JPH04261093A - Electronic component removing device - Google Patents

Abstract

PURPOSE:To prevent a substrate and an electronic component from being damaged up by an excessive heat load at the time of removal of the component from the substrate. CONSTITUTION:An electronic component removing device is provided with a heating unit 13, which can come into contact to the tip parts only of lead pins 6 made to project from a substrate 1 and has an elasticity in at least its surface part.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component removing device for removing an electronic component having lead pins passing through the board from a board.

0002

2. Description of the Related Art As a conventional electronic component removal device, there is one described, for example, in Japanese Patent Application Laid-Open No. 57-91874. This involves ejecting heated and molten solder from a solder nozzle onto the side of the board from which the lead pins protrude, melting the solder in the through holes, and removing the electronic component from the board.

0003

[Problems to be Solved by the Invention] However, with such conventional electronic component removal devices, it is very difficult to adjust the solder jetting force, and it is difficult to adjust the solder jetting force, and it is difficult to adjust the solder ejection force. The entire protruding portion of the board, or even the board, may come into contact with the heated and molten solder. Furthermore, it is difficult to control the temperature of heated and melted solder, and lead pins and the like may be heated more than necessary. Therefore, there is a problem that the board and electronic components may be damaged due to excessive heat load.

The present invention has been made in view of these conventional problems, and allows electronic parts to be removed from a board without heating the board or electronic parts more than necessary. An object of the present invention is to provide an electronic component removal device that can prevent components from being damaged by heat load.

[0005]

[Means for Solving the Problems] An electronic component removal device for achieving the above-mentioned object includes a heating body that can contact only the tip of a lead pin protruding from a board and that has at least an elastic surface. It is characterized by the fact that it is equipped with

[0006]

[Function] In the electronic component removal device according to the present invention, heating is performed using a solid heating body without using heated and melted liquid solder, so that only the tip of the lead pin can be easily heated. Therefore, the substrate is not directly heated, the substrate and electronic components are not heated excessively, and damage to the substrate and electronic components can be prevented.

Furthermore, since the heating body has elasticity, even if the positions of the tips of the plurality of lead pins are shifted in the longitudinal direction of the lead pins, the heating body can come into contact with the tips of all the lead pins. The solder that secures the lead pins can be reliably melted.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 2, the electronic component removal device of this embodiment removes an electronic component 5 mounted on a printed circuit board 1.
Applies to removal of. The electronic component 5 has a plurality of lead pins 6, 6, . This lead pin 6 penetrates the printed circuit board 1 via the through hole 2, and the side of the printed circuit board 1 where the electronic component main body 7 is not provided,
In other words, it protrudes toward the back side 3.

[0010] As shown in FIG. 1, the electronic component attachment/detachment device
The side of the printed circuit board 1 where the electronic component body 7 is provided,
In other words, the front side housing 10 that covers the electronic component body 7 from the front side 4, the back side housing 11 that covers the plurality of lead pins 6, 6, etc. protruding from the back side 3 of the printed circuit board 1, and the electronic component body 7 are gripped. At the same time, an electronic component lifting mechanism 12 that lifts the electronic component vertically upward, a heating element 13 that comes into contact with the tips of the lead pins 6, 6, ... protruding from the board 1, and a heating element lifting mechanism 1 that moves the heating element 13 up and down.
4, and a pressurizing mechanism 17 that pressurizes the inside of the front side housing 10.
and a pressure reducing mechanism 18 that makes the inside of the back side housing 11 a negative pressure.
and a control device 19 that controls the temperature of the heating body 13 and the operation of these mechanisms.

The force of the electronic component pulling mechanism 12 to pull up the electronic component 5 cannot be used to pull up the electronic component 5 from the fixed substrate 1 before heating, but when the solder in the through hole is melted by heating, the electronic component 5 cannot be pulled up from the fixed board 1. This value is within the range that can raise 5, and is set so that it always hangs vertically upward.

The heating body 13 is formed into a plate shape by a heat transfer wire (not shown) and silicone rubber covering the heat transfer wire.

The heating element elevating mechanism 14 raises the heating element 13 from the retracted position h0, where the heating element 13 and the lead pin 6 do not come into contact, to the uppermost position h2, where the upper surface 13a of the heating element 13 is above the tip of the lead pin 6. The main body 15 of the elevating mechanism has an arm 16 that connects the main body 15 and the heating body 13, and a buffer spring that softens the impact when the heating body 13 contacts the tip of the lead pin 6. has been done. Although the buffer spring is not shown, the arm 16
and the lifting mechanism main body 15.

Note that in this embodiment, the electronic component main body 7
A pulling means for grasping and pulling it out from the board 1 with a constant force is constituted by an electronic component pulling mechanism 12, and has two parts: the side of the board 1 where the electronic component body 7 is provided, and the side where the lead pins 6 protrude. The pressure difference forming means for creating a pressure difference between the two is comprised of a front side housing 11, a back side housing 12, a pressurizing mechanism 17, and a pressure reducing mechanism 18.

Next, the operation of this embodiment will be explained.

First, the main body 7 of the electronic component 5 mounted on the printed circuit board 1 is gripped by the electronic component lifting mechanism 12 .

Next, the electronic component main body 7 and the front side 4 of the printed circuit board 1 are covered and sealed with the front side housing 10, and the back side 3 of the printed circuit board 1 is also covered with the rear side housing 1.
Cover with 1 and seal.

Then, a current is passed through the heat transfer wire of the heating element 13 to raise the temperature of the heating element 13 itself to an appropriate temperature, and then the heating element lifting mechanism 14 is operated to raise the heating element 13. At this time, the heating element 13 tries to rise to the uppermost position h2 as shown in FIG. , 6, . . . stops at the position h1 where it touches the tip. The vertical positions of the tips of the plurality of lead pins 6, 6, ... are different due to manufacturing errors, etc., but the heating element 13 is moved upward by the buffer spring of the heating element lifting mechanism 14, that is, the lead pin 6, and because the heating element 13 is made of elastic silicone rubber, the heating element 13 only contacts the tips of all the lead pins 6, 6,... Make sure to make contact.

When the heating element 13 comes into contact with the lead pin 6, the pressure applying mechanism 17 and the pressure reducing mechanism 18 are operated to create a pressure difference between the inside of the front side housing 10 and the inside of the back side housing 11.

The heat of the heating element 13 is transmitted to the lead pins 6 and melts the solder in the through holes 2 of the printed circuit board 1. When the solder melts, the electronic component pulling mechanism 12
The electronic component 6 is pulled up and separated from the printed circuit board 1, and since there is a pressure difference between the two housings 10 and 11, the solder in the through hole of the printed circuit board 1 is transferred to the back side where the pressure is lower. It scatters into the side housing 11 and is removed.

In this way, in this embodiment, the lead pin 6
, 6, ... and because heat transfer wires whose temperature can be easily controlled are used, the printed circuit board 1 and the electronic component main body 7 are not heated excessively. This can prevent damage caused by load.

Furthermore, since the electronic component 6 is lifted vertically upward with a constant force by the electronic component lifting mechanism 12, no excessive force is applied to the lead pins 6 or the through holes 2, thereby preventing damage to them. Can be done.

Although the embodiments of the electronic component removal device have been described above, the present invention does not limit the material of the heating body to silicone rubber, but it can also be made of a material having heat resistance, elasticity, and good solder releasability. If so, other materials may be used.

Further, in this embodiment, a pressure applying mechanism and a pressure reducing mechanism are used as the pressure difference forming means, but only one of them may be used.

[0025]

According to the present invention, since only the tip of the lead pin is heated, it is possible to prevent the board and electronic components from being damaged due to excessive heat load.

[Brief explanation of the drawing]

FIG. 1 is a schematic overall sectional view showing the overall configuration of an electronic component removal device that is an embodiment of the present invention.

FIG. 1 is an explanatory diagram showing a state in which a heating body is in contact with the tip of a lead pin.

[Explanation of symbols]

1...Printed circuit board, 2...Through hole, 5...Electronic component,
6... Lead pin, 10... Front side housing, 11... Back side housing, 12... Electronic component lifting mechanism, 13... Heating body, 14... Heating body lifting mechanism, 17... Pressure mechanism, 18...
Decompression mechanism, 19...control device.

Claims (2)

[Claims] 1. An electronic component removal device for removing an electronic component to which a lead pin passes through the board and is fixed thereto, wherein only the tip of the lead pin protruding from the board can be contacted, and at least a surface portion thereof. An electronic component removal device characterized in that the device is equipped with an elastic heating body. 2. A pulling means for gripping the main body of the electronic component and pulling it out from the board with a constant force, a side of the board where the electronic component main body is provided and a side from which the lead pins protrude. 2. The electronic component removal apparatus according to claim 1, further comprising pressure difference forming means for creating a pressure difference between the two.