JPH04318017A - Novolak type epoxy resin - Google Patents
Novolak type epoxy resinInfo
- Publication number
- JPH04318017A JPH04318017A JP3108138A JP10813891A JPH04318017A JP H04318017 A JPH04318017 A JP H04318017A JP 3108138 A JP3108138 A JP 3108138A JP 10813891 A JP10813891 A JP 10813891A JP H04318017 A JPH04318017 A JP H04318017A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- type epoxy
- compound
- epoxy resin
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 54
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 54
- 229920003986 novolac Polymers 0.000 title claims abstract description 53
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000004593 Epoxy Substances 0.000 claims abstract description 21
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 7
- 239000003054 catalyst Substances 0.000 claims abstract description 6
- 230000002378 acidificating effect Effects 0.000 claims abstract description 5
- 125000005843 halogen group Chemical group 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000047 product Substances 0.000 abstract description 7
- -1 phenol compound Chemical class 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 8
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004587 chromatography analysis Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 238000001256 steam distillation Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- UXOPBFFFAPDJRA-UHFFFAOYSA-N 4,6-bis(hydroxymethyl)-6-methylcyclohexa-1,3-dien-1-ol Chemical compound OCC1(C)CC(CO)=CC=C1O UXOPBFFFAPDJRA-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SLAFUPJSGFVWPP-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;iodide Chemical compound [I-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 SLAFUPJSGFVWPP-UHFFFAOYSA-M 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、低粘度であり、耐熱性
に優れた硬化物を与えるノボラック型エポキシ樹脂に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novolac type epoxy resin which provides a cured product with low viscosity and excellent heat resistance.
【0002】0002
【従来の技術】エポキシ樹脂は、熱硬化性樹脂として被
覆、積層、塗装、接着、封止及び成形等の種々の分野で
広く利用されている。BACKGROUND OF THE INVENTION Epoxy resins are widely used as thermosetting resins in various fields such as coating, lamination, painting, adhesion, sealing, and molding.
【0003】近年、高分子材料に対する要求が厳しくな
り、また使用条件も苛酷になるに伴ない、一般に用いら
れるビスフエノールAとエピクロルヒドリンとから製造
されたエポキシ樹脂では、耐熱性、耐湿性等の要求特性
を充分に満足できないことが多くなってきた。[0003] In recent years, as requirements for polymeric materials have become stricter and usage conditions have become more severe, epoxy resins made from commonly used bisphenol A and epichlorohydrin are required to have higher heat resistance, moisture resistance, etc. In many cases, the characteristics cannot be fully satisfied.
【0004】従来、耐熱性向上のためにフエノールノボ
ラックエポキシ樹脂などのノボラック型エポキシ樹脂が
幅広く用いられていて、特に耐湿性の面からo−クレゾ
ールノボラック型エポキシ樹脂が多用されている。しか
し、これらのノボラック型エポキシ樹脂は、単にフエノ
ール類とアルデヒドを酸性条件下で縮合させて得られる
フエノール類ノボラックをエポキシ化したものであるの
で、芳香核が10個以上の多核体から低分子量体までの
多種類のフエノール類ノボラック型エポキシ化合物を含
有していて、分子量分布が広がってしまい、溶融粘度が
高くなり、作業性や取扱い性が悪い欠点があった。Conventionally, novolac type epoxy resins such as phenol novolac epoxy resins have been widely used to improve heat resistance, and o-cresol novolac type epoxy resins have been particularly frequently used from the viewpoint of moisture resistance. However, these novolak-type epoxy resins are simply epoxidized phenolic novolaks obtained by condensing phenols and aldehydes under acidic conditions, so they can vary from polynuclear bodies with 10 or more aromatic nuclei to low molecular weight bodies. It contains many types of phenolic novolac type epoxy compounds, has a wide molecular weight distribution, high melt viscosity, and has the drawbacks of poor workability and handling.
【0005】他方、フエノール類とアルデヒドとのモル
比を変更して縮合させ、溶融粘度を下げ、取扱い性を改
良したノボラック型エポキシ樹脂もあるが、この場合に
は、二核体フエノール類ノボラック型エポキシ化合物が
多く含まれ、耐熱性が充分でない欠点があった。On the other hand, there are novolac type epoxy resins in which the molar ratio of phenols and aldehydes is changed and condensed to lower the melt viscosity and improve handling properties. It contained a large amount of epoxy compounds and had the disadvantage of insufficient heat resistance.
【0006】[0006]
【発明が解決しようとする課題】本発明は、低粘度であ
って作業性及び取扱い性に優れ、かつ耐熱性に優れた硬
化物を与えるノボラック型エポキシ樹脂を提供しようと
するものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a novolak-type epoxy resin that has a low viscosity, has excellent workability and handling properties, and provides a cured product with excellent heat resistance.
【0007】[0007]
【課題を解決するための手段】本発明のノボラック型エ
ポキシ樹脂は、下記の構造式■で表わされるo−クレゾ
ールジメチロール化合物と、下記の一般式■で表わされ
るフエノール類とを酸性触媒の存在下で反応させて得ら
れたフエノール類ノボラック化合物を含有する多価フエ
ノール系化合物に、下記の一般式■で表わされる化合物
を反応させて得られたエポキシ樹脂であって、下記の一
般式■で表わされる三核体フエノール類ノボラック型エ
ポキシ化合物を20重量%以上、及び下記の一般式■で
表わされる二核体フエノール類ノボラック型エポキシ化
合物を20重量%以下含有し、かつ1分子当りの平均グ
リシジル基数が2.1〜3.9個であるノボラック型エ
ポキシ樹脂である。[Means for Solving the Problems] The novolac type epoxy resin of the present invention is produced by combining an o-cresol dimethylol compound represented by the following structural formula (1) and a phenol represented by the following general formula (2) in the presence of an acidic catalyst. An epoxy resin obtained by reacting a polyhydric phenol compound containing a phenolic novolak compound obtained by the reaction below with a compound represented by the following general formula (■), Contains 20% by weight or more of a trinuclear phenol novolac type epoxy compound represented by the following general formula (2) and 20% by weight or less of a dinuclear phenol novolac type epoxy compound represented by the following general formula (2), and has an average glycidyl content per molecule. It is a novolac type epoxy resin having a base number of 2.1 to 3.9.
【0008】[0008]
【化6】[C6]
【0009】[0009]
【化7】
(式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。)embedded image (In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R1 and R2 may be the same or different.)
【0010】0010
【化8】
(式中、Xはハロゲン原子、Zは水素原子又はメチル基
である。)[Chemical formula 8] (In the formula, X is a halogen atom, and Z is a hydrogen atom or a methyl group.)
【0011】[0011]
【化9】
(式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。Zは水素原子又はメチ
ル基である。)[Image Omitted] (In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R1 and R2 may be the same or different. Z is a hydrogen atom or a methyl group. be.)
【0012】0012
【化10】
(式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。Zは水素原子又はメチ
ル基である。)(In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R1 and R2 may be the same or different. Z is a hydrogen atom or a methyl group. be.)
【0013】本発明のノボラック型エポキシ樹脂は、前
記の一般式■で表わされる三核体フエノール類ノボラッ
ク型エポキシ化合物の含有量が20重量%以上で、二核
体フエノール類ノボラック型エポキシ化合物の含有量が
20重量%以下のものである。これは、その三核体エポ
キシ化合物の含有量が少なすぎ、二核体エポキシ化合物
の含有量が多すぎるもの、すなわち低分子量域に分子量
分布が広がったものは、硬化物が充分な耐熱性を示さな
くなる、からである。The novolac type epoxy resin of the present invention has a content of a trinuclear phenol novolak type epoxy compound represented by the above general formula (2) of 20% by weight or more, and a content of a dinuclear phenol type novolak type epoxy compound. The amount is 20% by weight or less. This is because if the content of the trinuclear epoxy compound is too low and the content of the dinuclear epoxy compound is too high, that is, if the molecular weight distribution is widened in the low molecular weight range, the cured product will not have sufficient heat resistance. This is because it no longer shows.
【0014】また、本発明のノボラック型エポキシ樹脂
は、1分子当りの平均グリシジル基数が2.1〜3.9
個の範囲内にあるようにする。これは、その平均グリシ
ジル基数が2.1個未満になると硬化物の耐熱性が不充
分となるし、3.9個を超えると、エポキシ樹脂の分子
量分布が広くなり、溶融粘度が高くなり、樹脂の作業性
が悪くなる、からである。Further, the novolac type epoxy resin of the present invention has an average number of glycidyl groups per molecule of 2.1 to 3.9.
within the range of . This is because if the average number of glycidyl groups is less than 2.1, the heat resistance of the cured product will be insufficient, and if it exceeds 3.9, the molecular weight distribution of the epoxy resin will become wide and the melt viscosity will increase. This is because the workability of the resin deteriorates.
【0015】本発明のノボラック型エポキシ樹脂を製造
するには、まず前記の構造式■で表わされるo−クレゾ
ールジメチロール化合物と、前記の一般式■で表わされ
るフエノール類、たとえばフエノール、o−クレゾール
、m−クレゾール、p−クレゾール、p−(t−ブチル
)フエノールなどとを、酸性触媒の存在下で反応させる
。この反応によって、下記の一般式■で表わされるフエ
ノール類ノボラックを少なくとも約20重量%以上含有
し、下記の一般式■で表わされる二核体フエノール類ノ
ボラックを約20重量%以下含有し、かつ1分子当り平
均水酸基数が約2.1〜3.9個であるフエノール類ノ
ボラックが得られる。In order to produce the novolac type epoxy resin of the present invention, first, an o-cresol dimethylol compound represented by the above structural formula (1) and a phenol represented by the above general formula (2), such as phenol, o-cresol, etc. , m-cresol, p-cresol, p-(t-butyl)phenol, etc. are reacted in the presence of an acidic catalyst. By this reaction, the phenol novolak represented by the following general formula (1) is contained at least about 20% by weight or more, the dinuclear phenol novolak represented by the following general formula (1) is contained at least about 20% by weight, and 1 A phenolic novolac having an average number of hydroxyl groups per molecule of about 2.1 to 3.9 is obtained.
【0016】[0016]
【化11】
(式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。)embedded image (In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R1 and R2 may be the same or different.)
【0017】[0017]
【化12】
(式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。)embedded image (In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R1 and R2 may be the same or different.)
【0018】次いで、前記のようにして得られたフエノ
ール類ノボラック化合物に、前記の一般式■で表わされ
る化合物を付加反応及び閉環反応させると、本発明のノ
ボラック型エポキシ樹脂が得られる。この反応において
は、前記のようにして得られたフエノール類ノボラック
化合物に、比較的に少量の他の多価フエノール系化合物
を併用して反応させることもできる。その付加反応及び
閉環反応は常法にしたがって行わせることができる。以
下に、前記の一般式■で表わされる化合物としてエピク
ロルヒドリンを用いた場合の代表的な反応態様例につい
て詳述する。Next, the phenolic novolak compound obtained as described above is subjected to an addition reaction and a ring-closing reaction with a compound represented by the above general formula (2) to obtain the novolac type epoxy resin of the present invention. In this reaction, the phenolic novolac compound obtained as described above may be reacted with a relatively small amount of other polyhydric phenol compounds. The addition reaction and ring closure reaction can be carried out according to conventional methods. Below, a typical example of a reaction mode when epichlorohydrin is used as the compound represented by the above general formula (1) will be described in detail.
【0019】まず、そのフエノール類ノボラック化合物
を、そのフエノール性水酸基1モル当り2〜20モルに
相当する量のエピクロルヒドリンに溶解させて均一な溶
液とする。次いで、その溶液を攪拌しながらこれにフエ
ノール性水酸基1モル当り1〜2モル量のアルカリ金属
水酸化物を固形又は水溶液で加えて反応させる。この反
応は、常圧下又は減圧下で行なわせることができ、反応
温度は、通常、常圧下の場合には約60〜105℃であ
り、減圧下の場合には約50〜80℃である。反応は、
必要に応じて所定の温度を保持しながら反応液を共沸さ
せ、揮発する蒸気を冷却して得られた凝縮液を油/水分
離し、水分を除いた油分を反応系に戻す方法によって反
応系より脱水しながら行なわせる。アルカリ金属水酸化
物の添加は、急激な反応をおさえるために、1〜8時間
かけて少量ずつ断続的若しくは連続的に添加する。アル
カリ金属水酸化物としては、通常NaOH又はKOHが
用いられる。その全反応時間は、通常、1〜10時間程
度である。First, the phenolic novolac compound is dissolved in epichlorohydrin in an amount corresponding to 2 to 20 moles per mole of phenolic hydroxyl group to form a homogeneous solution. Next, while stirring the solution, an alkali metal hydroxide in an amount of 1 to 2 moles per mole of phenolic hydroxyl group is added in the form of a solid or aqueous solution and reacted. This reaction can be carried out under normal pressure or reduced pressure, and the reaction temperature is usually about 60 to 105°C under normal pressure, and about 50 to 80°C under reduced pressure. The reaction is
The reaction is carried out by azeotropically distilling the reaction liquid while maintaining a predetermined temperature as necessary, cooling the volatile vapor, separating the resulting condensate from oil/water, and returning the oil with water removed to the reaction system. Perform this while dehydrating the system. The alkali metal hydroxide is added intermittently or continuously in small amounts over 1 to 8 hours in order to suppress rapid reaction. NaOH or KOH is usually used as the alkali metal hydroxide. The total reaction time is usually about 1 to 10 hours.
【0020】反応終了後、不溶性の副生塩を濾別して除
くか、水洗により除去したのち、未反応のエピクロルヒ
ドリンを減圧留去して除くと、目的のノボラック型エポ
キシ樹脂が得られる。After completion of the reaction, insoluble by-product salts are removed by filtration or washing with water, and unreacted epichlorohydrin is removed by distillation under reduced pressure to obtain the desired novolac type epoxy resin.
【0021】この反応においては、テトラメチルアンモ
ニウムクロリド、テトラエチルアンモニウムブロミドな
どの第四級アンモニウム塩類;ベンジルメチルアミン、
2,4,6−(トリスジメチルアミノメチル)フエノー
ルなどの第三級アミン類;2−エチル−4−メチルイミ
ダゾール、2−フエニルイミダゾールなどのイミダゾー
ル類;エチルトリフエニルホスホニウムイオダイドなど
のホスホニウム塩類;トリフエニルホスフインなどのホ
スフイン類等の触媒を用いてもよい。In this reaction, quaternary ammonium salts such as tetramethylammonium chloride and tetraethylammonium bromide; benzylmethylamine,
Tertiary amines such as 2,4,6-(trisdimethylaminomethyl)phenol; Imidazoles such as 2-ethyl-4-methylimidazole and 2-phenylimidazole; Phosphonium salts such as ethyltriphenylphosphonium iodide ; Catalysts such as phosphines such as triphenylphosphine may be used.
【0022】さらに、この反応においては、エタノール
、イソプロパノールなどのアルコール類;アセトン、メ
チルエチルケトンなどのケトン類;ジオキサン、エチレ
ングリコールジメチルエーテルなどのエーテル類;ジメ
チルスルホキシド、ジメチルホルムアミドなどの非プロ
トン性極性溶媒などの不活性な有機溶媒を使用してもよ
い。Furthermore, in this reaction, alcohols such as ethanol and isopropanol; ketones such as acetone and methyl ethyl ketone; ethers such as dioxane and ethylene glycol dimethyl ether; aprotic polar solvents such as dimethyl sulfoxide and dimethyl formamide; Inert organic solvents may also be used.
【0023】本発明のノボラック型エポキシ樹脂を用い
て硬化性エポキシ樹脂組成物を得るには、エポキシ樹脂
としてそのノボラック型エポキシ樹脂を単独使用するの
が望ましいが、1分子中に2個以上のエポキシ基を有す
る他のエポキシ樹脂を併用することもできる。In order to obtain a curable epoxy resin composition using the novolac type epoxy resin of the present invention, it is desirable to use the novolac type epoxy resin alone as the epoxy resin, but if two or more epoxy resins are present in one molecule, Other epoxy resins having groups can also be used in combination.
【0024】その併用できるエポキシ樹脂としては、た
とえばビスフエノールA型エポキシ樹脂、フエノールノ
ボラック型エポキシ樹脂、クレゾールノボラック型エポ
キシ樹脂などのグリシジルエーテル型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、グリシジルアミン型
エポキシ樹脂、線状脂肪族エポキシ樹脂、脂環式エポキ
シ樹脂、複素環式エポキシ樹脂、ハロゲン化エポキシ樹
脂等の種々の多官能エポキシ樹脂があげられる。Examples of epoxy resins that can be used in combination include glycidyl ether type epoxy resins such as bisphenol A type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, Examples include various polyfunctional epoxy resins such as linear aliphatic epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, and halogenated epoxy resins.
【0025】また、その硬化剤としては、たとえば芳香
族ポリアミン、ジシアンジアミド、酸無水物、各種のフ
エノールノボラック樹脂等があげられる。Examples of the curing agent include aromatic polyamines, dicyandiamide, acid anhydrides, and various phenol novolac resins.
【0026】また、その硬化促進剤としては、たとえば
ベンジルジメチルアミン、各種のイミダゾール系化合物
等のアミン類、トリフエニルホスフインなどの三級ホス
フイン類等があげられる。Examples of the curing accelerator include amines such as benzyldimethylamine and various imidazole compounds, and tertiary phosphines such as triphenylphosphine.
【0027】[0027]
【実施例】以下に、実施例及び比較例をあげてさらに詳
述するが、本発明はこれらの例によって限定されるもの
ではない。また、これらの例に記載の「部」は重量部を
意味する。[Examples] The present invention will be described in more detail below with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. Moreover, "parts" described in these examples mean parts by weight.
【0028】実施例1
攪拌機を備えたガラス容器に、2,4−ビスヒドロキシ
メチル−o−クレゾール84g、及びo−クレゾール1
62g(1.5モル)を加え、さらにシユウ酸1gを加
えて、75℃で4時間反応させたのち、減圧下で脱水し
て水蒸気蒸留し、ノボラック樹脂115gを得た。Example 1 In a glass container equipped with a stirrer, 84 g of 2,4-bishydroxymethyl-o-cresol and 1 g of o-cresol were added.
After adding 62 g (1.5 mol) and further adding 1 g of oxalic acid and reacting at 75° C. for 4 hours, dehydration was performed under reduced pressure and steam distillation to obtain 115 g of novolac resin.
【0029】次いで、このノボラック樹脂115g、及
びエピクロルヒドリン595gを攪拌機を備えたガラス
容器に入れ、30℃から50℃まで1℃/3分の割合で
昇温し、その間に48.5%NaOH水溶液を1g/2
分の割合で滴下し、50℃に達してから同温度を保ちな
がら60分間反応させた。反応終了後未反応のエピクロ
ルヒドリンを減圧下で除去し、水洗してノボラック型エ
ポキシ樹脂169gを得た。Next, 115 g of this novolak resin and 595 g of epichlorohydrin were placed in a glass container equipped with a stirrer, and the temperature was raised from 30° C. to 50° C. at a rate of 1° C./3 minutes, during which time a 48.5% NaOH aqueous solution was added. 1g/2
After the temperature reached 50°C, the reaction was carried out for 60 minutes while maintaining the same temperature. After the reaction was completed, unreacted epichlorohydrin was removed under reduced pressure and washed with water to obtain 169 g of a novolac type epoxy resin.
【0030】このエポキシ樹脂は、ガス・パーミエーシ
ヨン・クロマトグラフィー(GPC)パターン図が図1
に示すとおりであり、そのエポキシ当量、150℃の溶
融粘度、GPCより求めた1分子当りの平均グリシジル
基数、一般式■で表わされる三核体フエノール類ノボラ
ック型エポキシ化合物の含有量及び一般式■で表わされ
る二核体フエノール類ノボラック型エポキシ化合物の含
有量は、表1にそれぞれ示すとおりであった。以下、こ
のエポキシ樹脂を「エポキシ樹脂A1 」という。The gas permeation chromatography (GPC) pattern of this epoxy resin is shown in FIG.
The epoxy equivalent, the melt viscosity at 150°C, the average number of glycidyl groups per molecule determined by GPC, the content of the trinuclear phenol novolac type epoxy compound represented by the general formula (■), and the general formula (■) The content of the dinuclear phenol novolak type epoxy compound represented by is as shown in Table 1. Hereinafter, this epoxy resin will be referred to as "epoxy resin A1."
【0031】比較例1
攪拌機を備えたガラス容器にo−クレゾール126g(
1モル)、37%ホルマリン61g(0.75モル)、
及びシユウ酸1.3gを入れ、還流温度で3時間反応を
行なわせ、その後減圧下で脱水し、さらに水蒸気蒸留に
よりo−クレゾールを除去し、未反応o−クレゾール含
有量が0.5重量%以下のノボラック樹脂121gを得
た。Comparative Example 1 126 g of o-cresol (
1 mol), 37% formalin 61g (0.75 mol),
and 1.3 g of oxalic acid, reacted at reflux temperature for 3 hours, then dehydrated under reduced pressure, and further removed o-cresol by steam distillation, resulting in an unreacted o-cresol content of 0.5% by weight. 121 g of the following novolac resin was obtained.
【0032】次いで、このノボラック樹脂121gとエ
ピクロルヒドリン643gを攪拌機を備えたガラス容器
に入れ、実施例1と同様にして反応させ、同様の処理を
してノボラック型エポキシ樹脂176gを得た。Next, 121 g of this novolac resin and 643 g of epichlorohydrin were placed in a glass container equipped with a stirrer, and reacted in the same manner as in Example 1. The same treatment was carried out to obtain 176 g of a novolac type epoxy resin.
【0033】このノボラック型エポキシ樹脂は、GPC
パターン図が図2に示すとおりであり、そのエポキシ当
量、150℃の溶融粘度、GPCより求めた1分子当り
の平均グリシジル基数、一般式■で表わされる三核体フ
エノール類ノボラック型エポキシ化合物の含有量、及び
一般式■で表わされる二核体フエノール類ノボラック型
エポキシ化合物の含有量は、表1にそれぞれ示すとおり
であった。以下、このエポキシ樹脂を「エポキシ樹脂B
1 」という。[0033] This novolak type epoxy resin is
The pattern diagram is as shown in Figure 2, and its epoxy equivalent, melt viscosity at 150°C, average number of glycidyl groups per molecule determined by GPC, and content of trinuclear phenol novolac type epoxy compound represented by the general formula (■) The amount and the content of the dinuclear phenol novolac type epoxy compound represented by the general formula (2) were as shown in Table 1. Hereinafter, this epoxy resin will be referred to as "epoxy resin B".
1”.
【0034】比較例2
37%ホルマリンの使用量を75g(0.93モル)に
変更し、その他は比較例1と同様にしてノボラック樹脂
130gを得た。次いでこのノボラック樹脂130gと
エピクロルヒドリン726gを攪拌機を備えたガラス容
器に入れ、実施例1と同様にして反応を行なわせ、ノボ
ラック型エポキシ樹脂185gを得た。Comparative Example 2 130 g of novolak resin was obtained in the same manner as in Comparative Example 1 except that the amount of 37% formalin used was changed to 75 g (0.93 mol). Next, 130 g of this novolac resin and 726 g of epichlorohydrin were placed in a glass container equipped with a stirrer, and a reaction was carried out in the same manner as in Example 1 to obtain 185 g of a novolac type epoxy resin.
【0035】このノボラック型エポキシ樹脂は、GPC
パターン図が図3に示すとおりであり、そのエポキシ当
量、150℃の溶融粘度、GPCより求めた1分子当り
の平均グリシジル基数、一般式■で表わされる三核体フ
エノール類ノボラック型エポキシ化合物の含有量、及び
一般式■で表わされる二核体フエノール類ノボラック型
エポキシ化合物の含有量は、表1にそれぞれ示すとおり
であった。以下、このエポキシ樹脂を「エポキシ樹脂B
2 」という。[0035] This novolak type epoxy resin is
The pattern diagram is as shown in Figure 3, and its epoxy equivalent, melt viscosity at 150°C, average number of glycidyl groups per molecule determined by GPC, and content of trinuclear phenol novolac type epoxy compound represented by general formula (■) The amount and the content of the dinuclear phenol novolac type epoxy compound represented by the general formula (2) were as shown in Table 1. Hereinafter, this epoxy resin will be referred to as "epoxy resin B".
2”.
【0036】[0036]
【表1】[Table 1]
【0037】実験例
上記の実施例1、比較例1、及び比較例2で得られた各
エポキシ樹脂A1、B1 及びB2 をそれぞれ使用し
、表2に示すように硬化剤としてメチルテトラヒドロフ
タル酸無水物、硬化促進剤として2−メチル−4−エチ
ルイミダゾールを配合し、得られた硬化性樹脂組成物を
180℃で6時間加熱して硬化させた。得られた硬化物
のガラス転移温度、曲げ強度及び曲げ弾性率を測定した
結果は表2に示すとおりであった。Experimental Example Each of the epoxy resins A1, B1 and B2 obtained in Example 1, Comparative Example 1 and Comparative Example 2 above was used, and methyltetrahydrophthalic anhydride was used as a curing agent as shown in Table 2. 2-methyl-4-ethylimidazole was added as a curing accelerator, and the resulting curable resin composition was cured by heating at 180° C. for 6 hours. The results of measuring the glass transition temperature, bending strength and bending modulus of the obtained cured product are as shown in Table 2.
【0038】[0038]
【表2】[Table 2]
【0039】[0039]
【発明の効果】本発明のエポキシ樹脂は、溶融粘度が低
く、作業性に優れており、かつ耐熱性に優れた硬化物を
与えることができる。[Effects of the Invention] The epoxy resin of the present invention has a low melt viscosity, is excellent in workability, and can provide a cured product with excellent heat resistance.
【図1】実施例1で製造したエポキシ樹脂A1 のガス
・パーミエーシヨン・クロマトグラフィー(GPC)パ
ターン図である。測定に用いたカラムは、東洋曹達株式
会社製のTSKゲルG4000HXLを1本、同G30
00HXLを2本及び同G2000HXLを1本の計4
本を直列に構成して用いた。FIG. 1 is a gas permeation chromatography (GPC) pattern diagram of epoxy resin A1 produced in Example 1. The columns used for the measurement were one TSK gel G4000HXL manufactured by Toyo Soda Co., Ltd. and one TSK gel G30 column manufactured by Toyo Soda Co., Ltd.
Two 00HXL and one G2000HXL, total 4
The books were arranged in series and used.
【図2】比較例1で製造したエポキシ樹脂B1 の同様
のGPCパターン図である。FIG. 2 is a similar GPC pattern diagram of epoxy resin B1 produced in Comparative Example 1.
【図3】比較例2で製造したエポキシ樹脂B2 の同様
のGPCパターン図である。FIG. 3 is a similar GPC pattern diagram of epoxy resin B2 produced in Comparative Example 2.
Claims (1)
ゾールジメチロール化合物と、下記の一般式■で表わさ
れるフエノール類とを酸性触媒の存在下で反応させて得
られたフエノール類ノボラック化合物を含有する多価フ
エノール系化合物に、下記の一般式■で表わされる化合
物を反応させて得られたエポキシ樹脂であって、下記の
一般式■で表わされる三核体フエノール類ノボラック型
エポキシ化合物を20重量%以上、及び下記の一般式■
で表わされる二核体フエノール類ノボラック型エポキシ
化合物を20重量%以下含有し、かつ1分子当りの平均
グリシジル基数が2.1〜3.9個であるノボラック型
エポキシ樹脂。 【化1】 【化2】 (式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。) 【化3】 (式中、Xはハロゲン原子、Zは水素原子又はメチル基
である。) 【化4】 (式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。Zは水素原子又はメチ
ル基である。) 【化5】 (式中、R1 及びR2 はそれぞれ水素原子又は炭素
数4以下のアルキル基であり、R1 とR2 とは同一
であっても異なっていてもよい。Zは水素原子又はメチ
ル基である。)Claim 1: A phenolic novolak compound obtained by reacting an o-cresol dimethylol compound represented by the following structural formula (1) with a phenol represented by the following general formula (2) in the presence of an acidic catalyst. An epoxy resin obtained by reacting a compound represented by the following general formula (1) with a polyhydric phenol-based compound contained therein, the trinuclear phenol novolac type epoxy compound represented by the following general formula (2) is Weight% or more, and the following general formula ■
A novolak-type epoxy resin containing 20% by weight or less of a dinuclear phenol novolak-type epoxy compound represented by the following, and having an average number of glycidyl groups per molecule of 2.1 to 3.9. [Formula 1] [Formula 2] (In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, and R1 and R2 may be the same or different.) [Formula 3 ] (In the formula, X is a halogen atom, Z is a hydrogen atom or a methyl group.) [In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, (Z may be the same as or different from .Z is a hydrogen atom or a methyl group.) [Formula 5] (In the formula, R1 and R2 are each a hydrogen atom or an alkyl group having 4 or less carbon atoms, R1 and R2 may be the same or different. Z is a hydrogen atom or a methyl group.)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3108138A JPH04318017A (en) | 1991-04-15 | 1991-04-15 | Novolak type epoxy resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3108138A JPH04318017A (en) | 1991-04-15 | 1991-04-15 | Novolak type epoxy resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04318017A true JPH04318017A (en) | 1992-11-09 |
Family
ID=14476902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3108138A Pending JPH04318017A (en) | 1991-04-15 | 1991-04-15 | Novolak type epoxy resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04318017A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997029144A1 (en) * | 1996-02-09 | 1997-08-14 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin, epoxy resin composition and products of curing thereof |
JP2000239349A (en) * | 1998-12-24 | 2000-09-05 | Sumitomo Chem Co Ltd | Epoxy resin, composition and resin-sealed type semiconductor device |
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JPS6383035A (en) * | 1986-09-29 | 1988-04-13 | Mitsui Petrochem Ind Ltd | Production of trinuclear substituted phenol and composition containing glycidyl ether derivative of trinuclear substituted phenol |
JPS63225621A (en) * | 1987-03-16 | 1988-09-20 | Dainippon Ink & Chem Inc | Curable epoxy resin composition |
JPS63275620A (en) * | 1987-05-07 | 1988-11-14 | Arakawa Chem Ind Co Ltd | Production of polyhydroxy compound |
JPH04181790A (en) * | 1990-11-16 | 1992-06-29 | Toshiba Chem Corp | Prepreg for printed circuit board |
JPH04220422A (en) * | 1990-12-20 | 1992-08-11 | Nippon Kayaku Co Ltd | Epoxy resin, resin composition containing same, and cured article prepared from the composition |
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1991
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JPS6383035A (en) * | 1986-09-29 | 1988-04-13 | Mitsui Petrochem Ind Ltd | Production of trinuclear substituted phenol and composition containing glycidyl ether derivative of trinuclear substituted phenol |
JPS63225621A (en) * | 1987-03-16 | 1988-09-20 | Dainippon Ink & Chem Inc | Curable epoxy resin composition |
JPS63275620A (en) * | 1987-05-07 | 1988-11-14 | Arakawa Chem Ind Co Ltd | Production of polyhydroxy compound |
JPH04181790A (en) * | 1990-11-16 | 1992-06-29 | Toshiba Chem Corp | Prepreg for printed circuit board |
JPH04220422A (en) * | 1990-12-20 | 1992-08-11 | Nippon Kayaku Co Ltd | Epoxy resin, resin composition containing same, and cured article prepared from the composition |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO1997029144A1 (en) * | 1996-02-09 | 1997-08-14 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin, epoxy resin composition and products of curing thereof |
US6124420A (en) * | 1996-02-09 | 2000-09-26 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin, epoxy resin composition and hardened product thereof |
CN1099434C (en) * | 1996-02-09 | 2003-01-22 | 日本化药株式会社 | Epoxy resin, epoxy resin composition and products of curing thereof |
JP2000239349A (en) * | 1998-12-24 | 2000-09-05 | Sumitomo Chem Co Ltd | Epoxy resin, composition and resin-sealed type semiconductor device |
US6312829B1 (en) | 1998-12-24 | 2001-11-06 | Sumitomo Chemical Company, Limited | Epoxy resin and resin-sealed type semiconductor apparatus |
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