JPH04294043A - Charge-up control device for ion implanting machine - Google Patents

Charge-up control device for ion implanting machine

Info

Publication number
JPH04294043A
JPH04294043A JP3058523A JP5852391A JPH04294043A JP H04294043 A JPH04294043 A JP H04294043A JP 3058523 A JP3058523 A JP 3058523A JP 5852391 A JP5852391 A JP 5852391A JP H04294043 A JPH04294043 A JP H04294043A
Authority
JP
Japan
Prior art keywords
charge
control device
low
substrate
energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3058523A
Other languages
Japanese (ja)
Inventor
Norishige Aoki
青木 則茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP3058523A priority Critical patent/JPH04294043A/en
Publication of JPH04294043A publication Critical patent/JPH04294043A/en
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To prevent charging-up uniformly over the whole surface of a base board to be ion implanted. CONSTITUTION:A charge-up control device for an ion implanting machine a which is low energy electron generating device 2 is installed in such a way as surrounding the ion beam 5. Thereby electrons with the same energy can be supplied evenly to the whole surface of the base board 1, and its charging-up is controlled uniformly and prevented.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、イオン注入時のチャー
ジアップによりイオン注入される基板が破壊されること
を防止するイオン注入機のチャージアップ制御装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a charge-up control device for an ion implanter that prevents a substrate into which ions are implanted from being destroyed due to charge-up during ion implantation.

【0002】0002

【従来の技術】以下に従来のイオン注入機のチャージア
ップ制御装置について説明する。図3は従来のイオン注
入機のチャージアップ制御装置の斜視図である。図3に
おいて、11は半導体ウエハに代表される基板、12は
低エネルギー電子発生機構、13は負電圧印加電極、1
4はマグネット内蔵電極、15はイオンビーム、16は
低エネルギーの電子である。
2. Description of the Related Art A conventional charge-up control device for an ion implanter will be described below. FIG. 3 is a perspective view of a conventional charge-up control device for an ion implanter. In FIG. 3, 11 is a substrate typified by a semiconductor wafer, 12 is a low-energy electron generation mechanism, 13 is a negative voltage application electrode, and 1
4 is an electrode with a built-in magnet, 15 is an ion beam, and 16 is a low energy electron.

【0003】以上のように構成されたイオン注入機のチ
ャージアップ制御装置について、以下その動作について
説明する。チャージアップ制御のために発生させた低エ
ネルギーの電子16は、基板近傍の磁界、電界またはイ
オンビーム15等により基板11の方向に曲げられ、チ
ャージアップを起こしている基板11に供給されてその
表面のチャージを中和し、チャージアップによる基板1
1の破壊を防止する。
The operation of the charge-up control device for an ion implanter constructed as described above will be explained below. Low-energy electrons 16 generated for charge-up control are bent toward the substrate 11 by the magnetic field, electric field, ion beam 15, etc. near the substrate, and are supplied to the substrate 11, which is undergoing charge-up, to the surface of the substrate 11. Neutralize the charge and increase the charge on board 1
Prevent the destruction of 1.

【0004】0004

【発明が解決しようとする課題】しかしながら上記の従
来の構成では、電子16に加わる磁界、電界等による力
は一定であるが、電子16がエネルギー分布を持ってい
るために電子16のエネルギーによってその軌跡が異な
り、結果として基板11の上で場所的に分布が不均一に
なるという課題を有していた。
[Problems to be Solved by the Invention] However, in the above-mentioned conventional configuration, the force due to the magnetic field, electric field, etc. applied to the electron 16 is constant, but since the electron 16 has an energy distribution, the energy of the electron 16 causes the force to be The problem is that the trajectories are different, and as a result, the distribution becomes uneven locally on the substrate 11.

【0005】本発明は上記従来の課題を解決するもので
、イオン注入される基板の上のチャージアップを均一に
制御することを目的とする。
The present invention solves the above-mentioned conventional problems, and aims to uniformly control charge-up on a substrate into which ions are implanted.

【0006】[0006]

【課題を解決するための手段】この目的を達成するため
に本発明のイオン注入機のチャージアップ制御装置は、
イオン注入される基板の近傍にイオンビームを取り囲ん
で低エネルギー電子発生機構を設けた構成を有している
[Means for Solving the Problems] In order to achieve this object, a charge-up control device for an ion implanter according to the present invention has the following features:
It has a configuration in which a low-energy electron generation mechanism is provided surrounding the ion beam near the substrate into which ions are implanted.

【0007】[0007]

【作用】この構成によって、基板の表面の全ての場所に
平均的に同じエネルギーの電子を供給でき、基板のチャ
ージアップを均一に制御できる。
[Operation] With this configuration, electrons having the same average energy can be supplied to all locations on the surface of the substrate, and charge-up of the substrate can be uniformly controlled.

【0008】[0008]

【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。図1は本発明の第1の実施例におけ
るイオン注入機のチャージアップ制御装置の斜視図であ
る。図1において、1は半導体ウエハに代表される基板
、2は低エネルギー電子発生機構、2a〜2dは低エネ
ルギー電子発生器、3は負電圧印加電極、4はマグネッ
ト内蔵電極、5はイオンビーム、6は低エネルギーの電
子である。このようにイオンビーム5を4個の低エネル
ギー電子発生器2a〜2dで取り囲むことにより、基板
1の面上にほぼ同一のエネルギーを持つ電子6を均一に
供給することができる。なお、図1に示す第1の実施例
では、低エネルギー電子発生機構2を4個の低エネルギ
ー発生器2a〜2dで構成した例を示したが、さらに分
割して4個以上の低エネルギー発生器で構成することに
より一層の効果が得られる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a charge-up control device for an ion implanter according to a first embodiment of the present invention. In FIG. 1, 1 is a substrate represented by a semiconductor wafer, 2 is a low-energy electron generation mechanism, 2a to 2d are low-energy electron generators, 3 is a negative voltage application electrode, 4 is an electrode with a built-in magnet, 5 is an ion beam, 6 is a low energy electron. By surrounding the ion beam 5 with the four low-energy electron generators 2a to 2d in this manner, electrons 6 having approximately the same energy can be uniformly supplied onto the surface of the substrate 1. In addition, in the first embodiment shown in FIG. 1, an example was shown in which the low-energy electron generation mechanism 2 was configured with four low-energy generators 2a to 2d, but it can be further divided into four or more low-energy generators. Even more effects can be obtained by configuring it with a container.

【0009】図2は本発明の第2の実施例におけるイオ
ン注入機のチャージアップ制御装置の斜視図である。な
お、図2において図1に示す第1の実施例と同一箇所に
は同一符号を付し、詳細説明を省略した。図2に示す第
2の実施例が第1の実施例と異なる点は低エネルギー発
生機構7である。第2の実施例では低エネルギー発生機
構7が円環状になっており、基板1の全面により均一の
低エネルギー電子6を供給することができる。
FIG. 2 is a perspective view of a charge-up control device for an ion implanter according to a second embodiment of the present invention. Note that in FIG. 2, the same parts as in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and detailed explanations are omitted. The second embodiment shown in FIG. 2 differs from the first embodiment in a low energy generation mechanism 7. In the second embodiment, the low energy generation mechanism 7 has an annular shape, and can supply low energy electrons 6 more uniformly over the entire surface of the substrate 1.

【0010】0010

【発明の効果】以上のように本発明は、低エネルギー電
子発生機構をイオンビームを囲むように、複数個のまた
は円環状の低エネルギー発生器で構成することにより、
基板の表面の全ての場所に平均的に同じエネルギーの電
子を供給し、基板のチャージアップを均一に制御できる
優れたイオン注入機のチャージアップ制御装置を実現で
きるものである。
As described above, the present invention provides a low-energy electron generation mechanism that includes a plurality of or annular low-energy generators surrounding an ion beam.
It is possible to realize an excellent charge-up control device for an ion implanter that can uniformly control the charge-up of the substrate by supplying electrons with the same average energy to all locations on the surface of the substrate.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明の第1の実施例におけるイオン注入機の
チャージアップ制御装置の斜視図
FIG. 1 is a perspective view of a charge-up control device for an ion implanter in a first embodiment of the present invention.

【図2】本発明の第2の実施例におけるイオン注入機の
チャージアップ制御装置の斜視図
FIG. 2 is a perspective view of a charge-up control device for an ion implanter according to a second embodiment of the present invention.

【図3】従来のイオン注入機のチャージアップ制御装置
の斜視図
[Figure 3] Perspective view of a conventional ion implanter charge-up control device

【符号の説明】[Explanation of symbols]

1  基板 2  低エネルギー電子発生機構 5  イオンビーム 1 Board 2 Low energy electron generation mechanism 5 Ion beam

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】イオン注入される基板の近傍にイオンビー
ムを取り囲んで低エネルギー電子発生機構を設けたイオ
ン注入機のチャージアップ制御装置。
1. A charge-up control device for an ion implanter, which includes a low-energy electron generation mechanism surrounding an ion beam near a substrate into which ions are implanted.
【請求項2】低エネルギー電子発生機構が複数個の低エ
ネルギー電子発生器からなる請求項1記載のイオン注入
機のチャージアップ制御装置。
2. The charge-up control device for an ion implanter according to claim 1, wherein the low-energy electron generation mechanism comprises a plurality of low-energy electron generators.
【請求項3】低エネルギー電子発生機構が円環状の低エ
ネルギー電子発生器からなる請求項1記載のイオン注入
機のチャージアップ制御装置。
3. The charge-up control device for an ion implanter according to claim 1, wherein the low-energy electron generation mechanism comprises a circular low-energy electron generator.
JP3058523A 1991-03-22 1991-03-22 Charge-up control device for ion implanting machine Pending JPH04294043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3058523A JPH04294043A (en) 1991-03-22 1991-03-22 Charge-up control device for ion implanting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3058523A JPH04294043A (en) 1991-03-22 1991-03-22 Charge-up control device for ion implanting machine

Publications (1)

Publication Number Publication Date
JPH04294043A true JPH04294043A (en) 1992-10-19

Family

ID=13086791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3058523A Pending JPH04294043A (en) 1991-03-22 1991-03-22 Charge-up control device for ion implanting machine

Country Status (1)

Country Link
JP (1) JPH04294043A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100491471B1 (en) * 1996-02-01 2005-08-04 마이크론 테크놀로지 인코포레이티드 Large current type ion implanting device and ion implanting method using implanting device
JP2019523531A (en) * 2016-08-04 2019-08-22 ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド Electrode, accelerator column, and ion implantation apparatus including them

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100491471B1 (en) * 1996-02-01 2005-08-04 마이크론 테크놀로지 인코포레이티드 Large current type ion implanting device and ion implanting method using implanting device
JP2019523531A (en) * 2016-08-04 2019-08-22 ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド Electrode, accelerator column, and ion implantation apparatus including them

Similar Documents

Publication Publication Date Title
US6521895B1 (en) Wide dynamic range ion beam scanners
JP4998972B2 (en) Ion implantation apparatus and ion implantation method
US7358510B2 (en) Ion implanter with variable scan frequency
US5767522A (en) Ion-implantation system using split ion beams
JPH06275229A (en) Ion implanting device for emitting electron shower simultaneously with ion plantation
JPH04294043A (en) Charge-up control device for ion implanting machine
US6528804B1 (en) Method and apparatus for low energy ion implantation
US6348764B1 (en) Indirect hot cathode (IHC) ion source
JP2550077B2 (en) Ion implantation method and device
JPH09167593A (en) Ion implantation device
JP2936859B2 (en) Ion implanter
JP2824609B2 (en) Ion implantation method and apparatus
JP2023001063A (en) Charge carrier generation source
JPH05136078A (en) Ion implantor
JP2005026189A (en) Ion beam irradiation device
JPH11329335A (en) Ion doping device
JPH0744023B2 (en) Ion implanter
JPS6328861A (en) Surface treatment device
JP3473219B2 (en) Ion beam generator
JPS63301455A (en) Ion beam radiation device
JP3265988B2 (en) Ion irradiation equipment
JPH06132006A (en) Ion implantation device radiating electron shower simultaneously with ion implantation
JPH03233849A (en) Ion implantation machine
JPS63207127A (en) Ion implantation apparatus
JPH02288143A (en) Low energy electron generating device