JPH04318962A - Semiconductor device - Google Patents

Abstract

PURPOSE: To provide a technology, wherein reliability of a semiconductor device can be improved. CONSTITUTION: For a semiconductor device sealed up with a mold resin, an insulating tape 4 which electrically insulates an inner lead, comprising a common inner lead 3a2 and plural signal inner leads 3a1 from a semiconductor chip 1 is extruded by a slight amount above the common inner lead 3a2 and the signal inner lead 3a1 . An occurrence of crack on a sealing-up resin and occurrence of a void within a narrow space between the inner lead and the semiconductor chip are prevented, for improved reliability of a semiconductor device.

Description

[Detailed description of the invention]

0001

[Industrial application field]

3. DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor devices, and in particular to LOC (Lead On Chi) of large scale integrated circuits.
p) It relates to techniques that are effective when applied to structural packages.

0002

2. Description of the Related Art Conventionally, semiconductor chips have been molded and sealed with resin in order to protect them. Before performing this sealing, the leads are positioned on the semiconductor chip,
Several methods have been used for attachment.

For example, a lead frame having a tab in the center is used, and a semiconductor chip is attached thereto before being encapsulated. In this prior art, a method is known in which electrode pads located near the periphery of a semiconductor chip are connected to corresponding inner leads using bonding wires.

A common problem with prior art semiconductor packages has been the development of cracks along the mold parting line where the leads of the metal lead frame exit.

Another problem is that the path for environmental contamination sources to enter the semiconductor chip from the outside along the metal leads is relatively short.

Yet another problem is that the bonding wires required to connect the inner leads to the electrode pads of the semiconductor chip cannot be crossed.

Therefore, in order to solve the above problem, a plurality of inner leads are arranged on the circuit forming surface of the semiconductor chip.
In a semiconductor device in which the semiconductor chip and the semiconductor chip are bonded with an adhesive with an insulating tape interposed therebetween, the inner lead and the semiconductor chip are electrically connected with a bonding wire, and the semiconductor chip is sealed with a molding resin, forming a circuit on the semiconductor chip. A semiconductor device has been proposed in which a shared inner lead (bus bar inner lead) is provided near the center line in the longitudinal direction of the surface (Japanese Patent Laid-Open No. 2-246125).

[0008]

However, in the above semiconductor device, as shown in FIG. However, due to the accuracy of the work based on the design of the insulating tape 4, the length of the insulating tape 4 is affected by the adhesive heat pressure applied to the common inner lead 3A2 and the semiconductor chip 1. If the dimensions of the insulating tape 4 are equal or are located on the inner side, as shown in FIG. The sealing resin 2A acts to create a gap at the interface with the common inner lead 3A2, and as a result, stress concentrates at the corner of the common inner lead 3A2.
Since cracks CK are generated in A and voids BD are generated in the narrow space between the inner lead 3A1 and the semiconductor chip 1, there is a problem that the reliability of the semiconductor device is deteriorated.

Furthermore, as shown in FIG. 12, when the insulating tape 4 has a dimension that protrudes so long that it is located outside the length of the range affected by the adhesive thermal pressure, the insulating tape 4
Void BD in the part not affected by the adhesive heat pressure
occurs, which poses a problem of deteriorating the reliability of the semiconductor device.

An object of the present invention is to provide a technique that can improve the reliability of a semiconductor device.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

0012

[Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions will be as follows.
It is as follows.

(1) A common inner lead is bonded to the vicinity of the center line in the X direction or Y direction of the circuit forming surface of the semiconductor chip through an insulating tape that electrically insulates the semiconductor chip, and the semiconductor chip A plurality of signal inner leads are bonded to the circuit forming surface of the semiconductor chip through an insulating tape that electrically insulates the semiconductor chip, and the inner leads and the common inner leads and the semiconductor chip are each electrically connected with bonding wires. The semiconductor device is electrically connected to the common inner lead and the plurality of signal inner leads and the insulating tape that electrically insulates the semiconductor chip is connected to the common inner lead and the plurality of signal inner leads and is sealed with a mold resin. This is a semiconductor device that has a structure that protrudes slightly from the leads.

(2) The protrusion dimension of the insulating tape is:
It is 10 μm to 200 μm.

(3) The insulating tape is a comb-shaped insulating tape, and the dimension in the comb-teeth direction is from the point protruding outside the common inner lead to the adhesive end of the signal inner lead and the semiconductor chip. This is the length to the point where it protrudes.

[0016]

[Operation] According to the above-mentioned means, the insulating tape that electrically insulates the common inner lead and the plurality of signal inner leads and the semiconductor chip is structured so that it slightly protrudes from the common inner lead and the signal inner leads. The strong adhesion between the sealing resin and the adhesive prevents the progress of peeling between the sealing resin and other members, and can avoid the occurrence of cracks during temperature cycling. Further, since it is possible to prevent voids from being generated in the narrow space between the inner lead and the semiconductor chip, the reliability of the semiconductor device can be improved.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In all the drawings for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

A resin-sealed semiconductor device for sealing a DRAM, which is an embodiment of the present invention, is shown in FIG. 1 (partial sectional perspective view) and FIG.
(Plan view) and Figure 3 (Cross-sectional view taken along line A-I in Figure 2)
Indicated by

As shown in FIGS. 1, 2 and 3, the DR
AM (semiconductor chip) 1 is SOJ (Small Ou
It is sealed with a resin-sealed package 2 of the T-line (J-bend) type. The DRAM 1 has a large capacity of 16 [Mbit] x 1 [bit], and has a size of 15.58 [mm] x 8.15 [m].
m] is constructed in a rectangular planar shape. This DRAM1
is sealed in a resin-sealed package 2 of 400 [mil].

DRAM (semiconductor chip) of the present embodiment
The element layout and bonding pads BP of No. 1 are arranged as shown in FIG. 4 (layout plan view). That is, the memory cell array MA is arranged over substantially the entire surface of the DRAM 1. DRAM1 of this embodiment
Although not limited thereto, the memory cell array is roughly divided into four memory cell arrays 11A to 11D. In FIG. 4, two memory cell arrays 11A and 11B are arranged above the DRAM 1, and two memory cell arrays 11C and 11D are arranged below. Each of these four divided memory cell arrays 11A to 11D is further subdivided into 16 memory cell arrays MA. That is, DRAM1 has 64 memory cell arrays MA arranged therein. One memory cell array MA subdivided into 64 cells has a capacity of 256 [Kbit].

A sense amplifier circuit SA is arranged between two memory cell arrays MA of the 64 subdivided memory cell arrays MA of the DRAM 1. The sense amplifier circuit SA is composed of complementary MOSFETs (CMOS). A column address decoder circuit YDEC is arranged at one lower end of each of the four divided memory cell arrays 11A and 11B of the DRAM 1. Similarly, a column address decoder circuit YDEC is arranged at one upper end of each of the memory cell arrays 11C and 11D.

A peripheral circuit 12 and external terminals (bonding pads) BP are arranged between memory cell arrays 11A and 11B and between memory cell arrays 11C and 11D of the four divided DRAM 1, respectively. Further, a peripheral circuit 13 is provided below each of the memory cell arrays 11A and 11B and above each of the memory cell arrays 11C and 11D.

The peripheral circuit 12 mainly includes a main amplifier circuit, an output buffer circuit, and a substrate potential generation circuit (VBB:
generator circuit), power supply circuit, etc.

The peripheral circuit 13 mainly includes a row address strobe (RE) circuit, a write enable (W
) system circuit, data input buffer circuit, Vcc limiter circuit, X address driver circuit (logic stage), X system redundancy circuit, X address buffer circuit, column address strobe
CE system circuit, test circuit, VDL limiter circuit, Y address driver circuit (logic stage), Y system redundant circuit,
Y address buffer circuit, Y address driver circuit (drive stage), X address driver circuit (drive stage),
There is a mat selection signal circuit (drive stage).

The resin-sealed semiconductor device 2 has an LOC structure, and the inner leads 3A extend almost to the vicinity of the center line of the main surface of the DRAM 1, so that the external terminals BP are Almost on the center line on the main surface of DRAM1,
That is, they are arranged in a line from the upper end to the lower end of the center line of the DRAM 1 within the regions defined by each of the memory cell arrays 11A, 11B, 11C, and 11D. Each external terminal BP is electrically connected to an inner lead 3A disposed on the main surface of the semiconductor chip 1 by a bonding wire 5.

The signals applied to the external terminal BP have been explained in connection with the resin-sealed semiconductor device 2 shown in FIG. 1, so their explanation will be omitted here.

Basically, the reference voltage (Vss) and power supply voltage (V
Since the inner lead 3A to which each of cc) is applied extends, the DRAM 1 has a plurality of external terminals BP for the reference voltage (Vss) and the power supply voltage (Vcc) along the extending direction. It is placed. In other words, the DRAM 1 is configured to be able to sufficiently supply the reference voltage (Vss) and power supply voltage (Vcc).

Inner leads 3A are arranged on the main surface of the DRAM 1, that is, the surface on which the memory cell array and peripheral circuits are arranged. An insulating tape 4 is interposed between the DRAM 1 and the inner lead 3A. The insulating tape 4 is made of, for example, a thermosetting polyimide resin film (details will be described later). An adhesive layer (not shown) is provided on each surface of the insulating tape 4 on the DRAM 1 side and the inner lead 3A side. As the adhesive layer, for example, polyetheramide-imide resin or epoxy resin is used.

This type of resin-sealed package 2 has DR
It uses a LOC structure in which inner lead 3A is placed on AM1. Since the resin-sealed package 2 employing the LOC structure can freely route the inner leads 3A without being restricted by the shape of the DRAM 1, it is possible to seal the DRAM 1 which is larger in size by the amount corresponding to this routing. In other words, in the resin-sealed package 2 employing the LOC structure, even if the size of the DRAM 1 increases due to increased capacity, the sealing size (package size) can be kept small, so the packaging density can be increased.

One end of the inner lead 3A is integrally formed with the outer lead 3B. The signals applied to each outer lead 3B are defined and numbered based on standards. In FIG. 1, the front end on the left is terminal No. 1, and the front end on the right is terminal No. 14. Rear right end (
The terminal number is shown in inner lead 3A) is the 15th terminal,
Although not shown, the rear left end is terminal No. 28. In other words, this resin-sealed package 2 has terminals 1 to 6 and terminals 9 to 1.
It consists of a total of 24 terminals, including terminal No. 4, terminals 15 to 20, and terminals 23 to 28.

The first terminal is a power supply voltage Vcc terminal. The power supply voltage Vcc is, for example, a circuit operating voltage of 5 [V]. The 2nd terminal is a data input signal terminal (D), the 3rd terminal is an empty terminal, and the 4th terminal is a write enable signal terminal (W).
), the 5th terminal is the row address strobe signal terminal (RE
), the No. 6 terminal is an address signal terminal (A11).

Terminal 9 is an address signal terminal (A10),
The 10th terminal is the address signal terminal (A0), the 11th terminal is the address signal terminal (A1), the 12th terminal is the address signal terminal (A2), and the 13th terminal is the address signal terminal (A2).
A3). The 14th terminal is a power supply voltage Vcc terminal.

Terminal 15 is a reference voltage Vss terminal. The reference voltage Vss is, for example, a circuit reference voltage of 0 [V]. The 16th terminal is the address signal terminal (A4), the 17th terminal is the address signal terminal (A5), the 18th terminal is the address signal terminal (A6), and the 19th terminal is the address signal terminal (A6).
A7), the 20th terminal is an address signal terminal (A8).

Although terminals 23 to 28 are not shown, terminal 23 is an address signal terminal (A9), terminal 24 is an empty terminal, terminal 25 is a column address strobe signal terminal (CE), and terminal 26 is an address signal terminal (A9). The terminals are empty terminals, the 27th terminal is a data output signal terminal, and the 28th terminal is a reference voltage Vss terminal.

The other end side of the inner lead 3A is connected to the DR
Cross each long side of the rectangular shape of AM1, and
It is stretched towards the center of 1. Inner lead 3A
The tip of the other end is connected to D with the bonding wire 5 interposed.
Bonding pads arranged in the center of RAM1 (
External terminal) Connected to BP. The bonding wire 5 is made of gold (Au). Further, as the bonding wire 5, a copper (Cu) wire, a coated wire in which the surface of a metal wire is coated with an insulating resin, or the like may be used. The bonding wire 5 is bonded by a bonding method using thermocompression bonding and ultrasonic vibration.

[0037] The first terminal of the inner lead 3A,
Each inner lead of terminal No. 14 (Vcc) 3A
is constructed in one piece, and the central part of DRAM1 is stretched parallel to its long side (this inner lead (V
cc) 3A is said to be a shared inner lead or bus bar inner lead). Similarly, the inner leads (Vss) 3A of the 15th and 28th terminals are integrally formed and extend parallel to the long sides of the central part of the DRAM1 (this inner lead (Vss)
3A is said to be a shared inner lead or bus bar inner lead). Each of the inner lead (Vcc) 3A and the inner lead (Vss) 3A extends in parallel within a region defined by the tip of the other end of the other inner lead 3A (signal inner lead 3A1). ing. The inner lead (Vcc) 3A and the inner lead (Vss) 3A are connected to the power supply voltage Vcc and the reference voltage Vss at any position on the main surface of the DRAM 1, respectively.
It is configured to be able to supply In other words, this resin-sealed semiconductor device is configured to easily absorb power supply noise, and is configured to increase the operating speed of the DRAM 1.

On the short side of the rectangular shape of the DRAM 1, leads 3A21 for supporting the resin sealing part are provided to support the resin sealing package itself so that it does not fall when the leads are cut and molded.

Further, a dummy lead 3C, which is not for extracting signals, is provided at the center of the long side of the rectangular shape of the DRAM 1.

Each of the outer lead 3B and the sealing resin support lead 3A21 is cut or molded from the lead frame. The lead frame is made of Fe, for example.
-Ni (for example, Ni content 42 or 50 [%]) alloy,
It is made of Cu or the like.

[0041] The DRAM 1, the bonding wire 5,
Inner lead 3A, sealing resin part support lead 3A21
And the dummy leads 3C are sealed with mold resin 2A. The mold resin 2A uses an epoxy resin to which a phenolic curing agent, silicone rubber, and filler are added in order to reduce stress. Silicone rubber has the effect of lowering the elastic modulus of epoxy resin. The filler is made of spherical silicon oxide particles, and similarly has the effect of lowering the coefficient of thermal expansion. Furthermore, an index ID (notch provided at the left end in FIGS. 1 and 2) is provided at a predetermined position on the package 2.

Next, details of the lead frame will be explained.

As shown in FIGS. 1 and 5 (plan views of the entire lead frame), the lead frame of this embodiment is provided with 20 signal inner leads 3A1 and two common inner leads 3A2.

[0044] The above-mentioned D of the above-mentioned common inner lead 3A2
A dummy lead 3C, which is not for signal extraction, is provided at a position corresponding to the center of the long side of the rectangular shape of the RAM 1.

Further, the signal inner lead 3A1, the common inner lead 3A2, and the dummy lead 3C are arranged at equal intervals.

By arranging the inner leads 3A at regular intervals in this manner, no particularly wide space is formed, so that voids can be prevented from forming on the adhesive surface between the main surface of the DRAM 1 and the insulating tape 4.

Furthermore, in this embodiment, as shown in FIG.
Since the comb-shaped insulating tape 4 is used, the generation of voids due to the size of the space is eliminated. Further, the main surface of the DRAM 1, the insulating tape 4, and the inner lead 3A are bonded together using an adhesive. Further, the adhesive may not be used for bonding the main surface of the semiconductor chip 1 and the insulating tape 4, but may be used only for bonding the insulating tape 4 and the inner leads 3A.

In this embodiment, as shown in FIG.
Before bonding the main surface of M1 and the insulating tape 4, the insulating tape 4 made of a comb-shaped insulating tape and the inner lead 3A are aligned in advance and bonded with adhesive. Alternatively, the rectangular insulating tape 4 and the inner lead 3A may be bonded in advance with an adhesive and then cut into comb-shaped insulating tapes 4.

Furthermore, a lead 3A2 for supporting the resin sealing part supports the resin sealing package itself so that it does not fall.
1 is provided on the lead frame 3 so as to be located on the short side of the DRAM 1. By using this, DRAM1 and inner lead 3A can be bonded together.
Positioning of the RAM 1 can be facilitated.

Next, a method of adhesively fixing the semiconductor chip 1 to the lead frame 3 with the insulating film 4 interposed therein using an adhesive will be briefly described.

First, as shown in FIG. 5, an insulating layer is placed on the position facing each of the inner lead 3A, the common inner lead 3A2, the sealing resin part support lead 3A21, and the dummy lead 3C. Adhere the tape 4 in advance, align it to a predetermined position of the protective film 20 (described in detail later) on the main surface of the DRAM 1, and attach the insulating tape 4 side of the lead frame with the adhesive. Secure with adhesive.

As shown in FIG. 6, a comb-shaped insulating tape 4 is bonded to the lead frame 3 with an adhesive. This comb-shaped insulating tape 4 is
It has a dimension that slightly protrudes from the lead 3A2 and the inner lead 3A. The protrusion dimension is, for example, 10~
It is 200 μm. A preferred size is about 100 μm. At this time, the dimension of the inner lead 3A is 400 μm.
That's about it.

The dimension of the comb-shaped insulating tape 4 in the comb tooth direction is as shown in FIG.
This is the length to a point B that slightly protrudes from the bonded end of the DRAM 1 and the DRAM1. For example, as shown in FIG. 7, the dimension (2) that does not short-circuit the bonding wire 5 even if the adhesive protrudes is 300 to 2000 μm (preferable dimension: 7
00 μm), the protruding dimension (■) of the insulating tape 4 on the side of the common inner lead 3A2 is 10 to 200 μm (preferred dimension: 100 μm), the dimension necessary for wire bonding (■)
is 200 to 600 μm (preferred size: 400 μm)
, the dimension of the leak between inner leads is 100 to 500
μm (preferred dimension: 300 μm), wire bonding area down set required dimension ■ is 200 to 1000
μm (preferred dimension: 500 μm), the protrusion dimension ■ of the insulating tape 4 on the signal inner lead 3A1 side is 10
~200 μm (preferred size: 100 μm). The dimensions of this comb-shaped insulating tape 4 in the comb tooth direction vary depending on the type of semiconductor device, but are as small (thin) as possible.
This is preferable because stress can be reduced.

In this way, by providing the insulating tape 4 so as to slightly protrude from the inner lead 3A, the adhesion between the sealing resin and the adhesive is strong, so peeling between the sealing resin and other members is prevented. Progress can be prevented. Cracking during temperature cycling can be avoided. Further, since it is possible to prevent voids from being generated in the narrow space between the inner lead 3A and the DRAM 1, the reliability of the semiconductor device can be improved.

Furthermore, as shown in FIG.
A protective film 20 made of a polyimide resin is provided on a passivation film (PSiN or the like) on the main surface of the insulating tape 4, and the insulating tape 4 is provided thereon. The thickness of this protective film 20 is about 10 μm. The thermal expansion coefficient of the silicon wafer of DRAM 1 is 3×10￣6/°C, and the thermal expansion coefficient of the polyimide resin of insulating tape 4 is 10 to 70×10
It is ￣6/℃. Since polyimide resin is used, the thermal expansion coefficient of the protective film 20 is 10 to 70×10￣6.
/℃.

Here, the protective film 20 is preferably made of a material having a thermal expansion coefficient between that of the DRAM 1 and that of the insulating tape 4. Further, the protective film preferably has a tensile strength of 120 MPa or more.

With this configuration, the following effects can be obtained.

■ Since the protective film 20 absorbs the stress caused by the difference in thermal expansion coefficient between the DRAM 1 and the insulating tape 4, the DR
Destruction of the surface of AM1 can be prevented. for example,
If this protective film 20 is not interposed, the difference in thermal stress between the DRAM 1 and the insulating tape 4 will cause tensile stress to act on the passivation film under the end of the insulating tape 4, causing cracks to occur in the integrated circuit section on the DRAM 1. When the protective film 20 is present, compressive stress is generated on the surface of the passivation film, so that cracks can be prevented from occurring on the surface of the DRAM 1.

(2) Damage to the circuit due to filler in the sealing resin can be prevented.

(2) It is possible to shield alpha rays from the outside (prevent soft errors).

As shown in FIG. 9, the insulating tape 4 has the following characteristics:
Substrate 4A made of polyimide resin with a thickness of about 50 μm
The adhesive 4B is coated on both sides with a thickness of approximately 25 μm. If the thickness of the insulating tape 4 is too thick, stress due to temperature cycles will increase, causing cracks in the sealing resin. Also, if it is thin, the capacitance will be too large. Further, the influence on the DRAM 1 becomes large, and in the worst case, cracks occur. Therefore, it is necessary that the thickness of the insulating tape 4 be appropriate.

As can be seen from the above description, according to this embodiment, the inner lead 3A consisting of the common inner lead 3A2 and the plurality of signal inner leads 3A1 and the DR
The insulating tape 4 that electrically insulates the AM1 is structured so that it slightly protrudes from the common inner lead 3A2 and the signal inner lead 3A1, so that strong adhesion between the sealing resin and the adhesive can be achieved. It is possible to prevent the progress of peeling between the sealing resin and other members, and to avoid the occurrence of cracks during temperature cycling.

Furthermore, since it is possible to prevent voids from being generated in the narrow space between the inner lead 3A and the DRAM 1, the reliability of the semiconductor device can be improved.

[0064] The present invention has been specifically explained above based on examples, but it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. .

[0065]

Effects of the Invention A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By making the insulating tape slightly protrude from the inner lead 3A, the sealing resin (resin)
The strong adhesion between the sealing resin and the adhesive prevents the progress of peeling between the sealing resin and other members, and can avoid the occurrence of cracks during temperature cycling.

In addition, it is possible to prevent voids from forming in the narrow space between the inner lead and the semiconductor chip.
The reliability of a semiconductor device can be improved.

[Brief explanation of the drawing]

FIG. 1 is a partial cross-sectional perspective view of a resin-sealed semiconductor device that seals a DRAM, which is an embodiment of the present invention;

[Figure 2]
The plan view of FIG. 1,

[Figure 3] Cross-sectional view taken along line A-I in Figure 2,

[Figure 4]
An overall plan view of the lead frame of this embodiment,

[Figure 5]
An exploded assembly diagram showing the relationship between the semiconductor chip, insulating tape, and lead frame shown in Figure 1;

[Fig. 6] A partial plan view showing the dimensional relationship between the insulating tape and the lead frame shown in Fig. 1,

[Fig. 7] A partial cross-sectional view showing the positional relationship of the bonding wire, insulating tape, and lead frame shown in Fig. 1,

[Figure 8] Partially enlarged view of Figure 2,

FIG. 9 is a diagram for explaining the protective film provided on the main surface of the semiconductor chip of this example,

[Fig. 10] Diagram for explaining the problems of the conventional technology,

[Fig. 11] Diagram for explaining the problems of the conventional technology,

[Fig. 12] Diagram for explaining the problems of the conventional technology,

[Explanation of symbols]

1...DRAM, 2...Resin-sealed package, 2A...Sealing resin, 3...Lead frame, 3A...Inner lead, 3
A1... Signal inner lead, 3A2... Common inner lead, 3A21... Sealing resin support lead, 3B... Outer lead, 3C... Dummy lead, 4... Insulating film,
5...Bonding wire, 11A, 11B, 11C, 1
1D...Memory cell array.

Claims (3)

[Claims] 1. A common inner lead is bonded to the vicinity of the center line in the X direction or Y direction of the circuit forming surface of the semiconductor chip through an insulating tape that electrically insulates the semiconductor chip, and A plurality of signal inner leads are bonded onto the circuit forming surface through an insulating tape that electrically insulates the semiconductor chip, and the inner leads and common inner leads are electrically connected to the semiconductor chip using bonding wires. The semiconductor device is connected to a semiconductor chip and sealed with a mold resin, and the insulating tape electrically insulating the common inner lead and the plurality of signal inner leads and the semiconductor chip is connected to the common inner lead and the plurality of signal inner leads, and the insulating tape electrically insulates the common inner lead and the plurality of signal inner leads. A semiconductor device characterized by having a structure that protrudes further. [Claim 2] The protrusion dimension of the insulating tape is 1
Claim 1 characterized in that the diameter is 0 μm to 200 μm.
The semiconductor device described in . 3. The insulating tape is a comb-shaped insulating tape, and the dimension in the comb-teeth direction is from the point protruding outside the common inner lead to the bonded end of the signal inner lead and the semiconductor chip. 3. The semiconductor device according to claim 1, wherein the semiconductor device has a length up to a protruding point.