JPH04259246A - Cooling mechanism for integrated circuit - Google Patents
Cooling mechanism for integrated circuitInfo
- Publication number
- JPH04259246A JPH04259246A JP3041114A JP4111491A JPH04259246A JP H04259246 A JPH04259246 A JP H04259246A JP 3041114 A JP3041114 A JP 3041114A JP 4111491 A JP4111491 A JP 4111491A JP H04259246 A JPH04259246 A JP H04259246A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- fins
- plate
- block
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 239000002826 coolant Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】0001
【技術分野】本発明は集積回路の冷却機構に関し、特に
集積回路自体の冷却構造に関する。TECHNICAL FIELD The present invention relates to a cooling mechanism for an integrated circuit, and more particularly to a cooling structure for the integrated circuit itself.
【０００２】0002
【従来技術】従来、この種の冷却構造としては、図２に
示すように、集積回路１からの放熱が熱伝導性コンパウ
ンド８によって熱伝導ブロック１２に伝えられ、熱伝導
ブロック１２からコールドプレート１３へと伝達される
ことによって、コールドプレート１３の流路６を循環す
る冷媒５によって冷却される構造となっていた。2. Description of the Related Art Conventionally, in this type of cooling structure, as shown in FIG. The structure is such that the refrigerant 5 is cooled by the refrigerant 5 circulating through the flow path 6 of the cold plate 13.
【０００３】このような従来の冷却構造では、集積回路
１から流路６内の冷媒５までの間に、たとえば熱伝導ブ
ロック１２とコールドプレート１３との間のように金属
同士の接触面が複数箇所あるため、集積回路１からの放
熱の伝導性が悪くなるという欠点がある。また、集積回
路１と冷媒５との間に距離があるので、冷却性能が上が
らないという欠点がある。[0003] In such a conventional cooling structure, there are a plurality of metal contact surfaces between the integrated circuit 1 and the coolant 5 in the flow path 6, such as between the heat conduction block 12 and the cold plate 13. Since there are some locations, there is a drawback that the conductivity of heat radiation from the integrated circuit 1 is poor. Furthermore, since there is a distance between the integrated circuit 1 and the coolant 5, there is a drawback that the cooling performance cannot be improved.
【０００４】0004
【発明の目的】本発明は上記のような従来のものの欠点
を除去すべくなされたもので、冷却性能を向上させるこ
とができる集積回路の冷却機構の提供を目的とする。OBJECTS OF THE INVENTION The present invention has been made to eliminate the above-mentioned drawbacks of the conventional devices, and an object of the present invention is to provide a cooling mechanism for integrated circuits that can improve cooling performance.
【０００５】[0005]
【発明の構成】本発明による集積回路の冷却機構は、基
板上に搭載された集積回路の冷却機構であって、前記集
積回路を冷却するための冷媒を循環させる流路と、前記
集積回路に密着して設けられた放熱板と、前記流路内に
固定されるように前記放熱板上に設けられたフィンとを
有することを特徴とする。A cooling mechanism for an integrated circuit according to the present invention is a cooling mechanism for an integrated circuit mounted on a substrate, and includes a flow path for circulating a coolant for cooling the integrated circuit, and a cooling mechanism for cooling the integrated circuit. It is characterized by having a heat sink provided in close contact with each other, and fins provided on the heat sink so as to be fixed within the flow path.
【０００６】[0006]
【実施例】次に、本発明の一実施例について図面を参照
して説明する。[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.
【０００７】図１は本発明の一実施例の縦断面図である
。図において、集積回路１は外部接続のためのピン３を
有し、枠４に固定されたセラミック基板２上に搭載され
、半田でセラミック基板２に接続されている。また、集
積回路１上には高熱伝導性のコンパウンド８を介して放
熱板９が取付けられている。放熱板９には複数のフィン
が設けられており、これらのフィンはブロック７のスリ
ット１０に差込まれた状態で半田１１によって固定され
ている。このスリット１０はブロック７において冷媒５
が循環する流路６に貫通するように形成されており、ま
たブロック７はセラミック基板２と同様に枠４に固定さ
れている。よって、放熱板９のフィンはスリット１０を
介して流路６内に固定されることになる。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention. In the figure, an integrated circuit 1 has pins 3 for external connections, is mounted on a ceramic substrate 2 fixed to a frame 4, and is connected to the ceramic substrate 2 with solder. Further, a heat sink 9 is attached to the integrated circuit 1 via a highly thermally conductive compound 8. The heat dissipation plate 9 is provided with a plurality of fins, and these fins are inserted into the slits 10 of the block 7 and fixed with solder 11. This slit 10 is connected to the refrigerant 5 in the block 7.
The block 7 is formed so as to pass through the flow path 6 in which it circulates, and the block 7 is fixed to the frame 4 similarly to the ceramic substrate 2. Therefore, the fins of the heat sink 9 are fixed in the flow path 6 through the slits 10.
【０００８】集積回路４で発生した熱はコンパウンド８
を介して放熱板９に伝達され、放熱板９のフィンからブ
ロック７の流路６内の冷媒５に伝達される。したがって
、ブロック７の流路６内の冷媒５を循環させることによ
って、冷媒５で放熱板９のフィンが冷却され、放熱板９
を介して集積回路１が冷却される。The heat generated in the integrated circuit 4 is transferred to the compound 8
The coolant is transmitted to the heat sink 9 through the fins of the heat sink 9, and is transmitted from the fins of the heat sink 9 to the refrigerant 5 in the flow path 6 of the block 7. Therefore, by circulating the coolant 5 in the flow path 6 of the block 7, the fins of the heat sink 9 are cooled by the coolant 5, and the heat sink 9 is cooled by the coolant 5.
The integrated circuit 1 is cooled through.
【０００９】このように、集積回路１を冷却するための
放熱板９のフィンを、冷媒５が循環する流路６内に固定
するようにすることによって、集積回路１にコンパウン
ド８を介して密着した放熱板９が冷媒５によって直接冷
却されるとともに、集積回路１と冷媒５との距離が近く
なるので、従来の冷却構造に比べて冷却能力を向上させ
ることができる。In this manner, by fixing the fins of the heat dissipation plate 9 for cooling the integrated circuit 1 within the flow path 6 through which the coolant 5 circulates, the fins of the heat dissipation plate 9 for cooling the integrated circuit 1 are fixed to the integrated circuit 1 through the compound 8. The heat sink 9 is directly cooled by the coolant 5, and the distance between the integrated circuit 1 and the coolant 5 is shortened, so that the cooling capacity can be improved compared to the conventional cooling structure.
【００１０】また、放熱板９のフィンとブロック７とを
半田１１などで接続し、ブロック７のスリット１０の幅
に余裕を持たせることによって、集積回路１の高さや傾
きなどに合わせて放熱板９を取付けることができるので
、集積回路１と放熱板９との間に常に一定の間隙を保つ
ことができる。よって、集積回路１の交換時にブロック
７を交換することなく、放熱板９の傾きや高さを変える
ことができる。[0010] Furthermore, by connecting the fins of the heat sink 9 and the block 7 with solder 11 or the like, and providing a margin for the width of the slit 10 of the block 7, the heat sink can be adjusted to suit the height and inclination of the integrated circuit 1. 9 can be attached, a constant gap can always be maintained between the integrated circuit 1 and the heat sink 9. Therefore, the inclination and height of the heat sink 9 can be changed without replacing the block 7 when replacing the integrated circuit 1.
【００１１】[0011]
【発明の効果】以上説明したように本発明によれば、基
板上に搭載された集積回路を冷却するための冷媒を循環
させる流路内に、集積回路に密着した放熱板上のフィン
を固定するようにすることによって、冷却性能を向上さ
せることができるという効果がある。[Effects of the Invention] As explained above, according to the present invention, the fins on the heat sink that are in close contact with the integrated circuit are fixed in the flow path that circulates the coolant for cooling the integrated circuit mounted on the substrate. By doing so, there is an effect that cooling performance can be improved.
【図１】本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.
【図２】従来例の縦断面図である。FIG. 2 is a vertical cross-sectional view of a conventional example.
１ 集積回路 ２ セラミック基板 ６ 流路 ７ ブロック ８ コンパウンド ９ 放熱板 １０ スリット １１ 半田 1 Integrated circuit 2 Ceramic substrate 6 Flow path 7 Block 8 Compound 9 Heat sink 10 slit 11 Solder
Claims (1)
構であって、前記集積回路を冷却するための冷媒を循環
させる流路と、前記集積回路に密着して設けられた放熱
板と、前記流路内に固定されるように前記放熱板上に設
けられたフィンとを有することを特徴とする冷却機構。1. A cooling mechanism for an integrated circuit mounted on a substrate, comprising: a flow path for circulating a coolant for cooling the integrated circuit; a heat sink provided in close contact with the integrated circuit; A cooling mechanism comprising: a fin provided on the heat sink so as to be fixed within the flow path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3041114A JPH04259246A (en) | 1991-02-13 | 1991-02-13 | Cooling mechanism for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3041114A JPH04259246A (en) | 1991-02-13 | 1991-02-13 | Cooling mechanism for integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04259246A true JPH04259246A (en) | 1992-09-14 |
Family
ID=12599441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3041114A Pending JPH04259246A (en) | 1991-02-13 | 1991-02-13 | Cooling mechanism for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04259246A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6114761A (en) * | 1998-01-20 | 2000-09-05 | Lsi Logic Corporation | Thermally-enhanced flip chip IC package with extruded heatspreader |
| WO2002093339A1 (en) * | 2001-05-15 | 2002-11-21 | Mok-Hyoung Lee | Heat transfer apparatus using refrigerant and computer having the same |
-
1991
- 1991-02-13 JP JP3041114A patent/JPH04259246A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6114761A (en) * | 1998-01-20 | 2000-09-05 | Lsi Logic Corporation | Thermally-enhanced flip chip IC package with extruded heatspreader |
| WO2002093339A1 (en) * | 2001-05-15 | 2002-11-21 | Mok-Hyoung Lee | Heat transfer apparatus using refrigerant and computer having the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7209354B2 (en) | Ball grid array package with heat sink device | |
| WO2011096218A1 (en) | Heat radiation device and electronic equipment using the same | |
| US20130206367A1 (en) | Heat dissipating module | |
| JP2005064384A (en) | Lsi package with interface module and heat sink used for it | |
| JP2928236B1 (en) | Heat dissipating member for heating element | |
| JPH042156A (en) | Power semiconductor device | |
| JP2002289750A (en) | Multi-chip module and its radiation structure | |
| JP4438526B2 (en) | Power component cooling system | |
| JP2000332171A (en) | Heat dissipation structure of heat generating element and module having that structure | |
| JP2006210611A (en) | Heat sink equipped with radiation fin, and manufacturing method thereof | |
| JP2913879B2 (en) | Electronic component cooling structure | |
| JPH04259246A (en) | Cooling mechanism for integrated circuit | |
| JP2624362B2 (en) | Heat dissipation and shielding case for semiconductor elements | |
| JP4469101B2 (en) | Electronic circuit device having heat dissipation structure | |
| JPS6142864B2 (en) | ||
| US20080011459A1 (en) | Thermally conductive cover directly attached to heat producing component | |
| JPH0727677Y2 (en) | Refrigerant flow guide mechanism for heat sink | |
| JPH0494562A (en) | Cooling structure for integrated circuit | |
| JPS59155158A (en) | Cooling structure of semiconductor device | |
| JPH03208398A (en) | Semiconductor device | |
| JPH06181395A (en) | Heat dissipation printed-wiring board | |
| JPH06188342A (en) | Cooling device for semiconductor element | |
| JPH065750A (en) | Cooling mechanism for semiconductor element | |
| JP2567980Y2 (en) | Heat pipe studs and heat pipe stud integrated circuit components | |
| JPH073187U (en) | Circuit board device |