JPH0435895U - - Google Patents

Info

Publication number
JPH0435895U
JPH0435895U JP7707990U JP7707990U JPH0435895U JP H0435895 U JPH0435895 U JP H0435895U JP 7707990 U JP7707990 U JP 7707990U JP 7707990 U JP7707990 U JP 7707990U JP H0435895 U JPH0435895 U JP H0435895U
Authority
JP
Japan
Prior art keywords
board
substrate
cutter
divided
dividing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7707990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7707990U priority Critical patent/JPH0435895U/ja
Publication of JPH0435895U publication Critical patent/JPH0435895U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す平面図、第2
図は基板カツターが分割基板を切断する状態を示
す拡大図である。 1……分割基板、2……基板ホルダー、3……
基板カツター、4……カツターサポート、5……
ベース、6……ガイドレール。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is an enlarged view showing a state in which the board cutter cuts a divided board. 1... Divided board, 2... Board holder, 3...
Board cutter, 4... Cutter support, 5...
Base, 6...Guide rail.

Claims (1)

【実用新案登録請求の範囲】 基板カツターと、基板ホルダーとを有し、部品
を半付けして実装した分割基板を、該基板の分割
溝に沿つて個々に分割する実装基板分割装置であ
つて、 基板カツターは、カツターサポートに支持され
て分割基板の分解溝に押しあてるものであり、 基板ホルダーは、分割基板を支持し、該分割基
板を、基板カツターにより切断される方向に相対
移動させるものであることを特徴とする実装基板
分割装置。
[Claims for Utility Model Registration] A mounted board dividing device that has a board cutter and a board holder, and divides a divided board on which parts are half-attached and mounted into individual parts along the dividing grooves of the board. The substrate cutter is supported by a cutter support and pressed against the disassembly groove of the divided substrate, and the substrate holder supports the divided substrate and relatively moves the divided substrate in the direction in which it is cut by the substrate cutter. A mounting board dividing device characterized by:
JP7707990U 1990-07-20 1990-07-20 Pending JPH0435895U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7707990U JPH0435895U (en) 1990-07-20 1990-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7707990U JPH0435895U (en) 1990-07-20 1990-07-20

Publications (1)

Publication Number Publication Date
JPH0435895U true JPH0435895U (en) 1992-03-25

Family

ID=31619130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7707990U Pending JPH0435895U (en) 1990-07-20 1990-07-20

Country Status (1)

Country Link
JP (1) JPH0435895U (en)

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