JPH0428894A - Gold electrolytic solution - Google Patents
Gold electrolytic solutionInfo
- Publication number
- JPH0428894A JPH0428894A JP13402190A JP13402190A JPH0428894A JP H0428894 A JPH0428894 A JP H0428894A JP 13402190 A JP13402190 A JP 13402190A JP 13402190 A JP13402190 A JP 13402190A JP H0428894 A JPH0428894 A JP H0428894A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- ammonium
- current density
- contg
- thallous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 239000010931 gold Substances 0.000 title claims abstract description 24
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 24
- 239000008151 electrolyte solution Substances 0.000 title description 2
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 229910052716 thallium Inorganic materials 0.000 claims abstract description 9
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims abstract description 9
- 150000003863 ammonium salts Chemical class 0.000 claims abstract description 6
- 239000003792 electrolyte Substances 0.000 claims description 14
- -1 organic acid salt Chemical class 0.000 claims description 4
- LJJNEPKMBSUEND-UHFFFAOYSA-O azanium;gold;cyanide Chemical compound [NH4+].[Au].N#[C-] LJJNEPKMBSUEND-UHFFFAOYSA-O 0.000 claims description 3
- 239000013522 chelant Substances 0.000 claims 2
- 229910002651 NO3 Inorganic materials 0.000 claims 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- IQXHAJSMTNDJGA-UHFFFAOYSA-O azanium;gold(1+);dicyanide Chemical compound [NH4+].[Au+].N#[C-].N#[C-] IQXHAJSMTNDJGA-UHFFFAOYSA-O 0.000 abstract description 4
- 229910000374 thallium(I) sulfate Inorganic materials 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 3
- YTQVHRVITVLIRD-UHFFFAOYSA-L thallium sulfate Chemical compound [Tl+].[Tl+].[O-]S([O-])(=O)=O YTQVHRVITVLIRD-UHFFFAOYSA-L 0.000 abstract description 3
- 239000005696 Diammonium phosphate Substances 0.000 abstract description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000388 diammonium phosphate Inorganic materials 0.000 abstract description 2
- 235000019838 diammonium phosphate Nutrition 0.000 abstract description 2
- 238000005868 electrolysis reaction Methods 0.000 abstract description 2
- FFRBMBIXVSCUFS-UHFFFAOYSA-N 2,4-dinitro-1-naphthol Chemical compound C1=CC=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FFRBMBIXVSCUFS-UHFFFAOYSA-N 0.000 abstract 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229940119523 thallium sulfate Drugs 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、９９．９％以上の純金析出物を得ることか
でき、良好な耐熱性、半田付は性、ボンデインク性を要
求されるエレクトロニクス分野、特に、ＩＣフレーム、
ＩＣウェハ、チップオンボート基板、テープボンデイン
ク材などのメツキに好適な金電解液に関する。[Detailed Description of the Invention] <Industrial Field of Application> This invention is applicable to electronics where it is possible to obtain a pure gold deposit of 99.9% or more, and which requires good heat resistance, solderability, and bondability. fields, especially IC frames,
This invention relates to a gold electrolyte suitable for plating IC wafers, chip-on-board substrates, tape bonding ink materials, etc.
〈従来の技術〉
アルカリ金属イオンを実質的に含まないシアン化金アン
モニウムを用いた電解液かすてに提案されている（特公
昭４９−４６４５８号参照）。この電解液は、広範囲の
電流密度にわたって、一定のカソード効率を得られる点
で優れる。<Prior Art> An electrolytic solution using gold ammonium cyanide that does not substantially contain alkali metal ions has been proposed (see Japanese Patent Publication No. 49-46458). This electrolyte is advantageous in that it provides constant cathode efficiency over a wide range of current densities.
〈発明が解決しようとする課題〉
しかしながら、このような従来の電解液にあっては、ｉ
）析出物の色調に部分的なムラが生じる、ｉｉ）電流密
度をあまり高（できない、ｉｎ）建浴当初の低電流密度
における析出効率が９０％以下と低い、ｉｖ）析出物の
厚さの均一性に欠ける、などの課題もあった。<Problem to be solved by the invention> However, in such conventional electrolytes, i.
) Partial unevenness occurs in the color tone of the precipitate, ii) The current density cannot be set too high (in) The deposition efficiency is low at 90% or less at the low current density at the time of bath construction, iv) The thickness of the precipitate is There were also issues such as lack of uniformity.
この発明に係る金電解液は、このような従来の課題を解
決するために提案されたものである。The gold electrolyte according to the present invention has been proposed to solve these conventional problems.
〈課題を解決するための手段〉
この発明に係る金電解液は、上記の目的を達成するため
に、金をシアン化金アンモニウムの形で含有し、使用す
る電導塩の９０ｗｔ％以上がアンモニウム塩であり、０
．１〜５００ｍｇ／Ａの第一又は第二タリウムを含有し
て成るものである。使用するタリウムは、可溶性塩であ
れば、第一タリウムでも第二タリウムでも良く、特に硫
酸塩、硝酸塩、有機酸塩、キレートが好ましい。このタ
リウムの量は０．１〜５００ｍｇ／ｌであり、０．１ｍ
ｇ／１未満では顕著な効果を得られず、５００ｍｇ／ｌ
より多く添加してもそれ以上の効果を得られない。また
、電導塩はキレート、有機酸、無機酸のアンモニウム塩
が好適であり、これらを単独あるいは数種類混合して使
用できる。本発明の金電解液により得られる全析出物は
、９９．９％以上の純度を有すると共に、良好な耐熱性
、半田付は性ボンディング性を備えるため、エレクトロ
ニクス分野の金メツキに最適である。特に、浴電圧が従
来技術と比べて低いため、レジスト被膜や有機被膜への
ダメージが少なく、ＩＣウェハ、チップオンボード基板
、テープボンディング材等のメツキに適している。しか
も、比較的高い電流密度をとれると共に、低電流密度に
おける析出率も高く、析出物の厚さか比較的均一で、そ
の表面の色調にムラがない。<Means for Solving the Problems> In order to achieve the above object, the gold electrolyte according to the present invention contains gold in the form of gold ammonium cyanide, and 90 wt% or more of the conductive salt used is an ammonium salt. and 0
．． It contains 1 to 500 mg/A of primary or secondary thallium. The thallium used may be either primary or secondary thallium as long as it is a soluble salt, with sulfates, nitrates, organic acid salts, and chelates being particularly preferred. The amount of thallium is 0.1 to 500 mg/l, and 0.1 m
If less than 500 mg/l, no significant effect can be obtained.
Even if a larger amount is added, no further effect can be obtained. Further, suitable conductive salts are chelates, ammonium salts of organic acids, and inorganic acids, and these can be used alone or in combination. The total precipitate obtained by the gold electrolyte of the present invention has a purity of 99.9% or more, and has good heat resistance and solderability, making it ideal for gold plating in the electronics field. In particular, since the bath voltage is lower than that of conventional techniques, there is less damage to resist films and organic films, making it suitable for plating IC wafers, chip-on-board substrates, tape bonding materials, etc. In addition, a relatively high current density can be obtained, and the deposition rate at low current densities is also high, the thickness of the deposits is relatively uniform, and the color tone of the surface is uniform.
く実 施 例〉
第１実施例
電解液組成：
・クエン酸アンモニウム
・リン酸２アンモニウム
・シアン化金アンモニウム
・・−１５０ｇ／ｎ
・−−３０ｇ／ １
８ｇ／ｉ
（金メタルとして）
１ ｍ ｇ ／ （！
（タリウムとして）
６．５
・硫酸第一タリウム
・ｐＨ
操作条件：
・浴温
・電流密度・・
・電解時間
上記の電解液１
１を用い、
５８Ｃ
Ｉ Ａ／ｄｒＱ２
１０分間
２ ａｍ Ｘ ４ ｃｍ Ｘ厚さ０゜
２５胴の真鍮板に５μｍの光沢ニッケルメッキを施した
テストピースに対し、上記操作条件で金メツキを行った
。Example First Example Electrolyte composition: - Ammonium citrate, diammonium phosphate, ammonium gold cyanide...-150 g/n -30 g/18 g/i (as gold metal) 1 mg / (! (As thallium) 6.5 - Thallous sulfate - pH Operating conditions: - Bath temperature - Current density... - Electrolysis time Using the above electrolyte 1 1, 58C I A/drQ2 10 minutes 2 am A test piece made of a 4 cm x 0°25 mm brass plate plated with 5 μm bright nickel was plated with gold under the above operating conditions.
得られた全析出物は明るい黄金色を呈し、その表面色調
にはムラがなく、厚さも均一であった。The entire precipitate obtained had a bright golden color, no uneven surface color, and a uniform thickness.
また、検査によれば、析出率は９８％で、純度は９９．
９％あった。Also, according to the test, the precipitation rate was 98% and the purity was 99.
It was 9%.
第２実施例
前記第１実施例の硫酸第一タリウムを硫酸第二タリウム
（タリウムとして１０ｍｇ／ｆ）に変えて同様の金メツ
キを行ってみた。電解液組成のその他の成分及び操作条
件は先の実施例と同様である。結果は同様に、色調にム
ラがなく且つ均一な厚さの全析出物を得ることができた
。析出率及び純度も第１実施例と同様に高かった。Second Example Gold plating was carried out in the same manner as in the first example except that thallium sulfate was replaced with thallium sulfate (10 mg/f as thallium). Other components of the electrolyte composition and operating conditions are the same as in the previous example. As a result, it was possible to obtain a total precipitate with uniform color tone and uniform thickness. The precipitation rate and purity were also high as in the first example.
〈発明の効果〉
この発明に係る金電解液は、以上説明してきた如き内容
のものであって、９９，９％以上の純度を有し、良好な
耐熱性、半田付は性、ボンディング性を備えた全析出物
を得ることができるので、エレクトロニクス分野の金メ
ツキに最適である。また、比較的高い電流密度をとれる
と共に、低電流密度における析出率も高く、析出物の厚
さが比較的均一で、その表面の色調にムラがない。<Effects of the Invention> The gold electrolyte according to the present invention has the content as explained above, has a purity of 99.9% or more, and has good heat resistance, soldering properties, and bonding properties. It is ideal for gold plating in the electronics field, since it is possible to obtain a total deposit with a certain amount of properties. In addition, a relatively high current density can be obtained, the precipitation rate is high at low current densities, the thickness of the precipitates is relatively uniform, and the color tone of the surface is uniform.
Claims (4)
する電導塩の９０ｗｔ％以上がアンモニウム塩であり、
０．１〜５００ｍｇ／ｌの第一又は第二タリウムを含有
して成る金電解液。(1) Contains gold in the form of gold ammonium cyanide, and 90 wt% or more of the conductive salt used is ammonium salt,
A gold electrolyte containing 0.1 to 500 mg/l of primary or secondary thallium.
酸塩、キレート、の少なくともいずれか１つの可溶性塩
である請求項１記載の金電解液。(2) The gold electrolyte according to claim 1, wherein the primary or secondary thallium is a soluble salt of at least one of sulfate, nitrate, organic acid salt, and chelate.
、無機酸塩、の少なくともいずれか１つである請求項１
記載の金電解液。(3) Claim 1 wherein the ammonium salt used is at least one of a chelate, an organic acid salt, and an inorganic acid salt.
Gold electrolyte as described.
液。(4) The gold electrolyte according to claim 1, which has a pH of 5 to 7.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13402190A JPH0428894A (en) | 1990-05-25 | 1990-05-25 | Gold electrolytic solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13402190A JPH0428894A (en) | 1990-05-25 | 1990-05-25 | Gold electrolytic solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428894A true JPH0428894A (en) | 1992-01-31 |
Family
ID=15118527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13402190A Pending JPH0428894A (en) | 1990-05-25 | 1990-05-25 | Gold electrolytic solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428894A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6238435A (en) * | 1985-08-13 | 1987-02-19 | Nippon Kogaku Kk <Nikon> | Control device for diaphragm of camera |
-
1990
- 1990-05-25 JP JP13402190A patent/JPH0428894A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6238435A (en) * | 1985-08-13 | 1987-02-19 | Nippon Kogaku Kk <Nikon> | Control device for diaphragm of camera |
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