JPH0428492U - - Google Patents
Info
- Publication number
- JPH0428492U JPH0428492U JP6990190U JP6990190U JPH0428492U JP H0428492 U JPH0428492 U JP H0428492U JP 6990190 U JP6990190 U JP 6990190U JP 6990190 U JP6990190 U JP 6990190U JP H0428492 U JPH0428492 U JP H0428492U
- Authority
- JP
- Japan
- Prior art keywords
- terminal board
- heat dissipation
- flat surface
- rectangular flat
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Description
第１図は、本考案における放熱フインの一例の
一部を示す平面図、第２図ａは同じく端子板の平
面図、第２図ｂはその側面図、第３図は、本考案
の端子板付放熱フインの一例の側面図、第４図は
、従来の放熱フインの平面図、第５図は、同じく
端子板の側面図、第６図は、従来の端子板付放熱
フインの側面図である。
図中、１０は放熱フイン、２０は端子板、１は
溝部、２は方形平坦面、３は端子部、４は切欠部
、５はかしめ跡、６は屈曲部、７は識別表示を表
わす。
FIG. 1 is a plan view showing a part of an example of the heat dissipation fin of the present invention, FIG. 2 a is a plan view of the terminal board, FIG. 2 b is a side view thereof, and FIG. 3 is a terminal of the present invention. A side view of an example of a heat dissipation fin with a plate, FIG. 4 is a plan view of a conventional heat dissipation fin, FIG. 5 is a side view of a terminal board, and FIG. 6 is a side view of a conventional heat dissipation fin with a terminal board. . In the figure, 10 is a radiation fin, 20 is a terminal plate, 1 is a groove, 2 is a rectangular flat surface, 3 is a terminal, 4 is a notch, 5 is a caulking mark, 6 is a bent part, and 7 is an identification mark.
Claims (1)
フイン１０と両側に端子部３，３を形成した方形
平坦面２を有する端子板２０とから成り、放熱フ
イン１０の両側面部の左右には、端子板の方形平
坦面２の両側縁部を嵌装する微小深さの溝部１が
形成されており、端子板の方形平坦面２の両側縁
部には、それぞれ１つ以上の切欠部４，４が形成
されており、そして、端子板の方形平坦面２の両
側縁部は、放熱フインの溝部１，１に嵌装され、
溝部１，１における切欠部４に該当する各位置が
かしめ加工されていることを特徴とする端子板付
放熱フイン。 (2) 端子板の方形平坦面２に識別表示が施され
ていることを特徴とする請求項第１項記載の端子
板付放熱フイン。[Claims for Utility Model Registration] (1) Consisting of a heat dissipation fin 10 made of extruded aluminum material and a terminal plate 20 having a rectangular flat surface 2 with terminal parts 3, 3 formed on both sides, the heat dissipation fin 10 On the left and right sides of both side surfaces, grooves 1 of minute depth are formed into which both side edges of the rectangular flat surface 2 of the terminal board are fitted. Two or more notches 4, 4 are formed, and both side edges of the rectangular flat surface 2 of the terminal board are fitted into the grooves 1, 1 of the heat dissipation fin.
A heat dissipating fin with a terminal board, characterized in that each position corresponding to the notch 4 in the grooves 1, 1 is caulked. (2) The heat dissipation fin with terminal board according to claim 1, characterized in that an identification mark is provided on the rectangular flat surface 2 of the terminal board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6990190U JPH0428492U (en) | 1990-06-30 | 1990-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6990190U JPH0428492U (en) | 1990-06-30 | 1990-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428492U true JPH0428492U (en) | 1992-03-06 |
Family
ID=31605606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6990190U Pending JPH0428492U (en) | 1990-06-30 | 1990-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428492U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005221346A (en) * | 2004-02-04 | 2005-08-18 | Furukawa Electric Co Ltd:The | Heat sink and its manufacturing method |
| JP2011091105A (en) * | 2009-10-20 | 2011-05-06 | Shinko Electric Ind Co Ltd | Package for semiconductor laser, semiconductor laser device, and method of manufacturing the same |
-
1990
- 1990-06-30 JP JP6990190U patent/JPH0428492U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005221346A (en) * | 2004-02-04 | 2005-08-18 | Furukawa Electric Co Ltd:The | Heat sink and its manufacturing method |
| JP2011091105A (en) * | 2009-10-20 | 2011-05-06 | Shinko Electric Ind Co Ltd | Package for semiconductor laser, semiconductor laser device, and method of manufacturing the same |
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