JP3008512B2 - Coating resin composition and resin composition for color filter protective film using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for coating and a resin composition for a color filter protective film using the same.

[0002]

2. Description of the Related Art A coating film is often formed for the purpose of preventing deterioration or damage of the surface of various articles. In such a coating film, a smooth coating film can be obtained, high adhesion to a substrate, toughness, excellent water resistance and chemical resistance, excellent solvent resistance, heat resistance In addition, performance such as high light resistance and no deterioration for a long time is required.

In recent years, liquid crystal display devices, solar cells,
As a coating film used for an optical disk or the like, applications requiring transparency and the like in addition to the above-mentioned performance are increasing.

For example, in recent years, various color liquid crystal display devices incorporating a color filter have been announced. To manufacture this color liquid crystal display device, a color filter is provided on a transparent substrate such as glass, and an inorganic thin film made of indium tin oxide (ITO) or the like is deposited thereon and patterned by photolithography to form a transparent electrode. After the formation, a method of further disposing a liquid crystal thereon is becoming mainstream. In this case, the color filter does not have heat resistance and chemical resistance enough to withstand a process of forming a transparent electrode by photolithography by depositing ITO on the color filter. It is necessary to form a protective film on the color filter.

The properties required for the color filter protective film include heat resistance, chemical resistance, adhesion to a glass substrate and a color filter, coating properties, transparency, scratch resistance, and the like. Among them, heat resistance is based on the IT
When a transparent electrode such as O is formed by vapor deposition, the surface of the protective film is usually heated to 200 ° C. or higher, so that it is necessary to be stable under this condition.

As a coating material having such excellent heat resistance and chemical resistance, Japanese Patent Application Laid-Open No. 58-196506 is disclosed.
And JP-A-62-119501, polyglycidyl methacrylate-based resin described in JP-A-60-216307, JP-A-63-131
No. 103, melamine resin, epoxy resin and other polyimide resins have been proposed.

[0007]

However, each of the materials proposed in the prior art has its own drawbacks, and there is no well-balanced material that satisfies all the required characteristics.

For example, the heat resistance of an acrylic resin is insufficient, and there is a problem that wrinkles and cracks are formed on the surface of the film when depositing ITO or the like.

The polyglycidyl methacrylate-based resin has insufficient adhesion to a glass substrate or the like, and sufficiently prevents peeling during the liquid crystal element assembling process and entry of chemicals or the like into the color filter layer. Can not.

Although melamine resin has relatively high heat resistance, its adhesion to a glass substrate or a color filter is extremely poor, and cissing easily occurs on the substrate or the filter.

Epoxy resins having good adhesiveness have insufficient heat resistance, while those having high heat resistance are inferior in adhesion and coating properties, so that the required properties cannot be balanced. In addition, the polyimide resin has problems that the transparency is insufficient, the storage stability of the varnish is lacking, and that only a solvent that can soak the color filter can be used.

It is an object of the present invention to solve the above-mentioned drawbacks of the conventional materials and to provide a new and well-balanced material capable of satisfying all required characteristics such as heat resistance, chemical resistance, adhesion, coating properties, transparency, and scratch resistance. An object of the present invention is to provide a coating resin composition and a resin composition for a color filter protective film using the same.

[0013]

That is, the present invention provides: A, (1) N-substituted maleimide, (2) acrylic acid and / or methacrylic acid, and (3) if necessary (1)
And / or a resin composition for coating comprising a copolymer resin obtained by copolymerizing an unsaturated monomer copolymerizable with (2) and B, an epoxy resin having two or more epoxy groups in a molecule. And a resin composition for a color filter protective film using the same.

As (1) N-substituted maleimide as a monomer component constituting the copolymer resin which is the component A in the present invention, known compounds can be used, and N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide,
It is preferable to use at least one compound selected from the group consisting of butylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide and N-alkyl-substituted phenylmaleimide from the viewpoint of heat resistance and adhesion to a substrate. Of these, N-cyclohexylmaleimide and N-phenylmaleimide are particularly preferred. A
The amount of the (1) N-substituted maleimide in the copolymer resin as a component is preferably 20 to 70% by weight (based on the total amount of (1), (2) and (3)). If the amount is less than this, the heat resistance of the obtained coating film tends to be insufficient, and if it is more than this, there is a tendency that the adhesion and the coating property are disadvantageous.

(2) The amount of acrylic acid and / or methacrylic acid is preferably 5 to 30% by weight (based on the total amount of (1), (2) and (3)). When the amount is less than this, the heat resistance and scratch resistance of the obtained cured product tend to be insufficient, and when it is more than this, the coating property and the chemical resistance of the cured product tend to decrease.

(3) Examples of unsaturated monomers copolymerizable with (1) and / or (2) include unsaturated fatty acid esters, aromatic vinyl compounds and vinyl cyanide compounds.

As the unsaturated fatty acid ester, for example,
Alkyl acrylates such as methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, tricyclo [5,2,1,0 ² ' ⁶ ] deca-8-yl acrylate; Isobornyl acrylate, cycloalkyl acrylate such as norbornyl acrylate, phenyl acrylate, aromatic acrylate such as benzyl acrylate, glycidyl acrylate, acrylate such as 2-hydroxyethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, methacrylic acid alkyl esters such as 2-ethylhexyl methacrylate, cyclohexyl methacrylate, tricyclo [5,2,1,0 ^{2 '6]} dec-8-yl ester, methacryl Acid isobornyl methacrylate cycloalkyl esters such as norbornyl methacrylate, phenyl methacrylate, aromatic esters of benzyl methacrylate, glycidyl methacrylate, and the like methacrylic acid esters such as 2-hydroxyethyl methacrylate.

Examples of the aromatic vinyl compound include styrene or α-substituted styrene such as α-methylstyrene and α-ethylstyrene, and nucleus-substituted styrene such as chlorostyrene, vinyltoluene and t-butylstyrene.

As the vinyl cyanide compound, for example,
There are acrylonitrile, methacrylonitrile and the like.

The unsaturated monomer copolymerizable with (3) (1) and / or (2) is 0 to 50% by weight.
(Based on the total amount of (1), (2) and (3)). When the content is 50% by weight or more, the effect of the present invention tends to be insufficient.

In copolymerizing (1), (2) and (3), known methods such as radical polymerization and ionic polymerization can be used. For example, it can be produced by a method such as a bulk polymerization method, a solution polymerization method, a suspension polymerization method, and an emulsion polymerization method in the presence of a polymerization initiator.

Examples of the polymerization initiator include benzoyl peroxide, lauroyl peroxide, di-t-butylperoxyhexahydrophthalate, t-butylperoxy-2-ethylhexanoate and 1,1-di-t-butylperoxy. Organic peroxides such as -3,3,5-trimethylcyclohexane, azobisisobutyronitrile, azobis-4-
Azo compounds such as methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitrile, azodibenzoyl, water-soluble catalysts represented by potassium persulfate and ammonium persulfate, and reduction with peroxides or persulfates Any of those that can be used for ordinary radical polymerization, such as a redox catalyst by a combination of agents, can be used. The polymerization catalysts are (1), (2) and (3)
Is preferably used in the range of 0.01 to 10% by weight based on the total amount of

Further, as a polymerization regulator, a mercaptan compound, thioglycol, carbon tetrabromide, α-methylstyrene dimer, or the like can be added as needed for controlling the molecular weight.

The polymerization temperature is suitably selected within the range of 0 to 200 ° C., preferably 50 to 120 ° C.

As the solvent in the solution polymerization, a solvent used in ordinary radical polymerization can be used. Specific examples include aromatic solvents such as benzene, toluene, and xylene; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; diethyl ether, isopropyl ether, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and ethylene glycol diethyl ether. , Diethylene glycol dimethyl ether, diethylene glycol diethyl ether and other ether solvents; ethyl acetate, acetic acid-
n-propyl, isopropyl acetate, -n-butyl acetate,
Ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ester solvents such as γ-butyrolactone; amide solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone. Of these solvents,
Ester solvents and ketone solvents are preferred, alone,
Alternatively, two or more kinds can be used as a mixture.
In general, when used as a coating resin composition, since it contains a solvent, it is preferable to polymerize by a solution polymerization method using the same solvent. It is also possible to isolate and dissolve in another solvent before use.

The epoxy resin having two or more epoxy groups in the molecule as the component B in the present invention includes bisphenol A type liquid epoxy resin, bisphenol A type solid epoxy resin, bisphenol F type epoxy resin, phenol novolak epoxy resin, Cresol novolak epoxy resin, alicyclic epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin,
Although there are heterocyclic epoxy resins and the like, phenol novolak epoxy resin and cresol novolak epoxy resin are particularly preferable in terms of heat resistance and adhesion.

The mixing ratio of the component A and the component B in the composition of the present invention is preferably such that 30 to 300 parts by weight of the epoxy resin of the component B is mixed with 100 parts by weight of the copolymer resin of the component A. If the amount of the epoxy resin as the component B is too small, the chemical resistance tends to be insufficient. If the amount is too large, the adhesiveness tends to decrease.

The coating resin composition of the present invention includes:
If necessary, various components (component C) can be used in addition to the components A and B. The use of at least one compound selected from the group consisting of polycarboxylic anhydrides and polycarboxylic acids as the C component is advantageous in heat resistance,
It is preferable from the viewpoint of improving scratch resistance.

Examples of polycarboxylic anhydrides include itaconic anhydride, maleic anhydride, succinic anhydride, citraconic anhydride, dodecenylsuccinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. Aliphatic dicarboxylic anhydrides such as methylhexahydrophthalic acid, endmethylenetetrahydrophthalic anhydride, and methylendmethylenetetrahydrophthalic anhydride; cyclopentanetetracarboxylic dianhydride;
Aliphatic polycarboxylic dianhydrides such as 1,2,3,4-butanetetracarboxylic dianhydride; phthalic anhydride, trimetic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, 3,3 ′ Aromatic polycarboxylic anhydrides such as 4,4'-diphenylsulfonetetracarboxylic dianhydride; ethylene glycol bistrimellitate;
Acid anhydrides containing ester groups such as glycerin tris-limellitate can be mentioned. Examples of the polycarboxylic acid include aliphatic polycarboxylic acids such as itaconic acid, maleic acid, succinic acid, citraconic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, and cyclopentanetetracarboxylic acid; phthalic acid And aromatic polycarboxylic acids such as terephthalic acid, isophthalic acid, trimellitic acid, pyromellitic acid and benzophenonetetracarboxylic acid.

These polycarboxylic anhydrides and polycarboxylic acids may be used alone or in combination of two or more. However, aromatic polycarboxylic anhydrides and aromatic polycarboxylic acids may be used. Is preferred from the viewpoint of heat resistance, and trimellitic anhydride is particularly preferred from the viewpoint of the balance between heat resistance and solubility in a solvent.

C such as at least one compound selected from the group consisting of polycarboxylic anhydrides and polycarboxylic acids;
When the component is used, the copolymer resin 100 as the component A is used.
It is preferable to use in the range of 5 to 50 parts by weight with respect to parts by weight. If the amount is less than this, it is difficult to obtain a sufficient effect of use.

Further, a coupling agent can be added to the composition of the present invention in order to improve the adhesion. As the coupling agent, a functional silane coupling agent is preferably a silane coupling agent having a reactive substituent such as a vinyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an amino group, an isocyanate group, or an epoxy group. Vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane,
γ-isocyanatopropyltriethoxysilashi, γ-
Glycidoxypropyltrimethoxysilane and the like are preferable, and a silane coupling agent having an epoxy group is particularly preferable because of excellent adhesiveness and solvent resistance. These functional silane coupling agents may be used alone or in combination of two or more. The amount of the functional silane coupling agent used is, assuming that the total amount of the copolymer resin of the component A and the epoxy resin of the component B is 100 parts by weight,
The content is preferably in the range of 0.1 to 10 parts by weight. If the amount is less than 0.1 part by weight, the effect of use tends to be insufficient.

The composition of the present invention can be usually formed by dissolving in a solvent, applying the composition, and curing by heating. The solvent is not particularly limited as long as it dissolves the composition of the present invention and does not react with these components. Specifically, the solvents exemplified as the solvent when the copolymer resin as the component A of the present invention is subjected to solution polymerization are exemplified. Among these solvents, ester solvents and ketone solvents are preferred, and they can be used alone or as a mixture of two or more.

The method for preparing the composition solution by dissolving the composition of the present invention in a solvent is not particularly limited, and the composition solution may be prepared by simultaneously dissolving all the components in the solvent. If necessary, each component may be appropriately prepared as two or more solutions, and these may be mixed at the time of use to form a composition solution. The amount of the solvent used when preparing the composition solution in this manner is preferably 50 to 95% by weight based on the total amount of the final composition solution to be applied. 50
If the amount is less than 95% by weight, the solid content may be too high to reduce the leveling property of the coating film or the transparency of the coating film may be reduced. The chemical resistance of the coating film may be insufficient. Further, the composition of the present invention may be added, if necessary, with a curing accelerator used for curing a general epoxy resin, a stabilizer such as an antioxidant or an ultraviolet absorber to such an extent that transparency is not impaired. May be.

The method for applying the composition solution of the present invention is not particularly limited, and may be a dipping method, a spraying method, a roll coating method, a spin coating method, or the like, or a coating method such as screen printing or offset printing. is there. The heat-curing conditions of the composition of the present invention are appropriately selected depending on the specific types of each component of the composition, the mixing ratio, and the like.
10 to 10 hours, preferably about 100 to 250 ° C. for about 1 to 5 hours.

The coating film formed by the composition of the present invention exhibits excellent adhesion to various materials such as glass, metal, plastic, etc., and is smooth, tough, light-resistant, heat-resistant, water-resistant, and solvent-resistant. Because of its excellent properties and transparency, it is useful as a coating film for various articles. In particular, as a color filter protective film, a surface protective layer of various color filters obtained by dyeing various binder resins such as gelatin, glue, polyvinyl alcohol, and acrylic resin with a dye or dispersing the pigment, and a protective layer for preventing dyeing. Useful as When it is used as a color filter protective film, it can be appropriately coated and used so that the film thickness after heat curing is about 0.05 to 30 μm, preferably about 0.1 to 10 μm.

In the prior art, coating properties, adhesion,
Although none satisfy all the required properties such as heat resistance, by the combination of the compounds of the specific structure of the present invention,
These required characteristics can be satisfied in a well-balanced manner.

[0038]

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Example 1 100 parts by weight of cellosolve acetate (acetoxyethoxyethane) was charged into a 1-liter flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a reflux condenser, and a dropping funnel, and the atmosphere in the flask was replaced with nitrogen. 105 parts by weight of N-phenylmaleimide, 30 parts by weight of methacrylic acid, 15 parts by weight of ethyl acrylate, and 0.6 parts by weight of azobisisobutyronitrile were dissolved in 350 parts by weight of cellosolve acetate. It was added dropwise at 80 ° C. over 3 hours. After stirring at 80 ° C. for 5 hours, the temperature was raised to 120 ° C.
Time kept. The resulting copolymer resin solution had a viscosity of 43 poise (25 ° C.) and a nonvolatile content of 25.4% by weight (18%).
0 ° C, 1h, according to JIS C-2103), acid value 3
2.5 (mgKOH / g).

A cresol novolak epoxy resin (Nippon Kayaku Co., Ltd .; EOC) was added to 400 parts by weight of this copolymer resin solution.
N-102S, epoxy equivalent 214 (g / eq), softening point 75 ° C) 50 parts by weight, trimellitic anhydride 10 parts by weight, γ-darindoxypropyltrimethoxysilane (Dow Corning Toray Silicone Co., Ltd .; SH-604
0) 1.6 parts by weight and 375 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The resulting solution had a viscosity of 57 centipoise (25 ° C.) and a non-volatile content of 20.1% by weight (180 ° C., 1 h).

This solution was filtered through a membrane filter having a pore size of 0.2 μm, and then spin-coated at 2,000 rpm on a glass plate (Dow Corning 7059, non-alkali glass) using a spin coater. After coating, heat the glass plate in a thermostat at 180 ° C for 1 hour,
The coating was cured. The surface of the obtained coating film was extremely smooth, and no pinholes or the like were observed. The film thickness measured by a two-light interference microscope was 1.2 μm.

The following tests were conducted on the coating films thus prepared. Goban eye test (JIS-K-54) by tape peeling to examine the adhesion of the coating film to the glass plate
00). As a result, the remaining number was 100/100, and no peeling was observed.

Next, when the same glass plate as that on which the absorption spectrum at 400 nm to 800 nm of the coating film was applied was measured as a reference, the light transmittance was 90% or more in all regions.

The glass plate coated with the coating was immersed in N-methylpyrrolidone at room temperature for 30 minutes after a pressure cracker test (120 ° C., 2 atm) for 10 hours.
25% aqueous sodium hydroxide for 30 minutes at room temperature
After left in a 0 ° C. oven for 1 hour, the above-mentioned Goban test and the measurement of light transmittance were performed. In each case, no decrease in adhesiveness or light transmittance was observed. Table 1 summarizes the test results.

Example 2 Cellosolve acetate 100 was placed in a 1-liter flask equipped with a stirrer, thermometer, nitrogen inlet tube, reflux condenser, and dropping funnel.
A part by weight was charged and the inside of the flask was replaced with nitrogen. 105 parts by weight of N-phenylmaleimide, 45 parts by weight of methacrylic acid,
0.6 parts by weight of azobisisobutyronitrile was dissolved in 350 parts by weight of cellosolve acetate, and the solution was added dropwise to the above-mentioned 1 l flask at 80 ° C. in a nitrogen stream over 3 hours. 8 more
After stirring at 0 ° C. for 5 hours, 0.3 parts by weight of azobisisobutylnitrile was added, and the temperature was raised to 120 ° C. and maintained for 2 hours. The obtained copolymer resin solution has a viscosity of 62 poise (25
° C) and the nonvolatile content is 25.0% by weight (180 ° C, 1
h), the acid value was 49.4 (mg KOH / g).

A cresol novolak epoxy resin (Nippon Kayaku Co., Ltd .; EOC) was added to 400 parts by weight of this copolymer resin solution.
N-103S, epoxy equivalent 218 (g / eq), softening point 85 ° C) 65 parts by weight, trimellitic anhydride 10 parts by weight, γ-dalicidoxypropyltrimethoxysilane (Dow Corning Silicone Toray SH) −604
0) 1.8 parts by weight and 500 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The resulting solution had a viscosity of 51 centipoise (25 ° C.) and a non-volatile content (18
0 ° C., 1 h) 18.0% by weight. The obtained solution was applied on glass and cured by heating in the same manner as in Example 1, and various properties of the coating film were tested. Table 1 shows the results.

Example 3 Cellosolve acetate 100 was placed in a 1-liter flask equipped with a stirrer, thermometer, nitrogen inlet tube, reflux condenser, and dropping funnel.
A part by weight was charged and the inside of the flask was replaced with nitrogen. 90 parts by weight of N-cyclohexylmaleimide, 30 parts by weight of methacrylic acid, 30 parts by weight of ethyl acrylate, and 0.6 parts by weight of azobisisobutyronitrile are dissolved in 350 parts by weight of cellosolve acetate. 80 ℃
For 3 hours. After stirring at 80 ° C. for 5 hours, the temperature was raised to 120 ° C. and maintained for 2 hours.

Cresol novolak epoxy resin (Nippon Kayaku Co., Ltd. EO) was added to 400 parts by weight of the obtained copolymer resin solution.
CN-102S) 50 parts by weight, trimellitic anhydride 10
Parts by weight, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd. SH-60
40) 1.6 parts by weight and 375 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The resulting solution had a viscosity of 71 centipoise (25 ° C.) and a nonvolatile content of 2
0.5% by weight (180 ° C., 1 h). The obtained solution was applied on glass and cured by heating in the same manner as in Example 1, and various properties of the coating film were tested. Table 1 shows the results.

Comparative Example 1 Cresol novolak epoxy resin (Nippon Kayaku Co., Ltd. E
OCN-103S) 10 parts by weight, trimellitic anhydride 3
Parts by weight, γ-glycidoxypropyltrimethoxysilane (Toray Dow Corning Silicone Co., Ltd. SH-60
40) 0.1 part by weight and 40 parts by weight of cellosolve acetate were uniformly mixed and dissolved at room temperature, and the obtained solution was applied on glass and cured by heating in the same manner as in Example 1 to test various properties of the coating film. Was done. Table 1 shows the results.

Comparative Example 2 6 g of polyglycidyl methacrylate (weight average molecular weight in terms of polystyrene: about 80,000), 0.6 g of trimellitic anhydride, γ-glycidoxypropyltrimethoxysilane (Dow Corning Toray Silicone Co., Ltd.) SH-6
040) 0.3 g and 35 parts by weight of cellosolve acetate were uniformly mixed and dissolved at room temperature, and the resulting solution was applied on glass and cured by heating in the same manner as in Example 1 to perform various properties tests of the coating film. Was. Table 1 shows the results.

[0050]

[Table 1]

Example 4 The surface hardness of the coating films formed in Examples 1 to 3 was determined by pencil hardness (J
IS K-5400). Table 2 shows the results.

[0052]

[Table 2]

Example 5 Using the composition solutions prepared in Examples 1 to 3, the suitability for a color filter substrate was examined. As a test method, a color filter substrate was prepared by a generally known method, and its coatability and heat resistance were examined. First, an aqueous solution of gelatin-ammonium dichromate (10: 1, weight ratio) was spin-coated on a transparent glass substrate so that the film thickness after drying was 1 μm,
After drying for 0 minutes, the obtained coating film was irradiated with ultraviolet rays, and then developed with pure water to obtain a dyed substrate layer. This was immersed in the following red dyeing bath, washed with water, and dried at 150 ° C. for 30 minutes to form a color filter substrate dyed red. Dyeing bath Suminol Milling Red RS (Sumitomo Chemical Co., Ltd.) 2 g Acetic acid 3 g Distilled water 100 g

Next, the composition solution was spin-coated on the color filter substrate at 2,000 rpm and dried at 180 ° C. for 1 hour to form a protective layer. Indium tin oxide (ITO) was vapor-deposited on the thus-prepared color filter with a protective film according to a conventional method, and then patterned by photolithography. When the color filter having the ITO pattern was observed in detail with an optical microscope, no wrinkles or cracks were observed in the color filter or the protective film, and the adhesion and adhesion between the color filter and the protective film were good. Was.

[0055]

The coating film formed by the coating resin composition of the present invention is smooth and extremely excellent in transparency, adhesiveness, water resistance, chemical resistance, heat resistance, scratch resistance, etc. It is useful as a coating material for various articles, particularly as a color filter protective film material.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Minamisawa 14 Goi Minami Coast, Ichihara City, Chiba Prefecture Inside the Gosei Plant of Hitachi Chemical Co., Ltd. (72) Inventor Takashi Morinaga 2-1-1 Nishishinjuku, Shinjuku-ku, Tokyo No. Hitachi Chemical Co., Ltd. (56) References JP-A-4-272977 (JP, A) JP-A-4-272978 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name ) C09D 1/00-201/10 CA (STN) REGISTRY (STN) WPI (DIALOG) Patent file (PATOLIS)

Claims (5)

(57) [Claims] 1. A, (1) N-substituted maleimide, (2) acrylic acid and / or methacrylic acid and (3) an unsaturated monomer copolymerizable with (1) and / or (2) if necessary. A coating resin composition comprising: a copolymerized resin obtained by copolymerization; and B, an epoxy resin having two or more epoxy groups in a molecule. 2. Further, at least one selected from the group consisting of C, polycarboxylic anhydride and polycarboxylic acid.
The coating resin composition according to claim 1, which comprises a kind of compound. 3. The method according to claim 1, wherein the N-substituted maleimide is N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide,
The coating resin composition according to claim 1 or 2, which is at least one compound selected from the group consisting of butylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, and N-alkyl-substituted phenylmaleimide. 4. The coating resin composition according to claim 1, wherein the epoxy resin is at least one compound selected from the group consisting of a phenol novolak epoxy resin and a cresol novolak epoxy resin. 5. A resin composition for a color filter protective film comprising the resin composition for coating according to claim 1, 2, 3 or 4.