JPH0424983A - Flexible printed board for bending - Google Patents
Flexible printed board for bendingInfo
- Publication number
- JPH0424983A JPH0424983A JP12461090A JP12461090A JPH0424983A JP H0424983 A JPH0424983 A JP H0424983A JP 12461090 A JP12461090 A JP 12461090A JP 12461090 A JP12461090 A JP 12461090A JP H0424983 A JPH0424983 A JP H0424983A
- Authority
- JP
- Japan
- Prior art keywords
- bending
- circuit
- circuit part
- band
- earth line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 title claims abstract description 18
- 239000011888 foil Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000012141 concentrate Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012787 coverlay film Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ハードディスクドライブ、プリンター等に
使用される屈曲用フレキシブルプリント基板に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible printed circuit board for use in hard disk drives, printers, and the like.
従来から、ハードディスクドライブ(HDD)プリンタ
ー等に高屈曲性を有するフレキシブルプリント基板が用
いられている。この種のフレキシブルプリント基板は、
第3図(横断面図)および第4図(回路形成面の平面図
)に示すように、信号線用の複数の帯状回路部分とそれ
よりも広幅のアース線用の帯状回路部分とを有する金属
箔回路パターンに対して、その−面側に、ベース接着材
層を介してベースフィルムを接着し、他面側にカバーレ
イ接着材層を介してカバー1/イフイルムを接着して構
成されている。第3図および第4図において、1は信号
線用帯状回路部分、2はアース線用帯状回路部分、Aは
屈曲部、4はベースフィルム、5はベース接着剤、6は
カバーレイフィルム、7はカバーレイ接着剤である。2. Description of the Related Art Flexible printed circuit boards with high flexibility have been used in hard disk drives (HDDs), printers, and the like. This kind of flexible printed circuit board is
As shown in Fig. 3 (cross-sectional view) and Fig. 4 (plan view of the circuit forming surface), it has a plurality of band-shaped circuit parts for signal lines and a band-shaped circuit part wider than the band-shaped circuit parts for ground wires. A base film is bonded to the negative side of the metal foil circuit pattern via a base adhesive layer, and a cover 1/if film is bonded to the other side of the metal foil circuit pattern via a coverlay adhesive layer. There is. In FIGS. 3 and 4, 1 is a signal line strip circuit part, 2 is a ground wire strip circuit part, A is a bent part, 4 is a base film, 5 is a base adhesive, 6 is a coverlay film, and 7 is a coverlay adhesive.
このような構造の屈曲用フレキシブルプリント基板は、
第4図の実線Aで示す屈曲部から長手方向に対して略直
角に屈曲され、第5図に示すような屈曲状態と、伸長状
態とを繰り返す。しかしながら、このような構造の屈曲
用フレキシブルプリント基板では、金属箔回路パターン
において、ア−ス線は機器の特性を維持するため、信号
線よりも広幅に設定されているのであり、それが屈曲と
伸長とを繰り返すことにより、上記屈曲部Aにおいて応
力集中によって断線するという問題がある。A flexible printed circuit board with this structure is
It is bent approximately at right angles to the longitudinal direction from the bent portion shown by the solid line A in FIG. 4, and repeats the bent state and the extended state as shown in FIG. 5. However, in a bendable flexible printed circuit board with such a structure, the ground wire in the metal foil circuit pattern is set wider than the signal wire in order to maintain the characteristics of the device, which causes bending and bending. By repeating the stretching, there is a problem that the wire breaks due to stress concentration at the bent portion A.
この発明は、このような事情に鑑みなされたもので、屈
曲と伸長とを繰り返してもアース線用の帯状回路部分に
断線が生じない屈曲用フレキシブルプリント基板の提供
をその目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flexible printed circuit board for bending that does not cause disconnection in a band-shaped circuit portion for a ground wire even after repeated bending and stretching.
〔課題を解決するための手段]
上記の目的を達成するため、この発明の屈曲用フレキシ
ブルプリント基板は、信号線用の帯状回路部分とそれよ
りも広幅のアース線用の帯状回路部分とを有する金属箔
回路パターンが上下一対の合成樹脂フィルム層で密着挟
持されたフレキシブルプリント基板において、略U字状
に屈曲される部分のアース線用帯状回路部分が長手方向
に沿って複数の細幅帯状に分岐されているという構成を
とる。[Means for Solving the Problems] In order to achieve the above object, the flexible printed circuit board for bending of the present invention has a band-shaped circuit part for a signal line and a band-shaped circuit part for a ground line that is wider than the band-shaped circuit part. In a flexible printed circuit board in which a metal foil circuit pattern is tightly sandwiched between a pair of upper and lower synthetic resin film layers, the strip-shaped circuit portion for the ground wire that is bent into a substantially U-shape is formed into multiple narrow strips along the longitudinal direction. It has a branched configuration.
すなわち、この発明では1.屈曲部のアース線用の帯状
回路部分を複数の細幅帯状に分岐させることによって、
個々の分岐部分の幅が略信号線の幅(太さ)と同じにな
る。その結果、アース線用の帯状回路部分に対する応力
集中が回避され、曲げ応力が金属箔回路パターンの全体
に均一に加わるようになる。したがって、応力集中に基
づくアース線用の帯状回路部分の断線が生じなくなる。That is, in this invention, 1. By branching the strip circuit part for the ground wire at the bend into multiple narrow strips,
The width of each branch portion is approximately the same as the width (thickness) of the signal line. As a result, stress concentration on the band-shaped circuit portion for the ground wire is avoided, and bending stress is uniformly applied to the entire metal foil circuit pattern. Therefore, disconnection of the band-shaped circuit portion for the ground wire due to stress concentration does not occur.
つぎに、実施例について説明する。Next, examples will be described.
第1図(横断面図)および第2図(回路形成面の平面図
)は、この発明の一実施例を示している、すなわち、こ
の屈曲用フレキシブルプリント基板は、金属箔回路パタ
ーンにおける広幅のアース線用帯状回路部分2を屈曲部
Aにおいて複数の細幅帯状に分岐させて、分岐回路3を
形成している。この分岐回路3の幅は、それぞれ信号線
用の帯状回路部分1の幅と路間−の幅に設定されている
。この場合、アース線としての電気特性を維持させる目
的で、上記分岐回路3全体の断面積は、分岐されていな
いアース線用の帯状回路部分2の断面積と路間−に設定
されている。それ以外の部分は、第3図および第4図と
同様であり、同一または相当部分に同一符号を付してい
る。FIG. 1 (cross-sectional view) and FIG. 2 (plan view of the circuit forming surface) show an embodiment of the present invention. That is, this flexible printed circuit board for bending has a wide width in a metal foil circuit pattern. The ground wire strip circuit portion 2 is branched into a plurality of narrow strips at the bent portion A to form a branch circuit 3. The width of this branch circuit 3 is set to the width of the band-shaped circuit portion 1 for the signal line and the width of the path. In this case, in order to maintain the electrical characteristics of the ground wire, the cross-sectional area of the branch circuit 3 as a whole is set to be equal to the cross-sectional area of the strip circuit portion 2 for the unbranched ground wire. The other parts are the same as those in FIGS. 3 and 4, and the same or equivalent parts are given the same reference numerals.
このように構成した結果、屈曲部においてアース線用帯
状回路部分2に対する応力集中が解消され、金属箔回路
パターンの全体に分散されるようになる。したがって、
アース線用の帯状回路部分2に集中的に断線が発生する
という事態の発生が回避されるようになる。As a result of this configuration, stress concentration on the ground wire strip circuit portion 2 at the bent portion is eliminated and is dispersed over the entire metal foil circuit pattern. therefore,
The occurrence of a situation in which disconnections occur intensively in the band-shaped circuit portion 2 for the ground wire can be avoided.
つぎに、具体例について説明する。Next, a specific example will be explained.
厚み75μmのポリイミドフィルム(デュポン社製、カ
プトン300)1)を、ベースフィルムおよびカバーレ
イフィルム材料として準備した。そして、エポキシ系接
着剤をベースフィルムに塗布し、厚み35μmの圧延銅
箔を貼り合わせ、ベース基材とした。つぎに、このベー
ス基材に第2図に示すような金属箔回路パターンを形成
した。この場合、信号線用の帯状回路部分1の幅は、1
50μmに設定し、アース線用の帯状回路部分2は、屈
曲部における各分岐回路の輻(太さ)は150μmにし
、それ以外の部分の幅は500μmに設定した。つぎに
、エポキシ系接着剤を介して、上記ベース基材にカバー
レイフィルムを貼り合わせ、第1図および第2図に示す
ようなフレキシブルプリント基板を得た。A polyimide film (manufactured by DuPont, Kapton 300) 1) having a thickness of 75 μm was prepared as a base film and a coverlay film material. Then, an epoxy adhesive was applied to the base film, and a rolled copper foil having a thickness of 35 μm was bonded to the base film to form a base substrate. Next, a metal foil circuit pattern as shown in FIG. 2 was formed on this base material. In this case, the width of the band-shaped circuit portion 1 for the signal line is 1
In the belt-shaped circuit portion 2 for the ground wire, the convergence (thickness) of each branch circuit at the bent portion was set to 150 μm, and the width of the other portions was set to 500 μm. Next, a coverlay film was bonded to the base material using an epoxy adhesive to obtain a flexible printed circuit board as shown in FIGS. 1 and 2.
金属箔回路パターンを第4図に示すようにした。それ以
外は、上記具体例と同様にして第3図および第4図に示
すようなフレキシブルプリント基板を得た。The metal foil circuit pattern was as shown in FIG. Other than that, flexible printed circuit boards as shown in FIGS. 3 and 4 were obtained in the same manner as in the above specific example.
上記具体例および比較例のフレキシブルプリント基板の
屈曲特性を評価し、その結果を下記の表に示した。The bending characteristics of the flexible printed circuit boards of the above specific examples and comparative examples were evaluated, and the results are shown in the table below.
(以下余白)
MIT耐折性:JISP8115に準拠し、荷重2kg
、折り曲げ角度2R,135゜
、回数3/秒の条件で行った。(Left below) MIT folding resistance: Based on JISP8115, load 2kg
The bending angle was 2R, 135°, and the number of times was 3/sec.
耐屈曲性: IPC−FC−240Bに準拠し、屈曲半
径1.5R,ストローク25mm、回数2看/秒の条件
で行った。Bending resistance: Based on IPC-FC-240B, bending radius was 1.5R, stroke was 25mm, and the number of cycles was 2 views/second.
上記の結果から明らかなように、具体測高は、MIT耐
折性および耐屈曲性が比較例よりも大幅に向上している
ことがわかる。As is clear from the above results, it can be seen that the MIT bending resistance and bending resistance of the specific height measurement are significantly improved compared to the comparative example.
第1図はこの発明の一実施例の横断面図、第2図はその
回路形成面の平面図、第3図は従来例の横断面図、第4
図はその回路形成面の平面図、第5図はそれを屈曲した
状態の図である。
1・・・信号線用帯状回路部分 2・・・アース線用帯
状回路部分FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a plan view of its circuit forming surface, FIG. 3 is a cross-sectional view of a conventional example, and FIG.
The figure is a plan view of the circuit forming surface, and FIG. 5 is a view of the circuit in a bent state. 1... Band-shaped circuit part for signal line 2... Band-shaped circuit part for ground wire
Claims (1)
ス線用の帯状回路部分とを有する金属箔回路パターンが
上下一対の合成樹脂フイルム層で密着挟持されたフレキ
シブルプリント基板において、略U字状に屈曲される部
分のアース線用帯状回路部分が長手方向に沿つて複数の
細幅帯状に分岐されていることを特徴とする屈曲用フレ
キシブルプリント基板。(1) In a flexible printed circuit board in which a metal foil circuit pattern having a band-shaped circuit part for a signal line and a band-shaped circuit part wider than the band-shaped circuit part for a ground wire is tightly sandwiched between a pair of upper and lower synthetic resin film layers, approximately U 1. A flexible printed circuit board for bending, characterized in that a band-shaped ground wire circuit portion of a portion bent in a character shape is branched into a plurality of narrow band-shaped circuits along the longitudinal direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12461090A JPH0424983A (en) | 1990-05-15 | 1990-05-15 | Flexible printed board for bending |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12461090A JPH0424983A (en) | 1990-05-15 | 1990-05-15 | Flexible printed board for bending |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0424983A true JPH0424983A (en) | 1992-01-28 |
Family
ID=14889691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12461090A Pending JPH0424983A (en) | 1990-05-15 | 1990-05-15 | Flexible printed board for bending |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0424983A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738211A (en) * | 1993-07-16 | 1995-02-07 | Meiki Co Ltd | Printed circuit board, transfer sheet for printed circuit board and manufacture of printed circuit board |
JP2006341385A (en) * | 2005-06-07 | 2006-12-21 | Canon Inc | Ink jet recording head |
JP2008135706A (en) * | 2006-10-23 | 2008-06-12 | Nok Corp | Sealing structure |
WO2009041086A1 (en) * | 2007-09-26 | 2009-04-02 | Nok Corporation | Sealing structure |
US7902983B2 (en) | 2007-11-07 | 2011-03-08 | Fujitsu Limited | RFID tag |
JP2012084736A (en) * | 2010-10-13 | 2012-04-26 | Yazaki Corp | Metal core substrate for mounting multiple wiring materials |
JP2015116380A (en) * | 2013-12-19 | 2015-06-25 | 京楽産業.株式会社 | Game machine |
JP2015201065A (en) * | 2014-04-09 | 2015-11-12 | 株式会社フジクラ | touch sensor |
CN105578754A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and terminal |
CN106163077A (en) * | 2015-03-31 | 2016-11-23 | 上海和辉光电有限公司 | The cabling distribution method in flexible print circuit board bending region and cabling laying structure |
-
1990
- 1990-05-15 JP JP12461090A patent/JPH0424983A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738211A (en) * | 1993-07-16 | 1995-02-07 | Meiki Co Ltd | Printed circuit board, transfer sheet for printed circuit board and manufacture of printed circuit board |
JP2006341385A (en) * | 2005-06-07 | 2006-12-21 | Canon Inc | Ink jet recording head |
JP2008135706A (en) * | 2006-10-23 | 2008-06-12 | Nok Corp | Sealing structure |
WO2009041086A1 (en) * | 2007-09-26 | 2009-04-02 | Nok Corporation | Sealing structure |
US8835761B2 (en) | 2007-09-26 | 2014-09-16 | Nok Corporation | Sealing structure |
US7902983B2 (en) | 2007-11-07 | 2011-03-08 | Fujitsu Limited | RFID tag |
JP2012084736A (en) * | 2010-10-13 | 2012-04-26 | Yazaki Corp | Metal core substrate for mounting multiple wiring materials |
JP2015116380A (en) * | 2013-12-19 | 2015-06-25 | 京楽産業.株式会社 | Game machine |
JP2015201065A (en) * | 2014-04-09 | 2015-11-12 | 株式会社フジクラ | touch sensor |
CN106163077A (en) * | 2015-03-31 | 2016-11-23 | 上海和辉光电有限公司 | The cabling distribution method in flexible print circuit board bending region and cabling laying structure |
CN105578754A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and terminal |
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