JPH0426565U - - Google Patents

Info

Publication number
JPH0426565U
JPH0426565U JP1990067245U JP6724590U JPH0426565U JP H0426565 U JPH0426565 U JP H0426565U JP 1990067245 U JP1990067245 U JP 1990067245U JP 6724590 U JP6724590 U JP 6724590U JP H0426565 U JPH0426565 U JP H0426565U
Authority
JP
Japan
Prior art keywords
board
main board
display component
film carrier
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990067245U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0755014Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990067245U priority Critical patent/JPH0755014Y2/ja
Publication of JPH0426565U publication Critical patent/JPH0426565U/ja
Application granted granted Critical
Publication of JPH0755014Y2 publication Critical patent/JPH0755014Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP1990067245U 1990-06-27 1990-06-27 実装構造 Expired - Lifetime JPH0755014Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990067245U JPH0755014Y2 (ja) 1990-06-27 1990-06-27 実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990067245U JPH0755014Y2 (ja) 1990-06-27 1990-06-27 実装構造

Publications (2)

Publication Number Publication Date
JPH0426565U true JPH0426565U (en:Method) 1992-03-03
JPH0755014Y2 JPH0755014Y2 (ja) 1995-12-18

Family

ID=31600654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990067245U Expired - Lifetime JPH0755014Y2 (ja) 1990-06-27 1990-06-27 実装構造

Country Status (1)

Country Link
JP (1) JPH0755014Y2 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104783A (ja) * 2010-11-15 2012-05-31 Fuji Xerox Co Ltd 基板の取付方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104783A (ja) * 2010-11-15 2012-05-31 Fuji Xerox Co Ltd 基板の取付方法

Also Published As

Publication number Publication date
JPH0755014Y2 (ja) 1995-12-18

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