JPH0427155Y2 - - Google Patents

Info

Publication number
JPH0427155Y2
JPH0427155Y2 JP8126388U JP8126388U JPH0427155Y2 JP H0427155 Y2 JPH0427155 Y2 JP H0427155Y2 JP 8126388 U JP8126388 U JP 8126388U JP 8126388 U JP8126388 U JP 8126388U JP H0427155 Y2 JPH0427155 Y2 JP H0427155Y2
Authority
JP
Japan
Prior art keywords
electronic component
ceramic
sheets
substrate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8126388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH022822U (US20080094685A1-20080424-C00004.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8126388U priority Critical patent/JPH0427155Y2/ja
Publication of JPH022822U publication Critical patent/JPH022822U/ja
Application granted granted Critical
Publication of JPH0427155Y2 publication Critical patent/JPH0427155Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP8126388U 1988-06-20 1988-06-20 Expired JPH0427155Y2 (US20080094685A1-20080424-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8126388U JPH0427155Y2 (US20080094685A1-20080424-C00004.png) 1988-06-20 1988-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8126388U JPH0427155Y2 (US20080094685A1-20080424-C00004.png) 1988-06-20 1988-06-20

Publications (2)

Publication Number Publication Date
JPH022822U JPH022822U (US20080094685A1-20080424-C00004.png) 1990-01-10
JPH0427155Y2 true JPH0427155Y2 (US20080094685A1-20080424-C00004.png) 1992-06-30

Family

ID=31306050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8126388U Expired JPH0427155Y2 (US20080094685A1-20080424-C00004.png) 1988-06-20 1988-06-20

Country Status (1)

Country Link
JP (1) JPH0427155Y2 (US20080094685A1-20080424-C00004.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459233U (US20080094685A1-20080424-C00004.png) * 1990-09-28 1992-05-21

Also Published As

Publication number Publication date
JPH022822U (US20080094685A1-20080424-C00004.png) 1990-01-10

Similar Documents

Publication Publication Date Title
US4202007A (en) Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
JPH11288839A (ja) 積層チップ型電子部品及びその製造方法
US20020177360A1 (en) Composite electronic component and method of producing same
JPS5924535B2 (ja) 積層複合部品
JPS6235257B2 (US20080094685A1-20080424-C00004.png)
JPH05218653A (ja) セラミック多層回路基板
JPH0427155Y2 (US20080094685A1-20080424-C00004.png)
JP2873645B2 (ja) セラミック多層配線基板の製造方法
KR100474947B1 (ko) 적층 세라믹 전자 부품 제조 방법 및 적층 인덕터 제조 방법
JPS6221260B2 (US20080094685A1-20080424-C00004.png)
JP2946261B2 (ja) 積層電子部品の製造方法
KR100248196B1 (ko) 적층 세라믹 부품의 제조방법
JPH0685465A (ja) Smdモジュール用基板及びその製造方法
JPH0252497A (ja) 多層セラミック基板
JP3493291B2 (ja) 多層回路基板
JPH05347227A (ja) 積層薄膜コンデンサ
JPH0533016Y2 (US20080094685A1-20080424-C00004.png)
JPH022318B2 (US20080094685A1-20080424-C00004.png)
JP3001062U (ja) 積層型回路部品
JPH0142333Y2 (US20080094685A1-20080424-C00004.png)
JP2551064B2 (ja) セラミック多層基板の製造方法
JP2000114100A (ja) 多連型電子部品
JPH0727989B2 (ja) セラミックパッケージ型半導体装置の製造方法
JPH06283335A (ja) チップインダクタ及びその製造方法
JPH11204313A (ja) 電子部品とその製造方法