JPH04290286A - Flexible printed circuit board with electromagnetic wave shield - Google Patents
Flexible printed circuit board with electromagnetic wave shieldInfo
- Publication number
- JPH04290286A JPH04290286A JP5297591A JP5297591A JPH04290286A JP H04290286 A JPH04290286 A JP H04290286A JP 5297591 A JP5297591 A JP 5297591A JP 5297591 A JP5297591 A JP 5297591A JP H04290286 A JPH04290286 A JP H04290286A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- copper alloy
- weight
- printed board
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 28
- 239000011888 foil Substances 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 3
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 3
- 229910052796 boron Inorganic materials 0.000 claims abstract description 3
- 229910052745 lead Inorganic materials 0.000 claims abstract description 3
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 3
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 3
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 3
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 3
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract 3
- 229910052735 hafnium Inorganic materials 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920002457 flexible plastic Polymers 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 13
- 229910052797 bismuth Inorganic materials 0.000 abstract description 2
- 229910052791 calcium Inorganic materials 0.000 abstract description 2
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052726 zirconium Inorganic materials 0.000 abstract description 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、例えばプリンターヘッ
ド部分等の駆動系統に使用されて、１万回〜１００万回
以上の屈曲がくり返されるフレキシブルプリント板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed board that is used, for example, in a drive system for a printer head, and is bent 10,000 to 1,000,000 times or more.
【０００２】0002
【従来の技術とその課題】近年、電気機器の電子化に伴
ない、その部品間の電磁波による誤動作が問題となって
いる。このため、その部品間を結ぶフレキシブルプリン
ト板においても電磁波をシールドする必要がある。BACKGROUND OF THE INVENTION In recent years, with the electronicization of electrical equipment, malfunctions caused by electromagnetic waves between the parts have become a problem. Therefore, it is necessary to shield electromagnetic waves from the flexible printed board that connects the parts.
【０００３】この要望に応え、本出願人は、特願昭６３
−１８３７７４号において、下記の構成の電磁波シール
ド機能を持ったフレキシブルプリント板を提案した。[0003] In response to this request, the present applicant filed a patent application in 1983.
In No. 183774, we proposed a flexible printed board with an electromagnetic wave shielding function having the following configuration.
【０００４】記
プラスチックフィルム表面に回路パターンを形成し、こ
の回路パターン上に、絶縁アンダーコート層、導電ペー
スト塗布シールド層、オーバーコート層を順次設け、前
記回路パターンのグランドパターンと導電ペースト塗布
シールド層とを適宜間隔でアンダーコート層を貫通して
電気的に接続する。A circuit pattern is formed on the surface of the plastic film, and an insulating undercoat layer, a shield layer coated with conductive paste, and an overcoat layer are sequentially provided on the circuit pattern, and the ground pattern of the circuit pattern and the shield layer coated with conductive paste are formed. are electrically connected through the undercoat layer at appropriate intervals.
【０００５】この技術は、電磁波シールドの面では満足
いけるものであったが、耐屈曲性の点で問題が生じた。
すなわち、プリンターヘッド部分等の駆動系統に使用し
た場合、１万回〜１００万回以上の屈曲がくり返される
。しかし、上記技術では、回路パターンを純銅箔で形成
しており、この純銅箔であると、回路パターンのひび割
れ等による断線が生じていた。Although this technique was satisfactory in terms of electromagnetic shielding, a problem arose in terms of bending resistance. That is, when used in a drive system such as a printer head part, bending is repeated 10,000 to 1,000,000 times or more. However, in the above technique, the circuit pattern is formed of pure copper foil, and when the pure copper foil is used, disconnection occurs due to cracks or the like in the circuit pattern.
【０００６】本発明は、以上の点に留意し、屈曲強度を
向上させることを課題とする。[0006] The present invention takes the above points into consideration and aims to improve the bending strength.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、本発明にあっては、上記回路パターンを、下記Ａ乃
至Ｄの銅合金からなる圧延焼鈍箔により形成した構成を
採用したものである。[Means for Solving the Problems] In order to solve the above problems, the present invention adopts a configuration in which the above circuit pattern is formed from a rolled annealed foil made of copper alloys A to D below. be.
【０００８】記
（Ａ）Ｚｒ０．０１ 〜０．０５ 重量％、Ｃｒ０．０
１ 〜０．０５ 重量％、残部が実質的にＣｕより成る
銅合金。(A) Zr0.01 to 0.05% by weight, Cr0.0
1 to 0.05% by weight of a copper alloy, with the balance essentially consisting of Cu.
【０００９】（Ｂ）Ｚｒ０．０１ 〜０．０５ 重量％
、Ｃｒ０．０１ 〜０．０５ 重量％、Ｉｎ、Ｓｎ、Ａ
ｇ、Ａｌ、Ｂｉ、Ｃａ、Ｆｅ、Ｇｅ、Ｈｆ、Ｍｇ、Ｍｎ
、Ｎｉ、Ｐｂ、Ｓｂ、Ｓｉ、Ｔｉ、Ｚｎ、Ｂ、Ｙ、Ｏの
うち１種以上を合計量で０．００２〜０．３重量％、残
部が実質的にＣｕより成る銅合金。(B) Zr0.01 to 0.05% by weight
, Cr0.01 to 0.05% by weight, In, Sn, A
g, Al, Bi, Ca, Fe, Ge, Hf, Mg, Mn
, Ni, Pb, Sb, Si, Ti, Zn, B, Y, and O in a total amount of 0.002 to 0.3% by weight, and the remainder substantially consists of Cu.
【００１０】（Ｃ）少なくともＺｒを含む添加元素の総
量が０．００５〜０．５重量％であって、熱処理により
Ｃｕ３ Ｚｒを析出させて成る銅合金。(C) A copper alloy in which the total amount of additive elements containing at least Zr is 0.005 to 0.5% by weight, and Cu3Zr is precipitated by heat treatment.
【００１１】（Ｄ）少なくともＣｒを含む添加元素の総
量が０．１〜２．０重量％であって、熱処理によりＣｒ
を析出させた銅合金。(D) The total amount of additive elements containing at least Cr is 0.1 to 2.0% by weight, and Cr is removed by heat treatment.
Copper alloy precipitated.
【００１２】上記（Ａ）又は（Ｂ）の組成の銅合金にお
いては、Ｚｒ、Ｃｒの重量％は好ましくは０．３以下で
あり、実質的Ｃｕは酸洗を施したものが好ましく、また
、各組成の銅合金は、そのＯ２ 含有量が５０ｐｐｍ
未満のものが好ましく、さらにその組成金属の再結晶組
織は５０％以下で残存させるとよい。In the copper alloy having the composition (A) or (B) above, the weight percent of Zr and Cr is preferably 0.3 or less, the substantial amount of Cu is preferably pickled, and The copper alloy of each composition has an O2 content of 50 ppm.
It is preferable that the recrystallized structure of the composition metal remains at 50% or less.
【００１３】[0013]
【作用】上記の如く構成する本発明は、上記組成Ａ乃至
Ｄからなる銅合金が、耐屈曲性に優れ、導電性において
も、純銅に比べて遜色がない。例えば、疲労特性におい
て、曲げ歪０．３０６％の条件では、上記銅合金製の箔
の破断屈曲回数が約１６．１万回に対し、純銅箔のそれ
は約４．３万回と約４分の１であり、曲げ歪０．２２％
の条件では、上記銅合金箔：３１５０万回以上、純銅箔
：約１１．９３万回と約２６０分の１以下、曲げ歪０．
１８％の条件では、上記銅合金箔：６２００万回以上、
純銅箔：約２１．８万回と約２８０分の１以下である。[Function] In the present invention constructed as described above, the copper alloy having the above compositions A to D has excellent bending resistance and is comparable to pure copper in electrical conductivity. For example, in terms of fatigue properties, under the condition of bending strain of 0.306%, the number of times the copper alloy foil breaks and bends is about 161,000 times, while that of pure copper foil is about 43,000 times, which is about 4 minutes. 1, bending strain 0.22%
Under the following conditions, the above copper alloy foil: 31.5 million times or more, pure copper foil: about 119,300 times, about 1/260 or less, and bending strain of 0.
Under the condition of 18%, the above copper alloy foil: 62 million times or more,
Pure copper foil: Approximately 218,000 times, less than 1/280th.
【００１４】[0014]
【実施例】図１に示すように、５０μｍ厚のポリイミド
フィルム１上に、前記組成Ａからなる３０μｍ厚の圧延
焼鈍銅合金箔２を加熱加圧接着し、この銅合金箔２をエ
ッチング加工して所要の回路パターン２（１．５ ｍｍ
幅、１．０ｍｍ間隔で１５条、図面上は省略）を形成し
た。但し、１５本中、両端の２本はグランドパターン３
である。[Example] As shown in Fig. 1, a 30 μm thick rolled annealed copper alloy foil 2 having the composition A is bonded under heat and pressure on a 50 μm thick polyimide film 1, and this copper alloy foil 2 is etched. the required circuit pattern 2 (1.5 mm
15 stripes (not shown in the drawing) were formed with a width of 1.0 mm. However, among the 15 wires, two at both ends are ground pattern 3.
It is.
【００１５】上記回路パターン２上に、前記グランドパ
ターン３上の長さ方向に沿って一定間隔にマスクを設け
、且つ、回路パターン２の両端一定部分にマスクを設け
たスクリーン（図示せず）を用いて、印刷法によりエポ
キシメラミン樹脂からなるペーストを塗布して厚さ３０
μｍのアンダーコート層（ＵＣ層）４を設ける。このと
きグランドパターン３上長さ方向のＵＣ層４には前記ス
クリーンのマスクにより透孔５が形成され、回路パター
ン２両端には、前記スクリーンのマスクによりＵＣは塗
布されず回路は露出した状態となる（露出パターン６）
。Masks are provided on the circuit pattern 2 at regular intervals along the length direction of the ground pattern 3, and a screen (not shown) is provided with masks at constant portions at both ends of the circuit pattern 2. A paste made of epoxy melamine resin was applied using a printing method to a thickness of 30 mm.
An undercoat layer (UC layer) 4 with a thickness of μm is provided. At this time, a through hole 5 is formed in the UC layer 4 in the longitudinal direction above the ground pattern 3 by the mask of the screen, and no UC is applied to both ends of the circuit pattern 2 due to the mask of the screen, leaving the circuit exposed. Becomes (exposure pattern 6)
.
【００１６】つぎに、上記ＵＣ層４上全面に、導電塗料
をスクリーン印刷法によりその両端の一部を残して塗布
し、１５０℃×３０分の加熱処理を施してその塗膜を硬
化させ、厚さ２０μｍのシールド層７を形成する。この
とき導電塗料は前記透孔５を経てグランドパターン３に
到達しシールド層７とグランドパターン３が電気的に接
続される。[0016] Next, a conductive paint is applied to the entire surface of the UC layer 4 by a screen printing method, leaving a part of both ends, and the paint film is cured by heating at 150°C for 30 minutes. A shield layer 7 having a thickness of 20 μm is formed. At this time, the conductive paint reaches the ground pattern 3 through the through hole 5, and the shield layer 7 and the ground pattern 3 are electrically connected.
【００１７】上記導電塗料は、粒径５〜１０μｍの樹枝
状金属銅粉１００重量部に対して、樹脂混和物（メラミ
ン樹脂５０重量％とポリエステル系樹脂２０重量％とレ
ゾール型フェノール樹脂３０重量％とからなる樹脂混和
物）１６重量部、脂肪酸又は脂肪酸の金属塩１０重量部
およびキレート形成剤２．５重量部を配合し、溶剤とし
て若干のブチルセルソルブアセテートを加えて、２０分
間３軸ロールで混練りした適当な粘度のものとする。The above-mentioned conductive paint contains a resin mixture (50% by weight of melamine resin, 20% by weight of polyester resin, and 30% by weight of resol type phenolic resin) based on 100 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm. 16 parts by weight of a resin mixture consisting of ), 10 parts by weight of a fatty acid or a metal salt of a fatty acid, and 2.5 parts by weight of a chelate forming agent, some butyl cellosolve acetate was added as a solvent, and the mixture was rolled on a triaxial roll for 20 minutes. Knead it to a suitable viscosity.
【００１８】さらに、上記シールド層７上に一成分熱硬
化型シリコーンゴムコーティング材〔ＴＳＥ ３２５
１、東芝シリコーン株式会社製〕をスクリーン印刷法に
より塗布し、これを１５０℃、１ｈｒ加熱硬化して厚さ
２０μｍのオーバーコート層（ＯＣ層）８を設けて本発
明に係る電磁波遮蔽付きフレキシブルプリント板Ｐを得
た。Furthermore, a one-component thermosetting silicone rubber coating material [TSE 325] is applied on the shield layer 7.
1. manufactured by Toshiba Silicone Corporation] by a screen printing method, and heat cured at 150° C. for 1 hour to form an overcoat layer (OC layer) 8 with a thickness of 20 μm to produce a flexible print with electromagnetic shielding according to the present invention. A plate P was obtained.
【００１９】また、前記組成Ａからなる１００μｍ厚の
圧延焼鈍銅合金箔を、スリット加工して１．２ｍｍ幅の
平角箔条を形成し、この平角箔条を、１００μｍ厚のポ
リエステルフィルム１上に熱融着フィルムを介して２．
５４ｍｍのピッチで１５条引き揃え、熱融着させて回路
パターン２を形成し、以後、前述と同様にして他の実施
例の電磁波遮蔽付きフレキシブルプリント板Ｐを得た。Further, a 100 μm thick rolled and annealed copper alloy foil having the composition A was slit to form a 1.2 mm wide rectangular foil strip, and this rectangular foil strip was placed on a 100 μm thick polyester film 1. 2. Through a heat-sealing film.
Fifteen stripes were arranged at a pitch of 54 mm and heat-sealed to form circuit pattern 2. Thereafter, a flexible printed board P with electromagnetic shielding of another example was obtained in the same manner as described above.
【００２０】一方、比較例として、回路パターン２の材
料を純銅箔とし、その他は両実施例と同一としたものも
製作した。On the other hand, as a comparative example, one was also manufactured in which the material of the circuit pattern 2 was pure copper foil, and the other things were the same as those of both examples.
【００２１】この実施例と比較例のフレキシブルプリン
ト板Ｐを、第２図に示すように５ｍｍ径のマンドレル９
を介して実線←→鎖線のごとく繰返し屈曲を行った処、
実施例と比較例において、上記作用の項で記載した、銅
合金箔と純銅箔の疲労特性に基づく屈曲特性の差を得た
。[0021] The flexible printed boards P of this example and comparative example were placed on a mandrel 9 with a diameter of 5 mm as shown in Fig. 2.
After repeated bending as shown by the solid line ← → chain line,
In Examples and Comparative Examples, differences in bending properties based on the fatigue properties of copper alloy foils and pure copper foils were obtained, as described in the section on effects above.
【００２２】なお、上記の銅合金からなる細線を圧延し
て１００μｍ厚×１．２７ｍｍ幅の平角箔条を形成し、
その平角箔条でもって上記実施例と同様にフレキシブル
プリント板Ｐを製作したところ、同様な効果を得た。ま
た、銅合金箔に上記組成Ｂ、Ｃ、Ｄのものを使用しても
、同様な効果を得ることができ、実質的なＣｕを酸洗を
施した電気銅としたり、Ｏ２ 含有量を５０ｐｐｍ未満
、組成金属の再結晶組織が５０％以下のものにあっては
その効果はより向上した。[0022] The thin wire made of the above copper alloy was rolled to form a rectangular foil strip with a thickness of 100 μm and a width of 1.27 mm.
When a flexible printed board P was manufactured using the rectangular foil strip in the same manner as in the above embodiment, similar effects were obtained. In addition, similar effects can be obtained by using copper alloy foils with the above compositions B, C, and D, such as using pickled electrolytic copper instead of substantial Cu, or reducing the O2 content to 50 ppm. The effect was further improved when the composition metal had a recrystallized structure of 50% or less.
【００２３】[0023]
【発明の効果】本発明は、以上の構成としたので、耐屈
曲性が非常に優れたものとなる。[Effects of the Invention] Since the present invention has the above structure, the bending resistance is extremely excellent.
【図１】フレキシブルプリント板の部分斜視図[Figure 1] Partial perspective view of flexible printed board
【図２】
屈曲特性試験説明図[Figure 2]
Flexural characteristic test explanatory diagram
１ 可撓性プラスチックフィルム ２ 回路パターン（銅合金箔） ３ グランドパターン ４ アンダーコート層 ５ 透孔 ６ 露出パターン ７ シールド層 ８ オーバーコート層 ９ マンドレル Ｐ フレキシブルプリント板 1 Flexible plastic film 2 Circuit pattern (copper alloy foil) 3. Ground pattern 4 Undercoat layer 5 Through hole 6 Exposure pattern 7 Shield layer 8 Overcoat layer 9 Mandrel P Flexible printed board
Claims (7)
路パターンを形成し、この回路パターン上に、絶縁性ア
ンダーコート層、導電ペースト塗布シールド層、オーバ
ーコート層を順次設け、前記回路パターンのグランドパ
ターンと前記導電ペースト塗布シールド層とを適宜の間
隔でアンダーコート層を貫通して電気的に接続してなる
電磁波遮蔽付きフレキシブルプリント板において、前記
回路パターンを、下記の銅合金からなる圧延焼鈍箔によ
り形成したことを特徴とする電磁波遮蔽付きフレキシブ
ルプリント板。 記 Ｚｒ０．０１ 〜０．０５ 重量％、Ｃｒ０．０１ 〜
０．０５重量％、残部が実質的にＣｕより成る銅合金。1. A circuit pattern is formed on the surface of a flexible plastic film, and an insulating undercoat layer, a shield layer coated with conductive paste, and an overcoat layer are sequentially provided on the circuit pattern, and the ground pattern of the circuit pattern is In a flexible printed board with electromagnetic wave shielding which is electrically connected to the conductive paste coated shield layer by penetrating the undercoat layer at appropriate intervals, the circuit pattern is formed from rolled annealed foil made of the following copper alloy. A flexible printed board with electromagnetic wave shielding. Zr0.01-0.05% by weight, Cr0.01-0.01% by weight
A copper alloy consisting of 0.05% by weight and the balance substantially consisting of Cu.
ことを特徴とする請求項１記載の電磁波遮蔽付きフレキ
シブルプリント板。 記 Ｚｒ０．０１ 〜０．０５ 重量％、Ｃｒ０．０１ 〜
０．０５重量％、Ｉｎ、Ｓｎ、Ａｇ、Ａｌ、Ｂｉ、Ｃａ
、Ｆｅ、Ｇｅ、Ｈｆ、Ｍｇ、Ｍｎ、Ｎｉ、Ｐｂ、Ｓｂ、
Ｓｉ、Ｔｉ、Ｚｎ、Ｂ、Ｙ、Ｏのうち１種以上を合計量
で０．００２〜０．３重量％、残部が実質的にＣｕより
成る銅合金。2. The electromagnetic shielding flexible printed board according to claim 1, wherein the rolled annealed foil is made of the following copper alloy. Zr0.01~0.05% by weight, Cr0.01~
0.05% by weight, In, Sn, Ag, Al, Bi, Ca
, Fe, Ge, Hf, Mg, Mn, Ni, Pb, Sb,
A copper alloy containing one or more of Si, Ti, Zn, B, Y, and O in a total amount of 0.002 to 0.3% by weight, and the remainder substantially consisting of Cu.
銅であることを特徴とする請求項１又は２記載の電磁波
遮蔽付きフレキシブルプリント板。3. The electromagnetic shielding flexible printed board according to claim 1, wherein the substantial Cu is pickled electrolytic copper.
ことを特徴とする請求項１記載の電磁波遮蔽付きフレキ
シブルプリント板。 記 ・少なくともＣｒを含む添加元素の総量が０．１〜２．
０重量％であって、熱処理によりＣｒを析出させた銅合
金。4. The electromagnetic shielding flexible printed board according to claim 1, wherein the rolled annealed foil is made of the following copper alloy. - The total amount of additive elements containing at least Cr is 0.1 to 2.
A copper alloy containing 0% by weight and having Cr precipitated by heat treatment.
ことを特徴とする請求項１記載の電磁波遮蔽付きフレキ
シブルプリント板。 記 ・少なくともＺｒを含む添加元素の総量が０．００５〜
０．５重量％であって、熱処理によりＣｕ３ Ｚｒを析
出させた銅合金。5. The electromagnetic shielding flexible printed board according to claim 1, wherein the rolled annealed foil is made of the following copper alloy. Note: The total amount of additive elements including at least Zr is 0.005~
A copper alloy containing 0.5% by weight of Cu3Zr precipitated by heat treatment.
の電磁波遮蔽付きフレキシブルプリント板において、そ
の圧延焼鈍箔の組成金属の再結晶組織が５０％以下であ
ることを特徴とする電磁波遮蔽付きフレキシブルプリン
ト板。6. The electromagnetic shielding flexible printed board according to claim 1, wherein the rolled annealed foil has a recrystallized structure of the composition metal of 50% or less. with flexible printed board.
の電磁波遮蔽付きフレキシブルプリント板において、そ
の圧延焼鈍箔のＯ２ 含有量を５０ｐｐｍ 未満とした
ことを特徴とする電磁波遮蔽付きフレキシブルプリント
板。7. The electromagnetic shielding flexible printed board according to claim 1, wherein the rolled annealed foil has an O2 content of less than 50 ppm. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5297591A JPH04290286A (en) | 1991-03-19 | 1991-03-19 | Flexible printed circuit board with electromagnetic wave shield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5297591A JPH04290286A (en) | 1991-03-19 | 1991-03-19 | Flexible printed circuit board with electromagnetic wave shield |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04290286A true JPH04290286A (en) | 1992-10-14 |
Family
ID=12929899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5297591A Pending JPH04290286A (en) | 1991-03-19 | 1991-03-19 | Flexible printed circuit board with electromagnetic wave shield |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04290286A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6372061B1 (en) * | 1998-11-17 | 2002-04-16 | Nippon Mining & Metals Co., Ltd. | Rolled copper foil for flexible printed circuit and method of manufacturing the same |
| KR20030014168A (en) * | 2001-08-10 | 2003-02-15 | 닛코 킨조쿠 가부시키가이샤 | Copper alloy foil for laminated sheet |
| KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
| KR100504518B1 (en) * | 2001-07-13 | 2005-08-03 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233999A (en) * | 1988-07-23 | 1990-02-05 | Sakai Denshi Kogyo Kk | Flexible printed circuit forming body having electromagnetic wave shield |
| JPH0324244A (en) * | 1989-06-22 | 1991-02-01 | Kobe Steel Ltd | Copper alloy rolled foil for flexible print |
-
1991
- 1991-03-19 JP JP5297591A patent/JPH04290286A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233999A (en) * | 1988-07-23 | 1990-02-05 | Sakai Denshi Kogyo Kk | Flexible printed circuit forming body having electromagnetic wave shield |
| JPH0324244A (en) * | 1989-06-22 | 1991-02-01 | Kobe Steel Ltd | Copper alloy rolled foil for flexible print |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6372061B1 (en) * | 1998-11-17 | 2002-04-16 | Nippon Mining & Metals Co., Ltd. | Rolled copper foil for flexible printed circuit and method of manufacturing the same |
| US6689235B2 (en) | 1998-11-17 | 2004-02-10 | Nippon Mining & Metals Co., Ltd. | Method of manufacturing rolled copper foil for flexible printed circuit |
| KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
| KR100504518B1 (en) * | 2001-07-13 | 2005-08-03 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
| KR20030014168A (en) * | 2001-08-10 | 2003-02-15 | 닛코 킨조쿠 가부시키가이샤 | Copper alloy foil for laminated sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2090614A (en) | Conductive pastes | |
| DE112010004864T5 (en) | Mounting structure for electronic components | |
| JPH04290286A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| DE69733806T2 (en) | METHOD FOR ATTACHING AN ELECTRIC CONTACT ON A CERAMIC LAYER AND A RESISTANCE ELEMENT CREATED THEREFOR | |
| JPH04290283A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JP2809673B2 (en) | Copper alloy rolled foil for flexible printing | |
| JPH04290285A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JPH04290287A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JPH04290291A (en) | Fiexible printed circuit board with electromagnetic wave shield | |
| JPH04290290A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JPH04299886A (en) | Printed wiring board having electromagnetic wave shield | |
| JPH04290289A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JPH04290288A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JPH04290284A (en) | Flexible printed circuit board with electromagnetic wave shield | |
| JPH04267393A (en) | Flexible printed board | |
| JPH0529733A (en) | Flexible printed circuit board | |
| WO2023112667A1 (en) | Electronic component | |
| JP3052156B2 (en) | Flexible printed circuit board | |
| JPH06244520A (en) | Flexible printed-circuit board | |
| JPH0529739A (en) | Flexible printed circuit board | |
| JPH0529736A (en) | Flexible printed circuit board | |
| JP2531777B2 (en) | Copper alloy rolled foil for flexible printing | |
| JP4856745B2 (en) | Conductor for flexible substrate, method for producing the same, and flexible substrate | |
| JPS5978592A (en) | Flexible printed board | |
| JPH04267394A (en) | Flexible printed board |