JPH04259904A - Manufacture of thin film magnetic head - Google Patents

Abstract

PURPOSE:To precisely form the pattern of an inter-layer insulated layer composed of a photosensitive resin film to be interposed in the case of forming a thin film coil between first and second magnetic pole layers at the manufacture of a thin film magnetic head. CONSTITUTION:In the manufacture of the thin film magnetic head composed of successively laminating a first magnetic pole layer 12, gap layer 13, lower inter-layer insulated layer 15, thin film coil, upper inter-layer insulated layer and second magnetic pole layer on a substrate 11, the photosensitive resin films are patterned in a prescribed pattern shape on the said gap layer 13 or the thin film coil in the case of forming the above-mentioned lower inter-layer insulated layer 15 and the upper inter-layer insulated layer, and after heattreatment is executed, the lower inter-layer insulated layer 15 and the upper inter-layer insulated layer are precisely formed by etching a prescribed gap depth position on the head of the above-mentioned magnetic pole layer and a film part over extended rather than the surrounding part of the top by using an etching mask 21 of a prescribed pattern in the said heattreatment.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a method of manufacturing a thin film magnetic head used in a magnetic disk device, a magnetic tape device, etc., and in particular, the present invention relates to a method of manufacturing a thin film magnetic head used in a magnetic disk device, a magnetic tape device, etc. It's about how to do it.

In magnetic disk drives, highly reliable thin-film magnetic heads are required as the recording density increases, and in manufacturing such thin-film magnetic heads, a thin-film coil is formed between the first magnetic pole layer and the second magnetic pole layer. If a photosensitive resin film is used to form an interlayer insulating layer during this process, it tends to be difficult to improve the pattern accuracy of the interlayer insulating layer. Therefore, there is a need for a method of patterning an interlayer insulating layer using such a photosensitive resin film with high precision.

0003

2. Description of the Related Art As a conventional method for manufacturing a thin film magnetic head, there is a plan view of the main part shown in FIG. 7(a) and a plan view of FIG. As shown in the cross-sectional view, a substrate 11 made of ceramic or the like serves as a slider.
After forming a first magnetic pole layer 12 made of a Ni--Fe film or the like in a predetermined pattern on top, a photoresist or the like is formed on the substrate 11 including the top of the first magnetic pole layer 12 through a gap layer 13 made of SiO2. Apply a photosensitive resin material to
This photosensitive resin film is patterned by an exposure and development process to form a photosensitive resin film 14 having a predetermined pattern shape.

[0004] After that, a plan view of the main part of FIG. 8(a) and FIG. 8(b) taken along the cutting line AA' shown in FIG. 8(a) are shown.
As shown in the cross-sectional view, the patterned photosensitive resin film 14 having a predetermined pattern shape is heat-treated to smooth out steep steps, and the lower interlayer insulating layer 15 is cured.
form.

Next, a plan view of the main part of FIG. 9(a) and FIG. 9(b) taken along the cutting line AA' shown in FIG. 9(a) are shown.
As shown in the cross-sectional view, after forming a thin film coil 16 on the lower interlayer insulating layer 15, a method similar to that of forming the lower interlayer insulating layer 15 is applied on the lower interlayer insulating layer 15 including the thin film coil 16. An upper interlayer insulating layer 17 made of a photosensitive resin film such as photoresist is formed by using a method of forming an upper interlayer insulating layer 17 made of a photosensitive resin film such as a photoresist, and a second magnetic pole layer 18 made of a Ni-Fe film or the like is formed on the surface of the upper interlayer insulating layer 17, the tip of which is the tip of the first magnetic pole layer 12. The rear end of the first magnetic pole layer 12 is opposite to the first magnetic pole layer 12 through the gap layer
It is formed in a state connected to the rear end, and Al2O is coated on the top surface.
In addition, an insulating protective film 19 made of a material such as No. 3 is further deposited, and the exposed surfaces of the tips of the first and second magnetic pole layers 12 and 18 are cut and polished to ensure a predetermined gap depth. A medium facing surface 20 is formed.

[0006]

By the way, in the manufacturing process of the conventional thin film magnetic head as described above, for example, SiO2 is deposited on the substrate 11 including the first magnetic pole layer 12.
After forming a photosensitive resin film 14 in a predetermined pattern shape through a gap layer 13 consisting of a gap layer 13, heat treatment is performed to form a lower interlayer insulating layer 15. As shown in the side view of the lower interlayer insulating layer 15
is in a state where it flows and spreads around the first pole layer 12 (sagging state). There is a problem in that excessive spreading occurs, making it difficult to pattern the lower interlayer insulating layer 15 with good precision. This phenomenon can be solved by forming an upper interlayer insulating layer 17 made of a photosensitive resin film such as photoresist on the lower interlayer insulating layer 15 including the thin film coil 16 using the same formation method as the lower interlayer insulating layer 15. It also occurs when

[0007] Therefore, in order to improve the recording/reproducing efficiency in the head structure having the lower and upper interlayer insulating layers 15, 17 in such a spread state (sagging state), the first and second magnetic pole layers 12, When the gap depth at the tip of the first and second magnetic pole layers 12 is made smaller, the first and second magnetic pole layers 12
, 18 are exposed on the medium facing surface together with the tips of the first and second magnetic pole layers 12, 18. When forming the facing surface, a slight step is created on the medium facing surface due to the difference in hardness between the exposed materials, and
There was a problem that abrasion resistance decreased, and there was a drawback that reliability decreased.

In view of the above-mentioned conventional problems, the present invention provides an interlayer insulating layer using a photosensitive resin film on the surface of the gap layer on the first magnetic pole layer or on the thin film coil in the manufacturing process of the thin film magnetic head. The object of the present invention is to provide a novel method for manufacturing a thin-film magnetic head that enables highly accurate pattern formation.

[0009]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a first magnetic pole layer, a gap layer, a lower interlayer insulating layer, a thin film coil, an upper interlayer insulating layer, and a second magnetic pole layer on a substrate. In the method for manufacturing a thin film magnetic head formed by sequentially laminating layers, the lower interlayer insulating layer and the upper interlayer insulating layer are formed by patterning a photosensitive resin film into a predetermined pattern shape, subjecting it to heat treatment, and then using an etching mask with a predetermined pattern. The structure is formed by performing an etching process using a reactive ion etching method using oxygen plasma or the like.

[0010] Furthermore, in the method for manufacturing a thin film magnetic head in which a first magnetic pole layer, a gap layer, a lower interlayer insulating layer, a thin film coil, an upper interlayer insulating layer, and a second magnetic pole layer are laminated in order on a substrate, the lower The interlayer insulating layer and the upper interlayer insulating layer are formed by patterning a photosensitive resin film using a photomask with a predetermined pattern having a part protruding from other parts at a gap depth position above the tip of the first magnetic pole layer, The structure is formed by further performing heat treatment.

[0011]

[Function] In the manufacturing method of the present invention, after forming a lower interlayer insulating layer and an upper interlayer insulating layer made of a photosensitive resin film on the gap layer and the thin film coil, respectively, a heat treatment is performed to form a lower interlayer insulating layer and an upper interlayer insulating layer on the tip of the first magnetic pole layer. the predetermined gap depth position and the first
The lower interlayer insulating layer and the upper interlayer insulating layer that have expanded excessively from the periphery of the tip of the magnetic pole layer are removed by etching using a reactive ion etching method using a predetermined etching mask and oxygen plasma. The pattern accuracy of the layer and the upper interlayer insulating layer is improved.

[0012] Furthermore, when patterning the photosensitive resin film coated on the gap layer and the thin film coil to form a lower interlayer insulating layer and an upper interlayer insulating layer made of a photosensitive resin film, respectively, After patterning using a photomask with a pattern that has a protruding part at the gap depth position above the tip of the first magnetic pole layer, and the other parts are reduced by the width part that will be expanded extra by subsequent heat treatment,
By performing the heat treatment, the lower interlayer insulating layer and the upper interlayer insulating layer can be formed with high precision. As a result, a predetermined gap depth can be ensured, and the recording/reproducing efficiency of the thin film magnetic head can be easily increased by shortening the gap depth.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described in detail below with reference to the drawings. 1 to 4 are diagrams sequentially showing one embodiment of a method for manufacturing a thin film magnetic head according to the present invention.

First, a plan view of the main part of FIG.
As shown in the cross-sectional view of FIG. 1(b) taken along the line A-A' shown in FIG. is formed into a predetermined pattern shape, and the first magnetic pole layer 12
After forming a gap layer 13 made of SiO2 on the substrate 11 including the top, a photosensitive resin material made of photoresist or the like is applied to the surface of the gap layer 13, and the photosensitive resin film is exposed and developed by a process of exposure and development. The photosensitive resin film is patterned into a predetermined pattern shape and further heat-treated to form a hardened lower interlayer insulating layer 15 having good heat resistance and solvent resistance.

Next, a plan view of the main part of FIG.
As shown in the cross-sectional view of FIG. 2B taken along the line A-A' shown in FIG. Through this etching mask 21, oxygen ( 3(
a) Main part plan view and AA' shown in FIG. 3(a)
As shown in the cross-sectional view of FIG. 3(b) taken along the cutting line, a lower interlayer insulating layer 15a with good pattern accuracy can be obtained.

Hereinafter, as in the conventional case, as shown in the main part plan view of FIG. 4(a) and the sectional view of FIG. 4(b) taken along the cutting line AA' shown in FIG. 4(a), A spiral thin film coil 16 is formed on the lower interlayer insulating layer 15a, and an upper interlayer insulating layer 17a made of a photosensitive resin film is formed on the surface thereof by the same formation method as the lower interlayer insulating layer 15a.
A second magnetic pole layer 18 made of a Ni--Fe film or the like is formed on the surface of the gap layer 13 including the upper interlayer insulating layer 17a, and its tip is placed on the tip of the first magnetic pole layer 12 via the gap layer 13. Opposing and rear end portion is the first magnetic pole layer 12
It is connected to the rear end of the

[0017] After that, Al2O3 is further applied to the upper surfaces of these
At the same time, the exposed surfaces of the tips of the first and second magnetic pole layers 12 and 18 are cut and polished to ensure a predetermined gap depth. By forming the opposing surface 20, the positions of the portions of the lower interlayer insulating layer 15a and the upper interlayer insulating layer 17a above the tip of the first magnetic pole layer 12 and the portions extending around the tip are aligned. This improves pattern accuracy and eliminates the need for parts of the lower interlayer insulating layer 15a and upper interlayer insulating layer 17a to be exposed to the medium facing surface 20 side as in the conventional method. Can be easily secured.

In the above embodiment, an etching mask 2 made of a resist film having a predetermined pattern is provided on the surface of the lower interlayer insulating layer 15 and the upper interlayer insulating layer after heat treatment.
1, and etching the lower interlayer insulating layer 15 and the upper interlayer insulating layer at a predetermined gap depth position on the tip of the first magnetic pole layer 12 and around the tip of the first magnetic pole layer 12 through the etching mask 21. Oxygen (O
2) Although the explanation is based on an example in which removal is performed by reactive ion etching using plasma, for example, a thin film coil is formed on the lower interlayer insulating layer after heat treatment, and a film is removed on the lower interlayer insulating layer including the thin film coil. After forming and heat-treating a thick upper interlayer insulating layer, an etching mask having a predetermined pattern is formed on the surface of the upper interlayer insulating layer, and the upper interlayer insulating layer and the lower interlayer insulating layer are etched through this etching mask. At a predetermined gap depth position on the tip of the first magnetic pole layer and a portion extending excessively from the periphery of the tip of the first magnetic pole layer are continuously and simultaneously removed by reactive ion etching using oxygen (O2) plasma. You can do it like this.

FIGS. 5 and 6 are diagrams sequentially showing other embodiments of the method for manufacturing a thin film magnetic head according to the present invention, in which parts equivalent to those in FIG. 1 are given the same reference numerals. In this example, Fig. 5 (
a) Main part plan view and AA' shown in FIG. 5(a)
As shown in the cross-sectional view of FIG. 5(b) taken along the cutting line, Ni-
A first magnetic pole layer 12 made of Fe film or the like, and the first magnetic pole layer 1
After forming a gap layer 13 made of SiO2 on the substrate 11 including the upper surface of the gap layer 13, a photosensitive resin material made of photoresist or the like is applied to the surface of the gap layer 13, and the photosensitive resin film is applied to the first magnetic pole. Using a pattern-shaped photomask (not shown) that has a protruding part at a predetermined gap depth position on the tip of the layer 12, and the other parts are reduced by the width part that will be expanded extra by subsequent heat treatment. Patterning is done by exposure and development.

After that, the patterned photosensitive resin film 3
By forming the lower interlayer insulating layer 32 which is hardened by heat-treating 1, the principal part plan view of FIG. 6(a) and the FIG.
As shown in the cross-sectional view of FIG. 6(b) taken along the line A-A' shown in FIG. The position of the extension portion is aligned with that of the extension portion, and there is no possibility of displacement toward the medium facing surface.

Therefore, after that, a spiral thin film coil is formed on the lower interlayer insulating layer 32 in the same way as in the embodiment of FIG. forming an interlayer insulating layer, and a second magnetic pole layer on the surface of the gap layer 13 including the upper interlayer insulating layer;
The tip thereof is formed to face the tip of the first magnetic pole layer 12 with the gap layer 13 in between, and the rear end thereof is connected to the rear end of the first magnetic pole layer 12. An insulating protective film made of Al2O3 or the like is further deposited on the upper surface, and the exposed surfaces of the tips of the first magnetic pole layer 12 and the second magnetic pole layer are cut and polished to ensure a predetermined gap depth. By forming the medium facing surface by forming the medium facing surface, the position of the portion of the upper interlayer insulating layer above the tip of the first pole layer 12 and the portion extending around the tip with respect to the lower interlayer insulating layer 32 is also determined. The pattern accuracy can be improved without positional deviation toward the medium facing surface side, and a predetermined gap depth can be easily secured.

[0022]

As is clear from the above description, according to the method for manufacturing a thin film magnetic head according to the present invention, the photosensitive resin films interposed between the first magnetic pole layer, the second magnetic pole layer, and the thin film coil, respectively. Since it is possible to form the interlayer insulating layer with high precision without shifting the position toward the medium facing surface side, a predetermined gap depth can be secured, and the gap depth can be shortened to improve the recording and recording performance of the thin film magnetic head. Regeneration efficiency can be easily increased.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a main part and a sectional view taken along line AA' thereof, sequentially showing an embodiment of a method for manufacturing a thin film magnetic head of the present invention.

FIG. 2 is a plan view of a main part and a cross-sectional view taken along line AA' thereof, sequentially illustrating an embodiment of a method for manufacturing a thin film magnetic head of the present invention.

FIG. 3 is a plan view of a main part and a cross-sectional view taken along line AA' thereof, showing one embodiment of a method for manufacturing a thin-film magnetic head of the present invention.

4A and 4B are plan views of essential parts and sectional views taken along line AA' thereof, showing one embodiment of the method for manufacturing a thin film magnetic head of the present invention.

5A and 5B are plan views of essential parts and sectional views taken along line AA' thereof, showing in order another embodiment of the method for manufacturing a thin film magnetic head of the present invention.

6A and 6B are plan views of essential parts and sectional views taken along line AA' thereof, showing in order another embodiment of the method for manufacturing a thin film magnetic head of the present invention.

FIG. 7 is a plan view of a main part and a cross-sectional view taken along line AA' thereof, sequentially illustrating a method of manufacturing a conventional thin-film magnetic head.

FIG. 8 is a plan view of a main part and a cross-sectional view taken along line AA' thereof, sequentially illustrating a method of manufacturing a conventional thin-film magnetic head.

FIG. 9 is a plan view of a main part and a cross-sectional view taken along line AA' thereof, sequentially illustrating a method of manufacturing a conventional thin-film magnetic head.

[Explanation of symbols]

11 Board
12 first pole layer 13 gap layer 14,
31 Photosensitive resin film 15, 15a, 32 Lower interlayer insulation layer
16 Thin film coil 17, 17a Upper interlayer insulating layer 19 Insulating protective layer 20 Medium facing surface
21 Etching mask

Claims (3)

[Claims] Claim 1: A first magnetic pole layer (12) on a substrate (11).
In a method for manufacturing a thin-film magnetic head comprising a gap layer (13), a lower interlayer insulating layer (15), a thin film coil (16), an upper interlayer insulating layer (17) and a second magnetic pole layer (18), which are laminated in this order. , the lower interlayer insulating layer (15) and the upper interlayer insulating layer (17) are formed by patterning a photosensitive resin film into a predetermined pattern shape, performing heat treatment, and then etching using an etching mask (21) with a predetermined pattern. 1. A method of manufacturing a thin film magnetic head, the method comprising: forming a thin film magnetic head by applying 2. The method of manufacturing a thin film magnetic head according to claim 2, wherein the etching process is performed by a reactive ion etching method using oxygen plasma. 3. A first magnetic pole layer (12) on the substrate (11).
In a method for manufacturing a thin-film magnetic head comprising a gap layer (13), a lower interlayer insulating layer (15), a thin film coil (16), an upper interlayer insulating layer (17) and a second magnetic pole layer (18), which are laminated in this order. , the lower interlayer insulating layer (15) and the upper interlayer insulating layer (17) are formed by forming a photosensitive resin film into a predetermined pattern having a portion protruding from other portions at a gap depth position on the tip of the first magnetic pole layer. 1. A method of manufacturing a thin film magnetic head, the method comprising patterning using a photomask and further performing heat treatment.