JPH0431040B2 - - Google Patents
Info
- Publication number
- JPH0431040B2 JPH0431040B2 JP33043287A JP33043287A JPH0431040B2 JP H0431040 B2 JPH0431040 B2 JP H0431040B2 JP 33043287 A JP33043287 A JP 33043287A JP 33043287 A JP33043287 A JP 33043287A JP H0431040 B2 JPH0431040 B2 JP H0431040B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- plating tank
- plated
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 74
- 239000007788 liquid Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62330432A JPH01172598A (ja) | 1987-12-25 | 1987-12-25 | 全面メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62330432A JPH01172598A (ja) | 1987-12-25 | 1987-12-25 | 全面メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01172598A JPH01172598A (ja) | 1989-07-07 |
| JPH0431040B2 true JPH0431040B2 (US07714131-20100511-C00024.png) | 1992-05-25 |
Family
ID=18232550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62330432A Granted JPH01172598A (ja) | 1987-12-25 | 1987-12-25 | 全面メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01172598A (US07714131-20100511-C00024.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4684841B2 (ja) * | 2005-10-14 | 2011-05-18 | 株式会社太洋工作所 | 表面処理装置及び表面処理方法 |
-
1987
- 1987-12-25 JP JP62330432A patent/JPH01172598A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01172598A (ja) | 1989-07-07 |
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