JP2003077997A - Semiconductor substrate storing device and manufacturing method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor substrate storing device and a manufacturing method of a semiconductor device in which dust does not adhere to the surface of a semiconductor substrate when a cover part is removed to open enclosure of the inside of a storing vessel. SOLUTION: The semiconductor substrate storing vessel 100 is provided with a storing vessel 20 for storing the semiconductor substrate 10, an outer cover 30 tightly shutting the inside of the storing vessel, and an inner cover 32 for dividing the inside of the storing vessel into a substrate storing chamber storing at least the semiconductor substrate and a sealing open chamber being in a more outer cover side than the substrate storing chamber when at least the outer cover is removed to open the enclosure of the inside of the storing vessel.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate housing device and a method of manufacturing a semiconductor device.

[0002]

2. Description of the Related Art A semiconductor substrate accommodating device is used for accommodating and carrying a semiconductor substrate in a semiconductor device manufacturing process.

FIG. 9 shows a conventional semiconductor substrate housing device 800.
FIG. The semiconductor substrate accommodating device 800 includes a front opening integrated container (FOUP).
d)).

The semiconductor substrate housing device 800 has a container 820 for housing the semiconductor substrate 810 and a lid portion 830 for sealing the inside of the container. A seal member 840 is provided between the container 820 and the lid 830,
The seal member 840 is pressed between the container 820 and the lid 830 to seal the inside of the container 820.

In order to fix the lid portion 830 to the container 820 and to keep the inside of the semiconductor substrate housing device 800 sealed,
A lock portion 850 is provided.

When the inside of the container 820 is sealed, the substrate supporting portion 835 provided on the lid 830 presses the semiconductor substrate 810 against the inner wall of the container 820 to fix the semiconductor substrate 810. Incidentally, FIG. 9 and FIG.
0, the lid 830 is removed from the container 820,
It shows the state when the inner seal of 20 is opened.

[0007]

In order to take out the semiconductor substrate 810 contained in the container 820,
The lid portion 830 needs to be removed from the container 820. When the lock portion 850 is released and the lid portion 830 is removed from the container 820, the inside of the container 820 is opened.

When the inside of the container 820 is opened, the container 8 is inserted between the lid 830 and the seal member 840.
Gas rapidly flows into 20. Thereby, the lid portion 8
An airflow is generated between 30 and the seal member 840. Figure 9
In, the arrow 860 indicates the flow of airflow (hereinafter, referred to as airflow 860).

On the other hand, particles or dust 870 may exist outside the semiconductor substrate housing device 800.
Further, the lid portion 830 and the seal member 840 may slide, and the lid portion 830 or the seal member 840 may be scraped to generate particles or dust 870.

Such dust 870 enters the inside of the container 820 by the air flow 860, and the semiconductor substrate 81
It adheres to the surface of 0. In recent years, a large diameter semiconductor substrate 810 has been used. Since the larger diameter semiconductor substrate 810 has a larger surface area, dust 870 is more likely to adhere thereto. In particular, since the semiconductor substrate 810 having a diameter of 300 mm is beginning to be used, there is a problem that dust 870 is likely to adhere to the surface of the semiconductor substrate 810.

FIG. 10 shows that the side wall of the container 820 has a ventilation port 8
FIG. 10 is a cross-sectional view of a semiconductor substrate housing device 900 including 80. The ventilation port 880 can open the airtight inside the semiconductor substrate housing device 900. Therefore, before the lid portion 830 is removed from the container 820, the ventilation port 880 can open the airtight inside the container 820. Thereby, no airflow is generated between the lid portion 830 and the seal member 840. Therefore, the dust 870 does not enter the container 820.

However, since the container 820 is provided with the vent 880, the semiconductor substrate housing device 900 has a poorer hermeticity than the semiconductor substrate housing device 800. The gas inside the semiconductor substrate container may be replaced with an inert gas (not shown). Even in such a case, the container 82
Since the ventilation port 880 is provided at 0, the amount of the inert gas leaked to the outside is larger in the semiconductor substrate housing device 900 than in the semiconductor substrate housing device 800.

Therefore, according to the present invention, when the lid is removed to open the airtightness inside the container, particles and dust are prevented from adhering to the surface of the semiconductor substrate. The purpose is to provide a method.

It is another object of the present invention to provide a semiconductor substrate housing device that maintains good airtightness inside the housing when the lid is attached to the housing.

[0015]

A semiconductor substrate housing device according to an embodiment of the present invention is a container for housing a semiconductor substrate, an outer lid for sealing the inside of the container, and at least the outer lid being removed. When the inside of the container is opened, the inside of the container is partitioned into a substrate housing chamber in which at least the semiconductor substrate is housed and a sealed open chamber on the outer lid side of the substrate housing chamber. An inner lid is provided.

[0016] Preferably, the inner lid is connected to the outer lid so as to be interlocked with the outer lid and to be removed from the container with a delay from the outer lid.

Preferably, when the outer lid seals the inside of the container, the inner lid is elastically pressed against the container by the outer lid.

Preferably, the inner lid is elastically pressed against the container by using any one of a spring, a rubber, a magnetic material, a gas or a fluid.

Preferably, there is air permeability between the substrate accommodating chamber and the closed open chamber.

The inner lid may be made of a ventilation material. A ventilation material may be provided in at least a portion where the inner lid and the container are in contact with each other. The vent material may comprise a porous material. Preferably, the pore diameter of the porous material is 0.1 μm or less.

The inner lid has a projecting edge portion projecting from a main surface of the inner lid at an outer edge of the inner lid, and the container has a concave portion for receiving the projecting edge portion on an inner side wall, The substrate accommodating chamber and the sealed open chamber may be partitioned by allowing the concave portion to receive the projecting edge portion.

The inner lid includes a pressing shaft extending to the outside of the semiconductor substrate accommodating device through the outer lid, and at least when the outer lid is removed to release the airtightness inside the container, the pressing force is increased. By fixing the shaft,
The inner lid may be pressed against the container to partition the inside of the container into at least the substrate housing chamber and the closed open chamber.

Preferably, the inner lid supports the semiconductor substrate by elastically pressing the semiconductor substrate against the inner wall of the container.

A method of manufacturing a semiconductor device according to an embodiment of the present invention includes a step of subjecting a semiconductor substrate to a first semiconductor treatment, and a semiconductor substrate accommodating apparatus for transporting the semiconductor substrate subjected to the first semiconductor treatment. In the method of manufacturing a semiconductor device, the method comprises the steps of accommodating into The semiconductor substrate accommodating apparatus includes an outer lid that seals the inside of a container that accommodates a semiconductor substrate, a substrate accommodating chamber that accommodates the semiconductor substrate inside the container when pressed by the container, and the substrate. An inner lid for partitioning with a closed open chamber on the outer lid side of the accommodation chamber, Retrieving the semiconductor substrate,
An outer lid opening step of opening the inner seal of the container while the inner lid is pressed against the container, and an outer lid opening step of opening the inner seal of the container; The method includes a maintaining step of maintaining a state where the lid is removed for a predetermined period, and an inner lid opening step of removing the inner lid.

A method of manufacturing a semiconductor device according to another embodiment of the present invention includes a step of subjecting a semiconductor substrate to a first semiconductor treatment, and a semiconductor substrate accommodating device for treating the semiconductor substrate subjected to the first semiconductor treatment. In the method of manufacturing a semiconductor device, the method comprises the steps of accommodating into The semiconductor substrate accommodating apparatus includes an outer lid that seals the inside of a container that accommodates a semiconductor substrate, a substrate accommodating chamber that accommodates the semiconductor substrate inside the container when pressed by the container, and the substrate. An inner lid for partitioning into a closed open chamber located on the outer lid side with respect to the accommodation chamber; In the step of taking out the body substrate, the outer lid is removed while the inner lid is being pressed by the container, and an outer lid opening step of opening the airtight inside the container, and the inner lid being the container The method further includes a feeding step of forcibly feeding gas into the closed open chamber between the outer lid and the container while being pressed by the inner lid opening step of removing the inner lid.

Preferably, when the outer lid seals the inside of the container, the outer lid elastically presses the inner lid against the container, and when the inner lid is removed, The inner lid is interlocked with the outer lid and is removed from the container with a delay from the outer lid.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. The present embodiment does not limit the present invention.

FIG. 1 is a sectional view of a semiconductor substrate housing device 100 according to a first embodiment of the present invention. still,
FIG. 1A shows a state in which the inside of the semiconductor substrate housing device 100 is hermetically sealed. 1 (B) and 1 (C)
Shows a state where the inside of the semiconductor substrate housing device 100 is opened and the hermetically sealed state is released.

The semiconductor substrate housing apparatus 100 comprises a container 20 for housing the semiconductor substrate 10 and an outer lid 30 for sealing the inside of the container 20. A seal member 40 is provided between the container 20 and the outer lid 30, and the seal member 40 is pressed between the container 20 and the outer lid 30 to seal the inside of the container 20. Further, a lock portion 50 is provided in order to fix the outer lid 30 to the container 20 and keep the inside of the semiconductor substrate housing apparatus 100 airtight.

Further, the semiconductor substrate housing apparatus 100 has a substrate housing chamber 92 housing at least the semiconductor substrate 10 and a sealed open chamber 94 on the outer lid 30 side of the substrate housing chamber 92 inside the container 20. An inner lid 32 for partitioning is further provided.

The inner lid 32 has a pressing shaft 34 for transmitting a force for pressing the inner lid 32. By providing the plurality of pressing shafts 34, the inner lid 32 can be pressed without being biased. The inner lid 32 is provided on the surface opposite to the surface on which the pressing shaft 34 is provided.
It has a substrate supporting portion 35 for pressing and supporting.

A sliding body 36 having a diameter larger than that of the shaft 34 is provided at the tip of the pressing shaft 34. Sliding body 36
Are provided in the same number as the shafts 34.

The outer lid 30 is a sliding member 3 of the pressing shaft 34.
It has a cylinder 38 hollowed out inside the outer lid 30 so that it can receive 6. The same number of cylinders 38 as the shafts 34 and the sliding bodies 36 are provided. The sliding body 36 slides inside the cylinder 38. Opening 3
9 is formed to have a diameter smaller than the inner diameter of the cylinder 38 so as to come into contact with the sliding body 36 while penetrating the pressing shaft 34 inside thereof. Thereby,
The inner lid 32 can be interlocked without coming off from the outer lid 30.

The sliding body 36 can slide inside the cylinder 38. Therefore, the inner lid 32 can move relative to the outer lid 30 one-dimensionally. Further, the pressing shaft 34 may be designed to slide with respect to the opening 39. Thereby, the inner lid 32 with respect to the outer lid 30
The operation of is more stable.

A compression spring 90 is provided as an elastic body between the sliding body 36 and the cylinder 38. Thereby, the inner lid 32 and the outer lid 30 are elastically connected,
Can be interlocked. When the inside of the container 20 is sealed by the outer lid 30, the outer lid 30 holds the compression spring 90.
The inner lid 32 is elastically pressed against the inner wall of the container 20 via. Thereby, the inner lid 32 partitions the inside of the container 20 into the substrate housing chamber 92 and the closed open chamber 94.

Further, the substrate supporting portion 35 holds the semiconductor substrate 10 in the container 2 when the inside of the container 20 is sealed.
The semiconductor substrate 10 is fixed by pressing against the inner wall of 0.

Further, by the compression spring 90, the outer lid 30
After being removed from the container 20, the inner cover 32 can be removed from the container 20 with a delay to the outer cover 30.

The compression spring 90 as an elastic body may be rubber. Further, the inner lid 32 and the outer lid 30 may be elastically connected to each other by providing the cylinder 38 and the sliding body 36 with magnetic bodies having repulsive forces. Further, the cylinder 38 itself and the pressing shaft 34 themselves may be magnetic bodies having repulsive force. The inner lid 32 and the outer lid 30 may be elastically connected by keeping the cylinder 38 airtight or liquid-tight to some extent and enclosing a gas or a fluid in the cylinder 38.

The inner lid 32 is made of a non-breathable material, for example,
It may be formed of resin. However, it is preferable that the inner lid 32 is made of a porous material having air permeability so that the gas can pass between the substrate housing chamber 92 and the closed open chamber 94. Thereby, the atmospheric pressure between the substrate accommodation chamber 92 and the closed open chamber 94 becomes equal.

However, a porous material may be used for a part of the inner lid 32. Examples of porous materials include filters and foams. The pore diameter of the porous material is preferably about 0.1 μm or less in consideration of the diameter of dust in a general clean room. Thereby, the atmospheric pressure between the substrate accommodating chamber 92 and the sealed open chamber 94 is maintained equal, and dust is prevented from entering the container 20.

Semiconductor substrate accommodation device 1 according to the present embodiment
00 accommodates a semiconductor substrate having a diameter of 300 mm. As a result, it is possible to prevent dust from adhering to a large-diameter semiconductor substrate that easily adheres and has a high unit price.

Next, the semiconductor substrate 10 hermetically sealed inside the semiconductor substrate housing device 100 is replaced with the semiconductor substrate housing device 1.
The operation of extracting from 00 will be described.

In FIG. 1A, the inside of the semiconductor substrate housing device 100 is hermetically sealed.

In FIG. 1B, the lock portion 50 is released. The outer lid 30 is removed by the compression spring 90. Almost at the same time when the outer lid 30 is removed, the airtight inside the container 20 is opened. However, the inner lid 32 remains pressed by the compression spring 90 against the container 20.

Therefore, even if dust 70 is generated between the outer lid 20 and the seal member 40, the dust 70 is blocked by the inner lid 32 and cannot enter the inside of the container 20. Therefore, the dust 70 does not adhere to the semiconductor substrate 10 due to the airflow 60 between the outer lid 20 and the seal member 40 that occurs when the airtightness of the semiconductor substrate housing device 100 is opened.

The outer lid 30 is removed and the inner lid 32 is attached to the container 2.
The state of being pressed to 0 is maintained for a while until the air flow 60 disappears.

In FIG. 1C, the inner lid 32 is also removed.

A compression spring 9 is provided between the inner lid 32 and the outer lid 30.
0 is provided, and the inner lid 32 and the outer lid 30 are elastically connected. Therefore, the inner lid 32 operates in conjunction with the outer lid 30. Therefore, the inner lid 32 can be controlled in conjunction with the outer lid 30 by controlling the outer lid 30 without directly controlling the inner lid 32. Further, the compression spring 90 allows the inner lid 32 to be removed from the container 20 with a delay after the outer lid 30 is removed from the container 20.

In the method according to the present embodiment, the state in which the outer lid 30 is removed and the inner lid 32 is pressed against the container 20 is maintained for a predetermined period. The predetermined period is not particularly limited, but is preferably a period after the sealing is opened until the dust 70 is stagnated to some extent.

However, according to another embodiment, the inner lid 3 is opened after the inner sealing of the semiconductor substrate housing device 100 is opened.
2 is pressed against the container 20 and the outer lid 30 and the container 2
Gas (not shown) may be forced into the closed open chamber 94 between zero and zero.

The gas that is forcibly inserted is dust 7
0 is expelled from the closed open chamber 94. Therefore, the state in which the outer lid 30 is removed and the inner lid 32 is pressed against the container 20 is sufficient in a relatively short time as compared with the above-described embodiment.

It is preferable that all of these operations are automated in the semiconductor device manufacturing process.

FIG. 2 is a sectional view of a semiconductor substrate housing device 200 according to a second embodiment of the present invention. According to the present embodiment, the inner lid 32a is used instead of the inner lid 32. The inner lid 32a uses the porous material 210 in the portion pressed against the inner wall of the container 20 (corresponding to the portion indicated by the circle 110 in FIG. 1), so that the inner lid 32a is used.
Different from According to this embodiment, the porous material 210 is provided only on the outer edge portion of the inner lid 32a.

FIG. 3 is a sectional view of a semiconductor substrate housing device 300 according to a third embodiment of the present invention. According to this embodiment, instead of the container 20, the container 20a
Is used. In the container 20a, the porous material 310 is provided on the portion where the inner lid 32 is pressed against the inner wall of the container 20a.
It is different from the container 20 in that it has. According to this embodiment, the porous material 310 is provided on the inner wall of the opening of the container 20a.

Either one of the porous materials 210 and 310 may be provided, or both of them may be provided. However, the porous materials 210 and 310
Is a material that easily generates dust or particles, it is preferable that only one of the porous materials 210 and 310 is provided.

The pore diameter of the porous material is preferably about 0.1 μm or less in consideration of the diameter of dust.

FIG. 4 is a sectional view of a semiconductor substrate housing device 400 according to a fourth embodiment of the present invention. In this embodiment, the inner lid 32b and the container 20b are used instead of the inner lid 32 and the container 20.

The inner lid 32b differs from the inner lid 32 in that it has a projecting edge portion 410 projecting in a direction perpendicular to the surface of the inner lid 20b on the outer periphery thereof. In the present embodiment, the flange 4
10 is provided on the entire outer circumference of the inner lid 32b.

The container 20b has a recess 420 on its inner wall which can receive the flange 410. Container 20
A step is provided on the side surface of the inner wall of b, and the container 2 is provided at the end of the step.
0b in a direction substantially parallel to the side surface of the inner wall
By molding 0, the recess 420 is formed.

According to the present embodiment, the projection 430 provided in the recess 420 prevents dust and the like generated between the inner lid 32b and the container 20b from entering the inside of the container 20b. .

Further, according to the present embodiment, the protruding edge portion 41
The area of the contact surface between 0 and the concave portion 420 is smaller than that in the first to third embodiments. Therefore, dust or the like generated between the inner lid 32b and the container 20b is small.

FIG. 5 is a sectional view of a semiconductor substrate accommodation device 500 according to a fifth embodiment of the present invention. In this embodiment, a container 20c is used instead of the container 20b in the fourth embodiment.

The container 20c has a porous material 510 in the recess 420 as an air-permeable material. Porous material 510
Is provided at the bottom of the recess 420 with which the protruding edge 410 abuts. Thereby, gas can pass between the substrate housing chamber 92 and the closed open chamber 94.

FIG. 6 is a sectional view of a semiconductor substrate accommodation device 600 according to a sixth embodiment of the present invention. In this embodiment, an inner lid 32c is used instead of the inner lid 32b in the fourth embodiment.

The inner lid 32c has a porous material 610 as a breathable material at the tip of the projecting edge portion 410. Thereby, gas can pass between the substrate housing chamber 92 and the closed open chamber 94.

Incidentally, in the fourth to sixth embodiments,
The protruding end portion 430 may further have a claw portion 620 protruding toward the inside of the recess 420 at the tip thereof. That is, by the claw portion 620 as shown in FIG.
Dust and the like generated between 2c and the container 20b are stored in the recess 420. Therefore, it becomes more difficult for dust and the like to enter the inside of the container 32c.

FIG. 7 is a sectional view of a semiconductor substrate housing device 700 according to a seventh embodiment of the present invention. According to this embodiment, the engaging portion 3 is attached to the tip of the pressing shaft 34.
7 is provided. The outer lid 30a has a pressing shaft 34.
Has a hole 96 through which it can slide. The space between the pressing shaft 34 and the hole 96 is formed so that a hermetic seal is maintained. The pressing shaft 34 penetrates the outer lid 30a,
It projects and extends to the outside of the semiconductor substrate housing device 700.

The outer lid 30a is slidable with respect to the pressing shaft 34 and abuts on the engaging portion 37. As a result, when the outer lid 30a slides on the pressing shaft 34, the outer lid 30a and the inner lid 32 operate or stand independently of each other, and when the outer lid 30a abuts the engaging portion 37, the outer lid 30a moves outside. The lid 30a and the inner lid 32 move or stand still in association with each other. Thereby, the inner lid 32 can be interlocked without coming off from the outer lid 30a. Further, after the outer lid 30a is removed from the container 20, the inner lid 3 is delayed.
2 can be removed from the container 20.

FIG. 7A is a sectional view of the semiconductor substrate housing device 700 when the housing 20 is sealed.
An external device 710 is attached to the semiconductor substrate housing device 700 in order to open the airtightness of the semiconductor substrate housing device 700. The external device 710 is the semiconductor substrate housing device 70.
Since it is not a component of 0, it is indicated by a chain line.

The external device 710 includes the outer lid 30a and the container 2
An outer lid fixing portion 720 for removing from 0 and an inner lid fixing portion 730 for holding the engaging portion 37 of the inner lid 32 are provided.

Further, in the semiconductor substrate housing device 700, the inner lid 32 may be formed of a member having air permeability, for example, a porous member. Further, the portion where the inner lid 32 is pressed against the inner wall of the container 20 (the circle 7 in FIG. 7A)
2 or 3 corresponds to the part indicated by 70).
, The porous members 210, 31
0 may be provided. Further, the portion where the inner lid 32 is pressed against the inner wall of the container 20 may have a shape as shown in FIGS. 4 to 6, and as shown in FIG. 5 or 6, the porous member 510 may be formed. , 610 may be provided.

The operation of the semiconductor substrate housing device 700 will be described.

In FIG. 7B, the outer lid fixing portion 720 removes the outer lid 30a from the container 20. At the same time, the airtight inside the container 20 is opened. At this time, the inner lid fixing portion 730 is
The inner lid 32 is pressed against the inner wall of the container 20 via the pressing shaft 34. Thereby, it is possible to prevent dust from adhering to the semiconductor substrate 10 when the airtight inside the container 20 is opened.

When the outer lid 30a slides on the pressing shaft 34 and comes into contact with the engaging portion 37, the inner lid 32 is removed from the container 20. Thereby, the semiconductor substrate 10 can be taken out from the container 20.

The state in which the outer lid 30a is removed while the inner lid 32 is pressed against the container 20 is maintained for a predetermined period.
The predetermined period is the time during which the outer lid 30a is sliding on the pressing shaft 34. Therefore, by maintaining the speed of the outer lid 30a constant, the predetermined period may be defined by the length of the pressing shaft 34.

Further, the inner lid 32 is designed to be disengaged from the container 20 by engaging with the inner lid fixing portion 730 and other inner lid 32 portions before the outer lid 30a abuts the engaging portion 37. You may.

Further, it is preferable that all of these operations are automated in the manufacturing process of the semiconductor device.

FIG. 8 is a diagram schematically showing a part of the manufacturing process of the semiconductor device. In FIG. 8, the semiconductor substrate 1
0 is transferred from the semiconductor processing device 120 to the semiconductor processing device 130. In FIG. 8, the automatic transport device 140 is
Trackless automatic carrier (AGV (Auto Guided Vehicle))
Is.

First, after the processing in the semiconductor processing apparatus 120, for example, the etching processing and the film forming processing are completed,
The semiconductor substrate is unloaded from the semiconductor processing apparatus 120 and loaded into the semiconductor substrate housing apparatus 100 on the stand 150. Next, the semiconductor substrate housing device 100 is sealed.

The semiconductor substrate housing apparatus 100 is conveyed between the semiconductor processing apparatus 120 and the semiconductor processing apparatus 130 by the automatic transfer apparatus 140. Thereby, the semiconductor substrate 10 accommodated in the semiconductor substrate accommodation device 100 is transported between the semiconductor processing device 120 and the semiconductor processing device 130.

The automatic carrier device 140 moves the semiconductor substrate housing device 100 to the stand 160. Semiconductor substrate 10
Are unloaded from the semiconductor substrate housing apparatus 100 and loaded into the semiconductor processing apparatus 130. In the semiconductor processing apparatus 130, the semiconductor substrate 10 is subjected to processing subsequent to the processing in the semiconductor processing apparatus 120, for example, another etching processing or another film forming processing. When the semiconductor substrate is unloaded from the semiconductor substrate accommodation device 100, the semiconductor substrate accommodation device 1
The 00 seal is opened. The operation of opening the seal is performed as described above with reference to FIGS. 1 (A) to 1 (C).

The transportation of the semiconductor substrate 10 between the semiconductor processing apparatuses 120 and 130, the loading of the semiconductor substrate 10 into the semiconductor processing apparatus 130, and the unloading of the semiconductor substrate 10 from the semiconductor processing apparatus 120 are all automated. Further, the sealing of the semiconductor substrate housing device 100 and the opening of the semiconductor substrate housing device 100 are also automated. Therefore,
Different semiconductor processing devices 1 without human intervention
Transfer of the semiconductor substrate between 20 and 130 may be performed. This eliminates the need for human intervention
Generation of particles and dust is prevented.

The automatic transfer device 140 is a ceiling transfer device (OHT (Overhead Hoist Transportation)), a track-type automatic transfer device (RGV (Rail Guided Vehicle)), or a trolley with a transfer device (PGV (Personal Guided Vehicle)). ) Or the like.

[0084]

According to the semiconductor substrate accommodating apparatus and the semiconductor device manufacturing method of the present invention, particles and dust adhere to the surface of the semiconductor substrate when the lid is removed to open the inside of the container. There is nothing to do.

Further, according to the semiconductor substrate accommodating apparatus of the present invention, the airtightness inside the container can be maintained when the lid is attached to the container.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor substrate housing device 100 according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a semiconductor substrate housing device 200 according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a semiconductor substrate housing device 300 according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a semiconductor substrate housing device 400 according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view of a semiconductor substrate housing device 500 according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view of a semiconductor substrate housing device 600 according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view of a semiconductor substrate housing device 700 according to a seventh embodiment of the present invention.

FIG. 8 is a diagram schematically showing a part of a method for manufacturing a semiconductor device.

FIG. 9 is a sectional view of a conventional semiconductor substrate housing device 800.

FIG. 10 is a cross-sectional view of a conventional semiconductor substrate accommodation device 900.

[Description of Reference Signs] 10 semiconductor substrate 20 container 30 outer lid 32 inner lid 40 seal member 50 lock portion 60 airflow 70 dust 90 compression spring 92 substrate housing chamber 94 hermetically sealed open chamber 100, 200, 300, 400, 500, 700, 8
00 semiconductor substrate accommodation device 120, 130 semiconductor processing device 140 automatic transfer device

Claims (15)

[Claims] 1. A container for accommodating a semiconductor substrate, an outer lid for sealing the inside of the container, and an interior of the container when at least the outer lid is removed to open the interior of the container. A semiconductor substrate accommodating apparatus comprising: a substrate accommodating chamber accommodating at least the semiconductor substrate and an inner lid for partitioning the chamber into a closed open chamber on the outer lid side of the substrate accommodating chamber. 2. The inner lid is connected to the outer lid so as to be interlocked with the outer lid and to be removed from the container with a delay from the outer lid. The semiconductor substrate housing device described in 1. 3. The inner lid is elastically pressed against the container by the outer lid when the outer lid seals the inside of the container. Semiconductor substrate housing device. 4. The inner lid is elastically pressed against the container by using any one of a spring, a rubber, a magnetic material, a gas or a fluid. Semiconductor substrate housing device. 5. A gas permeable material between the substrate accommodating chamber and the closed open chamber.
The semiconductor substrate housing device described in 1. 6. The semiconductor substrate accommodating apparatus according to claim 5, wherein the inner lid is made of a ventilation material. 7. The semiconductor substrate accommodating apparatus according to claim 5, wherein a ventilation material is provided at least in a portion where the inner lid and the container are in contact with each other. 8. The semiconductor substrate accommodating apparatus according to claim 6, wherein the ventilation material is made of a porous material. 9. The semiconductor substrate housing device according to claim 8, wherein the porous material has a pore diameter of 0.1 μm or less. 10. The inner lid has a projecting edge portion protruding from a main surface of the inner lid at an outer edge of the inner lid, and the container has a recessed portion for receiving the projecting edge portion on an inner side wall. The semiconductor substrate housing apparatus according to claim 1, wherein the substrate housing chamber and the sealed open chamber are partitioned by receiving the projecting edge portion in the recess. 11. The inner lid includes a pressing shaft extending to the outside of the semiconductor substrate accommodating apparatus through the outer lid, and at least when the outer lid is removed to release the airtightness inside the container. By fixing the pressing shaft, the inner lid is pressed against the container to partition the inside of the container into at least the substrate housing chamber and the closed open chamber. The semiconductor substrate housing device described in 1. 12. The semiconductor substrate storage device according to claim 1, wherein the inner lid supports the semiconductor substrate by elastically pressing the semiconductor substrate against the inner wall of the storage container. 13. A step of subjecting a semiconductor substrate to a first semiconductor treatment, a step of accommodating the semiconductor substrate subjected to the first semiconductor treatment in a semiconductor substrate accommodating apparatus, and a step of taking out the semiconductor substrate from the semiconductor substrate accommodating apparatus. In the method of manufacturing a semiconductor device, which comprises the steps of: and a step of performing a second semiconductor treatment on the semiconductor substrate taken out from the semiconductor substrate housing device, the semiconductor substrate housing device includes a container for housing a semiconductor substrate. An outer lid to be sealed, and the interior of the container when pressed by the container is partitioned into a substrate accommodating chamber in which the semiconductor substrate is accommodated and a sealed open chamber that is closer to the outer lid than the substrate accommodating chamber. An inner lid, wherein the step of taking out the semiconductor substrate from the semiconductor substrate accommodation device includes the inner lid pressing the container. The outer lid is removed and the outer lid is opened to release the airtightness inside the container, and a state in which the outer lid is removed while the inner lid is pressed against the container is predetermined. A method of manufacturing a semiconductor device, comprising: a maintaining step of maintaining a period of time; and an inner lid opening step of removing the inner lid. 14. A step of subjecting a semiconductor substrate to a first semiconductor treatment, a step of accommodating the semiconductor substrate subjected to the first semiconductor treatment in a semiconductor substrate accommodating apparatus, and a step of taking out the semiconductor substrate from the semiconductor substrate accommodating apparatus. In the method of manufacturing a semiconductor device, which comprises the steps of: and a step of performing a second semiconductor treatment on the semiconductor substrate taken out from the semiconductor substrate housing device, the semiconductor substrate housing device includes a container for housing a semiconductor substrate. An outer lid to be sealed, and the interior of the container when pressed by the container is partitioned into a substrate accommodating chamber in which the semiconductor substrate is accommodated and a sealed open chamber that is closer to the outer lid than the substrate accommodating chamber. An inner lid, wherein the step of taking out the semiconductor substrate from the semiconductor substrate accommodation device includes the inner lid pressing the container. The outer lid is removed, and the outer lid is opened to release the airtightness inside the container, and the inner lid is pressed against the container, and the space between the outer lid and the container is maintained. A method of manufacturing a semiconductor device, comprising: a feeding step of forcibly feeding gas into the closed open chamber; and an inner lid opening step of removing the inner lid. 15. The outer lid elastically presses the inner lid against the container when the outer lid seals the inside of the container, and the inner lid is removed when the inner lid is removed. 15. The method of manufacturing a semiconductor device according to claim 13, wherein the lid is detached from the container after being interlocked with the outer lid and later than the outer lid.