JPH04267392A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH04267392A JPH04267392A JP2814391A JP2814391A JPH04267392A JP H04267392 A JPH04267392 A JP H04267392A JP 2814391 A JP2814391 A JP 2814391A JP 2814391 A JP2814391 A JP 2814391A JP H04267392 A JPH04267392 A JP H04267392A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- copper
- flexible printed
- content
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 17
- 239000011888 foil Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 229910052738 indium Inorganic materials 0.000 claims abstract description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、例えばプリンターヘッ
ド部分等の駆動系統に使用されて、1万回〜100万回
以上の屈曲がくり返されるフレキシブルプリント板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed board that is used, for example, in a drive system for a printer head, and is bent 10,000 to 1,000,000 times or more.
【0002】0002
【従来の技術とその課題】この種のフレキシブルプリン
ト板は、図1に示すように、ポリエステル、ポリエチレ
ンテレフタレート、ポリアミド等の可撓性ベースフィル
ム1上に圧延焼鈍銅箔を加熱加圧接着し、この銅箔をエ
ッチング加工して所要の回路パターン2を形成したもの
である。[Prior Art and its Problems] As shown in FIG. 1, this type of flexible printed board is made by bonding rolled annealed copper foil under heat and pressure onto a flexible base film 1 made of polyester, polyethylene terephthalate, polyamide, etc. This copper foil is etched to form a required circuit pattern 2.
【0003】しかしながら、その銅箔には、従来純銅が
使用されており、1万〜100万回の屈曲をくり返すと
、回路パターン2のひび割れ等による断線が生じていた
。[0003] However, conventionally, pure copper has been used for the copper foil, and when the foil is bent 10,000 to 1,000,000 times, the circuit pattern 2 cracks and breaks.
【0004】本発明は、以上の点に留意し、屈曲強度を
向上させることを課題とする。[0004] The present invention takes the above points into consideration and aims to improve the bending strength.
【0005】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明にあっては、上記圧延焼鈍純銅箔に代えて、
本出願人の提案に係る下記A乃至Dの銅合金からなる圧
延焼鈍箔を採用したものである。[Means for Solving the Problems] In order to solve the above problems, in the present invention, instead of the above rolled annealed pure copper foil,
Rolled annealed foils made of copper alloys A to D below as proposed by the present applicant are employed.
【0006】記
インジウム含有量が0.047〜1重量%、酸素含有量
が0.01重量%を超え且つ0.03重量%以下、イン
ジウム含有量が酸素含有量の4.7倍以上であって、残
部が実質的に銅から成る銅合金。(特公昭61−465
35号公報参照)[0006] The indium content is 0.047 to 1% by weight, the oxygen content is more than 0.01% by weight and 0.03% by weight or less, and the indium content is 4.7 times or more the oxygen content. A copper alloy with the remainder consisting essentially of copper. (Tokuko Showa 61-465
(Refer to Publication No. 35)
【0007】[0007]
【作用】上記の如く構成する本発明は、上記組成の銅合
金が、上記公報に記載のごとく、耐屈曲性に優れ、導電
性においても、純銅に比べて遜色がない。例えば、疲労
特性において、曲げ歪0.306%の条件では、上記銅
合金製の箔の破断屈曲回数が約16.1万回に対し、純
銅箔のそれは約4.3万回と約4分の1であり、曲げ歪
0.22%の条件では、上記銅合金箔:3150万回以
上、純銅箔:約11.93万回と約260分の1以下、
曲げ歪0.18%の条件では、上記銅合金箔:6200
万回以上、純銅箔:約21.8万回と約280分の1以
下である。[Function] In the present invention constructed as described above, the copper alloy having the above composition has excellent bending resistance as described in the above publication, and is comparable to pure copper in electrical conductivity. For example, in terms of fatigue properties, under the condition of bending strain of 0.306%, the number of times the copper alloy foil breaks and bends is about 161,000 times, while that of pure copper foil is about 43,000 times, which is about 4 minutes. 1, and under the condition of bending strain of 0.22%, the above copper alloy foil: more than 31.5 million times, pure copper foil: about 119,300 times, about 1/260th or less,
Under the condition of bending strain of 0.18%, the above copper alloy foil: 6200
More than 1,000 times, pure copper foil: about 218,000 times, about 1/280th or less.
【0008】[0008]
【実施例】図1に示すように、ポリアミドからなる50
μm厚の可撓性ベースフィルム1上に、前記組成からな
る30μm厚の圧延焼鈍銅合金箔2を加熱加圧接着し、
この銅合金箔2をエッチング加工して所要の回路パター
ン2(1.5 mm幅、1.0 mm間隔で15条、図
面上は省略)を形成し、この回路パターン2上に約30
μm厚のポリエステルフィルムを熱融着させて保護被膜
(図示せず)を施してフレキシブルプリント板Pを得た
。[Example] As shown in Figure 1, 50
A 30 μm thick rolled annealed copper alloy foil 2 having the above composition is bonded with heat and pressure on a μm thick flexible base film 1,
This copper alloy foil 2 is etched to form a required circuit pattern 2 (1.5 mm width, 15 stripes at 1.0 mm intervals, omitted in the drawing), and about 30 strips are formed on this circuit pattern 2.
A flexible printed board P was obtained by heat-sealing a μm-thick polyester film and applying a protective coating (not shown).
【0009】また、前記組成からなる100μm厚の圧
延焼鈍銅合金箔を、スリット加工して1.2mm幅の平
角箔条を形成し、この平角箔条を、100μm厚のポリ
エステル製可撓性ベースフィルム1上に熱融着フィルム
を介して2.54mmのピッチで15条引き揃えて回路
パターン2を形成し、この上に、ポリエステルの保護絶
縁フィルムを配して、この保護絶縁フィルムとベースフ
ィルム1を前記熱融着フィルムを介し熱融着してフレキ
シブルプリント板Pを得た。Further, a 100 μm thick rolled annealed copper alloy foil having the above composition is slit to form a 1.2 mm wide rectangular foil strip, and this rectangular foil strip is attached to a 100 μm thick polyester flexible base. A circuit pattern 2 is formed by aligning 15 stripes at a pitch of 2.54 mm on the film 1 via a heat-sealable film, and a polyester protective insulating film is placed on top of this, and this protective insulating film and base film are arranged. 1 was heat-sealed via the heat-sealing film to obtain a flexible printed board P.
【0010】一方、比較例として、回路パターン2の材
料を純銅箔とし、その他は両実施例と同一としたものも
製作した。On the other hand, as a comparative example, a circuit pattern 2 was also manufactured in which the material was pure copper foil and the other features were the same as those of both examples.
【0011】この実施例と比較例のフレキシブルプリン
ト板Pを、第2図に示すように5mm径のマンドレル3
を介して実線←→鎖線のごとく繰返し屈曲を行った処、
実施例と比較例において、上記作用の項で記載した、銅
合金箔と純銅箔の疲労特性に基づく屈曲特性の差を得た
。[0011] The flexible printed boards P of this example and comparative example were placed on a mandrel 3 with a diameter of 5 mm as shown in Fig. 2.
After repeated bending as shown by the solid line ← → chain line,
In Examples and Comparative Examples, differences in bending properties based on the fatigue properties of copper alloy foils and pure copper foils were obtained, as described in the section on effects above.
【0012】なお、上記の銅合金からなる細線を圧延し
て100μm厚×1.27mm幅の平角箔条を形成し、
その平角箔条でもって上記実施例と同様にフレキシブル
プリント板Pを製作したところ、同様な効果を得た。[0012] The thin wire made of the above copper alloy was rolled to form a rectangular foil strip with a thickness of 100 μm and a width of 1.27 mm.
When a flexible printed board P was manufactured using the rectangular foil strip in the same manner as in the above embodiment, similar effects were obtained.
【0013】[0013]
【発明の効果】本発明は、以上の構成としたので、耐屈
曲性が非常に優れたものとなる。[Effects of the Invention] Since the present invention has the above structure, the bending resistance is extremely excellent.
【図1】フレキシブルプリント板の部分斜視図[Figure 1] Partial perspective view of flexible printed board
【図2】
屈曲特性試験説明図[Figure 2]
Flexural characteristic test explanatory diagram
1 可撓性ベースフィルム 2 導体回路パターン(銅合金箔) 3 マンドレル P フレキシブルプリント板 1 Flexible base film 2 Conductor circuit pattern (copper alloy foil) 3 Mandrel P Flexible printed board
Claims (1)
銅合金からなる圧延焼鈍箔により導体回路パターンを形
成したことを特徴とするフレキシブルプリント板。 記 インジウム含有量が0.047〜1重量%、酸素含有量
が0.01重量%を超え且つ0.03重量%以下、イン
ジウム含有量が酸素含有量の4.7倍以上であって、残
部が実質的に銅から成る銅合金。1. A flexible printed board characterized in that a conductive circuit pattern is formed on a flexible base film using a rolled annealed foil made of the following copper alloy. The indium content is 0.047 to 1% by weight, the oxygen content is more than 0.01% by weight and 0.03% by weight or less, the indium content is 4.7 times or more than the oxygen content, and the balance is A copper alloy consisting essentially of copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2814391A JPH04267392A (en) | 1991-02-22 | 1991-02-22 | Flexible printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2814391A JPH04267392A (en) | 1991-02-22 | 1991-02-22 | Flexible printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04267392A true JPH04267392A (en) | 1992-09-22 |
Family
ID=12240547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2814391A Pending JPH04267392A (en) | 1991-02-22 | 1991-02-22 | Flexible printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04267392A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6146535A (en) * | 1984-08-11 | 1986-03-06 | Fujitsu Ltd | Pseudo error setting control system |
JPH02183774A (en) * | 1989-01-05 | 1990-07-18 | Toshiba Corp | Air conditioner |
-
1991
- 1991-02-22 JP JP2814391A patent/JPH04267392A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6146535A (en) * | 1984-08-11 | 1986-03-06 | Fujitsu Ltd | Pseudo error setting control system |
JPH02183774A (en) * | 1989-01-05 | 1990-07-18 | Toshiba Corp | Air conditioner |
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