JPH04307297A - Ic card - Google Patents

Abstract

PURPOSE:To provide an IC card which is protected against an external force as an IC card used for collation and data recording. CONSTITUTION:Projecting parts 18 for positioning an IC module 13 are provided on the side surface of a recessed part 12 formed on a card base 11. In addition, the projecting part 18 consists of a tapered part 17 which spreads open from the bottom of the recessed part 12 to the top surface 16b of the card base 11. Subsequently, the IC module 13 is fixed at a specified position by the projecting part 18 for positioning, and at the time, if a force is applied to bend the card base 11, it is absorbed by the tapered part 17 provided at the projecting part 18. The IC module 13 is protected against breakage and no stress is applied to the corner 16a of the bottom surface of the recessed part 12.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card used for verification, data recording, etc.

0002

2. Description of the Related Art Conventional IC cards will be explained below. As shown in FIGS. 6 and 7, a recess 2 is provided in the card base material 1, and an IC module 3 is embedded in this recess 2. This IC module 3 was adhered and fixed to the bottom surface of the recess 2 with an adhesive 4. As a similar technology, for example, Japanese Patent Application Laid-Open No. 63-188964
There is a publication.

0003

[Problems to be Solved by the Invention] However, in such a conventional configuration, when bending stress is applied to the card base material 1, stress is applied to the card base material 1 or the IC module 3, and the IC card may be destroyed. there were. That is,
As shown in FIGS. 8 and 9, the card base material 1 is
When the card base material 11 is repeatedly bent in the direction shown in FIG.

Furthermore, as shown in FIG. 9, when bending stress is applied in the B direction, the top surface 6b side of the recess 2 is bent toward the IC module 3.
It will come into pressure contact with the At this time, excessive stress is applied and the IC module 3 may be destroyed.

The present invention solves these problems and provides a highly reliable IC card that is protected against external forces even if the IC card is bent due to excessive force. The purpose is to provide the following.

[0006]

[Means for Solving the Problems] In order to achieve this object, the IC card of the present invention has a plurality of protrusions for positioning the IC module on the side surface of the recess provided in the card base material, and the protrusions A tapered portion is provided that widens from the bottom surface of the recess toward the top surface of the card base material.

[0007]

[Function] With this configuration, the IC module is fixed in a predetermined position by the positioning protrusion, and since the protrusion has a tapered portion toward the top surface of the card base,
Even if a force is applied to bend the card base material, that force will be absorbed by the tapered portion provided on the convex portion. In other words, the IC module is not subjected to any pressing force from the top surface of the card base material, and is protected from destruction. At this time, no stress is applied to the bottom corner of the recess, so the card base material is prevented from cracking. do not have.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is a plan view of an IC card according to the present invention. Moreover, FIG. 1 is a sectional view of a main part taken along the line BB in FIG.

In FIGS. 1 and 3, 11 is a card base material, and this card base material 11 is provided with a recess 12. As shown in FIG. In this recess 12, an IC module 13 is placed.
is buried. Moreover, this IC module 13 is adhered and fixed to the bottom surface of the recess 12 with an adhesive 14.

FIG. 2 shows the recess 1 provided in the card base material 11.
FIG. 2 is an enlarged plan view of FIG. 1 and 2, a tapered portion 17 is formed on the side surface of the recessed portion 12 and widens toward the top surface 16b of the card base material 11. As shown in FIG. And 1
8 and 19 are from the corner 16a of the tapered portion 17 to the top surface 16b.
It is a convex portion provided toward the IC module 13.
Used for positioning.

Note that the tapered portion 17 has convex portions 18 and 19.
It is only necessary to provide it on the entire side surface of the recessed portion 12.

[0012] Here, the bottom surface of the concave portion 12 increases by at least the heights 18a, 19a (not shown) of the convex portions. That is, the end face and corner 1 of the IC module 13
6a becomes larger. Therefore, for example, as shown in FIG. 4, even if a force in the direction A is applied to the card base material 11, the force will be dispersed over this expanded area S. This means that excessive force will not be concentrated only on the corner 16a. Therefore, the card base material 11 will not be broken at the corner 16a.

Furthermore, even if force B is applied in the opposite direction as shown in FIG. 5, it will be absorbed by the tapered portions 17 provided on the convex portions 18 and 19. Therefore, since the IC module 13 is not subjected to the pressing force by the top surface 16b of the card base material 11, the IC module 13 will not be destroyed. Further, at this time, no stress is applied to the bottom corner 16a of the recess 12.

Furthermore, in FIG. 2, the convex portion 18 is connected to the concave portion 12.
One piece is provided on each of the short sides of the sides. Also,
Two protrusions 19 are provided on each long side. The number of protrusions 19 disposed on the long side is preferably two or more. The reason for this is that the IC module 13 does not move loosely within the recess 12 when the IC module 13 is bonded, and is thereby securely positioned. However, if this number is too large, I
The sum of the contact parts c between the C module 13 and the convex parts 18 and 19 increases, and the bending stress of the card base material 11 causes the corners 16
The stress applied to a and the effect of protecting the IC module 13 are reduced. Furthermore, the volume for storing the adhesive 14 decreases, and there is a risk that the adhesive 14 may flow out to the top surface 16b of the card base material 11, resulting in poor contact of the terminals 15 (FIG. 3). Therefore, in this embodiment, the number shown above is set in consideration of such a situation.

[0015] Here, the taper angle of the tapered portion 17 is preferably in the range of 5 degrees to 20 degrees with respect to the perpendicular line. That is, if this taper angle is 5 degrees or less, the effect of the taper portions 17 provided on the convex portions 18 and 19 will be reduced when a force in the B direction is applied, as explained with reference to FIG. Therefore, I
There is a possibility that the C module 13 will be destroyed by the pressing force exerted by the top surface 16b of the card base material 11. Also, at this time, stress is applied to the bottom corner 16a.

On the other hand, if the taper angle is 20 degrees or more, the gap between the IC module 13 and the top surface 16b becomes large, and the commercial value decreases in terms of appearance. In this example, good results were obtained by setting the taper angle to 10 degrees.

Note that the smaller the contact portion c of the convex portions 18 and 19 with the IC module 13, the better. If this dimension is increased, the effect of protecting the IC module 13 from the bending stress of the card base material 11 will be reduced, and the adhesive 1
4, the adhesive 14 flows out to the top surface 16b of the card base material 11 and adheres to the connection terminal 15 (FIG. 3) of the IC module 13, reducing the reliability of contact with external devices. It may cause deterioration. In this embodiment, this dimension c is set to 1 mm or less.

[0018]

As described above, the IC card of the present invention is provided with a plurality of protrusions for positioning the IC module on the side surface of the recess provided in the card base material, and the protrusions are provided with Since the card base material has a configuration in which a tapered portion is provided that widens toward the top surface, the following effects are achieved.

That is, the IC module is fixed in a predetermined position by the positioning protrusion, and since the protrusion has a tapered portion toward the top surface of the card base material, even if a force that bends the card base material Even if this force is applied, the force will be absorbed by the tapered portion provided on this convex portion. In other words, the IC module is not subjected to any pressing force from the top surface of the card base material, and is protected from destruction. At this time, no stress is applied to the bottom corner of the recess, so the card base material is prevented from cracking. do not have.

[0020] Furthermore, when the IC module is bonded to the recess with adhesive, excess adhesive accumulates on the side surfaces of the recess. Therefore, the excess adhesive will not flow out from the side surfaces of the recess and adhere to the contact terminals, thereby causing poor contact with external equipment.

[Brief explanation of the drawing]

[Figure 1] Enlarged cross-sectional view of main parts taken along BB section in Figure 3

[Fig. 2] An enlarged plan view of essential parts of an IC card according to an embodiment of the present invention.

FIG. 3 is a plan view of an IC card according to an embodiment of the present invention.

[
FIG. 4: An enlarged sectional view of essential parts when bending stress in direction A is applied to an IC card according to an embodiment of the present invention

FIG. 5 is an enlarged sectional view of the main parts when bending stress in direction B is applied to the IC card according to an embodiment of the present invention.

[Figure 6] Plan view of conventional IC card

[Figure 7] Enlarged sectional view of main parts of a conventional IC card

[Figure 8] Enlarged sectional view of main parts when bending stress in direction A is applied to a conventional IC card

[Figure 9] Enlarged sectional view of main parts when bending stress in direction B is applied to a conventional IC card

[Explanation of symbols]

11 Card base material 12 Recess 13 IC module 14 Adhesive 16a Corner 16b Top surface 17 Taper part 18, 19 Convex part

Claims (3)

[Claims] 1. A recess provided in a card base material, and an IC module fixed to the recess with an adhesive. A plurality of protrusions for positioning the IC module are provided on a side surface of the recess. an IC in which a tapered portion is provided in the portion thereof, the tapered portion expanding from the bottom surface of the recessed portion toward the top surface of the card base material;
card. [Claim 2] At least a pair of opposing sides of the recesses include:
I according to claim 1, wherein two or more positioning protrusions are provided.
C card. [Claim 3] The taper angle of the positioning convex portion is approximately 10
2. The IC card according to claim 1, wherein the IC card is