JPH04272977A - Curable coating resin composition and resin composition for color filter protective film containing same - Google Patents

Abstract

PURPOSE:To provide a coating resin composition excellent in smoothness, transparency, adhesiveness, water resistance, chemical resistance, heat resistance and mar resistance. CONSTITUTION:A curable coating resin composition comprising a copolymer resin prepared by copolymerizing an N-substituted maleimide (i) with methyl methacrylate (ii), acrylic acid and/or methacrylic acid (iii), and optionally an unsaturated monomer copolymerizable with (i), (ii) and/or (iii) and an epoxy resin having at least two epoxy groups in the molecule.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating curing resin composition and a color filter protective film resin composition using the same.

0002

2. Description of the Related Art Cured coatings are often formed for the purpose of preventing deterioration and damage to the surfaces of various articles. In such a cured coating film, it is necessary to obtain a smooth coating film, have high adhesion to the substrate, be tough, and have excellent water resistance, chemical resistance, and solvent resistance.
It is required to have high heat resistance, high light resistance, and no deterioration for a long period of time.

[0003] In recent years, liquid crystal display elements, solar cells,
In addition to the above-mentioned performance, there is an increasing number of applications in which cured coating films for optical discs and the like are required to have transparency and the like.

For example, in recent years, various color liquid crystal display elements incorporating color filters have been announced. In producing this color liquid crystal display element, a color filter is provided on a transparent substrate such as glass, an inorganic thin film made of indium tin oxide (ITO), etc. is deposited on this, and transparent electrodes are formed by patterning using photolithography. A method in which liquid crystal is further placed on top of the liquid crystal after forming the liquid crystal is becoming mainstream. In this case, since the color filter does not have enough heat resistance and chemical resistance to withstand the process of vapor depositing ITO on it and forming transparent electrodes using photolithography, it is necessary to It is necessary to form a protective film on the color filter.

Properties required of this color filter protective film include, in addition to heat resistance and chemical resistance, adhesion to glass substrates and color filters, coating properties, transparency, and scratch resistance. Of these, heat resistance is based on the IT
When a transparent electrode such as O is formed by vapor deposition, the surface of the protective film is usually heated to 200° C. or higher, so it needs to be stable under this condition.

[0006] Examples of coating hardening materials having excellent heat resistance and chemical resistance include acrylic resins described in JP-A-58-196506 and JP-A-62-119501; Polyglycidyl methacrylate resin described in JP-A-216307, JP-A-63-13110
Melamine resins, epoxy resins, and other polyimide resins described in Publication No. 3 have been proposed.

[0007]

[Problems to be Solved by the Invention] However, each of the conventionally proposed materials has drawbacks, and there is no well-balanced material that satisfies all required properties.

For example, acrylic resins have insufficient heat resistance, and there is a problem in that wrinkles and cracks occur on the surface of the film during vapor deposition of ITO and the like.

[0009] Polyglycidyl methacrylate resin has insufficient adhesion to glass substrates, etc., and it is necessary to sufficiently prevent peeling during the liquid crystal element assembly process and infiltration of chemicals into the color filter layer. I can't.

Although melamine resin has relatively high heat resistance, it has extremely poor adhesion to glass substrates and color filters, and tends to cause repellency on the substrates and filters.

Epoxy resins with good adhesion have insufficient heat resistance, and those with high heat resistance have poor coating properties, making it impossible to balance the required properties. Furthermore, polyimide resins have problems such as insufficient transparency, poor storage stability of varnishes, and the fact that only solvents that can soak color filters can be used.

The purpose of the present invention is to solve the above-mentioned drawbacks of conventional materials and to create a well-balanced material that satisfies all required properties such as heat resistance, chemical resistance, adhesion, coating properties, transparency, and scratch resistance. The present invention provides a novel coating curing resin composition and a color filter protective film resin composition using the same.

[0013]

[Means for Solving the Problems] That is, the present invention is based on A.
(1) N-substituted maleimide (2) Methyl methacrylate, (
3) Acrylic acid and/or methacrylic acid and (
4) A copolymer resin obtained by copolymerizing an unsaturated monomer copolymerizable with (1), (2) and/or (3) if necessary; and B. The present invention relates to a coating curing resin composition containing an epoxy resin having two or more epoxy groups in the molecule, and a color filter protective film resin composition using the same.

As (1) N-substituted maleimide as a monomer component constituting the copolymer resin which is component A in the present invention, known ones can be used, including N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-substituted maleimide, and N-substituted maleimide.
It is preferable to use at least one compound selected from the group consisting of butylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, and N-alkyl group-substituted phenylmaleimide from the viewpoint of heat resistance and adhesion to the substrate. Among these, N-cyclohexylmaleimide and N-phenylmaleimide are particularly preferred. A
The blending amount of (1) N-substituted maleimide in the component copolymer resin is 20 to 70% by weight ((1), (2), (3)
) and (4) based on the total amount). If the amount is less than this, the resulting coating film tends to have insufficient heat resistance, and if it is more than this, there is a tendency for problems with adhesion and coating properties to occur.

The blending amount of methyl methacrylate in (2) is 10 to 60% by weight ((1), (2), (3)) in the copolymer resin.
) and (4) based on the total amount). When the amount is less than this, coating properties and adhesion tend to deteriorate, and when it is more than this, heat resistance tends to be insufficient.

The blending amount of acrylic acid and/or methacrylic acid (3) is 5 to 30% by weight ((1
), (2), (3) and (4)). When the amount is less than this, the heat resistance and scratch resistance of the resulting cured product tend to be insufficient, and when it is more than this, the coating properties and the chemical resistance of the cured product tend to be reduced.

(4) (1), (2) and/or (
Examples of unsaturated monomers copolymerizable with 3) include unsaturated fatty acid esters, aromatic vinyl compounds, and vinyl cyanide compounds.

Examples of unsaturated fatty acid esters include:
Acrylic acid alkyl esters such as methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, acrylic acid tricyclo[5,2,1,02'6]dec-8-yl ester, acrylic acid Acrylic acid cycloalkyl esters such as isobornyl and norbornyl acrylate; acrylic acid aromatic esters such as phenyl acrylate and benzyl acrylate; acrylic acid esters such as glycidyl acrylate 2-hydroxyethyl acrylate; ethyl methacrylate and butyl methacrylate , methacrylic acid alkyl esters such as 2-ethylhexyl methacrylate, cyclohexyl methacrylate, tricyclo methacrylate [5,2,1,
02'6] Methacrylic acid cycloalkyl esters such as dec-8-yl ester, isobornyl methacrylate, norbornyl methacrylate, methacrylic acid aromatic esters such as phenyl methacrylate, benzyl methacrylate, glycidyl methacrylate, 2-hydroxy methacrylate Examples include methacrylic acid esters such as ethyl.

Examples of aromatic vinyl compounds include styrene, α-substituted styrenes such as α-methylstyrene and α-ethylstyrene, and nuclear-substituted styrenes such as chlorostyrene, vinyltoluene and t-butylstyrene.

Examples of vinyl cyanide compounds include:
Examples include acrylonitrile and methacrylonitrile.

These (4), (1), (2) and/
Alternatively, the unsaturated monomer copolymerizable with (3) is used in an amount of 0 to 50% by weight based on the total amount of (1), (2), (3) and (4) in the copolymer resin of component A. When the amount is 50% by weight or more, the effect of the present invention tends to be insufficient.

These (1), (2), (3) and (
In copolymerizing 4), known methods such as radical polymerization and ionic polymerization can be applied. For example, it can be produced by methods such as bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization in the presence of a polymerization initiator.

Examples of the polymerization initiator include benzoyl peroxide, lauroyl peroxide, di-t-butylperoxyhexahydrophthalate, t-butylperoxy-2-ethylhexanoate, 1,1-di-t-butylperoxy -Organic peroxides such as 3,3,5-trimethylcyclohexane, azobisisobutyronitrile, azobis-4-
Reduction with azo compounds such as methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitrile, and azodibenzoyl, water-soluble catalysts such as potassium persulfate, and ammonium persulfate, and peroxides or persulfates. Redox catalyst by combination of agents, etc.
Any material that can be used in normal radical polymerization can be used. The polymerization catalyst is preferably used in an amount of 0.01 to 10% by weight based on the total amount of (1), (2), (3) and (4).

Further, as a polymerization regulator, a mercaptan compound, thioglycol, carbon tetrabromide, α-methylstyrene dimer, etc. may be added as necessary for controlling the molecular weight.

The polymerization temperature is preferably selected appropriately within the range of 0 to 200°C, particularly preferably 50 to 12°C.

[0026] As the solvent for solution polymerization, the solvents used for ordinary radical polymerization can be used. Specific examples include aromatic solvents such as benzene, toluene, and xylene;
Ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; Ether solvents such as diethyl ether, isopropyl ether, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether; ethyl acetate, acetic acid -n-propyl, isopropyl acetate, n-butyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene Examples include ester solvents such as glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and γ-butyrolactone; amide solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. Among these solvents, ester solvents and ketone solvents are preferred and can be used alone or in combination of two or more. In addition,
Normally, when used as a resin composition for coating effect, it contains a solvent, so it is preferable to polymerize by solution polymerization using the same solvent. It is also possible to use it by separating it and dissolving it in another solvent.

The epoxy resin having two or more epoxy groups in the molecule, which is component B in the present invention, includes bisphenol A type liquid epoxy resin, bisphenol A type solid epoxy resin, bisphenol F type epoxy resin, phenol novolac epoxy resin, Cresol novolac epoxy resin, alicyclic epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin,
Although there are heterocyclic epoxy resins, phenol novolac epoxy resins and cresol novolac epoxy resins are particularly preferred from the viewpoint of heat resistance and adhesiveness.

The mixing ratio of component A and component B in the composition of the present invention is preferably such that 30 to 300 parts by weight of the epoxy resin as component B is blended to 100 parts by weight of the copolymer resin as component A. If the amount of the epoxy resin as component B is too small, chemical resistance tends to be insufficient, and if it is too large, adhesion tends to decrease.

[0029] In addition to components A and B, various components (component C) can be used in the resin composition for coating and curing of the present invention, if necessary. As component C, it is preferable to use at least one compound selected from the group consisting of polyvalent carboxylic acid anhydrides and polyvalent carboxylic acids from the viewpoint of improving heat resistance and scratch resistance.

Examples of the polycarboxylic anhydride include itaconic anhydride, maleic anhydride, succinic anhydride, citraconic anhydride, dodecenylsuccinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and anhydride. Aliphatic dicarboxylic anhydrides such as methylhexahydrophthalic acid, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride; cyclopentanetetracarboxylic dianhydride;
Aliphatic polycarboxylic dianhydrides such as 1,2,3,4-butanetetracarboxylic dianhydride; phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, 3,3 Aromatic polycarboxylic acid anhydrides such as ',4,4'-diphenylsulfonetetracarboxylic dianhydride; ester group-containing acid anhydrides such as ethylene glycol bistrimelitate and glycerin tristrimelitate; can. Examples of polycarboxylic acids include aliphatic polycarboxylic acids such as itaconic acid, maleic acid, succinic acid, tosilaconic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, and cyclopentanetetracarboxylic acid; phthalic acid, Examples include aromatic polycarboxylic acids such as terephthalic acid, isophthalic acid, trimellitic acid, pyromellitic acid, and benzophenonetetracarboxylic acid.

[0031] These polyvalent carboxylic acid anhydrides and polyvalent carboxylic acids may be used alone or in combination of two or more types, but aromatic polyvalent carboxylic acid anhydrides and aromatic polyvalent carboxylic acids is preferred from the viewpoint of heat resistance, and trimellitic anhydride is particularly preferred from the viewpoint of the balance between heat resistance and solubility in solvents.

C of at least one compound selected from the group consisting of polyvalent carboxylic acid anhydrides and polyvalent carboxylic acids.
When using a component, copolymer resin 100 which is component A
It is preferable to use it in a range of 5 to 50 parts by weight. When the amount is less than this, it is difficult to obtain a sufficient effect of use, and when it is more than this, coating properties, chemical resistance, etc. tend to deteriorate.

[0033] Furthermore, a coupling agent may be added to the composition of the present invention in order to improve adhesion. As the coupling agent, a functional silane coupling agent is preferable, and a silane coupling agent having a reactive substituent such as a vinyl group, methacryloyl group, hydroxyl group, carboxyl group, amino group, isocyanate group, or epoxy group, specifically, Vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane,
γ-Isocyanatopropyltriethoxysilane, γ-
Examples include glycidoxypropyltrimethoxysilane, and silane coupling agents having epoxy groups are particularly preferred because they have excellent adhesive properties, solvent resistance, and the like. These functional silane coupling agents may be used alone or in combination of two or more. The amount of the functional silane coupling agent used is based on the total amount of the copolymer resin of component A and the epoxy resin of component B being 100 parts by weight. The amount is preferably in the range of 0.1 to 10 parts by weight; if it is less than this, the effect of use tends to be insufficient, and if it is more than this, chemical resistance etc. tend to decrease.

The composition of the present invention can usually be dissolved in a solvent, applied, and cured by heating to form a coating film. The solvent is not particularly limited as long as it dissolves the composition of the present invention and does not react with these components. Specifically, the solvents exemplified as solvents for solution polymerizing the copolymer resin, which is component A of the present invention, may be mentioned. Among these solvents, ester solvents and ketone solvents are preferred, and they can be used alone or in combination of two or more.

The method of preparing a composition solution by dissolving the composition of the present invention in a solvent is not particularly limited, and the composition solution may be prepared by dissolving all the components in a solvent at the same time. If necessary, each component may be prepared as two or more solutions and mixed at the time of use to form a composition solution. When preparing the composition solution in this manner, the amount of solvent used is preferably 50 to 95% by weight of the total amount of the final composition solution to be applied. If it is less than 50% by weight, the solid content concentration is too high, which may reduce the leveling properties of the coating film or reduce the transparency of the coating film, while if it exceeds 95% by weight, the solid content concentration is too low. In some cases, the chemical resistance of the coating film may become insufficient. Also,
If necessary, stabilizers such as curing accelerators, antioxidants, and ultraviolet absorbers used in the curing of general epoxy resins may be added to the composition of the present invention to an extent that does not impair transparency. Also good.

The method for applying the composition solution of the present invention is not particularly limited, and includes coating methods such as dipping, spraying, roll coating, and spin coating, as well as printing methods such as screen printing and offset printing. . The heat curing conditions for the composition of the present invention are appropriately selected depending on the specific type and blending ratio of each component of the composition, but are usually 50 to 300°C and 0.1 to
It is about 10 hours, preferably about 1 to 5 hours at 100 to 250°C.

The cured coating film formed from the composition of the present invention exhibits excellent adhesion to various materials such as glass, metals, and plastics, and is smooth, tough, and has light resistance, heat resistance,
Because it has excellent water resistance, solvent resistance, and transparency, it is useful as a coating film for various articles. In particular, as color filter protective films, surface protective layers and anti-dye protective layers of various color filters obtained by dyeing various binder resins such as gelatin, glue, polyvinyl alcohol, and acrylic resins with dyes or by dispersing pigments are used. It is useful as When used as a color filter protective film,
The film thickness after heat curing is 0.05 to 30 μm, preferably 0.
．． It can be used by appropriately applying the coating to a thickness of about 1 to 10 μm.

[0038] In the prior art, coating properties, adhesion,
Although there was nothing that satisfied all the required properties such as heat resistance, by combining compounds with specific structures of the present invention,
It has become possible to satisfy each of these required characteristics in a well-balanced manner.

[0039]

[Examples] The present invention will be explained in detail with reference to Examples below, but the present invention is not limited to these Examples. Example 1 100 parts by weight of cellosolve acetate (acetoxyethoxyethane) was charged into a 1-liter flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a reflux condenser, and a dropping funnel, and the inside of the flask was purged with nitrogen. 75 parts by weight of N-phenylmaleimide, 45 parts by weight of methyl methacrylate, 30 parts by weight of methacrylic acid, and 0.6 parts by weight of azobisisobutyronitrile were dissolved in 350 parts by weight of cellosolve acetate, and the solution was placed in the 1 L flask described above in a nitrogen stream. The mixture was added dropwise at 80°C over 3 hours. After further stirring at 80°C for 5 hours, the temperature was raised to 120°C and maintained for 2 hours.

The obtained copolymer resin solution has a viscosity of 52 poise (25°C) and a nonvolatile content of 25.2% by weight (1
80° C. for 1 hour, according to JIS C-2103), and the acid value was 32.3 (mgKOH/g).

Cresol novolac epoxy resin (Nippon Kayaku Co., Ltd.; EOC) was added to 400 parts by weight of this copolymer resin solution.
N-102S, epoxy equivalent 214 (g/eq), softening point 75°C) 50 parts by weight, trimellitic anhydride 10 parts by weight, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd.); SH-6040
) and 375 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The resulting solution had a viscosity of 62 centipoise (25°C) and a volatile content of 19
．． It was 8% by weight (180%・1h).

[0042] This solution was filtered through a membrane filter with a pore size of 0.2 μm, and then spin-coated on a glass plate (Dow Corning 7059 material, alkali-free glass) at a rotation speed of 2,000 rpm using a spin coater. After coating, the glass plate was heat-treated in a constant temperature bath at 180° C. for 1 hour to cure the coating film. The surface of the resulting coating film was extremely smooth and no pinholes were observed. The film thickness measured by a dual-light interference microscope was 1.2 μm.

The following tests were conducted on the coating film thus prepared. In order to examine the adhesion of the coating film to the glass plate, a cross-cut test (JIS-K-54) was performed using tape peeling.
00) was performed. As a result, the number of remaining samples was 100/100, and no peeling was observed.

Next, the absorption spectrum of the coating film in the range from 400 nm to 800 nm was measured using the same glass plate as the one on which it was applied as a reference, and the light transmittance was 90% or more in the entire region.

[0045] Also, after 10 hours of pressure cooker test (120°C, 2 atmospheres) of the glass plate with this coating applied,
After 30 minutes of immersion in N-methylpyrrolidone at room temperature, 30 minutes of immersion in 5% sodium hydroxide aqueous solution at room temperature, and 250°C
After being left in a gear oven for 1 hour, the above-mentioned cross-over test and light transmittance measurement were performed, but no decrease in adhesiveness or light transmittance was observed in either case. The test results are summarized in Table 1.

Example 2 Cellosolve acetate 100 was added to a 1 L flask equipped with a stirrer, thermometer, nitrogen inlet tube, reflux condenser, and dropping funnel.
Parts by weight were charged and the inside of the flask was purged with nitrogen. 75 parts by weight of N-phenylmaleimide, 37.5 parts by weight of methyl methacrylate
parts by weight, 37.5 parts by weight of methacrylic acid, 0.6 parts by weight of azobisisobutyronitrile, and 35 parts by weight of cellosolve acetate.
8 parts by weight in a nitrogen stream in the aforementioned 1 liter flask.
The mixture was added dropwise at 0°C over 3 hours. After further stirring at 80°C for 5 hours, the temperature was raised to 120°C and maintained for 2 hours. The obtained copolymer resin solution has a viscosity of 86 poise (25°C), a nonvolatile content of 25.3% by weight (180°C, 1 h), and an acid value of 40.
5 (mgKOH/g).

Cresol novolac epoxy resin (Nippon Kayaku Co., Ltd.; EOC) was added to 400 parts by weight of this copolymer resin solution.
N-103S epoxy equivalent 218 (g/eq) softening point 85°C) 65 parts by weight, trimellitic anhydride 10 parts by weight, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd., SH- 6040
) and 500 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The resulting solution had a viscosity of 67 centipoise (25°C) and a non-volatile content (180
℃・1h) 18.0% by weight. The obtained solution was applied onto glass in the same manner as in Example 1 and cured by heating, and various characteristic tests of the coating film were conducted. The results are shown in Table 1.

Example 3 Cellosolve acetate 100 was added to a 1 L flask equipped with a stirrer, thermometer, nitrogen inlet tube, reflux condenser, and dropping funnel.
Parts by weight were charged and the inside of the flask was purged with nitrogen. 75 parts by weight of N-cyclohexylmaleimide, 4 parts by weight of methyl methacrylate
5 parts by weight, 30 parts by weight of methacrylic acid, 0.6 parts by weight of azobisisobutyronitrile, and 350 parts by weight of cellosolve acetate.
80% by weight in a nitrogen stream into the 1 liter flask mentioned above.
The mixture was added dropwise at ℃ over 3 hours. After further stirring at 80°C for 5 hours, the temperature was raised to 120°C and maintained for 2 hours.

Cresol novolak epoxy resin (Nippon Kayaku Co., Ltd. EO) was added to 400 parts by weight of the obtained copolymer resin solution.
CN-102S) 50 parts by weight, trimellitic anhydride 10
Parts by weight, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd., SH-6
040) 1.6 parts by weight and 375 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The resulting solution had a viscosity of 56 centipoise (at 25°C) and a non-volatile content of 20
．． It was 2% by weight (180°C/1h). The obtained solution was applied onto glass in the same manner as in Example 1 and cured by heating, and various characteristic tests of the coating film were conducted. The results are shown in Table 1.

Comparative Example 1 Cresol novolac epoxy resin (Nippon Kayaku Co., Ltd.,
EOCN-103S) 10 parts by weight, trimellitic anhydride 3 parts by weight, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd., SH-
6040) 0.1 parts by weight 40 parts by weight of cellosolve acetate were uniformly mixed and dissolved at room temperature, and the resulting solution was used in Example 1.
In the same manner as above, it was applied onto glass and cured by heating, and various characteristic tests of the coating film were conducted. The results are shown in Table 1.

Comparative Example 2 Polyglycidyl methacrylate (polystyrene equivalent weight average molecular weight approximately 80,000) 6 g, trimellitic anhydride 0
．． 6g, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd., SH-6
040) 0.3 g and 35 parts by weight of cellosolve acetate were uniformly mixed and dissolved at room temperature, and the resulting solution was applied on glass in the same manner as in Example 1, and cured by heating, and various characteristics tests of the coating film were conducted. . The results are shown in Table 1.

[0052]

[Table 1]

Example 4 The surface hardness of the coating films formed in Examples 1 to 3 was determined by pencil hardness (J
IS K-5400). The results are shown in Table 2.

[0054]

[Table 2]

Example 5 Using the composition solutions prepared in Examples 1 to 3, suitability for color filter substrates was investigated. As a testing method, a color filter base material was prepared using a generally known method, and the applicability on this base material and heat resistance were examined. To prepare the color filter base material, first, an aqueous solution of gelatin-ammonium dichromate (10:1, polymerization ratio) was spin-coated on a transparent glass substrate so that the film thickness after drying was 1 μm, and then coated at 80°C for 10 minutes. After drying for minutes and irradiating the resulting coating with ultraviolet light,
A dyed substrate layer was obtained by developing with pure water. This was immersed in the following red dyeing bath, washed with water, and then dried at 150° C. for 30 minutes to form a color filter base material dyed red. Dye bath Suminol Milling Red RS (manufactured by Sumitomo Chemical Co., Ltd.)
2g acetic acid

3g distilled water

100g

[0056] Next, the composition solution was spin-coated on this color filter base material at 2,000 rpm, and dried at 180°C for 1 hour to form a protective layer. Indium tin oxide (ITO) was placed on the color filter with a protective film prepared in this way.
was deposited according to a conventional method, and then patterned by photolithography. When this color filter with an ITO pattern was observed in detail using an optical microscope, no wrinkles or cracks were observed on the color filter or the protective film, and the adhesion and adhesion between the color filter and the protective film were also good. Ta.

[0057]

Effects of the Invention As is clear from the examples, the coating film formed by the coating curing composition of the present invention is smooth, has transparency, adhesion, water resistance, chemical resistance, heat resistance, and scratch resistance. It is extremely excellent in the following, and is useful as a coating material for various articles, especially as a color filter protective film material.

Claims (5)

[Claims] [Claim 1] A. (1) N-substituted maleimide, (2)
Methyl methacrylate, (3) acrylic acid and/or methacrylic acid, and (4) optionally (1), (2)
and/or a copolymer resin obtained by copolymerizing an unsaturated monomer copolymerizable with (3); and B. A resin composition for coating and curing, comprising an epoxy resin having two or more epoxy groups in the molecule. Claim 2: Furthermore, C. A coating-curing resin composition comprising at least one compound selected from the group consisting of polycarboxylic anhydrides and polycarboxylic acids. 3. The N-substituted maleimide is N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-substituted maleimide, and N-substituted maleimide.
The coating curing resin composition according to claim 1 or 2, which is at least one compound selected from the group consisting of butylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, and N-alkyl group-substituted phenylmaleimide. 4. The coating curing resin composition according to claim 1, wherein the epoxy resin is at least one selected from the group consisting of phenol novolac epoxy resins and cresol novolac epoxy resins. 5. A resin composition for a color filter protective film, comprising the coating curing resin composition according to claim 1, 2, 3, or 4.