JPH04275445A - Method for testing miniature electronic device and tester used for the same - Google Patents

Abstract

PURPOSE:To judge whether tester action is normal or abnormal by charging the socket of a socket board corresponding to each model with a standard sample and by executing test with the test board and the standard sample before the model is tested. CONSTITUTION:There provided are a socket 10, which contains a test IC 19 to execute electrical test, and a socket board or test socket board 15, which is loaded with peripheral circuits corresponding to the socket 10 and the test IC 19. The test head rises up to a test position to force a contact pin 17 and a contact pad 7 into mutual pressing, so that electrical connection is secured. A test program is executed to the standard sample. If the result of a preliminary test is a failure in action, it is checked whether a right test program is read into the tester; further, fall and rise of the test head 18 are repeated, and after completion of reset the previous preliminary test is executed to judge whether test action is normal or abnormal.

Description

[Detailed description of the invention]

0001

[Industrial Field of Application] The present invention relates to an inspection technique for performing electrical characteristic tests on small electronic devices such as semiconductor devices and semiconductor integrated circuit devices (hereinafter referred to as ICs), and in particular to a screening test for good and defective products. Concerning effective techniques that can be used to carry out.

0002

[Prior art] As a conventional technology, Japanese Patent Application Publication No. 62
No. 55572 discloses a method in which a standard sample is set in a test socket via a separate route during measurement to perform a preliminary check of the tester.

[0003] Furthermore, regarding the automatic inspection of a wide variety of ICs, Japanese Patent Application Publication No. 63-142650 or Japanese Patent Application Publication No. 64
An example is shown in No.-80035.

0004

However, these devices are not able to adequately handle tests involving a wide variety of products, which require various external peripheral circuits or auxiliary circuits for each product. Furthermore, the conventional I
The inventor of the present invention has revealed that the following problem occurs when a C sorting device selects and inspects ICs having different characteristics.

[0005] Normally, when performing IC selection testing, the tester itself can be used commonly for all types within a product group, but in order to test the unique electrical characteristics of the IC to be tested, it is necessary to use a tester for each type of IC. It is necessary to replace the socket board for electrically connecting the external terminal of the IC to be tested and the external circuit electrically connected to the socket. However, in conventional apparatuses, such matters were not particularly taken into account, resulting in poor inspection efficiency.

Furthermore, before running a test on a certain product, it is necessary to determine whether the tester is operating normally by testing a standard sample that is a good product, but managing the standard sample at this time is complicated. There are some problems.

[0007] Accordingly, one object of the present invention is to provide an inspection technique that can efficiently change product types.

A further object of the present invention is to provide a technique that can automatically perform electrical tests on small electronic devices such as a wide variety of ICs having various test conditions.

Another object of the present invention is to provide an automatic inspection technique that can check whether the operation of the tester is normal or not before testing.

Another object of the present invention is to provide an automatic inspection technique that can automatically correct abnormalities in the operation of the tester.

A further object of the present invention is to provide an inspection technique that can efficiently and automatically perform electrical tests on small electronic devices such as a wide variety of semiconductor devices.

0012

[Means for Solving the Problems] One of the outlines of the present invention for achieving the above object is briefly explained as follows.

That is, when performing an electrical test on a semiconductor device using an autohandler, a standard sample is loaded in advance into the socket of a socket board corresponding to each product type, and the test board and the standard sample are loaded before testing for that product type. The tester performs self-diagnosis by executing the same test as the test sample, and only when it is determined to be normal, completes the test of the test IC with the standard evacuated to the temporary storage station, and then ,
The purpose is to return the standard sample to the socket of the socket board.

In other words, the configuration of the present invention is such that the socket of the socket board, which has a socket for accommodating and testing the IC to be tested and an auxiliary circuit necessary for testing the type thereof, has already been installed by the test. A tester is equipped with a sample that has been determined to be a non-defective product, and before testing the IC to be tested, performs the same test as the IC to be tested with the sample housed in the socket. This is to determine whether the operation is normal or abnormal.

[0015]

[Operation] According to the above-described means, when the type of IC to be tested is changed, the necessary replacement of the socket board, change to a test program for the new type, and type switching operations can be automatically performed. Moreover, since the standard sample is always stored in the socket provided on the socket board, there is extremely little chance of product changeover failures due to work errors, etc., and it is possible to quickly move on to the next inspection. Furthermore, this reduces non-operating stoppage time when switching types, and enables long-term unmanned operation.

Further, one structure and effect of the present invention other than those described above will be explained below. That is, the present invention provides (a)
an inspected good reference small electronic device that is the same as the small electronic device to be tested belonging to the first type and has a plurality of external terminals;
a socket having a plurality of external terminals for accommodating the small electronic device and making electrical connections with the plurality of external terminals; and a socket that serves as an auxiliary circuit for testing the small electronic device or is mounted on the small electronic device. an external peripheral circuit for testing that becomes an equivalent circuit to the external circuit when the external circuit is connected to the test head of an external tester, and the external peripheral circuit for testing and the plurality of external terminals of the socket are connected directly or indirectly to the test head of an external tester. a first socket board preparation step of accommodating a first test socket board consisting of a plurality of contact pads for making connections with a plurality of test pins and a circuit board accommodating these in a test socket board accommodation space; (b) ) A tested reference small electronic device that is the same as the small electronic device to be tested and belongs to a second type different from the first type and has a plurality of external terminals; A socket having a plurality of external terminals for making electrical connections with the terminals, and an equivalent circuit that serves as an auxiliary circuit for testing the small electronic device or that becomes an external circuit when the small electronic device is mounted. A plurality of external peripheral circuits for testing, and a plurality of external terminals for connecting the external peripheral circuit for testing and the plurality of external terminals of the socket directly or indirectly to the plurality of test pins provided on the test head of the external tester. a second socket board preparation step of accommodating a second test socket board consisting of contact pads and a circuit board containing these in the test socket board storage location; (c) the first and second types; (d) A test execution signal supplied from inside or outside, or a test execution signal supplied from the inside or outside; the first and second input or read from
based on at least one of the data regarding the test socket board or the plurality of small electronic devices.
or an automatic socket board conveying step of automatically placing a second socket board on the test head of the tester for electrical testing of the small electronic device so that a desired electrical test can be performed; The test to be performed on the small electronic device to be tested is performed with the inspected good reference small electronic device of the type to be tested stored in the socket on the socket board placed on the test head. an automatic preliminary test step of automatically executing all or part of the same test; (f) an automatic preliminary test result determination step of automatically determining whether the test operation is normal based on the result of the preliminary test; (g) automatic reference good small electronic device that automatically takes out the good reference small electronic device accommodated in the socket after the judgment result becomes normal and places it in a temporary storage place for the good reference small electronic device; Small electronic equipment removal process (h
) At least one of the plurality of untested small electronic devices to be tested is automatically accommodated in the empty socket after the reference good small electronic device is taken out, and the electrical test is performed. automatic test process for small electronic devices to be inspected, (i) after the test of all or a predetermined part of the small electronic devices to be inspected belonging to one type among the large number of small electronic devices to be inspected is completed; a step of automatically returning the small electronic device to the socket of the socket board; (j) returning the socket board to which the good small electronic device has been returned to the test socket board; This is a testing method for small electronic devices, which includes a return process of a socket board, in which the socket board is transferred to its original location or a predetermined location.

Furthermore, the summary of one invention of the present application is that in the above invention, (k) after or in parallel with the socket board return step, testing is performed on the first and second types according to each step. This test method for small electronic devices consists of an automatic repeat test process in which each of the above steps (d) to (j) is automatically executed for products that have not been subjected to the test.

Furthermore, the summary of one invention of the present application is that in the above invention, (l) after the automatic preliminary test result determination step, if the result is an abnormality in the test operation, the small electronic device to be tested that is about to be executed; This is a method for testing small electronic devices, comprising an automatic test preparation reconfirmation step for automatically reconfirming whether test preparations have been made correctly.

(m) a re-automatic preliminary test step of automatically re-executing the automatic preliminary test step after the automatic test preparation reconfirmation step; (n) a re-preliminary test step after the automatic re-pretest step; This method of testing a small electronic device includes an automatic re-pretest result determination step of automatically determining whether or not the test operation is normal based on the results of the test.

Furthermore, the summary of one invention of the present application is that in the above invention, the automatic test preparation reconfirmation step automatically determines whether or not the previously executed preliminary test step was executed by a correct program corresponding to the product type. This is a test method for small electronic devices, which is an automatic test program confirmation process in which the program is automatically checked and if the program is not correct, it is automatically changed to the correct program.

Furthermore, the summary of one invention of the present application is that in the above-mentioned invention, the automatic test preparation reconfirmation step determines whether the inspected good reference small electronic device is accommodated in the test socket or the plurality of test pins and the plurality of This is a test method for small electronic devices that is an automatic contact state confirmation process that automatically confirms the contact state with a contact pad.

Furthermore, the summary of one invention of the present application is that in the above invention, the contact state confirmation step automatically brings the plurality of test pins and the plurality of contact pads from a contact state to a non-contact state, and then automatically changes the contact state of the plurality of test pins and the plurality of contact pads to a non-contact state and then automatically again. This is a test method for small electronic devices that is an automatic re-contact process consisting of a process of returning to a contact state.

Furthermore, the summary of one invention of the present application is that in the above invention, (o) when the judgment result of the automatic re-preliminary test result judgment step is again an abnormal test operation, the next test step of the small electronic device to be tested is performed. This test method for small electronic devices consists of an automatic stop warning process that automatically issues an alarm or warning signal to the outside without transitioning to the system.

[0024] Further, one aspect of the invention of the present application is a method for testing a small electronic device in the above invention, wherein the temporary storage location is provided outside the socket board.

[0025] Furthermore, one aspect of the invention of the present application further comprises: (p) a test temperature preparatory step for preliminarily adjusting the temperature to a temperature close to a desired test temperature before the small electronic device to be tested is accommodated in a test socket; This is a testing method for small electronic devices that consists of an adjustment process.

Another aspect of the invention of the present application is a method for testing a small electronic device, in which the test temperature preliminary adjustment step is a sample preheating step for preheating the small electronic device to be tested.

Furthermore, the summary of one invention of the present application is as follows: (a) A small electronic device to be tested belonging to the first type having a plurality of external terminals is accommodated and electrically connected to the plurality of external terminals. a socket having a plurality of external terminals, and an external peripheral circuit for testing that becomes an auxiliary circuit for testing the small electronic device or an equivalent circuit of an external circuit when the small electronic device is mounted; A plurality of contact pads for connecting the external peripheral circuit for testing and the plurality of external terminals of the socket directly or indirectly to a plurality of test pins provided on a test head of an external tester, and a circuit board accommodating these. (b) a first socket board storage shelf for accommodating a first test socket board consisting of: (b) a small electronic device to be tested belonging to a second type different from the first type having a plurality of external terminals; a socket having a plurality of external terminals for accommodating and establishing electrical connections with the plurality of external terminals; A test external peripheral circuit that is an equivalent circuit to a circuit, and a plurality of tests that connect the external test peripheral circuit and the plurality of external terminals of the socket directly or indirectly to the test head of the external tester. a second socket board storage shelf for accommodating a second test socket board consisting of a plurality of contact pads for making connections with pins and a circuit board accommodating these; (d) a test execution signal supplied from inside or outside; or (d) a test execution signal supplied from inside or outside; Based on at least one of the data regarding the first and second test socket boards or the plurality of small electronic devices inputted or read from the outside, the first or second socket board is connected to the small electronic device. automatic socket board transport means for automatically placing the test head of the tester for electrical testing so as to perform a desired electrical test; a small electronic device to be tested transport means for automatically accommodating at least one of the electronic devices; (f) for automatically controlling execution of an electrical test on the small electronic device to be tested accommodated in the socket board; This is a test device for small electronic devices consisting of a tester control system.

[0028] Furthermore, one aspect of the invention of the present application further comprises: (g) for preliminarily adjusting the temperature of the small electronic device to be tested to a temperature close to a desired test temperature before housing the small electronic device to be tested in the socket; This is a test device for a small electronic device comprising test temperature preliminary adjustment means.

[0029] Further, one aspect of the invention of the present application is a testing apparatus for a small electronic device, in which the test temperature preliminary adjustment means is a sample preheating means for preheating the small electronic device to be tested. be.

[0030]

[Examples] Specific examples will be described below. Identical reference numerals in these embodiments and figures indicate identical or similar functions. However, this does not apply if it is specifically stated to the contrary.

FIG. 1 is a front view of the tester section of the present invention. In the figure, 10 is a socket for accommodating the IC to be tested and performing an electrical test, 13 is a socket cover having IC heating means, 14 is its hook, and 15
is a socket board or test socket board on which peripheral circuits corresponding to the socket 10 and the IC to be tested are mounted (here, peripheral circuits are external test boards such as load circuits or auxiliary circuits such as impedance conversion circuits in the case of logic ICs). This is a peripheral circuit, and in the case of a linear IC, it is an external peripheral circuit for testing that is an equivalent circuit to the external circuit corresponding to the set in which the IC is installed, such as a television or video recorder.Furthermore, this socket board is composed of a multilayer wiring board of approximately 50 cm x 50 cm), 16 is a contact guide pin for positioning (generally there are 4 of these), and 17 is for electrical connection between the socket board 15 and the tester. Contact probe pins or test pins for the
There are 00 books. ), 18 is the test head of the tester, 19
71 is an IC to be tested or a small electronic device to be tested (for example, a resin-sealed pin or 100-pin IC), and 71 is a contact pad for electrically connecting with the contact probe pin.

FIG. 2 is a top view of the handler section of the present invention. In the figure, 1 is an untested IC tray that accommodates a large number of untested ICs or a storage area for untested small electronic devices for testing (untested small electronic device storage section), and 2 is a robot arm for transporting the ICs to be tested. , 3 (3a and 3b) are IC
An intermediate station for loading; 4a is an IC loading intermediate station movement guide for transporting the IC station in the Y direction; 4b is for transporting the IC station carrying the inspected IC in the Y direction; Intermediate station movement guide for IC unloading, 5a and 5b are I
C suction transport mechanism support frame; 6 is a first X-direction guide rod for guiding transport in the X direction; 7 (7a and 7b) is an intermediate stay for IC unloading for transporting inspected ICs in the Y direction. 8 is a second X-direction guide rod for guiding the transfer in the X-direction, and 9 is a first X-direction IC suction conveyance for suction-transferring the IC to be tested in the X-direction between the intermediate station and the test socket. 10 is a test socket for accommodating the IC to be tested and carrying out the test; 11 is a second X-direction IC suction transport mechanism for suction-transferring the standard sample in the X-direction between each intermediate station; 12 is a standard sample temporary storage station for temporarily storing the standard sample during regular testing; 19 is an untested IC; 21 is a tray for inspected defective products; 22 is a tray for inspected non-defective products; and 29 is a socket board. 30 is a clamper rod for holding this clamper, 31 is a clamper 30
a clamper movement guide for moving the clamper rod 31 in the axial direction, 33 a clamper stand for supporting these, 34 a socket board storage for storing various socket boards, and 72 a spare for ICs to be tested. This is a preheating hot plate for heating. Note that the intermediate station 3 and the socket 10 are provided with a preheating mechanism for the IC to be tested (all or part of these are collectively referred to as test temperature preconditioning means or test sample preheating means). . Note that the robot arm,
The intermediate station for IC loading, the intermediate station movement guide for IC loading, the intermediate station movement guide for IC unloading, the IC suction conveyance mechanism support frame, the first X-direction guide rod, and the IC unloading intermediate station. All or part of the intermediate station, the second X-direction guide rod, the first X-direction IC suction transport mechanism, the second X-direction IC suction transport mechanism, etc. are collectively referred to as the means for transporting the small electronic device to be inspected. Make it.

FIGS. 3 and 4 are front views of the entire apparatus, respectively, for explaining the measurement operation of the present invention. In the figure, 15a is a socket board under test, 15b or 15d is a socket board in storage with each standard sample mounted, 20 is an IC that has been tested, and 23 is an IC suction nozzle installed at the tip of the robot arm 2. , 24 is the autohandler main body, 25 is an autohandler lifting guide for raising and lowering the autohandler main body 24, 26 is an autohandler mount that holds these, and 27 is the test head 1.
8 is a test head mount for holding the test head 18; 28 is a test head lifting guide for lifting and lowering the test head 18;
Reference numeral 2 denotes a clamper Z-direction rotational lifting shaft for rotationally raising and lowering the clamper 29, 35 a storage shelf lifting guide for lifting and lowering the storage, 36 a storage rack for holding the storage, etc., and 37 an autohandler. 38a to 38d are socket board storage shelves (socket board storage locations for testing).

FIG. 5 is a flowchart showing the flow of testing according to the present invention. In the figure, 51 is a product name designation step for inputting the product name using the keyboard of the tester control system, and 52 is a socket board for selectively transporting a desired socket board from the socket board storage shelf based on this product name data. a selection step, 53 a socket board mounting step (socket board automatic transport step) for placing the unloaded socket board on the test head, and 54 a test program stored in the tester based on the product name data. A test program changing step 55 for selecting a corresponding test program from among them is a test program change step in which a standard sample, that is, an IC of the same type that is known in advance to be a good product, is subjected to the same test as that performed on the IC to be inspected; A standard sample electrical characteristic testing process or a preliminary testing process (automatic preliminary testing process) for pre-testing whether or not the operation of the socket, program, tester, etc. is normal; 56 is for determining the results of the preliminary testing; 57 is a standard sample test result determination step or preliminary test result determination step (automatic preliminary test result determination step), and 57 is a standard sample retrieval step (automatic reference 58 is a test IC supply step for placing the test IC on the socket set on the test head; 59 is the test IC supply step for placing the test IC set in the socket in the previous program; 60 is an IC to be tested electric characteristic testing process (automatic test process for small electronic device to be tested) for testing based on
61 is an IC test result determination step for determining the test result of the IC to be inspected; 61 is a classification step for classifying inspected ICs into good and defective products based on the pass/fail judgment;
2 is a standard sample storage process for returning the standard samples that had been evacuated to the temporary storage station to their original sockets after the testing of all ICs to be tested belonging to that type has been completed. automatic return process)
, 63 and 64 are respectively a socket board removal process and a socket board storage process (socket board return process) for returning the socket board containing the standard sample to the original shelf, and 65 is a case where the preliminary inspection result is not normal. 66 is a warning signal generation/display step for issuing a warning to that effect, and 66 is an operation cause investigation/treatment step for investigating and removing the cause of the malfunction based on the signal.

Next, the operation of the inspection apparatus of the present invention will be explained based on FIGS. 1 to 5. First, the preparation stage will be explained. Socket board storage 34 as shown in FIG.
A socket board 15a or 15d corresponding to each type is inserted into each storage shelf 38a or 38d. Furthermore, correspondingly, their product types, insertion position information, etc. are input to the control system from the keyboard or the like of the tester control system. Each socket board 15a or 15d
The socket 10 houses an IC of that type that is known to be good as a result of a previous test, that is, a standard sample (tested good small electronic device for reference).

On the other hand, an untested tray on which a large number of untested ICs 19 are mounted is installed at a predetermined position on the handler main body 24, as shown in FIG. Furthermore, the IC mounted on this tray
The product type and the address information on the tray are input from the keyboard to the tester control system. Note that this tray is usually installed in multiple locations to prolong the automatic operation time.

[0037] In this state, automatic inspection is started. First, as shown in FIG. 4, the control system issues a command to the socket board transport system consisting of a clamper, etc., based on the type and address information of the IC to be tested on the untested IC tray, and clamps the desired socket board 15a. It is carried out from the storage shelf 38c. At this time, the test head 18 has descended as shown in FIG. 4, and the conveyance system rotates while adjusting the height direction to install the socket board 15a at a predetermined position on the test head 18, and then returns to the standby position. return. Thereafter, the test head is raised to the test position, and the contact pins 17 and contact pads 71 are pressed together to ensure electrical connection. If necessary, the standard sample is heated to a predetermined test temperature by a heater provided in the socket 10.

On the other hand, the control system unloads the test program corresponding to the product type from the test program storage means storing a plurality of test programs based on the socket board unloading command signal. When unloading of this program and setting of test conditions are completed, the test program is executed on the standard sample. If the result of this preliminary test is that the test operation is normal, the process proceeds to the actual test. On the other hand, if the result of this preliminary test is a malfunction, first check whether the correct test program has been loaded into the tester (test program automatic confirmation process), and then In order to reconfirm the target contact, the test head 18 repeatedly descends and rises and executes a reset operation to return to the test position (contact state automatic confirmation process or automatic recontact process, and further confirmation of the previous program). Collectively referred to as the automatic test preparation reconfirmation process).
After the reset is completed, execute the previous preliminary test again (re-automatic preliminary test process) to determine whether the test operation is normal or abnormal (
Automatic re-pretest result judgment process). As a result, if the test operation is normal, the process directly proceeds to the next original test. At this time, if the test operation is abnormal, an alarm signal is issued to the outside (lighting of a warning lamp, alarm buzzer, or sending an electrical signal from the tester control system to the outside) and the operation is stopped (automatic stop warning process). ).

As a result of such a series of preliminary tests, if it is determined that the test operation is normal, the process moves to the next step, a test step for the IC to be inspected (automatic repeat test step).
. That is, as shown in FIGS. 2 and 3, the socket cover 13 is opened, the standard sample is transferred by vacuum suction by the first X-direction IC suction transport mechanism 9, and placed on the unloading intermediate station 7a. . This intermediate station moves to position 7b, and at that position, the standard sample is adsorbed and transported by the second X-direction IC transport mechanism 11 and temporarily placed on the standard sample temporary storage station. IC to be tested of the type corresponding to the program unloaded during this time
A predetermined number of samples are automatically transferred from the uninspected tray 1 onto the preheating hot plate 72 by the robot arm 2, and preheated to a predetermined test temperature (test temperature preadjustment step or test sample preheating step). ). The ICs to be tested on the hot plate 72 are transferred one by one onto the loading intermediate station 3a by the robot arm 2. This intermediate station 3a moves to position 3b with the IC to be tested placed thereon. If the test temperature is higher than room temperature, a heater is also provided in the intermediate station to maintain the IC at a predetermined test temperature. The IC to be tested at the position 3b is placed in the test socket 1 by the suction transport mechanism 9.
Transfer set within 0. (At this time, the loading intermediate station 3b moves to the position 3a and receives the next IC to be tested.) In this state, the electrical test is performed, and when the test is completed, the tested IC is unloaded by the suction transport mechanism 9. The intermediate station 7a is then moved to the position 7b. (During this time,
The next IC to be tested is set in the test socket 10 and an electrical test is performed. ) Here, the inspected IC is transferred to the robot arm 2 depending on whether the inspection result is good or defective.
The products are classified and placed on the non-defective tray 22 or the defective tray 21 according to the following criteria. By repeating such operations, when all the ICs to be tested belonging to that type have been tested, the standard sample is transferred to the loading intermediate station 3a by the suction conveyance mechanism 11 according to a command from the control system.
The intermediate station 3a moves to position 3b. At position 3b, the standard sample is set in the socket 10 by the suction transport mechanism 9. Subsequently, the socket cover 13 is closed. When the return of the standard sample to the original socket board is completed in this way, the test head 18 descends and stops, and in this state, the socket board transport mechanism consisting of the clamper 29 etc. (Automatic socket board transport means)
The socket board 15a, which has been inspected by
It is inserted and placed in 8c. The test for one product has now been completed, but the control system sends signals to each part to execute the test for the next product, and performs a preliminary test for the next product in the same way as before. Repeat the original test.

[0040]

Effects of the Invention The effects obtained by typical inventions disclosed in this application are as follows.

[0041] That is, according to the above configuration, it is confirmed that the tester operates normally before executing the test.
Test failures caused by the tester itself can be prevented.

Furthermore, since the sample is always accommodated in the socket of the socket board belonging to the type except during testing, it is easy to manage standard samples such as the sample.

[0043] As described above, the technical field that is the background of the present invention,
In other words, I explained the screening test for linear ICs,
It goes without saying that the present invention is not limited thereto and can be modified in various ways without departing from the gist of the present invention. For example, it can be applied to various tests of microcomputer ICs, logic ICs, and other small electronic devices in general.

[Brief explanation of the drawing]

FIG. 1 is a front view of a tester section of the present invention.

FIG. 2 is a top view of the handler section of the present invention.

FIG. 3 is a front view of the entire apparatus for explaining the measurement operation of the present invention.

FIG. 4 is a front view of the entire device for explaining the operation of the stocker of the present invention.

FIG. 5 is a flowchart showing the flow of testing according to the present invention.

[Explanation of symbols]

1...Uninspected IC tray, 2...Robot arm, 3a, 3
b...Intermediate station for IC loading, 4a...Intermediate station movement guide for IC loading, 4b...Intermediate station movement guide for IC unloading, 5a, 5b...IC suction transport mechanism support frame, 6...First X direction guide Rod, 7a,
7b...Intermediate station for IC unloading, 8...Second X
Directional guide rod, 9...first X-direction IC suction conveyance mechanism,
10...Socket, 11...Second X-direction IC suction conveyance mechanism,
12...Standard sample temporary storage station, 13...Socket cover, 14...Hook, 15, 15a, 15b, 15
c, 15d...Socket board, 16...Contact guide pin, 17...Contact probe pin, 18...Test head, 19...IC to be tested, 20...Inspected IC, 21...
Inspected defective tray, 22...Inspected good tray, 2
3...IC suction nozzle, 24...Auto handler body, 25
... Autohandler elevating guide, 26... Autohandler mount, 27... Test head mount, 28... Test head elevating guide, 29... Attachment/detaching clamper (socket board clamper), 30... Clamper rod, 31... Clamper movement guide, 32... Clamper Z-direction rotation lifting shaft, 33... Clamper mount, 34... Socket board storage, 35... Storage shelf lifting guide, 36... Storage rack mount, 37... Auto handler safety cover, 38a, 38b, 38c, 38d... Socket board storage shelf , 51... Product name specification process, 52... Socket board selection process, 53... Socket board installation process, 54
...Test program change process, 55...Standard sample electrical characteristics inspection process, 56...Standard sample test result judgment process, 57...Standard sample extraction process, 58...Test IC
Supply process, 59...Electrical characteristic test of IC to be inspected, 60...IC test result determination process, 61...Classification of good products and defective products, 6
2... Standard sample accommodation process, 63... Socket board removal process, 64... Socket board accommodation process, 65... Alarm signal transmission and display process, 66... Malfunction cause investigation and treatment process, 7
1...Contact pad, 72...Hot plate for preheating.

Claims (13)

[Claims] 1. A method for testing a small electronic device comprising the following steps: (a) an inspected good reference small electronic device that is the same as a small electronic device to be tested belonging to a first type and having a plurality of external terminals; a socket having a plurality of external terminals for accommodating the small electronic device and making electrical connections with the plurality of external terminals; and a socket that serves as an auxiliary circuit for testing the small electronic device or is mounted on the small electronic device. an external peripheral circuit for testing that becomes an equivalent circuit to the external circuit when the external circuit is connected to the test head of an external tester, and the external peripheral circuit for testing and the plurality of external terminals of the socket are connected directly or indirectly to the test head of an external tester. a first socket board preparation step of accommodating a first test socket board consisting of a plurality of contact pads for making connections with a plurality of test pins and a circuit board accommodating these in a test socket board accommodation space; (b)
) A second type that is different from the first type described above and has multiple external terminals.
A socket having an inspected good reference small electronic device that is the same as the small electronic device to be tested belonging to the type of the small electronic device, and a plurality of external terminals for accommodating the small electronic device and establishing electrical connections with the plurality of external terminals. , an external peripheral circuit for testing that becomes an auxiliary circuit for testing the small electronic device or an equivalent circuit to that which becomes an external circuit when the small electronic device is mounted; A second circuit board comprising a plurality of contact pads for directly or indirectly connecting the plurality of external terminals of the socket to the plurality of test pins provided on the test head of the external tester, and a circuit board accommodating these. a second socket board for storing a test socket board in the test socket board storage location;
(c) an untested small electronic device preparation step of accommodating a large number of small electronic devices to be tested belonging to at least one of the first and second types in an untested small electronic device storage space; (d) a test execution signal supplied internally or externally, or the first and second signals input or read externally;
based on at least one of the data regarding the test socket board or the plurality of small electronic devices.
or an automatic socket board conveying step of automatically placing a second socket board on the test head of the tester for electrical testing of the small electronic device so that a desired electrical test can be performed; The test to be performed on the small electronic device to be tested is performed with the inspected good reference small electronic device of the type to be tested stored in the socket on the socket board placed on the test head. an automatic preliminary test step of automatically executing all or part of the same test; (f) an automatic preliminary test result determination step of automatically determining whether the test operation is normal based on the result of the preliminary test; (g) automatic reference good small electronic device that automatically takes out the good reference small electronic device accommodated in the socket after the judgment result becomes normal and places it in a temporary storage place for the good reference small electronic device; Small electronic equipment removal process (h
) Automatically accommodating at least one of the plurality of untested small electronic devices to be tested in the empty socket after the good reference small electronic devices are taken out, and then executing the electrical test. automatic test process for small electronic devices to be inspected, (i) after the test of all or a predetermined portion of the small electronic devices belonging to one type among the large number of small electronic devices to be inspected is completed, the temporary reference non-defective devices; (j) a step of automatically returning the small electronic device to the socket of the socket board; (j) returning the socket board to which the good small electronic device has been returned to the test socket board; Socket board return process for transporting to the original location of the storage location or to a predetermined location. 2. The method for testing a small electronic device according to claim 1, further comprising the following steps: (k) after or in parallel with the socket board return step, testing the first and second types of devices; Among these, an automatic repeat test step in which each of the steps (d) to (j) is automatically executed for a product that has not been tested in each of the above steps. 3. The method for testing a small electronic device according to claim 2, further comprising the following steps: (l) after the automatic preliminary test result determination step, if the result is an abnormality in the test operation, the test method is performed from now on; (m) After the automatic test preparation reconfirmation step, the automatic test preparation a re-automatic pre-test step for automatically re-executing the pre-test step; (n) after the automatic re-pre-test step, automatically determining whether the test operation is normal based on the result of the re-pre-test; Automatic re-pretest result judgment process. 4. In claim 3, the automatic test preparation reconfirmation step automatically checks whether or not the previously executed preliminary test step is executed by a correct program corresponding to the product type. , a method for testing small electronic devices, which is an automatic test program confirmation process that automatically changes to the correct program if it is not the correct program. 5. In claim 4, the automatic test preparation reconfirmation step includes determining whether the inspected good reference small electronic device is accommodated in the test socket or the plurality of test pins and the plurality of contact pads. A test method for small electronic devices, which is an automatic contact status confirmation process that automatically checks the contact status of the device. 6. In claim 5, the contact state checking step automatically changes the plurality of test pins and the plurality of contact pads from a contact state to a non-contact state, and then automatically changes the contact state again. A method for testing small electronic devices that is an automatic re-contact process consisting of a process of returning to 7. The method for testing a small electronic device according to claim 6, further comprising the following steps: (o) when the determination result of the automatic re-preliminary test result determination step is again an abnormal test operation; An automatic stop warning process that automatically issues an alarm or warning signal to the outside without proceeding to the test process for the small electronic device being tested. 8. The method for testing a small electronic device according to claim 7, wherein the temporary storage location is provided outside the socket board. 9. A method for testing a small electronic device according to claim 8, further comprising the following steps: (p) preliminarily testing the small electronic device to be near a desired test temperature before housing the small electronic device to be tested in a test socket; Test temperature pre-adjustment process to adjust the temperature to . 10. The method for testing a small electronic device according to claim 9, wherein the test temperature preliminary adjustment step is a sample preheating step for preheating the small electronic device to be tested. 11. A testing device for a small electronic device having the following configuration: (a) accommodating a small electronic device to be tested belonging to a first type having a plurality of external terminals and electrically connected to the plurality of external terminals; a socket having multiple external terminals for taking the
an external peripheral circuit for testing that becomes an auxiliary circuit for testing the small electronic device or an equivalent circuit to an external circuit when the small electronic device is mounted; the external peripheral circuit for testing; and the socket. A first test socket board consisting of a plurality of contact pads for directly or indirectly connecting a plurality of external terminals with a plurality of test pins provided on a test head of an external tester, and a circuit board accommodating these. (b) a first socket board storage shelf for accommodating a small electronic device to be tested belonging to a second type different from the first type having a plurality of external terminals; A socket having a plurality of external terminals for making electrical connections, and an auxiliary circuit for testing the small electronic device, or an equivalent circuit to the external circuit when the small electronic device is mounted. A plurality of contacts for connecting an external peripheral circuit for testing, the external terminals for testing and the plurality of external terminals of the socket directly or indirectly with the plurality of test pins provided on the test head of the external tester. a second socket board storage shelf for accommodating a second test socket board consisting of a pad and a circuit board containing the pads; (c) a plurality of test socket boards belonging to at least one of the first and second types; (d) a test execution signal supplied from inside or outside, or the above-mentioned signal input or read from the outside; the tester for electrical testing of the small electronic devices, based on at least one of data regarding the first and second test socket boards or the plurality of small electronic devices; (e) automatic socket board transport means for automatically placing at least one of the plurality of untested small electronic devices in the socket to perform a desired electrical test; (f) a tester control system for automatically controlling execution of an electrical test on the small electronic device to be tested accommodated in the socket board; 12. The testing apparatus for a small electronic device according to claim 11, further comprising the following configuration: (g) Preliminarily testing the small electronic device to be near a desired test temperature before housing the small electronic device to be tested in the socket. Test temperature pre-adjustment means for adjusting to the temperature of. 13. The apparatus for testing a small electronic device according to claim 12, wherein the test temperature pre-adjusting means is a test sample preheating means for preheating the small electronic device to be tested.