JPH0231619U - - Google Patents
Info
- Publication number
- JPH0231619U JPH0231619U JP10902088U JP10902088U JPH0231619U JP H0231619 U JPH0231619 U JP H0231619U JP 10902088 U JP10902088 U JP 10902088U JP 10902088 U JP10902088 U JP 10902088U JP H0231619 U JPH0231619 U JP H0231619U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lower molds
- cutting
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Accessories And Tools For Shearing Machines (AREA)
Description
第１図ａ，ｂはそれぞれ本考案刃を用いた上金
型及び下金型の斜視図、第２図ａ，ｂはそれぞれ
本考案における上、下金型を取付けた卓上プレス
機の正面図及び側面図、第３図は本考案刃により
面付プリントサーキツトボードを切断する場合の
説明図、第４図は本考案により分割される面付プ
リントサーキツトボードの一例を示す平面図、第
５図は従来刃により面付プリントサーキツトボー
ドを切断する場合の説明図である。
１…面付プリントサーキツトボード（Ｐ．Ｃ．
Ｂ）、２…分割部分、３…卓上プレス機、４…上
金型、５…下金型、６…分割切断刃。
Figures 1a and b are perspective views of the upper and lower molds using the blade of the present invention, respectively, and Figures 2a and b are front views of the tabletop press machine with the upper and lower molds of the present invention installed, respectively. and a side view, FIG. 3 is an explanatory diagram of cutting an imprinted printed circuit board with the blade of the present invention, and FIG. 4 is a plan view showing an example of an imprinted printed circuit board divided by the invention. FIG. 5 is an explanatory diagram of cutting a surface-mounted printed circuit board with a conventional blade. 1... Imprinted printed circuit board (P.C.
B), 2...Divided portion, 3...Desk press machine, 4...Upper mold, 5...Lower mold, 6...Divided cutting blade.
Claims (1)
型４，５を用いその分割切断刃６により分割部分
２で切断するものにおいて、前記切断刃６を上、
下金型４，５の水平面に対して斜め形状とした構
成とする面付プリントサーキツトボード分割用金
型の刃構造。 In a device for cutting an imprinted printed circuit board 1 into divided portions 2 with a divided cutting blade 6 using upper and lower molds 4 and 5, the cutting blade 6 is
The blade structure of a mold for dividing a surface-mounted printed circuit board is configured to be diagonal with respect to the horizontal plane of the lower molds 4 and 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10902088U JPH0231619U (en) | 1988-08-18 | 1988-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10902088U JPH0231619U (en) | 1988-08-18 | 1988-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231619U true JPH0231619U (en) | 1990-02-28 |
Family
ID=31344894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10902088U Pending JPH0231619U (en) | 1988-08-18 | 1988-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231619U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012183644A (en) * | 2011-03-03 | 2012-09-27 | Denso Corp | Method and apparatus for dividing substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58899B2 (en) * | 1979-07-05 | 1983-01-08 | 日本国土開発株式会社 | Continuous clay slurry production equipment |
| JPS59121892A (en) * | 1982-12-27 | 1984-07-14 | 協栄プリント技研株式会社 | Method of separating printed board and mold therefor |
| JPH01115595A (en) * | 1987-10-29 | 1989-05-08 | Fujitsu Ltd | Printed board diveder |
-
1988
- 1988-08-18 JP JP10902088U patent/JPH0231619U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58899B2 (en) * | 1979-07-05 | 1983-01-08 | 日本国土開発株式会社 | Continuous clay slurry production equipment |
| JPS59121892A (en) * | 1982-12-27 | 1984-07-14 | 協栄プリント技研株式会社 | Method of separating printed board and mold therefor |
| JPH01115595A (en) * | 1987-10-29 | 1989-05-08 | Fujitsu Ltd | Printed board diveder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012183644A (en) * | 2011-03-03 | 2012-09-27 | Denso Corp | Method and apparatus for dividing substrate |
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