JPH04286309A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor

Info

Publication number
JPH04286309A
JPH04286309A JP5105491A JP5105491A JPH04286309A JP H04286309 A JPH04286309 A JP H04286309A JP 5105491 A JP5105491 A JP 5105491A JP 5105491 A JP5105491 A JP 5105491A JP H04286309 A JPH04286309 A JP H04286309A
Authority
JP
Japan
Prior art keywords
metal
plated
terminal
nickel
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5105491A
Other languages
Japanese (ja)
Other versions
JP3149447B2 (en
Inventor
Akio Otake
大竹 章夫
Osamu Torigoe
鳥越 理
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP05105491A priority Critical patent/JP3149447B2/en
Publication of JPH04286309A publication Critical patent/JPH04286309A/en
Application granted granted Critical
Publication of JP3149447B2 publication Critical patent/JP3149447B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To weld the metal terminal of an aluminum rod, which is exposed by cutting, to a substrate using metal-plate piece of three-layer structure copper substrate having a treated nickel-plated surface on one side of the copper substrate, such as phosphor bronze and the like used as terminal material, and also having a treated solder-plated surface on a part. CONSTITUTION:Outer connection terminals 28 and 28, consisting of copper material, are welded respectively to the metal terminals 24 and 24, which become both electrodes of a capacitor element, by laser welding 36 and 36. The outer connection terminals 28 and 28 have a three-layer structure formed by nickel-plating 34 on one side of a copper substrate 30 consisting of phosphor bronze and the like. The connection terminals 28 and 28 of three-layer structure are attached by laser welding 36 to the metal terminals 24 and 24, which are exposed by cutting, by projecting a laser beam on the nickel plated surface 32. Consequently, as an aluminum rod electrode terminal, which is exposed by cutting, and an alloy can be formed easily when a welding work is conducted, high welding strength can be maintained.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明は、小形電子機器で使用
されるプリント基板等への表面実装に適した固体電解コ
ンデンサに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid electrolytic capacitor suitable for surface mounting on printed circuit boards used in small electronic devices.

【0002】0002

【従来の技術】電子機器の小形化および携帯化が進むに
伴い、機器を構成する電子部品の高密度実装技術が必要
不可欠なものとなってきている。高密度実装化のため、
電子部品の中でも多数使用される抵抗器や積層セラミッ
クコンデンサ等の小形化要求は強く、現在ではチップ部
品と呼ばれる大きさ1.6mm×0.8mm(1608
部品)や1.0mm×0.5mmの超小形品(1005
部品)までが開発され使用されるに至っている。このよ
うな小形化が要求される状況のもとで、比較的大容量の
特性を有する電解コンデンサも従来のような円筒形のリ
ード端子付きのものから、より一層の小形化を図り表面
実装に適したリードレスの角型固体電解コンデンサが開
発されてきている。
2. Description of the Related Art As electronic equipment becomes smaller and more portable, high-density packaging technology for electronic components constituting the equipment has become essential. For high-density packaging,
There is a strong demand for miniaturization of resistors, multilayer ceramic capacitors, etc., which are used in large numbers among electronic components.
parts) and ultra-small products of 1.0 mm x 0.5 mm (1005
Even parts) have been developed and are now in use. Under these circumstances where miniaturization is required, electrolytic capacitors with relatively large capacity characteristics are also being made smaller and surface-mounted instead of conventional ones with cylindrical lead terminals. Suitable leadless prismatic solid electrolytic capacitors have been developed.

【0003】このような角型固体電解コンデンサは、プ
ラス電極およびマイナス電極用の各金属箔にアルミ棒の
金属端子をステッチあるいは超音波溶接等によりそれぞ
れ取付けた後、セパレータを介して各金属箔を巻回し、
電解液に含浸して焼成し、化成処理を行うことによりコ
ンデンサ素子を形成し、このコンデンサ素子を樹脂ケー
スにポッティング樹脂と共に収納して封口し、ポッティ
ング樹脂の硬化後、さらに前記樹脂ケースの金属端子側
の面を金属端子とポッティング樹脂とが露出するよう所
望個所で切断し、次いでこの露出した前記各金属端子に
アルミの外部接続用端子を溶接等で接続することにより
製造される。前記切断により露出したアルミ棒の金属端
子と外部接続用端子との溶接部には、外部接続用端子と
露出した金属端子のアルミと充分な溶接強度が要求され
るため、金属端子と同種金属のアルミを端子材として使
用している。
[0003] Such a rectangular solid electrolytic capacitor is manufactured by attaching aluminum rod metal terminals to each metal foil for the positive and negative electrodes by stitching or ultrasonic welding, and then attaching each metal foil through a separator. winding,
A capacitor element is formed by impregnating it with an electrolytic solution, firing it, and performing a chemical conversion treatment. This capacitor element is then stored in a resin case together with a potting resin and sealed. After the potting resin has hardened, the metal terminal of the resin case is further sealed. It is manufactured by cutting the side surface at desired locations to expose the metal terminals and the potting resin, and then connecting aluminum external connection terminals to the exposed metal terminals by welding or the like. The welding part between the metal terminal of the aluminum rod exposed by the cutting and the external connection terminal requires sufficient welding strength with respect to the aluminum of the external connection terminal and the exposed metal terminal. Aluminum is used as the terminal material.

【0004】0004

【発明が解決しようとする課題】しかしながら、前述し
たように切断により露出したアルミ棒の金属端子と外部
接続用端子とを溶接する製造方法によって製造された固
体電解コンデンサによれば、外部接続用端子の端子材と
してアルミを使用するので溶接部は同種金属同士の溶接
であり、充分高い溶接強度を有するけれども、端子材と
しての強度に欠けるという問題点があった。また、アル
ミを端子材とするため、はんだメッキを行うことが困難
でありプリント基板等へのはんだ付けを難しくするとい
う問題点もあった。
[Problems to be Solved by the Invention] However, according to the solid electrolytic capacitor manufactured by the manufacturing method of welding the metal terminal of the aluminum rod exposed by cutting and the external connection terminal as described above, the external connection terminal Since aluminum is used as the terminal material, the welded part is a weld of the same type of metal, and although it has sufficiently high welding strength, there is a problem that it lacks the strength as a terminal material. In addition, since aluminum is used as the terminal material, it is difficult to perform solder plating, making it difficult to solder to a printed circuit board or the like.

【0005】そこで、本発明の目的は、切断により露出
したアルミ棒の金属端子と充分高い溶接強度を持って溶
接することができ、しかもはんだメッキも行いやすい端
子材を外部接続用端子として使用した固体電解コンデン
サを提供するにある。
[0005] Therefore, an object of the present invention is to use a terminal material as an external connection terminal that can be welded with sufficiently high welding strength to the metal terminal of the aluminum rod exposed by cutting, and is also easy to solder plate. To provide solid electrolytic capacitors.

【0006】[0006]

【課題を解決するための手段】本発明に係る固体電解コ
ンデンサは、プラス電極およびマイナス電極用の各金属
箔にアルミ棒の金属端子をステッチあるいは超音波溶接
等により取付けた後、セパレータを介して各金属箔を巻
回し、電解液に含浸して焼成し、かつ化成処理を行うこ
とによりコンデンサ素子を形成し、このコンデンサ素子
を樹脂ケースに収納してエポキシ樹脂等のポッティング
樹脂で封口し、さらに前記樹脂ケースの封口側を切断し
た後、切断により露出した前記各金属端子に外部接続用
端子をレーザ溶接で接続して構成される固体電解コンデ
ンサにおいて、前記外部接続用端子の端子材として燐青
銅等の銅系基材、該銅系基材の片面に処理したニッケル
メッキ面、さらにこのニッケルメッキ面の一部に処理し
たはんだメッキ面からなる3層構造の銅系基材の金属板
片を使用し、該金属板片を前記金属端子側が銅系基材、
レーザ照射面がニッケルメッキ面およびプリント基板等
への表面実装側がはんだメッキ面となるよう接続構成し
たことを特徴とする。
[Means for Solving the Problems] A solid electrolytic capacitor according to the present invention is provided by attaching a metal terminal of an aluminum rod to each metal foil for a positive electrode and a negative electrode by stitching or ultrasonic welding, and then attaching the metal terminal through a separator. A capacitor element is formed by winding each metal foil, impregnating it in an electrolytic solution, firing it, and performing a chemical conversion treatment.The capacitor element is then placed in a resin case and sealed with a potting resin such as epoxy resin. In a solid electrolytic capacitor configured by cutting the sealing side of the resin case and then connecting external connection terminals to each of the metal terminals exposed by the cutting by laser welding, phosphor bronze is used as the terminal material of the external connection terminals. A metal plate piece of a copper base material with a three-layer structure consisting of a copper base material such as, a nickel plated side treated on one side of the copper base material, and a solder plated side treated on a part of the nickel plated side. and the metal terminal side of the metal plate piece is a copper-based base material,
The device is characterized in that the laser irradiation surface is connected to the nickel-plated surface, and the surface mounting side to a printed circuit board or the like is the solder-plated surface.

【0007】[0007]

【作用】本発明に係る固体電解コンデンサによれば、外
部接続用端子の端子材としてアルミと合金を形成し易い
燐青銅等の銅系基材を用いることによりアルミ棒金属端
子との強度の高い溶接が行える。さらに、この銅系基材
の片面に施したニッケルメッキ面はレーザ光の吸収効率
を高くし、はんだメッキ面はプリント基板等へのはんだ
付けを容易にする。
[Function] According to the solid electrolytic capacitor of the present invention, by using a copper-based base material such as phosphor bronze that easily forms an alloy with aluminum as the terminal material for the external connection terminal, the strength between the aluminum bar metal terminal and the aluminum bar metal terminal is high. Can weld. Furthermore, the nickel-plated surface on one side of this copper base material increases the absorption efficiency of laser light, and the solder-plated surface facilitates soldering to printed circuit boards and the like.

【0008】[0008]

【実施例】次に本発明に係る固体電解コンデンサの実施
例につき、添付図面を参照しながら以下詳細に説明する
。図1は本発明の一実施例を示す固体電解コンデンサの
外部接続用端子部分の構造を示す概略図であり、図1の
(A)は外部接続用端子部の厚さ方向を拡大して示す側
面図、図1の(B)はコンデンサ素子の金属端子側を見
た外部接続用端子の平面図である。図1の(B)におい
て参照符号22は樹脂ケースを示し、樹脂ケース22に
は図示しないコンデンサ素子が封口用ポッティング樹脂
のエポキシ樹脂16により封止されている。コンデンサ
素子の両電極となる金属端子24,24に銅系基材から
なる外部接続用端子28,28をそれぞれレーザ溶接3
6,36により溶接する。この外部接続用端子28は、
図1の(A)に示すように、燐青銅等の銅系基材30の
片面にニッケルメッキ32を施し、さらにニッケルメッ
キ面の一部にはんだメッキ34を施した3層構造となっ
ている。
Embodiments Next, embodiments of the solid electrolytic capacitor according to the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the structure of an external connection terminal portion of a solid electrolytic capacitor according to an embodiment of the present invention, and (A) in FIG. 1 is an enlarged view of the thickness direction of the external connection terminal portion. The side view (B) of FIG. 1 is a plan view of the external connection terminal looking at the metal terminal side of the capacitor element. In FIG. 1B, reference numeral 22 indicates a resin case, and a capacitor element (not shown) is sealed in the resin case 22 with an epoxy resin 16, which is a potting resin for sealing. External connection terminals 28, 28 made of a copper-based base material are laser welded 3 to metal terminals 24, 24, which become both electrodes of the capacitor element, respectively.
Weld by 6,36. This external connection terminal 28 is
As shown in FIG. 1A, it has a three-layer structure in which nickel plating 32 is applied to one side of a copper base material 30 such as phosphor bronze, and further solder plating 34 is applied to a part of the nickel plated surface. .

【0009】ここで図2の(A)乃至(D)は、本発明
に係る外部接続用端子28を使用する固体電解コンデン
サの主要製造工程を工程順に概略的に示す外観斜視図で
ある。以下、図2を用いて本発明に係る固体電解コンデ
ンサの製造方法につき、工程順に説明する。
FIGS. 2A to 2D are external perspective views schematically showing the main manufacturing steps of a solid electrolytic capacitor using the external connection terminal 28 according to the present invention in order of process. Hereinafter, the method for manufacturing a solid electrolytic capacitor according to the present invention will be explained in order of steps with reference to FIG.

【0010】図2の(A)において、参照符号22は内
部が円筒状凹部に成形された樹脂ケースであり、樹脂ケ
ース22の開口部分は内部の円筒状凹部の直径よりも広
く円錘状にテーパーが付けられている。このように成形
加工された樹脂ケース22内に、溶接26等で搬送用フ
レーム10に取付けられているコンデンサ素子12を挿
入する。この際、コンデンサ素子12と樹脂ケース22
との位置合わせは開口部にテーパーがあるためそれ程厳
密な合わせ精度を必要とせず、容易に挿入することがで
きる。なお、図示しないが予め底部にポッティング樹脂
のエポキシ樹脂16を注入しておくと底部および周辺部
の気密性が良好となる。また、このコンデンサ素子12
はプラス電極及びマイナス電極用の各金属箔(図示せず
)に、リード線14,14が取付けられたアルミ棒の金
属端子24,24をステッチあるいは超音波溶接等によ
り予め取付けた後、図示しないセパレータを介して各金
属箔を巻回し、電解液に含浸して焼成し、さらに化成処
理を行うことにより形成する。
In FIG. 2A, reference numeral 22 is a resin case whose inside is molded into a cylindrical recess, and the opening of the resin case 22 is conical and wider than the diameter of the cylindrical recess inside. It is tapered. The capacitor element 12 attached to the transport frame 10 by welding 26 or the like is inserted into the resin case 22 formed in this manner. At this time, the capacitor element 12 and the resin case 22
Since the opening has a taper, alignment with the holder does not require very strict alignment accuracy and can be easily inserted. Although not shown, if an epoxy resin 16, which is a potting resin, is injected into the bottom in advance, the airtightness of the bottom and the surrounding area will be improved. Moreover, this capacitor element 12
After attaching metal terminals 24, 24 made of aluminum rods with lead wires 14, 14 attached to each metal foil (not shown) for the positive electrode and negative electrode in advance by stitching or ultrasonic welding, etc., Each metal foil is wound through a separator, impregnated with an electrolytic solution, fired, and further subjected to a chemical conversion treatment.

【0011】図2の(B)は、前記搬送用フレーム10
に取付けられたコンデンサ素子12を樹脂ケース22に
収納し、さらに溶融したエポキシ樹脂16を注入し、エ
ポキシ樹脂16が硬化して封口された状態を示す。樹脂
ケース22に注入したエポキシ樹脂16は、その溶融状
態において表面張力による凹凸を形成するがテーパー部
までエポキシ樹脂16を注入しておけば、樹脂量が多少
ばらついてもテーパー部の下側で次の切断工程において
切断するので問題はない。
FIG. 2B shows the transport frame 10.
The capacitor element 12 attached to the capacitor element 12 is housed in a resin case 22, and molten epoxy resin 16 is further injected into the capacitor element 12, and the epoxy resin 16 is hardened and sealed. The epoxy resin 16 injected into the resin case 22 forms unevenness due to surface tension in its molten state, but if the epoxy resin 16 is injected up to the taper part, even if the amount of resin varies slightly, the next part will be formed below the taper part. There is no problem because it is cut in the cutting process.

【0012】図2の(C)において、樹脂ケース22の
テーパー部の下側で所定長さになるようエポキシ樹脂1
6と金属端子24,24とを一緒に切断し、図示するよ
うに金属端子24,24を露出した状態にする。
In FIG. 2C, the epoxy resin 1 is applied to a predetermined length below the tapered portion of the resin case 22.
6 and the metal terminals 24, 24 are cut together, leaving the metal terminals 24, 24 exposed as shown.

【0013】図2の(D)において、切断により露出し
た金属端子24,24にそれぞれ図1で示した3層構造
の外部接続用端子28,28を使用し、ニッケルメッキ
32の面にレーザ光を照射してレーザ溶接36により取
付ける。この後、樹脂ケース22の表面に定格値や電極
の極性等の印刷を行えば、表面実装用角型固体電解コン
デンサが完成する。
In FIG. 2(D), external connection terminals 28 and 28 having the three-layer structure shown in FIG. irradiation and attaching by laser welding 36. Thereafter, by printing rated values, electrode polarities, etc. on the surface of the resin case 22, a square solid electrolytic capacitor for surface mounting is completed.

【0014】[0014]

【発明の効果】前述した実施例から明らかなように、本
発明によれば、外部接続用端子の端子材として燐青銅等
の銅系基材を使用したため、端子材としての必要な強度
を有して、しかも溶接の際に、切断により露出したアル
ミ棒電極端子と合金を形成し易いので溶接強度も高く保
持できる。
Effects of the Invention As is clear from the above embodiments, according to the present invention, since a copper base material such as phosphor bronze is used as the terminal material of the external connection terminal, it has the necessary strength as a terminal material. Moreover, during welding, it is easy to form an alloy with the aluminum rod electrode terminal exposed by cutting, so welding strength can be maintained high.

【0015】また、燐青銅等の銅系基材を使用した外部
接続用端子の片面にニッケルメッキを施し、さらにニケ
ルメッキ面の一部に施したはんだメッキ面からなる3層
構造の銅系基材の金属板片を使用し、レーザ照射面には
レーザ光の吸収率の高いニッケルメッキ面を配し、プリ
ント基板等の接続面側にははんだメッキ面を配した端子
構造であるため、レーザ溶接が効率よく行えると共に、
プリント基板等へのはんだ接続も容易となる。
[0015] In addition, a copper base material with a three-layer structure consisting of an external connection terminal using a copper base material such as phosphor bronze, nickel plated on one side, and a solder plated surface on a part of the nickel plated surface. The terminal structure uses a piece of metal plate, with a nickel-plated surface that has a high absorption rate of laser light on the laser irradiation surface, and a solder-plated surface on the connection surface of the printed circuit board, etc., so laser welding is possible. can be done efficiently, and
Solder connection to a printed circuit board or the like is also facilitated.

【0016】以上、本発明の好適な実施例について説明
したが、本発明は前記実施例に限定されることなく、本
発明の精神を逸脱しない範囲内において種々の設計変更
をなし得ることは勿論である。
Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and it goes without saying that various design changes can be made without departing from the spirit of the present invention. It is.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例を示す固体電解コンデンサの
外部接続用端子部分の構造を示す説明図であり、(A)
は外部接続用端子部の厚さ方向を拡大して示す側面図、
(B)はコンデンサ素子の金属端子側を見た外部接続用
端子の平面図である。
FIG. 1 is an explanatory diagram showing the structure of an external connection terminal portion of a solid electrolytic capacitor according to an embodiment of the present invention;
is a side view showing an enlarged view of the external connection terminal in the thickness direction;
(B) is a plan view of the external connection terminal when looking at the metal terminal side of the capacitor element.

【図2】本発明に係る固体電解コンデンサの製造方法に
おける主要製造工程を工程順に示した外観斜視図である
FIG. 2 is an external perspective view showing the main manufacturing steps in the method for manufacturing a solid electrolytic capacitor according to the present invention in order of process.

【符号の説明】[Explanation of symbols]

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  プラス電極およびマイナス電極用の各
金属箔にアルミ棒の金属端子をステッチあるいは超音波
溶接等により取付けた後、セパレータを介して各金属箔
を巻回し、電解液に含浸して焼成し、かつ化成処理を行
うことによりコンデンサ素子を形成し、このコンデンサ
素子を樹脂ケースに収納してエポキシ樹脂等のポッティ
ング樹脂で封口し、さらに前記樹脂ケースの封口側を切
断した後、切断により露出した前記各金属端子に外部接
続用端子をレーザ溶接で接続して構成される固体電解コ
ンデンサにおいて、前記外部接続用端子の端子材として
燐青銅等の銅系基材、該銅系基材の片面に処理したニッ
ケルメッキ面、さらにこのニッケルメッキ面の一部に処
理したはんだメッキ面からなる3層構造の銅系基材の金
属板片を使用し、該金属板片を前記金属端子側が銅系基
材、レーザ照射面がニッケルメッキ面およびプリント基
板等への表面実装側がはんだメッキ面となるよう接続構
成したことを特徴とする固体電解コンデンサ。
[Claim 1] After attaching metal terminals of aluminum rods to each metal foil for the positive and negative electrodes by stitching or ultrasonic welding, each metal foil is wound through a separator and impregnated with an electrolytic solution. A capacitor element is formed by firing and chemical conversion treatment, this capacitor element is housed in a resin case and sealed with a potting resin such as epoxy resin, and after cutting the sealing side of the resin case, In a solid electrolytic capacitor configured by connecting external connection terminals to each of the exposed metal terminals by laser welding, a copper base material such as phosphor bronze is used as the terminal material of the external connection terminals, A metal plate piece of a copper-based base material with a three-layer structure consisting of a nickel plated surface treated on one side and a solder plated side treated on a part of the nickel plated side is used, and the metal terminal side is copper-plated. A solid electrolytic capacitor characterized in that the connection structure is such that the base material and the laser irradiation surface are nickel-plated, and the surface mounting side to a printed circuit board or the like is a solder-plated surface.
JP05105491A 1991-03-15 1991-03-15 Solid electrolytic capacitors Expired - Fee Related JP3149447B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05105491A JP3149447B2 (en) 1991-03-15 1991-03-15 Solid electrolytic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05105491A JP3149447B2 (en) 1991-03-15 1991-03-15 Solid electrolytic capacitors

Publications (2)

Publication Number Publication Date
JPH04286309A true JPH04286309A (en) 1992-10-12
JP3149447B2 JP3149447B2 (en) 2001-03-26

Family

ID=12876094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05105491A Expired - Fee Related JP3149447B2 (en) 1991-03-15 1991-03-15 Solid electrolytic capacitors

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080909A (en) * 2005-09-12 2007-03-29 Matsushita Electric Ind Co Ltd Case mold capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080909A (en) * 2005-09-12 2007-03-29 Matsushita Electric Ind Co Ltd Case mold capacitor
JP4534918B2 (en) * 2005-09-12 2010-09-01 パナソニック株式会社 Case mold type capacitor

Also Published As

Publication number Publication date
JP3149447B2 (en) 2001-03-26

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