JPH042595U - - Google Patents
Info
- Publication number
- JPH042595U JPH042595U JP15085589U JP15085589U JPH042595U JP H042595 U JPH042595 U JP H042595U JP 15085589 U JP15085589 U JP 15085589U JP 15085589 U JP15085589 U JP 15085589U JP H042595 U JPH042595 U JP H042595U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cutting blade
- dividing
- dividing device
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 6
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Nonmetal Cutting Devices (AREA)
Description
第１図は本考案による基板の分割装置の斜視図
、第２図は前記分割装置によつて切断された印刷
配線基板の状態を説明するための斜視図、第３図
ａ，ｂ及び第４図ａ，ｂは従来技術を説明するた
めの図である。
１０，１０′……印刷配線基板、１１……耳部
、２１……基板ガイド、２２……凹部、２３，２
３′……切断刃、２４，２４′……支持柱、２５
，２５′……ガイド板、２６，２６′……ガイド
穴、２７，２７′……押し板、２８，２８′……
圧縮スプリング、２９……台座。
FIG. 1 is a perspective view of a board dividing device according to the present invention, FIG. 2 is a perspective view for explaining the state of a printed wiring board cut by the dividing device, and FIGS. Figures a and b are diagrams for explaining the prior art. 10, 10'... Printed wiring board, 11... Ledge, 21... Board guide, 22... Recess, 23, 2
3'... Cutting blade, 24, 24'... Support column, 25
, 25'... Guide plate, 26, 26'... Guide hole, 27, 27'... Push plate, 28, 28'...
Compression spring, 29...Pedestal.
補正 平３．８．１９
図面の簡単な説明を次のように補正する。
明細書１０頁１１行目から１２行目に「第４図
ａ，ｂは」とあるのを「第４図ａ，ｂ及び第５図
ａ，ｂは」と補正します。Amendment 3/8/19 The brief description of the drawing is amended as follows. On page 10, lines 11 to 12 of the specification, the statement ``Figure 4 a, b'' will be corrected to ``Figure 4 a, b and Figure 5 a, b''.
Claims (1)
割する装置であつて、前記基板をその両側縁で保
持する基板ガイドと、前記基板上に形成された分
割ラインに沿つて設けられた切断刃と、前記切断
刃の背後に設けられ、前記切断刃をその背後から
押圧する押し板と、前記切断刃をガイドするガイ
ド板とを備えたことを特徴とする基板の分割装置
。 (2) 前記実用新案登録請求の範囲第１項におい
て、切断刃、押し板及びガイド板が基板の上下両
面側に設けられた基板の分割装置。[Claims for Utility Model Registration] (1) A device for cutting and dividing a substrate along its dividing line, comprising a substrate guide that holds the substrate on both sides thereof, and a dividing device formed on the substrate. It is characterized by comprising a cutting blade provided along a line, a push plate provided behind the cutting blade to press the cutting blade from behind, and a guide plate guiding the cutting blade. Board dividing device. (2) The substrate dividing device according to claim 1 of the above-mentioned utility model registration, in which a cutting blade, a push plate, and a guide plate are provided on both upper and lower sides of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15085589U JPH042595U (en) | 1989-12-30 | 1989-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15085589U JPH042595U (en) | 1989-12-30 | 1989-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042595U true JPH042595U (en) | 1992-01-10 |
Family
ID=31697187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15085589U Pending JPH042595U (en) | 1989-12-30 | 1989-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042595U (en) |
-
1989
- 1989-12-30 JP JP15085589U patent/JPH042595U/ja active Pending
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