JPH03214645A - Housing and transfer apparatus of semiconductor wafer - Google Patents
Housing and transfer apparatus of semiconductor waferInfo
- Publication number
- JPH03214645A JPH03214645A JP2010836A JP1083690A JPH03214645A JP H03214645 A JPH03214645 A JP H03214645A JP 2010836 A JP2010836 A JP 2010836A JP 1083690 A JP1083690 A JP 1083690A JP H03214645 A JPH03214645 A JP H03214645A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- vacuum
- lock chamber
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000011261 inert gas Substances 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 66
- 239000000428 dust Substances 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 238000009489 vacuum treatment Methods 0.000 abstract 1
- 238000011109 contamination Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体ウェハの収納・搬送装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor wafer storage and transport device.
第４図は従来の牛導体装置搬送装置を示すもので、図に
おいて、■は牛導体装置の処理チャンバー、２は牛導体
装置のロードロツクチャンパー３はロードロツクチャン
パー２にウェハまたはウェハケースを出し入れするため
の扉、４はウェハ、５はウェハケース、６は真空ポンプ
である。Fig. 4 shows a conventional cow conductor device conveyance device. 4 is a wafer, 5 is a wafer case, and 6 is a vacuum pump.
次に従来装置の動作について説明する。ウエ八４または
ウェハ４を収納したウェハケース５は、大気中よりロー
ドロツクチャンバ２の扉３を開閉することによりロード
ロンクチャンバ２内にセットされる。この後真空処理装
置の場合、真空ボンプ６によってロードロンクチャンバ
２内の真空リきを行う。ロードロンクチャンバ２内が所
定の真空度に達しｋ後、ウェハ４は処理チャンバ１に搬
送される。ウェハ処理が完了した後、ウェハ４はロード
ロンクチャンバ２６こもどされ、ロードロンクチャンバ
２内を大気圧にもどし、ウェハ４またはウェハケース５
を取り出す。Next, the operation of the conventional device will be explained. The wafer 4 or the wafer case 5 containing the wafers 4 is set in the load lock chamber 2 by opening and closing the door 3 of the load lock chamber 2 from the atmosphere. After this, in the case of a vacuum processing apparatus, the inside of the loadronk chamber 2 is evacuated using a vacuum pump 6. After the inside of the loadronk chamber 2 reaches a predetermined degree of vacuum, the wafer 4 is transferred to the processing chamber 1. After the wafer processing is completed, the wafer 4 is returned to the loadronk chamber 26, the inside of the loadronk chamber 2 is returned to atmospheric pressure, and the wafer 4 or wafer case 5 is
Take out.
従来の半導体ウェハの収納・搬送装置は以上のように構
成されているので、ウェハまたはウェハケースを出し入
れする際、毎回真空引き及び真空の破壊を行なわなけれ
ばならない。この時、真空装置内Ｏこ蓄積したダストが
舞い上がり、ウェハ表面を汚染する間頌がある。また装
置間のウェハ搬送時に必然的に大気にさらされることに
より、大気中に混入している不純物原子の吸着が生じ、
ウェハ表面を汚染する問題がある。Since the conventional semiconductor wafer storage/transfer device is constructed as described above, it is necessary to draw a vacuum and break the vacuum each time a wafer or a wafer case is taken in or taken out. At this time, the dust accumulated in the vacuum apparatus flies up and contaminates the wafer surface. In addition, due to the inevitable exposure to the atmosphere during wafer transfer between devices, impurity atoms mixed in the atmosphere may be adsorbed.
There is a problem of contaminating the wafer surface.
この発明は、上記のような問題点を解消する茫めになさ
れたもので、ウェハを大気にさらすことなく、容易に半
導体装置間を搬送保管出来るとともに、真空装置内での
発塵によるウェハ表面の汚染を無くすことが出来る半導
体ウェハ収納・搬送装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is possible to easily transport and store wafers between semiconductor devices without exposing them to the atmosphere. The object of the present invention is to provide a semiconductor wafer storage/transfer device that can eliminate contamination of semiconductor wafers.
本発明に係る半導体ウェハ収稍・搬送装置は、半導体ウ
ェハ収納・搬送容器をロードロツクチャンバーに脱着司
能な構造とするとともに、半導体ウェハ収納・搬送容器
の半導体ウェハ出し入れ口の蓋をロードロツクチャンバ
ー内において開閉できるような治具を設けたものである
。The semiconductor wafer storage/transfer device according to the present invention has a structure that allows the semiconductor wafer storage/transfer container to be attached to and removed from the load lock chamber, and the lid of the semiconductor wafer inlet/outlet of the semiconductor wafer storage/transfer container is attached to the load lock chamber. It is equipped with a jig that can be opened and closed inside.
この発明（こおけるウェハ収納・搬送装置を使用するこ
とにより、処理装置間のウェハ搬送を真空または不活性
ガス雰囲気中で行なえる。このためウェハ表面汚染のな
い搬送保管が可能となる。By using the wafer storage and transfer device of the present invention, wafers can be transferred between processing devices in a vacuum or in an inert gas atmosphere. Therefore, transfer and storage without contaminating the wafer surface is possible.
以下、この発明の一実施例を図について説明する。第１
図は本発明の半導体ウェハ収納・搬送容器を示すもので
、図において、１０はウェハ収納・搬送容器、４はウェ
ハ、１１はウェハ収納・搬送容器１０の蓋、Ｌはウェハ
４の出し入れ口、１４はウェハ収納−搬送容器１０をロ
ードロツクチャンパー２に取り付けｔ際、気密性を保持
させるための０リング、化は蓋１１とウエ八収納・搬送
容器本体１０との気密性を保持させるための０リングで
ある。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure shows a semiconductor wafer storage/transport container of the present invention. In the figure, 10 is a wafer storage/transport container, 4 is a wafer, 11 is a lid of the wafer storage/transport container 10, L is an opening for loading and unloading the wafer 4, 14 is an O-ring for maintaining airtightness when attaching the wafer storage/transfer container 10 to the load lock chamber 2; It is a 0 ring.
第２図イ、口はウェハ収納・搬送容器１０の正面図及び
平面図であり、７はウエ八を保持するためのガイドであ
る。In FIG. 2A, the opening is a front view and a plan view of the wafer storage/transfer container 10, and 7 is a guide for holding the wafers.
第８図は半導体ウェハ収納・搬送容器１０をロードロン
クチャンパー２に装着した状態を表わしたものである。FIG. 8 shows a state in which the semiconductor wafer storage/transfer container 10 is attached to the loadronc chamber 2. As shown in FIG.
図において、１は午導坏装誼の処理チャンバ、２は半導
体装置のロードロンクチャンパー ８はウェハ収納・搬
送容器１０の蓋１１を開閉させるｔめの泊具、６は真空
ポンプ、９はＮ嘗等の不活性〃ス供給バルプである。In the figure, 1 is a processing chamber of the wafer assembly, 2 is a load chamber for semiconductor devices, 8 is a t-th holder for opening and closing the lid 11 of the wafer storage/transfer container 10, 6 is a vacuum pump, and 9 is an N This is a similar inert gas supply valve.
次に本発明の動作について説明する。あらかじめウエ八
４が真空状態で収納されているウェハ収納・搬送容器１
０を半導体装置四一ドロンクチャンバ２の所定の場所に
セントする。ウェハ収納・搬送容ｅｒ１０を気密性よく
セットするために容器の一部ヲ四一ドロンクチャンバ２
にはめ込み、例えば容器側のマグネットで固定する。ウ
ェハ収納・搬送容器ｌＯをセットした後、真空ボンブ６
でロードロンクチャンパー２内を所定の真空度まで真空
げきする。この後、治具８を用い、ウェハ収納・搬送容
器１０の蓋１１をはずす。この状態でウェハ収納・搬送
容器ｌＯからウェハ４を取り出し、処理チャンバ１に搬
送する。処理チャンバ１内での処理が完了した後、ウェ
ハ４は再びウエ八収納・搬送容器ｌＯにもどされ、治具
８によって蓋１１が閉められる。Next, the operation of the present invention will be explained. A wafer storage/transfer container 1 in which wafers 4 are stored in a vacuum state in advance.
0 is placed at a predetermined location in the semiconductor device 41 drone chamber 2. In order to set the wafer storage/transfer container ER10 with good airtightness, a part of the container is placed in the Drunk chamber 2.
Fit it into place and secure it with a magnet on the side of the container, for example. After setting the wafer storage/transfer container lO, vacuum bomb 6
The inside of the loadronc chamber 2 is evacuated to a predetermined degree of vacuum. Thereafter, using the jig 8, the lid 11 of the wafer storage/transfer container 10 is removed. In this state, the wafer 4 is taken out from the wafer storage/transport container IO and transported to the processing chamber 1. After the processing in the processing chamber 1 is completed, the wafer 4 is returned to the wafer storage/transfer container IO, and the lid 11 is closed by the jig 8.
この状態でロードロンクチャンパー２の真空を破壊する
。蓋１１は圧力差によって吸着され、ウェハ収納・搬送
容器ｌＯ内の真空度を保持するが、マグネットなどによ
って固定するようにしてもよい。In this state, destroy the vacuum in Lordronk Champer 2. The lid 11 is attracted by the pressure difference and maintains the degree of vacuum inside the wafer storage/transfer container IO, but it may also be fixed using a magnet or the like.
本発明によるウェハ収納・搬送容器１０は、ウェハ１枚
を収納するものに限らず、同様の構造で複数枚数のウェ
ハを収納するものでもよい。また真空装置以外の場合に
は、チャンバー２でバルブ９の開閉により不活性ガスを
供給し、チャンバー２を不活性ガス算囲気にした後、本
ウエノ＼収納・搬送容器１０からウェハ４を出し入れす
ればよい。The wafer storage/transport container 10 according to the present invention is not limited to one that stores one wafer, but may have a similar structure and store a plurality of wafers. In addition, in the case of a device other than a vacuum device, inert gas is supplied in the chamber 2 by opening and closing the valve 9, and after the chamber 2 is surrounded by an inert gas atmosphere, the wafer 4 can be taken out and taken out from the wafer storage/transfer container 10. Bye.
以上のように本発明は、半導体装置に容易に脱着司能な
ウェハ収納・搬送容器を用い、その内部を真空状態″Ｅ
だは不活性ガス雰囲気に保持出来るように構成したため
、真空処理装置内での発塵によるウェハ表面の汚染また
は大気中をウェハ搬送又は保管することにより汚染の問
題が解決出来る。As described above, the present invention uses a wafer storage/transfer container that can be easily attached to and detached from a semiconductor device, and maintains the inside of the container in a vacuum state.
Since the wafer is configured so that it can be maintained in an inert gas atmosphere, the problem of contamination of the wafer surface due to dust generation within the vacuum processing apparatus or contamination caused by transporting or storing the wafer in the atmosphere can be solved.
第１図はこの発明の一実施例の半導体ウエ／１の収納・
搬送容器を示す斜視図・第２図久、ｂはその正面図及び
平面図、第８図はこの発明の一実額例を示す路線斜視図
、第４図は従来の半導体ウェハ収納・搬送装置を示す路
線斜視図である。
図中・ｌは牛導体処理チャンバー ２はロードロツクチ
ャンパー ４は半導体ウェハ、６は真空ボンブ、７はガ
イド、８は蓋開閉用の治具、９はバルプ、ｌＯは半導体
ウェハの収納・搬送容器、ｌ１は蓋・ルは半導体ウェハ
の出し入れ口、１３、ｌ５はＯリングである。
なお図中同一符号は同一または相当部分を示す。FIG. 1 shows the storage and storage of semiconductor wafer/1 in one embodiment of the present invention.
Figures 2 and 2b are perspective views showing a transport container; Figure 8 is a front view and plan view thereof; Figure 8 is a perspective view of a route showing an example of the present invention; Figure 4 is a conventional semiconductor wafer storage and transport device. It is a route perspective view showing. In the figure, l is a conductor processing chamber, 2 is a load lock chamber, 4 is a semiconductor wafer, 6 is a vacuum bomb, 7 is a guide, 8 is a jig for opening and closing the lid, 9 is a valve, and 1O is a container for storing and transporting semiconductor wafers. , l1 is a lid, l is a semiconductor wafer loading/unloading opening, and 13 and l5 are O-rings. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
性ガス雰囲気になされるロードロックチャンバーに半導
体ウェハの出し入れ口が連通するように気密に着脱する
半導体ウェハの収納・搬送容器において、上記半導体ウ
ェハ出し入れ口を気密に塞ぐ蓋を備え、この蓋を上記ロ
ードロツクチャンバー内において開閉する治具を上記ロ
ードロックチャンバーに設けたことを特徴とする半導体
ウェハの収納・搬送装置。In a storage/transfer container for semiconductor wafers that is airtightly installed and removed so that the semiconductor wafer loading/unloading port communicates with a load-lock chamber that is adjacent to the semiconductor processing chamber and has a vacuum or inert gas atmosphere inside, the semiconductor wafer loading/unloading port is 1. A semiconductor wafer storage/transport device, characterized in that the load lock chamber is provided with a lid that airtightly closes the lid, and a jig for opening and closing the lid in the load lock chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010836A JPH03214645A (en) | 1990-01-18 | 1990-01-18 | Housing and transfer apparatus of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010836A JPH03214645A (en) | 1990-01-18 | 1990-01-18 | Housing and transfer apparatus of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03214645A true JPH03214645A (en) | 1991-09-19 |
Family
ID=11761438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010836A Pending JPH03214645A (en) | 1990-01-18 | 1990-01-18 | Housing and transfer apparatus of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03214645A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104331A (en) * | 1992-08-04 | 1994-04-15 | Internatl Business Mach Corp <Ibm> | Pressurized and hermetically sealed portable container |
| JPH06104333A (en) * | 1992-08-04 | 1994-04-15 | Internatl Business Mach Corp <Ibm> | Pressurized interface device |
-
1990
- 1990-01-18 JP JP2010836A patent/JPH03214645A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104331A (en) * | 1992-08-04 | 1994-04-15 | Internatl Business Mach Corp <Ibm> | Pressurized and hermetically sealed portable container |
| JPH06104333A (en) * | 1992-08-04 | 1994-04-15 | Internatl Business Mach Corp <Ibm> | Pressurized interface device |
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