JPH04297596A - Plating device for film-or tape-like material - Google Patents

Abstract

PURPOSE:To provide such plating device which can treat a thin tape-like material made of a synthetic resin without applying so much high tension thereto and without generating slack, etc., and allows the simple change of the treating time only with the necessary cells. CONSTITUTION:The plating cells 2, pretreating cell 3 and post treating cell 4 respectively having introducing rollers 8, immersing rollers 7 and delivery rollers 9 are continuously provided. The delivery rollers of the respective treating cells are uniaxially driven in order to deal with the tension and the slack, etc., of the tape-like material M. The device is so constituted that the height positions of the immersing rollers of the necessary cells can be adjusted and the immersion time can be adjusted only with the necessary cells.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for continuously plating tape-like objects, and particularly to a plating apparatus suitable for tape-like objects made of synthetic resin films.

0002

2. Description of the Related Art Examples of cases in which it is necessary to plate a film-like tape-like material include those related to TAB technology, which is one of the semiconductor manufacturing methods. That is, T
In AB technology, the mounting process is performed using an endless long film carrier, but this film carrier is a tape-shaped film made of synthetic resin with a lead pattern pasted with thin copper foil, and this lead pattern is coated with gold. In the manufacturing process of this film carrier, it is necessary to plate the film-like tape-like material.

By the way, although the TAB technology itself has been proposed for a relatively long time, its practical application has only recently occurred. Along with this, technical problems have also arisen regarding the plating process for the film carrier mentioned above. In other words, since the film carrier is a thin film, if a large amount of tension is applied during feeding, the lead pattern of the thin copper foil may become deformed or cause defects, or may become loose, making it difficult to process. Time management becomes unstable. Therefore, "feeding" is used to pass through various plating tanks and processing tanks in succession.
A plating equipment with sufficient consideration is required.

[0004] Furthermore, endless plating on a long tape-like object has its own problems in processing efficiency and speed. In other words, the processing time in each tank, especially the processing time in the plating tank, varies greatly depending on the type of plating metal, such as gold plating and solder plating, or even for the same plating metal, depending on various plating conditions such as the composition of the plating solution and the plating thickness. It's coming. Therefore, for efficient processing, a plating apparatus is required that can relatively change the processing time only for the necessary tanks.

[0005]

SUMMARY OF THE INVENTION Therefore, the present invention provides a film-like tape-like material without applying too much tension and without causing loosening or the like.
A further object of the present invention is to provide a plating apparatus for film-like tape-like materials in which the processing time can be easily changed for only the necessary tanks.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the plating apparatus according to the present invention is provided with various processing tanks successively provided before and after the plating tank, and each tank is provided with an introduction roller, A dipping roller and a lead-out roller are provided in order, and the film-like tape-like material to be plated is arranged along the upper surface of the lead-in roller and the lead-out roller and along the bottom surface of the dipping roller. The lead-out rollers of each tank are each driven by a single drive shaft. In order to relatively change the processing time only for the required tanks, the height position of the immersion roller relative to the liquid level can be adjusted for the required tanks, and the immersion time can be adjusted by adjusting the height position. In addition, the horizontal position of the dipping roller can be adjusted for the required tank, and the dipping time can be adjusted by adjusting the horizontal position, or,
For the required tank, the height position of the dipping roller relative to the liquid level can be adjusted, and the horizontal position of the dipping roller can be adjusted, and the dipping time can be adjusted by a combination of these height position adjustments and horizontal position adjustments. It is considered possible.

[0007]

[Function] This plating device drives the lead-out rollers in each processing zone and applies feeding force at short distance intervals to prevent excessive tension from being applied to the tape-like material. The tape-like material is prevented from loosening by applying the driving force of 1 through a single drive shaft so as to prevent a difference in rotational speed between the respective lead-out rollers.

[0008] Furthermore, the processing time is adjusted by adjusting the dipping time for the required tank, and the dipping time can be adjusted by simply adjusting the height or horizontal position of the dipping roller. All you have to do is work,
Processing time can be easily adjusted.

[0009]

[Embodiments] Examples of the present invention will be described below. As shown in FIG. 1, this plating apparatus 1 for film-like tape-like materials includes a plurality of pre-treatment tanks 3, 3, . . . Processing tank 4.4. …
... are provided continuously, and furthermore, a supply reel 5, a take-up reel 6, etc. are provided at both ends of the drying layer 4d and the processing tank row.

Each treatment tank 2.3.4 has a slightly longer immersion time than other tanks based on the immersion time required for gold plating, and except for the plating tank 2c, which is provided with two immersion rollers 7, the introduction roller 8, one immersion roller 7 and one lead-out roller 9 are provided, and a thin tape-like material M made of synthetic resin to be plated is applied to each of these rollers, and a thin tape-like material M made of synthetic resin is applied to the lead-in roller 8 and lead-out roller 9. The material is fed along the upper surface and to the dipping roller 7 along the lower surface.

Further, as shown in FIG. 2, a lead-out roller 9 is driven for each processing tank 2.3.4 including the plating tank 2c. As a result, the feeding force is applied at short distance intervals, and it is not necessary to apply too much tension to the tape-like material M. Further, the driving force of each lead-out roller 9 is driven by one axis, that is, one drive shaft 11 connected to a drive motor 10, and by keeping each lead-out roller 9 always at the same rotational speed, the tape-shaped material can be M is made so that there is no slack.

[0012] Also, in each processing tank 2.3.4, except for the washing tank, the immersion roller 7 is
With the structure shown in , the height position relative to the liquid level L can be adjusted. Specifically, the dipping roller 7
The bearings 7m that hold each end of the rotating shaft 7s are the base plate 1.
2, and both ends of this base plate 12 are fixed to the guide member 1.
The base plate 12 can be moved up and down by loosening the push screws 14 screwed into the guide members 13 and 13, and the base plate 12 can be moved up and down. 14, it will be fixed at that height position. In addition, the height position is the base plate 12
This can be confirmed by a height scale 15 provided at the top.

Furthermore, especially regarding the plating tank 2c, not only the height position but also the horizontal position of one of the dipping rollers 7 can be adjusted. in particular,
With the same structure as above, the guide members 13, 13 are fitted and held by a pair of upper and lower auxiliary guide members 16, 16, and when a push screw (not shown) is loosened, the guide members 13, 13 can be moved horizontally, When tightened, it will stay in place. Although FIG. 3 shows an example in which an adjustment mechanism is provided for the immersion roller 7 on the output side, it is also possible to provide an adjustment mechanism for the immersion roller 7 on the introduction side, or for both immersion rollers 7, 7. An adjustment mechanism may also be provided.

This is done by keeping the speed of the drive motor 10 constant, that is, by changing the immersion time only for necessary tanks without changing the immersion time (processing time) for unnecessary tanks. This is to make it possible to provide the processing time required by the plating conditions.

That is, as shown in FIG. 4, when the height of the dipping roller 7 is raised to bring it closer to the liquid level L (the state shown by the imaginary line), the tape-like material M is moved to the plating tank 2 at a shorter distance.
(2a, 2b), the immersion time can be shortened, and conversely, if the height position of the immersion roller 7 is lowered to a state that is greater than the liquid level L (state shown by the solid line), the tape-like material M is bent greatly and moves over a longer distance to plating tank 2 (2a, 2a,
2b), the immersion time can be increased. For example, if the dipping roller 7 has a diameter of 300 mm, a height adjustment range of 150 mm, and a feed speed of 500 mm/min, it is possible to provide a difference in dipping time of about 2 minutes between the shortest and longest lengths. This time difference is a sufficiently effective time difference considering that the gold plating, which has the longest dipping time, has a dipping time of about 3 minutes.

In the case of the plating bath 2c, the immersion time can also be adjusted by changing the horizontal position of the immersion roller 7, as shown in FIG. That is, the dipping roller 7
If the horizontal position of the roller is changed to reduce the inclination relative to the introduction roller 8 and the extraction roller 9, the immersion time will be increased, and vice versa, the immersion time will be shortened. In this case, if the maximum horizontal movement distance of both dipping rollers 7 is 600 mm, a dipping time difference of about 30 seconds can be provided. For washing tanks in which the height position of the dipping roller 7 is not adjusted, the height of the washing water level can be adjusted, and the soaking time can be adjusted by adjusting the liquid level. It looks like this.

[0017]

[Effects of the Invention] As explained above, in the plating apparatus according to the present invention, the lead-out rollers of each processing zone are each driven by a single drive shaft, so that excessive tension is not applied to the tape-like object. Furthermore, the process can be performed without causing any loosening or the like, and for example, plating of a film carrier in TAB technology can be performed accurately. In addition, by adjusting the height position of the dipping roller, the dipping time can be adjusted only for the necessary tanks, so for tanks that do not require changing the dipping time depending on the plating conditions, the dipping time can be kept to the minimum necessary. , overall processing efficiency can be improved.

[0018]

[Brief explanation of drawings]

FIG. 1 is a side view of a plating apparatus according to the present invention.

FIG. 2 is a plan view of the plating apparatus of FIG. 1;

FIG. 3 is a perspective view showing a height position adjustment structure of a dipping roller.

FIG. 4 is an explanatory diagram showing the state of height position adjustment of the dipping roller.

FIG. 5 is an explanatory diagram showing the state of height position adjustment of the dipping roller.

[Explanation of symbols]

1...Plating equipment 2...Plating layer 3...Pre-treatment layer 4...Post-processing layer 7...Immersion roller 8...Introduction roller 9... Leading out roller 11... Drive shaft M...Tape-like material

Claims (3)

[Claims] Claim 1: Various processing tanks are successively provided before and after the plating tank, and each tank is provided with an introduction roller, an immersion roller, and a take-out roller in this order, and a film-like material to be plated. In a plating device for film-like tape-like materials, the tape-like material is fed along the upper surface to the introduction roller and the output roller and along the lower surface to the dipping roller. Each of the lead-out rollers is driven by a single drive shaft, and the height position of the dipping roller relative to the liquid level can be adjusted for the required tank, and the dipping time can be adjusted by adjusting the height position. Features: Plating equipment for film-like and tape-like materials. [Claim 2] Various processing tanks are successively provided before and after the plating tank, and each tank is provided with an introduction roller, an immersion roller, and a lead-out roller in order, and a film-like material to be plated. In a plating device for film-like tape-like materials, the tape-like material is fed along the upper surface to the introduction roller and the output roller and along the lower surface to the dipping roller. Each of the lead-out rollers is driven by a single drive shaft, and the horizontal position of the dipping roller can be adjusted for the required tank, and the dipping time is adjusted by adjusting the horizontal position. Plating equipment for film-like tape-like materials. 3. Various processing tanks are successively provided before and after the plating tank, and each tank is provided with an introduction roller, an immersion roller, and a take-out roller in order, and a film-like material to be plated. In a plating device for film-like tape-like materials, the tape-like material is fed along the upper surface to the introduction roller and the output roller and along the lower surface to the dipping roller. Each of the lead-out rollers is driven by a single drive shaft, and the height position of the dipping roller relative to the liquid level can be adjusted for the required tank, and the horizontal position of the dipping roller can be adjusted, and these heights can be adjusted. A plating device for film-like tape-like materials, characterized in that the dipping time is adjusted by a combination of position adjustment and horizontal position adjustment.