producing molded article for electromagnetic shield |
| JPS63240100A (en) * | 1987-03-27 | 1988-10-05 | 東海ゴム工業株式会社 | Resin box with metal layer and manufacture of the same |
| JPH01165415A (en) * | 1987-12-22 | 1989-06-29 | Mitsubishi Cable Ind Ltd | Preparation of ic card case |
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