JPH04304697A - Manufacture of ceramic multilayer wiring board - Google Patents

Abstract

PURPOSE:To provide a method which manufactures a ceramic multilayer wiring board having an excellent surface evenness. CONSTITUTION:An insulation layer 5 or a conductor pattern 4 is installed on a heat resistant board. A conductor paste is printed and dried in pattern-shaped on the base film 3 and forms the conductor pattern 4. After the formation of the pattern 4, an insulation paste is printed and coated in such a fashion that it may cover the pattern 4 and dried, thereby forming a transfer sheet 9. The transfer sheet 9 to which a through hole 6a which penetrates the insulation layer is for at its specified position is laid out on the aforesaid heat resistant board and it is heated and contact-bonded and filled with a via conductor 6 from the rear side of the base film 3. And then, base film is peelded off. A ceramic multilayer wiring board is manufactured by repeating this process serveral times.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a ceramic multilayer wiring board.

0002

2. Description of the Related Art A ceramic multilayer wiring board has a three-dimensional array of interconnected wiring pattern layers inside.
It is manufactured by the method described below.

The first method is the so-called green sheet multilayer method, in which a conductor pattern is formed on a ceramic green sheet, and a through hole is appropriately drilled, and the hole is filled with a conductor. This is a manufacturing method that follows the process of aligning and stacking several layers to form via holes, applying pressure to integrate them, and then applying heat treatment such as removing the binder and firing to make them denser.
(See Japanese Patent Publication No. 8458, Japanese Patent Publication No. 55-7720, Japanese Patent Publication No. 55-8837, and Japanese Patent Publication No. 61-45876). In this method, three-dimensional shrinkage of the compact occurs during sintering of the material.

The second method is generally called the thick film printing method, and is a method that repeats the process of printing, drying, and baking conductor paste or insulator paste on a sintered substrate to create a multilayer structure. (Refer to Japanese Patent Publication No. 57-19599). Via holes are formed by pattern printing of insulating paste, photo process, laser irradiation, etc.
9-29160). In addition to these, many other manufacturing methods have been proposed, including a combination of the above two methods.

[0005]

[Problems to be Solved by the Invention] As mentioned above, in the green sheet multilayer method, shrinkage occurs during firing;
In order to manufacture green sheets without disrupting the intended pattern arrangement, the composition of the slurry used to create the green sheets, the dispersion state of the powder, the thickness of the sheets, the pressure conditions, etc. must be controlled extremely precisely. If this is not achieved, warpage or waviness will occur in the fired body, and an even bigger problem will be poor conduction in via holes due to misalignment between layers. Further, when a finer circuit pattern is required to improve packaging density, such shrinkage due to firing becomes a fatal problem in terms of production yield.

On the other hand, the thick film printing method can solve the problems of the green sheet multilayer method. This is because, according to this construction method, there is no dimensional change in the molded body in the two-dimensional direction during firing, and the pattern arrangement and the position of the via hole do not shift. However, in this method, a reverse pattern of the conductive pattern is formed using an insulating paste (Japanese Patent Publication No. 57-54956, Japanese Patent Publication No. 58-26680).
Furthermore, unless an insulating layer is printed multiple times on the conductor pattern, a reliable multilayer board with a flat surface cannot be obtained. Furthermore, repeating firing for the required number of layers means that
This results in the inconvenience that the conductor and insulator must be repeatedly subjected to thermal history under conditions similar to those used for firing them. That is, there are problems such as deterioration of insulation resistance due to diffusion of the conductive material into the insulating layer and deterioration due to heat, which are extremely undesirable from the viewpoint of reliability.

[0007] In addition, as a method to improve the disadvantages of the thick film printing method while taking advantage of the advantage of not causing pattern displacement, an insulator green sheet is applied after forming a conductor pattern on a sintered substrate. Overlap and crimp,
JP-A-1-100997 discloses a process in which a conductive pattern is further printed, the insulating green sheets are stacked and pressure bonded, and a laminate is formed by repeating the process, followed by heat treatment. . However, this method cannot eliminate the level difference on the insulator layer caused by the conductor pattern layer, which not only hinders the printing of the conductor pattern when the number of laminated layers increases, but also causes problems such as However, there is a problem in that it is not possible to manufacture ceramic multilayer substrates that require a smooth surface.

The present invention solves the above-mentioned conventional problems and provides a ceramic multilayer substrate with excellent surface flatness with high productivity, and a ceramic multilayer wiring that can be produced at low cost with a high yield using an extremely sophisticated method for forming via holes. The purpose of the present invention is to provide a method for manufacturing a substrate.

[0009]

[Means for Solving the Problems] In order to achieve the above object, the present invention prints a conductor paste in a pattern on a base film, dries it to form a conductor pattern, and then pastes an insulator to cover it. A transfer sheet is formed by printing or coating and drying to form an insulating layer, and after the transfer sheet is placed on a heat-resistant substrate and heat-pressed to transfer the conductor pattern and the insulating layer, the base film is transferred. The present invention provides a method for manufacturing a ceramic multilayer wiring board, in which a plurality of the conductor patterns and insulating layers are laminated by repeating the peeling process.

[0010] Furthermore, in the above method, the present invention includes forming a through hole at a predetermined position of the transfer sheet, and filling the through hole with conductive paste or conductive powder from the back side of the base film of the pressed transfer sheet. Then, the via hole is formed by peeling off the base film.

[0011]

[Operation] In the present invention, when manufacturing a transfer sheet, an insulating layer is formed to cover a conductive pattern, so the unevenness of the conductive pattern is smoothed by the flow of the insulating paste, and this is further thermally transferred. Since the surface from which the base film is peeled constitutes the surface of the laminate, the surface flatness of the resulting ceramic multilayer wiring board is greatly improved. Also,
Since the process of filling the via hole is configured as part of the thermal transfer process, the process can be shortened.

0012

[Embodiment] A ceramic multilayer wiring board according to an embodiment of the present invention will be described below.

(Embodiment 1) A first embodiment of manufacturing a ceramic multilayer wiring board according to the present invention will be described with reference to FIGS. 1(a) to (e) and FIGS. 2(a) to (c). Figures 1(a)-(
e) is a cross-sectional view of the ceramic multilayer wiring board in each step, and FIGS. 2(a) to (c) are cross-sectional views showing the manufacturing process of the transfer sheet.

First, regarding the manufacturing process of the transfer sheet 9,
This will be explained with reference to FIGS. 2(a) to 2(c). Silver paste was screen printed in a pattern on the base film 3 and dried to form a conductor pattern 4 with a film thickness of 15 to 20 μm (see FIG. 2(a)). In this example, an inexpensive PET film (manufactured by Toray Industries, Ltd., thickness 75 μm) with good dimensional accuracy was used as the base film. In addition, in this example, a commercially available silver paste (manufactured by Shoei Chemical Co., Ltd., H-456) was used as a conductor.
6) As an insulating paste, a glass-ceramic powder containing alumina as a main component was used, which was dispersed in a vehicle in which butyral resin, dioctyl phthalate, and butyl carbitol were made compatible. The above-mentioned insulating paste was screen printed to cover the conductor pattern 4 in a size of 98 x 98 mm, and dried to form an insulating layer 5. The thickness of the insulating layer 5 and the level difference between the part with the conductive pattern 4 and the part without it depend on the viscosity of the insulating paste and the printing conditions, but in this example, the screen printing plate,
By adjusting the squeegee shape, hardness, squeegee speed, etc., each print can print approximately 55μm and 5μm, respectively.
m. Printing and drying were performed twice to avoid deterioration of the insulation due to pinholes. In this way, a transfer sheet 9 was obtained in which the thickness of the insulating layer 5 was about 100 μm and the above-mentioned level difference was about 3 μm (FIG. 2(b)).
reference). A through hole 6a is made in the land portion of the conductor pattern 4 of this transfer sheet 9 using a carbon dioxide laser.
A transfer sheet 9 shown in FIG. 2(c) was obtained. In this embodiment, the diameter of the through hole 6a was set to approximately 0.2 mm by appropriately adjusting the laser power and irradiation conditions, but according to experiments conducted by the present inventors, a hole diameter of approximately 0.05 mm was obtained. It was also possible. Needless to say, various other drilling methods such as punching, drilling, etc. may be used to form the through hole 6a.

Next, explanation will be given using FIGS. 1(a) to 1(e). First, on a 96% alumina substrate 1 of 100 x 100 mm and 0.6 mm thick, a transfer sheet 9 consisting of the above-mentioned base film 3, conductor pattern 4, and insulator layer 5 with through holes 6a formed therein is placed. Placed, 40kg/cm2, 1
Thermocompression bonding is performed at 00°C for 10 seconds. The size of the insulator layer 5 was 98×98 mm (see FIG. 1(b)). Next, the through holes 6a of the transfer sheet 9 are filled with the same silver paste as described above using a squeegee in the same manner as screen printing to form via conductors 6. That is, at this time, the base film 3 functions as a substitute for a mask. At this time, it is sufficient to perform the squeezing operation in only one direction, but if the squeezing operation is repeated in two opposite directions, preferably in four directions, more complete filling can be achieved. After filling the via conductors 6 in this manner, the base film 3 is peeled off, as shown in FIG. 2(c). When using a commercially available thick-film conductor paste as described above, it is better to peel off the base film 3 before the paste dries after filling the via conductors 6. This does not apply when filling.

Further, the arrangement of the transfer sheet 9, thermocompression bonding, filling of the via conductor 6, and peeling of the base film 3 were repeated four times in the same manner as described above, to obtain the laminate shown in FIG. 1(e). The flatness of the laminate surface in this state is ±
It was 5 μm. After removing the binder in the atmosphere, the temperature was raised from room temperature to 100°C for about 15 minutes, then raised to 520°C at a rate of 30°C/h, held at that temperature for 3 hours, and then left to cool. , heat treatment was performed in the air in a belt furnace at a peak temperature of 890° C. and a holding time of 10 minutes. The surface flatness of the ceramic multilayer wiring board obtained by these heat treatments was ±3 μm, and no cracks in the insulating layer 5, disconnections in the conductive patterns 4, or poor continuity between the conductive patterns 4 were observed.

As described above, according to this embodiment, a ceramic multilayer wiring board having four inner conductor layers and one surface conductor layer with excellent surface smoothness can be formed on one side of the 96% alumina substrate 1. . Needless to say, this ceramic multilayer wiring board has the same characteristics as the conventional ceramic multilayer wiring board produced by the thick film multilayer method, such as high strength and high heat dissipation. In addition, as can be easily inferred, increasing the number of conductor layers due to the requirement for higher density packaging depends on the properties of the inorganic powder, the organic binder and plasticizer in the insulator paste and conductor paste, and the properties of the organic binder and plasticizer. This can be done by considering the blending ratio of. The conductor pattern 4 created in this example has a minimum line width of 100 μm,
Since the line spacing was 125 μm, screen printing was applied as described above, but if a more precise pattern is required, offset printing or photolithography techniques can be applied.

(Embodiment 2) A second embodiment of the present invention is shown in FIG.
This will be explained with reference to (a) to (e). Figure 3(a)~
1(e) shows a cross-sectional view of the ceramic multilayer wiring board at each step, similar to FIGS. 1(a) to 1(e).

First, the production of the transfer sheet 9 used in this embodiment will be described. The conductor in this example is a copper oxide paste, which has a resistance similar to that of the silver used in Example 1 (2
~3 mΩ/□), the dry film thickness had to be increased to 40 μm, so the following method was used to make the transfer sheet 9. That is, in the transfer sheet 9 of this example, a conductive pattern 4 having a thickness of 40 μm is formed using a conductive paste in which copper oxide powder (reagent, manufactured by Hanui Chemical Co., Ltd.) is dispersed in the same vehicle as described above. After that, an insulating paste was printed using a screen printing plate with a reverse pattern to this pattern, and then the insulating paste was printed in the same manner as in Example 1, so that the thickness of the insulating layer 5 was about 130 μm.
, the difference in level between the part with the conductor pattern and the part without it is about 3μ.
A transfer sheet 9 having a size of m was obtained. Next, this transfer sheet 9
A through hole 6a was made in the land portion of the conductor pattern 4 in the same manner as in Example 1 to obtain a transfer sheet 9.

[0020] First, 100×100mm, thickness 0.8mm
An insulating paste with a size of 98 x 98 mm is placed on a 99% alumina substrate 1 of This was then screen printed and dried to form an insulator layer 2 with a thickness of 30 μm (FIG. 3(a)). The transfer sheet 9 having the aforementioned insulating layer 5 having a size of 98 x 98 mm was placed on top of this, and thermocompression bonded at 40 kg/cm 2 , 100° C., and 3 seconds (FIG. 3(b)).

Next, the through holes 6a of the transfer sheet 9 are filled with the same copper oxide paste as described above in the same manner as in Example 1 (FIG. 3(c)). Figure 3 (
d).

Furthermore, the arrangement of the transfer sheet 9, thermocompression bonding, filling of vias, and peeling of the base film were performed in the same manner as described above.
By repeating the process several times, a laminate shown in FIG. 3(e) was obtained. The flatness of the surface of the laminate in this state was ±3 μm. The binder was removed using the same profile as in Example 1, and then reduction was performed at 350° C. for 3 hours in a hydrogen stream to convert copper oxide to copper. Thereafter, heat treatment was performed in a belt furnace in nitrogen at a peak temperature of 890° C. for a holding time of 10 minutes. The surface flatness of the ceramic multilayer wiring board obtained by these heat treatments was ±1.5 μm, and no cracks in the insulating layer, disconnections in the wiring pattern, or poor conductivity between wiring layers were observed.

As described above, it can be seen that according to this example, a ceramic multilayer wiring board with excellent surface flatness can be manufactured as in Example 1 even when the thickness of the conductive pattern 4 is large. . It goes without saying that this ceramic multilayer wiring board also has the same characteristics as the conventional ceramic multilayer wiring board produced by the thick film multilayer method, such as high strength and high heat dissipation. Furthermore, as can be easily inferred, increasing the number of conductor layers due to the demand for higher density packaging is due to
This can be done by considering their blending ratio. The conductor pattern 4 created in this example has a minimum line width of 1
00 μm and the line spacing was 125 μm, so screen printing was applied as described above, but if a more precise pattern is required, offset printing or photolithography techniques can be applied.

(Embodiment 3) A third embodiment of the present invention is shown in FIG.
This will be explained with reference to (a) to (h). Figures 4(a) to (h)
) shows cross-sectional views of the ceramic multilayer wiring board at each step. First, a similar insulating layer 2 was formed using the same insulating paste as in Example 2 on a steatite substrate 10 of 100×100 mm and 0.8 mm thick (FIG. 4(a)). next,
In (b), a through hole 7a penetrating the substrate 1 and the insulator layer 2 was drilled using a carbon dioxide laser, and then a conventional via filling device using vacuum suction (manufactured by Iwatani Sangyo Co., Ltd.) was used to perform the example. The through hole 7a was filled with the copper oxide paste shown in No. 2 to form the via conductor 7 (FIG. 4(c)). The laser conditions were set so that the diameter of this was 0.3 mm. After drying the filled copper oxide paste, it was aligned with the via conductor 7, a transfer sheet 9 similar to that in Example 2 was placed, and thermal transfer was performed under the same conditions (FIG. 4(d)). Thereafter, as shown in FIGS. 4(e) and 4(f), the same process as in Example 2 was carried out to obtain the laminate shown in FIG. 4(g). Furthermore, a conductor pattern 8 was printed on the back surface of the steatite substrate 10 in alignment with the via conductor 7, resulting in a laminate shown in FIG. 4(h). The paste for conductor pattern 8 was prepared by adding 2.5 wt% of borosilicate glass powder (GA-1, Nippon Electric Glass) to a commercially available copper oxide paste (DD-3100, manufactured by Kyoto Elex) based on copper oxide. I used something. The addition of glass is a measure taken in consideration of the adhesive strength of the conductor pattern 8 to the steatite substrate 10. After this, Example 2
Heat treatment was carried out in the same process as above, and a ceramic multilayer wiring board with excellent surface flatness as in the above two examples was obtained. Needless to say, in the ceramic multilayer wiring board of this example, no cracks or defects in the insulating layer 5 or poor continuity between the conductor patterns 4 were observed at all.

In this embodiment, copper oxide paste was used as the conductive pattern 8 on the back side of the substrate, and heat treatment was performed all at once. However, if the adhesion to the steatite substrate 10 is insufficient, as shown in FIG. It is also possible to carry out a process in which the series of heat treatments described above are performed in step g), and then the conductor pattern 8 is formed using a commercially available copper paste and fired in nitrogen. At this time, a solder resist or a glass paste as a protective material may be applied as necessary.

In the step (d) of this embodiment, when the number of via holes is large and their diameters are small, alignment accuracy is required, as shown in FIGS. 6(a) to (h). This can be done by applying a manufacturing method. That is,
In FIG. 6(a), a conductor pattern 4' serving as wiring and a land is formed on a steatite substrate 1, and then a reverse pattern of this is formed with an insulator paste to form an insulator layer 2. Next, as shown in FIG. 6(b), a through hole 7a is formed in the designated position of the conductor pattern 4' using a carbon dioxide laser, and then as shown in FIG. Manufacture. In this way, poor conduction of the via conductor 7 due to misalignment with the transfer sheet 9 can be prevented. Here, as can be easily considered, the conductor pattern 4
If the film thickness of conductor pattern 4' is not large, there is no need to print the reverse pattern using insulating paste as described above, and thermocompression bonding of transfer sheet 9 may be carried out immediately after printing and drying of conductor pattern 4'.

As described above, according to this embodiment, the inner layer conductor 4 having excellent surface smoothness is formed on both sides of the steatite substrate 10.
A ceramic multilayer wiring board having two layers of surface conductors can be formed. Needless to say, this multilayer wiring board has characteristics similar to those of the conventional ceramic multilayer wiring board produced by the thick film multilayer method, such as high strength and high heat dissipation. In addition, as can be easily inferred, increasing the number of conductor layers due to the requirement for higher density packaging depends on the properties of the inorganic powder, the organic binder and plasticizer in the insulator paste and conductor paste, and the properties of the organic binder and plasticizer. This can be done by considering the blending ratio of. The conductor pattern 4 created in this example has a minimum line width of 100 μm and a line spacing of 125 μm.
Since the size was μm, screen printing was applied as described above, but if a more precise pattern is required, offset printing or photolithography techniques can be applied.

(Embodiment 4) A fourth embodiment of the present invention is shown in FIG.
This will be explained with reference to (a) to (h). Figure 5(a)~
1(h) shows a cross-sectional view of the ceramic multilayer wiring board at each step, similar to FIGS. 1(a) to 1(e). First 100×
Glass-ceramic powder containing alumina as a main component was placed on a 96% alumina substrate 1 of 100 mm and 0.6 mm thick.
An insulating paste prepared by dispersing butyral resin, dioctyl adipate, and butyl carbitol in a compatible vehicle is screen printed on a size of 98 x 98 mm and dried twice on the front and back sides. Thickness 20
An insulator layer 2 of μm thickness was provided (FIG. 5(a)). Needless to say, in this step, a combination of the insulating layer 2 and the conductive layer as shown in FIG. 6(a) may be provided. Next, as in Example 3, a through hole 7a penetrating the 96% alumina substrate 1 and the insulator layer 2 was bored using a carbon dioxide laser, and a copper oxide paste was filled in the same manner to form a via conductor 7 ( Figure 5 (
b)). Thereafter, in the same manner as in Example 3, thermocompression bonding of the transfer sheet 9, filling of vias, and peeling of the base film 3 were repeated to obtain the laminate shown in FIG. 5(f). Furthermore, the above process was repeated on the back surface of the 96% alumina substrate 1 to obtain a laminate shown in FIG. 5(g). This was heat-treated in the same manner as in Example 2, and a ceramic multilayer wiring board having excellent surface flatness as in Examples 1 to 3 was obtained. Needless to say, in the ceramic multilayer wiring board of this example, no cracks or defects in the insulating layer 5 or poor continuity between the conductor patterns 4 were observed.

In this embodiment, steps (d), (c), and (f) in the lamination process of the transfer sheet 9 are repeated for each side of the 96% alumina substrate 1. There is no problem in doing it on both sides one layer at a time. Further, in this example and Example 3, the heat-resistant substrate is perforated using a laser, but a substrate that has been previously perforated in a green sheet and then fired may be used. In this case, use a printing plate that does not allow paste to flow into the holes.

As described above, according to this embodiment, the inner layer conductor 8 having excellent surface smoothness is provided on both surfaces of the 96% alumina substrate 1.
A ceramic multilayer wiring board having two layers of surface conductors can be formed. Needless to say, this multilayer wiring board has characteristics similar to those of the conventional ceramic multilayer wiring board produced by the thick film multilayer method, such as high strength and high heat dissipation. Further, as can be easily inferred, increasing the number of conductor layers in response to the request for higher density packaging can be done in the same manner as in the above-described embodiments.

As a comparison with the above embodiments, FIG.
With the structure shown in e), it was difficult to form the via conductor 6 formed on the alumina substrate by the screen printing method using the same paste as used in Example 1, and the holes were formed by the insulating paste. There were many cases where it was blocked. Additionally, as the number of laminated layers increases, the difference in level between areas with and without internal conductors becomes extremely large, and when printing the conductor pattern 4 of the fourth layer, printing problems caused by this level difference caused blurring and disconnections. . Regarding those subjected to heat treatment, the insulating layer 5 and the conductive pattern 4 were often torn at portions with steps, and conduction failures of the via conductors 6 were also frequently observed.

In the above embodiments, all the transfer sheets were of the type shown in FIG. 2(c), but the type shown in FIG. 2(b) may also be used if necessary. for example,
The first layer of the laminate shown in FIG. 1(d), which does not require the via conductor 6, and the first layer of the laminate shown in FIG. 3(c) are examples where this type can be used. However, in Figure 1 (
c) or when the via conductor 6 in FIG. 3(d) is intended for heat dissipation to the substrate, this is not the case. Further, a transfer sheet 9 of the type shown in FIG. 2(c) without the conductor pattern 4, that is, a transfer sheet 9 composed only of the insulator layer 5, may also be used in the present invention. This can be used, for example, when only via holes need to be formed in the uppermost layer, such as in FIGS. 1(e), 3(c), and 4(g).

[0033] Regarding the various materials that can be used in the present invention, those shown in the above embodiments are merely examples. For example, as the base film 3 of the transfer sheet 9, from the viewpoint of dimensional accuracy and surface smoothness, other than PET, polyimide or other organic films can be used without any problem. As the insulating layer 5, commercially available glass ceramics or powders of forsterite, enstatite, dolomite, etc., which are conventionally frequently used as insulators, can be used. Further, as vehicle components for making the paste, resins, plasticizers, and solvents commonly used in conventional ceramic powder processing and thick film printing pastes may be used as long as thermal transferability is not impaired. The substrate used in the above example was a 96% alumina plate and a steatite plate, but depending on the heat treatment conditions of the material constituting the laminate, silicon carbide plates, quartz glass plates, forsterite plates, and aluminum nitride plates may also be used. A wide variety of heat resistant substrates can be used, including plate and enameled steel.

[0034]

[Effects of the Invention] As described above, the present invention provides a method for manufacturing a ceramic multilayer wiring board with excellent flatness on a heat-resistant substrate with high productivity, and a method for forming via holes with extremely high alignment accuracy. be able to.

[Brief explanation of drawings]

[Fig. 1] (a) to (e) are cross-sectional views showing the manufacturing process of a ceramic multilayer wiring board in one embodiment of the present invention.

[Figure 2]
(a) to (c) are cross-sectional views showing the manufacturing process of a transfer sheet in one embodiment of the present invention.

FIGS. 3(a) to 3(e) are cross-sectional views showing the manufacturing process of a ceramic multilayer wiring board in a second embodiment of the present invention.

FIG. 4 (a) to (h) are cross-sectional views showing the manufacturing process of a ceramic multilayer wiring board in a third embodiment of the present invention.

[Figure 5]
(a) to (h) are cross-sectional views showing the manufacturing process of a ceramic multilayer wiring board in a fourth embodiment of the present invention.

[Figure 6] (a
) to (h) are cross-sectional views showing the manufacturing process of a ceramic multilayer wiring board in the third embodiment of the present invention.

[Explanation of symbols]

1. 96% alumina substrate 2 Insulator layer 3 Base film 4, 4', 8 Conductor pattern 5 Insulator layer 6,7 Via conductor 6a, 7a Through hole 9 Transfer sheet 10　Steatite substrate

Claims (4)

[Claims] Claim 1: After printing a conductive paste in a pattern on a base film and drying it to form a conductive pattern, printing or applying an insulating paste to cover it and drying it to form an insulating layer. A transfer sheet is constructed by
The process of arranging the transfer sheet on a heat-resistant substrate, applying heat and pressure to transfer the conductor pattern and insulating layer, and then peeling off the base film is repeated, thereby laminating a plurality of conductor patterns and insulating layers. A method for manufacturing a multilayer wiring board. 2. The method of manufacturing a ceramic multilayer wiring board according to claim 1, wherein through holes are formed at predetermined positions of the transfer sheet. 3. The method of manufacturing a ceramic multilayer wiring board according to claim 1, wherein the insulating paste and the conductive paste are printed or applied on the heat-resistant substrate in advance to form a dried thick film layer. (4) A via hole is formed by filling a conductive paste or a conductive powder into the through hole from the back side of the base film of the pressed transfer sheet and peeling off the base film. The method for manufacturing the ceramic multilayer wiring board described above.