JPH04287349A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To facilitate modification work after soldering to a wiring board, by using a structure wherein a heat sink is fixed by fastening a heat sink side hook to a fitment on the ceramic board side. CONSTITUTION:An integrated circuit 2 is fixed on a ceramic board 1. A lid 6 is fixed to the ceramic board 1 and tightly closed. A heat sink 7 is so fixed that a hook 8 can be rotated. A heat dissipating sheet 9 is sandwiched by the board 1 and the heat sink 7. The heat sink 7 is fixed by fastening the hook 9 to a fitment 10 arranged on the board 1 side. The heat generated in the integrated circuit 2 travels the board 1, and is conducted to the heat sink 7 through the heat dissipating sheet 9. Thus the heat is transmitted to cooling air. By disengaging the hook 8 from the fitment 10, detaching is facilitated after leads 3 are soldered to the wiring board 5.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing integrated circuit elements used in electronic equipment such as information processing equipment, and more particularly to an integrated circuit package having a structure in which a heat sink for cooling can be easily attached and detached.

0002

[Prior Art] Generally, electronic equipment such as information processing equipment is constructed by storing integrated circuit elements in plastic or ceramic packages and mounting multiple cards on wiring boards in a rack. Cooled by forced air cooling. In recent years, integrated circuit devices have become more highly integrated and the amount of heat generated by the devices has increased, so a heat sink is often attached to an integrated circuit package to increase the heat transfer area and reduce thermal resistance.

FIG. 3 shows a conventional integrated circuit package. A heat sink 302 is attached to the integrated circuit package 301 in advance by adhesion or brazing. Leads 304 are attached to the wiring board 303 by soldering them onto soldering pads 305 .

0004

[Problems to be Solved by the Invention] In recent years, the speed of electronic equipment such as information processing devices has been significantly increased, and integrated circuit packages have been developed to minimize the propagation time of signals between integrated circuit elements on wiring boards. There is a need for high-density mounting with small spacing. On the other hand, a modification pattern is formed on the wiring board so that errors in circuit design can be corrected, and modifications can be made by wiring on the wiring board as necessary.

[0005] In the conventional integrated circuit package described above, the heat sink is fixed in a state that cannot be easily removed by adhesion or brazing, and if the heat sink is arranged and mounted at small intervals on the wiring board, it is difficult to modify the wiring. work becomes difficult.

Furthermore, since the heat sink is directly fixed to the integrated circuit package, it is necessary to match the thermal expansion coefficients of the integrated circuit package material and the heat sink material, which has the disadvantage that it is necessary to select a material that is difficult to process for the heat sink. There is.

[0007]

[Means for Solving the Problems] An integrated circuit package of the present invention includes an integrated circuit element mounted on a ceramic substrate and a heat sink attached for heat radiation, wherein the integrated circuit package is provided on a side surface of the heat sink,
The heat sink has a hook that rotates around an axis fixed to the heat sink, and a stopper provided on the ceramic substrate, and the ceramic substrate and the heat sink are fixed by hooking the hook to the stopper. It is characterized by

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view of this embodiment. 1 is a ceramic substrate,
2 is an integrated circuit element, 3 is a lead, and the integrated circuit element 2
A signal from the ceramic substrate 1 is connected to a lead 3 via a wiring pattern in the ceramic substrate 1, and is connected to a wiring board 5 by soldering on a soldering pad 4.

The integrated circuit element 2 is mounted on the ceramic substrate 1, and the lid 6 is fixed to the ceramic substrate 1 and sealed. 7 is a heat sink to which a hook 8 is rotatably attached, a heat dissipation sheet 9 is sandwiched between it and the ceramic substrate 1, and the heat sink is fixed by hooking the hook 8 to a stopper 10 provided on the ceramic substrate side.

The heat generated in the integrated circuit element 2 is transmitted to the ceramic substrate 1, then to the heat sink 7 via the heat dissipation sheet 9, and then to the cooling air.

The heat sink 7 can be easily removed even after the leads 3 are soldered to the wiring board 5 by removing the hooks 8 from the fasteners 10 as shown by broken lines in FIG. Therefore, the integrated circuit package is connected to the wiring board 5.
Even if the heat sinks 7 are densely arranged on the top, if wiring is required for modification, the work can be easily done by removing the heat sink 7.

Furthermore, when the heat sink 7 is directly bonded or brazed to the ceramic substrate 1, it is necessary to select a material for the heat sink 7 that has a coefficient of thermal expansion comparable to that of the ceramic substrate 1. The material of the heat sink 5 can be freely selected, such as a material that can be easily processed, without particular consideration of the coefficient of thermal expansion.

[0014]

[Effects of the Invention] As explained above, the integrated circuit package of the present invention has a structure in which the heat sink is fixed by hooking the hook on the heat sink side to the stopper on the ceramic substrate side, so that the heat sink can be easily attached and detached. This has the effect of making it easier to modify the integrated circuit package after it has been soldered to the wiring board.
By adopting a structure in which the heat sink is not directly fixed to the integrated circuit package, there is an effect that the material of the heat sink can be freely selected.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a longitudinal cross-sectional view of the embodiment shown in FIG. 1;

FIG. 3 shows a conventional integrated circuit package.

[Explanation of symbols]

1 Ceramic substrate 2 Integrated circuit element 3 Lead 4 Soldering pad 5. Wiring board 6 Lid 7 Heat sink 8 Hook 9 Heat dissipation sheet 10 Stopper 301 Ceramic substrate 302 Heat sink 303 Wiring board 304 Lead 305 Soldering pad

Claims (1)

[Claims] 1. In an integrated circuit package in which an integrated circuit element is mounted on a ceramic substrate and a heat sink is attached for heat radiation, a hook is provided on a side surface of the heat sink and rotates around an axis fixed to the heat sink. and a fastener provided on the ceramic substrate, and the ceramic substrate and the heat sink are fixed by hooking the hook onto the fastener.