JPH04302454A - Manufacturing apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To provide a manufacturing apparatus for a semiconductor device which is capable of reducing the time required for the evacuation and restoration to the ambient pressure during the manufacturing process of a semiconductor device where vacuum processing of a wafer is required. CONSTITUTION:A cassette 2 with a closure 7, which can carry a wafer in an evacuated state, is inserted into the main unit 3 of a semiconductor manufacturing system through a cassette insert port 11 thereof. An opening/closing mechanism 9 for use with the closure of the cassette is hermetically sealed and evacuated, and the wafer 1 then undergoes processes with the closure 7 open. After the completion of the processes, air is introduced into the opening/closing mechanism 9 with the closure 7 closed, and the cassette 2 is transported. Thus, this arrangement requires only the evacuation of the closing/opening mechanism 9, so that the amount of dust attached to the wafer is reduced, since the wafer 1 is not exposed to the outside air.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to semiconductor manufacturing equipment.

0002

2. Description of the Related Art FIG. 2(a) is a perspective view of a conventional semiconductor substrate storage container, and FIG. 2(b) is a sectional view of a conventional semiconductor manufacturing apparatus. In the figure, 1 is a semiconductor substrate (hereinafter referred to as “
2 is a semiconductor storage container (hereinafter referred to as a "cassette"), 3 is a main body of the semiconductor manufacturing apparatus, 4 is a pressure adjustment section, 5 is a processing section, and 6 is a mounting section.

Next, the operation will be explained. The cassette 2 containing the wafers 1 is carried to the mounting section 6. In the single wafer type, one wafer 1 is introduced into the pressure adjustment section 4 and vacuum evacuation is performed. Thereafter, the wafer 1 is processed in the processing section 5, and then returned to atmospheric pressure in the pressure adjustment section 4 and stored in the cassette 2. Therefore, this operation is repeated for the number of wafers 1. In batch processing, the wafers 1 and the cassettes 2 are collectively evacuated and processed. The wafer 1 being transported and the wafer 1 waiting to be processed are exposed to the outside air while being housed in the cassette 2.

0004

[Problems to be Solved by the Invention] Conventional semiconductor manufacturing equipment is configured as described above, so each time a wafer is introduced into the main body of the semiconductor manufacturing equipment, a large amount of evacuation time is required, resulting in a long processing time. There were some problems, such as: Also,
Since wafers are directly exposed to the outside air, when workers handle cassettes or when wafers come close to moving parts such as equipment or manipulators, dirt and other substances tend to adhere to them, which can reduce yields. There were some problems, such as:

The present invention has been made to solve the above-mentioned problems, and provides a semiconductor manufacturing apparatus that can shorten the processing time for manufacturing processes that require vacuum evacuation, and can also reduce the adhesion of dust during cassette transport. The purpose is to obtain.

[0006]

[Means for Solving the Problems] A semiconductor manufacturing apparatus according to the present invention provides a semiconductor storage container with an openable/closable lid and a brim-like projection, and also provides packing at the opening and brim-like portion of the semiconductor storage container. Furthermore, the semiconductor device main body is provided with a fastener for holding the brim-like protrusion.

[0007]

[Function] According to the semiconductor manufacturing apparatus of the present invention, the atmosphere of the wafer is always kept in a vacuum state, so the evacuation time and the time for returning the cassette to atmospheric pressure when it is placed into the semiconductor manufacturing apparatus main body are shortened. , and the adhesion of dust during transportation is reduced.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the drawings. FIG. 1(a) is a perspective view showing a cassette according to an embodiment of the present invention, and FIGS. 1(b) and 1(c) are a perspective view and a sectional view, respectively, showing the state in which the cassette is attached to a main body of a semiconductor manufacturing apparatus. In the figures, parts that are the same as those of the conventional device are designated by the same reference numerals. 7 is a lid that can be opened and closed; 8 is a packing for maintaining the vacuum state of the lid opening/closing mechanism section 9 when inserting the cassette 2 into the interior of the cassette 2 and into the semiconductor manufacturing equipment main body 3; and 10 is a flange-shaped lid provided on the cassette 2. protrusion,
11 is the insertion slot for inserting the cassette 2, 12 is the cassette 2
This is a fastener for holding the flange-shaped protrusion 10 provided on the cassette 2 and securely fixing the cassette 2.

Next, the operation will be explained. A wafer 1 is stored in a evacuated cassette 2. A packing 8 is attached to the opening of the cassette 2, and
Since the lid 7 is pressed by atmospheric pressure, a vacuum state is maintained and the wafer 1 is not exposed to the outside air. Moreover, even if the cassette 2 falls down due to a work error or the like, the wafer 1 will not fall off. This cassette 2 is inserted into the insertion opening 11 of the semiconductor manufacturing apparatus main body 3 as shown in FIG. Since the packing 8 is also attached to the brim-shaped projection 10, the cassette lid opening/closing mechanism section 9 is sealed, and only the cassette lid opening/closing mechanism section 9 needs to be evacuated before processing the wafer 1. After evacuation, the pressure difference between the inside and outside of the cassette 2 is small, so
Since the lid 7 can be easily opened, the wafers 1 are taken out one by one, processed in the processing section 5, and returned to the cassette 2. After the processing is completed, the lid 7 is closed and only the cassette lid opening/closing mechanism 9 is leaked, so that the inside of the cassette 2 is maintained in a vacuum state, and the cassette 2 is removed from the semiconductor manufacturing apparatus 5 and transported.

0010

[Effects of the Invention] As described above, according to the present invention, the cassette is provided with a vacuum-sealable lid, and the inside of the semiconductor manufacturing equipment can be vacuum-sealed by inserting the cassette. The processing time of semiconductor manufacturing equipment, which requires extremely frequent evacuation during the manufacturing process, can be shortened, and there is less dust adhering to wafers during cassette transport, which has the effect of improving quality.

[Brief explanation of drawings]

FIG. 1 is a perspective view a of a cassette showing an embodiment of the present invention.
FIG. 3 is a perspective view b and a cross-sectional view c showing the cassette being inserted into the main body of the semiconductor manufacturing apparatus.

FIG. 2 is a perspective view a showing a conventional cassette and a cross-sectional view b of a semiconductor manufacturing apparatus.

[Explanation of symbols]

1 Wafer 2 Cassette 3 Semiconductor manufacturing equipment body 5 Processing section 7 Lid 8 Packing １０　　　Brim-shaped protrusion 12 Fastener

Claims (1)

[Claims] Claim 1: In a semiconductor manufacturing apparatus in which a semiconductor substrate storage container containing a semiconductor substrate is attached to a semiconductor manufacturing equipment main body, the semiconductor substrate is transported to a processing section, and the semiconductor substrate is processed in a vacuum state, the semiconductor storage container is opened and closed. In addition to providing a freely movable lid and a brim-like protrusion, packing is installed on the opening and the brim-like protrusion of the semiconductor storage container, and the semiconductor manufacturing equipment main body holds the brim-like protrusion, and the semiconductor storage container 1. Semiconductor manufacturing equipment characterized by having a fastener for securely fixing.